Display module and display device

Abstract

The display module comprises a display panel, a first supporting layer and a driving chip, the display panel comprises a plane portion, a binding portion arranged opposite to the plane portion and a bending portion connected between the plane portion and the binding portion, the first supporting layer is arranged between the plane portion and the binding portion, and the driving chip is arranged on the first supporting layer. The orthographic projection of the first supporting layer on the binding part is located in the binding part, the driving chip is arranged on one side of the plane part of the binding part and connected with the binding part, the first supporting layer is provided with a first buffer groove, and the first buffer groove is located on the side, close to the binding part, of the first supporting layer; the orthographic projection of the first buffer groove on the binding part is overlapped with the orthographic projection of at least part of the driving chip on the binding part, so that the deformation generated when the display panel is impacted by external force is absorbed and relieved through the first buffer groove, and the situation that the driving chip is damaged or cracked due to the fact that stress is directly transmitted to the driving chip is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to display technical field especially relates to a display module and display device. BACKGROUND

[0002] At present, in order to improve screen ratio and reduce frame size, usually adopt terminal bending technology (pad bending), and the flexible substrate of display module is bent to the back, and the flexible circuit board, chip and printed circuit board are bound on its back, with the popularization and use scene diversification of intelligent equipment, especially folding mobile phone, wearable device and smart watch and other products, user's requirement to durability and anti drop ability increases day by day, and the thinness and lightness of equipment make that anti drop performance becomes important index for measuring product quality.

[0003] Display module design usually adopts thin and light flexible circuit board and driving chip, in the drop test process, when display module bears external force impact, the position of driving chip is prone to stress concentration, easy to cause the damage or crack of partial structure, destroys the connection between driving chip and display panel, and then leads to signal transmission interruption or distortion, finally causes display module to appear vertical bright line or other display abnormal phenomenon. SUMMARY

[0004] The utility model embodiment provides a kind of display module and display device to alleviate the deficiency in the related art.

[0005] To achieve the above function, the technical scheme provided by the utility model embodiment is as follows:

[0006] The utility model embodiment provides a kind of display module, comprising:

[0007] Display panel, including plane part, the binding part of the opposite setting with the plane part and the bending part connected between the plane part and the binding part;

[0008] First support layer, between the plane part and the binding part, the orthographic projection of the first support layer on the binding part is located in the binding part;

[0009] Driving chip, on the side of the binding part away from the plane part, the driving chip is connected with the binding part;

[0010] Wherein, the first support layer is provided with first buffer groove, and the first buffer groove is located on the side of the first support layer close to the binding part, and the orthographic projection of the first buffer groove on the binding part is overlapped with at least part of the orthographic projection of the driving chip on the binding part.

[0011] Optionally, in an embodiment, the orthographic projection of the driving chip on the binding portion is located within the orthographic projection of the first buffer groove on the binding portion.

[0012] Optionally, in an embodiment, the first buffer groove penetrates the first support layer along the thickness direction of the display panel.

[0013] Optionally, in an embodiment, the orthographic projection of the driving chip in the first buffer groove has a first spacing with the inner wall of the first buffer groove, the first spacing is greater than or equal to 200 microns and less than or equal to 300 microns.

[0014] Optionally, in an embodiment, the display module further comprises a second support layer, the second support layer is arranged in overlap with the planar portion, the second support layer is provided with a second buffer groove, and the second buffer groove is in communication with the first buffer groove.

[0015] The orthographic projection of the second buffer groove on the binding portion is arranged in overlap with at least part of the orthographic projection of the driving chip on the binding portion.

[0016] Optionally, in an embodiment, the second buffer groove penetrates at least part of the second support layer along the thickness direction of the display panel, and the orthographic projection of the driving chip on the binding portion is located within the orthographic projection of the second buffer groove on the binding portion.

[0017] Optionally, in an embodiment, along the thickness direction of the display panel, the depth of the second buffer groove is less than or equal to half of the thickness of the second support layer.

[0018] Optionally, in an embodiment, the depth of the second buffer groove in the thickness direction of the display panel is greater than or equal to 60 microns and less than or equal to 100 microns.

[0019] Optionally, in an embodiment, the display module further comprises a buffer portion, the buffer portion is arranged in the first buffer groove, and the elastic modulus of the buffer portion is less than the elastic modulus of the first support layer.

[0020] The buffer portion is arranged in interval with the inner wall of the first buffer groove, and along the thickness direction of the display panel, the thickness of the buffer portion is less than the depth of the first buffer groove.

[0021] An embodiment of the utility model provides a kind of display device, comprising the display module of any one described above.

[0022] The beneficial effects of this utility model embodiment are as follows: This utility model embodiment provides a display module and display device, a first support layer and a driving chip. The display panel includes a planar portion, a binding portion disposed opposite to the planar portion, and a bent portion connected between the planar portion and the binding portion. The first support layer is disposed between the planar portion and the binding portion. The orthographic projection of the first support layer on the binding portion is located inside the binding portion. The driving chip is disposed on one side of the planar portion of the binding portion and is connected to the binding portion. The first support layer has a first buffer groove. The first buffer groove is located on the side of the first support layer near the binding portion, and the orthographic projection of the first buffer groove on the binding portion overlaps with the orthographic projection of at least a portion of the driving chip on the binding portion. This allows the first buffer groove to absorb and alleviate the deformation of the display panel when subjected to external impact, preventing stress from being directly transmitted to the driving chip, which could cause damage or cracks in the driving chip. This also avoids display problems such as vertical bright lines, screen misalignment, and image flicker caused by abnormal driving chip. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of the display module provided in an embodiment of the present utility model;

[0025] Figure 2 Provided for the embodiments of this utility model Figure 1 A schematic diagram of the first type of cross section corresponding to point A-Aˋ;

[0026] Figure 3 Provided for the embodiments of this utility model Figure 2 Enlarged view of point B in the middle;

[0027] Figure 4 This is a partial top view of the display module provided in an embodiment of the present utility model;

[0028] Figure 5 Provided for the embodiments of this utility model Figure 1 A schematic diagram of the second cross section corresponding to point A-Aˋ;

[0029] Figure 6 This is a schematic diagram of the structure of the display device provided in an embodiment of the present utility model. Detailed Implementation

[0030] The technical solutions in the embodiments of the present application will be clearly and completely described with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of the present application. In addition, it should be understood that the specific implementation described herein is only used to illustrate and explain the present application, and is not used to limit the present application. In the present application, unless stated otherwise, the orientation words such as "upper" and "lower" generally refer to the upper and lower of the device in the actual use or working mode, and specifically refer to the drawing direction in the drawings; and "inner" and "outer" refer to the outline of the device.

[0031] In addition, the terms "first" and "second" are only used for description purposes, and the features limited by "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more than two, unless otherwise explicitly specified and limited.

[0032] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting" and "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection; it can be mechanical connection, or electrical connection or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium; it can be the communication or interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0033] The following disclosure provides many different embodiments for implementing the different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application provides examples of various specific processes and materials, but those skilled in the art can realize the application of other processes and / or the use of other materials.

[0034] Please refer to Figure 1 , Figure 2 and Figure 3 ; wherein, Figure 1 is a structural schematic diagram of a display module provided by the embodiments of the present application; Figure 2 is a first cross-sectional schematic view of the display module provided by the embodiments of the present application at A-A' position; Figure 1 is a first cross-sectional schematic view of the display module provided by the embodiments of the present application at A-A' position; Figure 3 is a first cross-sectional schematic view of the display module provided by the embodiments of the present application at A-A' position; Figure 2An enlarged schematic view at B.

[0035] The embodiment provides a display module 1, which comprises a display panel 11, a first support layer 12, a second support layer 13 and an encapsulation structure 14; wherein the encapsulation structure 14 is located at the light-out side of the display panel 11, and the display panel 11 comprises but is not limited to an organic light-emitting diode display panel.

[0036] The display panel 11 comprises a planar part 111, a binding part 112 which is oppositely arranged with the planar part 111, and a bending part 113 which is connected between the planar part 111 and the binding part 112; the first support layer 12 is arranged between the planar part 111 and the binding part 112, the orthographic projection of the first support layer 12 on the binding part 112 is located in the binding part 112, and the material of the first support layer 12 comprises but is not limited to polyethylene terephthalate; the second support layer 13 is arranged between the planar part 111 and the first support layer 12, the second support layer 13 is arranged in overlap with the planar part 111, and the material of the second support layer 13 comprises but is not limited to a metal material or a plastic material, preferably one of aluminum alloy, stainless steel (SUS), injection-molded copper sheet, copper column or thermoplastic polymer structure material (ABS); when the material of the second support layer 13 is a metal material, the second support layer 13 has good heat conduction effect on the basis of strong support performance, so that the heat generated by the display panel 11 can be dissipated.

[0037] The display module 1 can further include a first back plate 15, a second back plate 16, a heat dissipation layer 17, a driving chip 18 and a circuit board 19. The first back plate 15 is located between the planar part 111 and the second support layer 13, and the first back plate 15 is arranged in overlap with the planar part 111. The second back plate 16 is located between the second support layer 13 and the binding part 112, and the second back plate 16 is arranged in overlap with the binding part 112. The orthographic projection of the first support layer 12 on the second back plate 16 is located in the second back plate 16. The heat dissipation layer 17 is arranged between the first back plate 15 and the second support layer 13, and the heat dissipation layer 17 includes, but is not limited to, a copper layer, a pressure-sensitive adhesive layer, a white emulsion layer, a foam rubber layer and a heat dissipation film layer arranged in sequence away from the second support layer 13. The driving chip 18 is arranged on the side of the binding part 112 away from the planar part 111, and the driving chip 18 is connected with the binding part 112. The circuit board 19 includes, but is not limited to, one of a flexible circuit board or a printed circuit board. The circuit board 19 is arranged on the side of the binding part 112 away from the planar part 111, and the circuit board 19 is located on the side of the driving chip 18 away from the bending part 113. The circuit board 19 is electrically connected with the binding part 112.

[0038] Further, the first support layer 12 is provided with a first buffer groove 121. The first buffer groove 121 is located on the side of the first support layer 12 close to the binding part 112. The orthographic projection of the first buffer groove 121 on the binding part 112 overlaps at least partially with the orthographic projection of the driving chip 18 on the binding part 112. Therefore, when the display module 1 is subjected to external force impact, the first buffer groove 121 can weaken the stress intensity acting on the driving chip 18, thereby improving the impact resistance of the driving chip 18 and avoiding the stress being directly transmitted to the driving chip 18, which can cause the driving chip 18 to be damaged or cracked.

[0039] Specifically, when the display module 1 is subjected to external force impact (for example, when the display module is subjected to a small ball drop test), due to the differences in rigidity, hardness, toughness and the like between the material of the binding part 112 and the material of the driving chip 18, the contact surface of the binding part 112 and the driving chip 18 is prone to become a stress concentration area, thereby causing the driving chip 18 to be damaged or cracked, and further causing the display module 1 to have display problems such as vertical bright lines, picture misalignment and image flicker due to the abnormal driving chip 18.

[0040] It can be understood that, by arranging the first support layer 12 between the flat portion 111 and the binding portion 112, the first support layer 12 is provided with a first buffer groove 121 located on a side of the first support layer 12 close to the binding portion 112, and a normal projection of the first buffer groove 121 on the binding portion 112 overlaps at least partially with a normal projection of the driving chip 18 on the binding portion 112, so that the first buffer groove 121 can serve as a buffer zone for absorbing and releasing stress, and when the display panel 11 deforms under external force, part of the stress can be absorbed by the first buffer groove 121, thereby reducing the stress intensity acting on the driving chip 18, reducing the mechanical impact directly borne by the driving chip 18, reducing the risk of physical damage or cracking of the driving chip 18, and further reducing the probability of occurrence of display abnormal phenomena (such as vertical bright lines, display distortion, etc.).

[0041] It should be noted that, in the thickness direction of the display panel 11, the cross-sectional shape of the first buffer groove 121 can be rectangular, trapezoidal, circular arc-shaped or any other shape, to adapt to different impact force distribution and mechanical requirements, thereby further improving the stress dispersion effect of the display panel 11; wherein the thickness direction of the display panel can be the Z direction in the coordinate system shown in FIG. 1. Figure 2

[0042] Further, the display module 1 further comprises a functional film layer 110 arranged on the light-out side of the display panel 11 and a protective layer arranged on one side of the bending portion 113, the functional film layer 110 is arranged between the encapsulation structure 14 and the display panel 11, and the functional film layer 110 comprises but is not limited to a polarizing plate 1101 arranged on the light-out side of the display panel 11, and a normal projection of the functional film layer 110 on a direction perpendicular to the display panel 11 covers the flat portion 111; the protective layer can extend from above the flat portion 111 to a side of the binding portion 112 away from the flat portion 111, and the protective layer can comprise light-curable resin; wherein in an embodiment, the protective layer can also be arranged in the same layer as the polarizing plate.

[0043] ​The encapsulation structure 14 is matched with the shape of the functional film layer 110, and the encapsulation structure 14 can be attached to the side of the functional film layer 110 away from the display panel 11 through a transparent optical adhesive 120 (Optically Clear Adhesive, OCA); the encapsulation structure 14 includes, but is not limited to, a flexible substrate 141, a flexible cover plate 142, and a repairable protective film 143 (Circulating Protective Film, CPF) away from the display panel 11 in turn; wherein the material of the flexible substrate 141 includes, but is not limited to, one of cover glass (Cover window, CW) and ultra-thin glass (Ultra-Thin Glass, UTG), and the flexible cover plate 142 includes, but is not limited to, a combination of a protective film (protect window, PW) and an optical adhesive; the repairable protective film 143 is located on the side of the encapsulation structure 14 away from the display panel 11, and the repairable protective film 143 can protect the cover glass or the ultra-thin glass on the inside with a higher price, and can be repeatedly replaced to keep the screen appearance beautiful.

[0044] Please continue to combine Figures 1 to 3 In an embodiment, the orthographic projection of the driving chip 18 on the binding portion 112 is located in the orthographic projection of the first buffer groove 121 on the binding portion 112, so that the first buffer groove 121 can directly correspond to and absorb the stress acting on the driving chip 18.

[0045] Specifically, when the display module 1 is deformed due to external force impact, the stress acting on the binding portion 112 will be transmitted to the area where the driving chip 18 is located, and the area will be deformed. By setting the orthographic projection of the driving chip 18 on the binding portion 112 to be located in the orthographic projection of the first buffer groove 121 on the binding portion 112, the first buffer groove can effectively disperse and alleviate part of the stress, avoid the stress from being concentrated and directly transmitted to the driving chip 18, and thus reduce the risk of damage, cracking or functional failure of the driving chip 18 due to excessive stress.

[0046] It can be understood that, by setting the orthographic projection of the driving chip 18 on the binding portion 112 to be located in the orthographic projection of the first buffer groove 121 on the binding portion 112, the impact resistance of the driving chip 18 is improved, the negative impact of external force impact on the overall stability and display effect of the display module 1 is reduced, and thus the reliability and durability of the display module 1 are improved, and the normal display function of the display module 1 under external force is ensured.

[0047] Further, the first buffer groove 121 penetrates the first support layer 12 along the thickness direction of the display panel 11, so as to further improve the stress dispersion and relief effect of the first buffer groove 121.

[0048] Specifically, when the display module 1 is deformed due to external force impact, since the first buffer groove 121 penetrates the first support layer 12 along the thickness direction of the display panel 11, the stress acting on the binding part 112 can be uniformly dispersed to each part of the first support layer 12 through the first buffer groove 121, so as to avoid that the stress concentration causes excessive impact force on the driving chip 18 and other components located on the binding part 112, thereby improving the impact resistance of the driving chip 18 and reducing display failure and other problems caused by external force.

[0049] Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 ; wherein, Figure 4 is a partial top view structure schematic diagram of the display module provided by the embodiment of the utility model.

[0050] In an embodiment, the driving chip 18 has a first spacing D between the orthographic projection of the driving chip 18 in the first buffer groove 121 and the inner wall of the first buffer groove 121, the first spacing D is greater than or equal to 200 microns and less than or equal to 300 microns, by controlling the size of the first spacing D, so as to avoid that the stress dispersion effect is affected due to that the space of the first buffer groove 121 is too small or too large; it should be noted that the first spacing D refers to the minimum horizontal distance between the orthographic projection of the driving chip and the inner wall of the first buffer groove, that is, along the length / width direction of the display panel, the spacing between the outer edge projection of the driving chip and the inner wall of the first buffer groove; wherein the length direction of the display panel can be the Y direction in Figure 1 , and the width direction of the display panel can be the X direction in Figure 1 .

[0051] Specifically, if the first spacing D is too small, when the display module 1 is deformed due to external force impact, the space of the first buffer groove 121 cannot fully absorb and disperse the stress of the external force acting on the driving chip 18, so as to cause stress concentration, thereby increasing the risk of damage or crack of the driving chip 18; and if the first spacing D is set to be too large, it can cause the weakening of the buffering effect, so as to fail to effectively reduce the force borne by the driving chip 18 when impacted, thereby affecting the impact resistance thereof.

[0052] It can be understood that the first distance D is greater than or equal to 200 microns and less than or equal to 300 microns, thereby ensuring that a local cavity is formed in the first support layer 12 when the display module 1 is impacted by an external force, and the first buffer groove 121 can provide additional space to relieve stress transmission; Specifically, the first buffer groove 121 can uniformly disperse the stress acting on the driving chip 18 to each part of the first support layer 12, thereby improving the impact resistance of the driving chip 18.

[0053] Please continue to combine Figures 1 to 4 In an embodiment, the display module 1 further comprises a second support layer 13, the second support layer 13 is arranged in overlap with the planar portion 111, the second support layer 13 is provided with a second buffer groove 131, the second buffer groove 131 is in communication with the first buffer groove 121, the first buffer groove 121 and the second buffer groove 131 can act together to form a continuous buffer zone; wherein the orthographic projection of the second buffer groove 131 on the binding portion 112 is arranged in overlap with at least part of the orthographic projection of the driving chip 18 on the binding portion 112, so that when the display module 1 is impacted by an external force, the first buffer groove 121 and the second buffer groove 131 jointly absorb and disperse the stress acting on the driving chip 18, further improve the impact resistance of the driving chip 18, avoid the stress directly transmitted to the driving chip 18, and cause the driving chip 18 to be damaged or cracked.

[0054] It can be understood that since the second buffer groove 131 is in communication with the first buffer groove 121, the second buffer groove 131 and the first buffer groove 121 can form a continuous stress dispersion path, so that the stress dispersed into the first support layer 12 by the first buffer groove 121 can be further transmitted to the second buffer groove 131 and dispersed into the second support layer 13 by the second buffer groove 131, thereby further reducing the stress intensity acting on the driving chip 18.

[0055] Further, the second buffer groove 131 penetrates at least part of the second support layer 13 along the thickness direction of the display panel 11, and the orthographic projection of the driving chip 18 on the binding portion 112 is located within the orthographic projection of the second buffer groove 131 on the binding portion 112, thereby ensuring that the driving chip 18, the first buffer groove 121 and the second buffer groove 131 are precisely docked, thereby avoiding the stress directly concentrated on the driving chip 18, further improving the impact resistance of the driving chip 18, and reducing the risk of damage, cracking or functional failure of the driving chip 18 caused by external impact.

[0056] Please continue to combineFigures 1 to 5 In an embodiment, the depth H of the second buffer groove in the thickness direction of the display panel is less than or equal to half of the thickness of the second support layer, so that the second buffer groove can effectively disperse stress and relieve impact, while the second support layer is not weakened in structural strength due to the second buffer groove being too deep, thereby affecting the structural stability and load-bearing capacity of the second support layer.

[0057] Further, the depth H of the second buffer groove 131 in the thickness direction of the display panel 11 is greater than or equal to 60 microns and less than or equal to 100 microns, and by controlling the depth H of the second buffer groove 131 within this range, the stress absorption and dispersion capacity of the second buffer groove 131 under external force can be effectively enhanced, and stress is avoided from being directly concentrated on the driving chip 18, thereby improving the overall impact resistance of the display module 1.

[0058] Please refer to Figure 1 and Figure 5 ; wherein, Figure 5 is a second cross-sectional view of the display module 1 according to an embodiment of the present application. Figure 1

[0059] In an embodiment, the display module 1 further comprises a buffer portion 130, which is arranged in the first buffer groove 121, and the elastic modulus of the buffer portion 130 is less than that of the first support layer 12, thereby further enhancing the stress absorption capacity of the first buffer groove 121 when the display module 1 is subjected to external force impact.

[0060] Further, the buffer portion 130 is arranged in spaced relation to the inner wall of the first buffer groove 121, and the thickness of the buffer portion 130 in the thickness direction of the display panel 11 is less than the depth of the first buffer groove 121, so that when the display module 1 is subjected to external force impact, the buffer portion 130 and the inner wall of the first buffer groove 121 do not directly contact each other, thereby avoiding possible friction or compression between the buffer portion 130 and the inner wall of the first buffer groove 121, and preventing stress from being unevenly distributed at the contact surface between the buffer portion 130 and the inner wall of the first buffer groove 121, so that stress can be more evenly dispersed and absorbed, thereby further improving the impact resistance and stability of the display module 1.

[0061] It should be noted that the material of the buffer portion 130 is not specifically limited in the present embodiment; different materials can be selected according to actual application requirements; for example, materials such as rubber, silicone, polyurethane, etc. having appropriate elastic modulus can be selected, which can deform under external force and return to the original state, thereby improving the impact resistance of the display module. ​

[0062] Specifically, the first support layer 12 is provided with a first buffer groove 121, the second support layer 13 is provided with a second buffer groove 131, the second buffer groove 131 is communicated with the first buffer groove 121, thereby forming a local cavity in the first support layer 12 and the second support layer 13, so that the first buffer groove 121 and the second buffer groove 131 can provide additional space to relieve stress transmission when the display module 1 is impacted by external force, thereby enhancing the stress dispersion effect, and further avoiding excessive stress concentration on the driving chip 18, and improving the impact resistance of the driving chip 18; wherein the first buffer groove 121 is provided with a buffer portion 130, the buffer portion 130 has a lower elastic modulus, and can effectively absorb the deformation energy generated by external force impact, when the display panel 11 is subjected to external force, the buffer portion 130 absorbs part of the energy by deformation and disperses stress, thereby reducing the direct effect of stress on the driving chip 18, and further improving the impact resistance of the driving chip 18.

[0063] Please refer to Figure 6 The structural schematic diagram of the display device provided by the embodiment of the utility model.

[0064] The embodiment also provides a display device 2, which comprises the display module 1 described in any of the above embodiments.

[0065] It can be understood that the display module 1 has been described in detail in the above embodiments, and will not be repeated here.

[0066] The display device 2 also comprises a housing 21, which is combined with the display module 1 as a whole to provide support and protection for the display module 1.

[0067] In specific applications, the display device 2 can be at least one of a smart phone, a tablet computer, a mobile phone, a video phone, an electronic book reader, a desktop computer, a laptop computer, a netbook, a workstation, a server, a personal digital assistant, a portable media player, an MP3 player, a mobile medical machine, a camera, a game machine, a digital camera, a car navigation device, an electronic billboard, an automatic teller machine or a wearable device, etc.

[0068] In the above embodiments, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the relevant description of other embodiments.

[0069] The display module and the display device provided by the embodiments of the present application are described in detail, and the principles and implementation manners of the present application are described by applying specific examples, and the above embodiment is only used to help understand the technical solutions and the core ideas of the present application; those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced equivalently; and the modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display module, characterized by The display module comprises: a display panel comprising a planar portion, a binding portion arranged opposite to the planar portion, and a bending portion connected between the planar portion and the binding portion; a first support layer arranged between the planar portion and the binding portion, wherein a projection of the first support layer on the binding portion is located in the binding portion; a driving chip arranged on a side of the binding portion away from the planar portion, wherein the driving chip is connected with the binding portion; wherein the first support layer is provided with a first buffer groove, the first buffer groove is located on a side of the first support layer close to the binding portion, and a projection of the first buffer groove on the binding portion overlaps at least part of a projection of the driving chip on the binding portion.

2. The display module of claim 1, wherein, The projection of the driving chip on the binding portion is located in the projection of the first buffer groove on the binding portion.

3. The display module of claim 2, wherein, The first buffer groove penetrates the first support layer along a thickness direction of the display panel.

4. The display module of claim 2, wherein, A first spacing is provided between a projection of the driving chip in the first buffer groove and an inner wall of the first buffer groove, the first spacing is greater than or equal to 200 microns and less than or equal to 300 microns.

5. The display module of any one of claims 1 to 4, wherein, The display module further comprises a second support layer, the second support layer is arranged to overlap the planar portion, the second support layer is provided with a second buffer groove, and the second buffer groove is in communication with the first buffer groove; wherein a projection of the second buffer groove on the binding portion overlaps at least part of a projection of the driving chip on the binding portion.

6. The display module of claim 5, wherein, The second buffer groove penetrates at least part of the second support layer along a thickness direction of the display panel, and the projection of the driving chip on the binding portion is located in the projection of the second buffer groove on the binding portion.

7. The display module of claim 6, wherein, Along the thickness direction of the display panel, a depth of the second buffer groove is less than or equal to half of a thickness of the second support layer.

8. The display module of claim 6, wherein, The depth of the second buffer groove in the thickness direction of the display panel is greater than or equal to 60 microns and less than or equal to 100 microns.

9. The display module of any one of claims 1-4, wherein, The display module further comprises a buffer portion arranged in the first buffer groove, an elastic modulus of the buffer portion is less than an elastic modulus of the first support layer; wherein the buffer portion is arranged to be spaced apart from the inner wall of the first buffer groove, and along the thickness direction of the display panel, a thickness of the buffer portion is less than a depth of the first buffer groove.

10. A display device, characterized by comprising: The display module comprises any one of claims 1 to 9.

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