Silicon wafer bearing device and solar cell production system

Abstract

The utility model relates to a silicon wafer bearing device and a solar cell production system. The silicon wafer bearing device comprises a carrier plate main body and a bearing piece, the carrier plate main body is provided with a plurality of concave parts which are arranged at intervals, and the adjacent concave parts are separated from each other by virtue of a dike part; the bearing piece is detachably arranged in the concave part; wherein the embankment part corresponding to each concave part is provided with a first bearing part, and the bearing piece is provided with a second bearing part which is closer to the geometric center of the concave part than the first bearing part. The bearing part is detachably arranged in the concave part, and the second bearing part on the bearing part is used for bearing the silicon wafers, so that the silicon wafers with different sizes can be borne. Moreover, the bearing piece can be flexibly replaced, so that the silicon wafer bearing device can bear silicon wafers of various sizes in a compatible manner. According to the silicon wafer bearing device, the bearing requirements of silicon wafers of various sizes are met through replacement of the bearing pieces, multiple first bearing parts do not need to be arranged on the carrier plate main body, and the thickness of the carrier plate main body cannot be increased.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of solar cells, in particular to a silicon wafer carrying device and a solar cell production system. BACKGROUND

[0002] Solar energy is an important energy for sustainable development of human society as it is widely distributed, inexhaustible and green. At present, the main form of solar energy utilization is photovoltaic power generation. Solar cells can convert solar energy into electrical energy, which is convenient for storage and transportation, and thus can be applied to various fields.

[0003] A silicon wafer is an important component of a solar cell, and a carrying device is needed to carry the silicon wafer during transportation or processing. Generally, a receiving groove is arranged on the carrying device to position the silicon wafer in the receiving groove. However, the size of the receiving groove cannot be adjusted, and only one size of silicon wafer can be accommodated. Different sizes of silicon wafers need to be customized with different specifications of carrying devices.

[0004] In some related technologies, multiple steps are arranged in the receiving groove to accommodate and support silicon wafers of different sizes. However, the size of the silicon wafer that can be accommodated is limited due to the size of the receiving groove, and different sizes of silicon wafers still need to be configured with multiple specifications of carrying devices. At the same time, the more steps arranged in the receiving groove, the greater the thickness of the carrying device needs to be to ensure the strength of the carrying device, which increases the manufacturing difficulty and cost of the carrying device. UTILITY MODEL CONTENT

[0005] Therefore, it is necessary to provide a silicon wafer carrying device and a solar cell production system, which can carry silicon wafers of multiple sizes while taking into account the strength of the carrying device without increasing the thickness of the carrying device.

[0006] In a first aspect, the present application provides a silicon wafer carrying device, comprising:

[0007] a carrier plate body, the carrier plate body is configured with multiple grooves arranged at intervals; wherein adjacent grooves are spaced apart by a bank; and

[0008] a carrying member, which is detachably arranged in the groove;

[0009] wherein the bank corresponding to each groove is provided with a first carrying part, and the carrying member is provided with a second carrying part closer to the geometric center of the groove than the first carrying part.

[0010] In some embodiments, the carrying member is provided with a positioning part matched with the bank.

[0011] In some embodiments, the carrier is provided with a hollow portion in a middle portion of the carrier;

[0012] The positioning portion is located on a side of the carrier away from the hollow portion, and the second carrier portion is located on another side of the carrier close to the hollow portion.

[0013] In some embodiments, the bank portion is provided with a matching portion adapted to the positioning portion;

[0014] The first carrier portion is multiplexed as the matching portion.

[0015] In some embodiments, when the positioning portion of the carrier is adapted to the matching portion, a side surface of the carrier away from the bottom surface of the recess is flush with the upper surface of the bank portion.

[0016] In some embodiments, the first carrier portion is configured as a first stepped portion;

[0017] The positioning portion is configured as a flange adapted to the first carrier portion.

[0018] In some embodiments, when the positioning portion of the carrier is adapted to the matching portion, a side surface of the carrier facing the bottom surface of the recess abuts the bottom surface of the recess.

[0019] In some embodiments, the first carrier portion is configured as a first stepped portion; and / or

[0020] The second carrier portion is configured as a second stepped portion.

[0021] In some embodiments, the first carrier portion has a first carrier surface, and the second carrier portion has a second carrier surface;

[0022] The first carrier surface and the second carrier surface are arranged staggered in a direction in which the bank portion points to the geometric center of the recess.

[0023] In some embodiments, the first carrier surface and the second carrier surface are arranged parallel.

[0024] In some embodiments, the carrier is provided with a plurality of the second carrier portions;

[0025] The plurality of the second carrier surfaces on the same carrier are arranged staggered in a direction in which the bank portion points to the geometric center of the recess;

[0026] The plurality of the second carrier surfaces on the same carrier are arranged staggered in a depth direction of the recess.

[0027] In some embodiments, one of the plurality of the second carrier surfaces on the same carrier is in the same plane as the first carrier surface.

[0028] In some embodiments, an axis passing through the geometric center of the recess and parallel to the depth direction of the recess is defined as a reference axis;

[0029] The first bearing part corresponding to each recess is configured to be arranged at least partially around the reference axis.

[0030] In some embodiments, the first bearing part corresponding to each recess is configured as a continuous structure around the reference axis.

[0031] In some embodiments, an axis passing through the geometric center of the recess and parallel to the depth direction of the recess is defined as a reference axis;

[0032] The second bearing part corresponding to each recess is configured to be arranged at least partially around the reference axis.

[0033] In some embodiments, the second bearing part corresponding to each recess is configured as a continuous structure around the reference axis.

[0034] In some embodiments, the silicon wafer bearing device comprises a plurality of specifications of the bearing member;

[0035] The second bearing part has a stop surface for stopping the side edge of the silicon wafer, and the stop surface of the bearing member closest to the bank in different specifications is not equal in distance from the bank in the direction in which the bank points to the geometric center of the recess.

[0036] In a second aspect, the present application also provides a solar cell production system, comprising a conveying device, a silicon wafer processing device, and a silicon wafer bearing device as in the above embodiments;

[0037] The conveying device is used to convey the silicon wafer bearing device bearing the silicon wafer to the silicon wafer processing device, and the silicon wafer processing device is used to process the silicon wafer conveyed thereto.

[0038] The above silicon wafer bearing device bears at least one size of silicon wafer by arranging the first bearing part on the bank of the carrier plate main body. The bearing member is detachably arranged in the recess, and the second bearing part on the bearing member bears the silicon wafer. The second bearing part is closer to the geometric center of the recess than the bank, so that the second bearing part and the first bearing part can bear silicon wafers of different sizes. Moreover, the bearing member can be detachably arranged on the carrier plate main body, and a plurality of sizes of bearing members can be flexibly replaced, so that the silicon wafer bearing device can be compatible with bearing a plurality of sizes of silicon wafers. The silicon wafer bearing device meets the bearing requirements of silicon wafers of multiple sizes by replacing the bearing member, and multiple first bearing parts do not need to be arranged on the carrier plate main body, so that the thickness of the carrier plate main body is not increased, which is conducive to reducing the manufacturing difficulty and manufacturing cost of the silicon wafer bearing device. Attached Figure Description

[0039] Figure 1 A top view of the carrier plate body provided in an embodiment of this application;

[0040] Figure 2 A top view of a carrier provided in an embodiment of this application;

[0041] Figure 3 A partial cross-sectional view of the carrier plate body provided in an embodiment of this application;

[0042] Figure 4 for Figure 3 Enlarged structural diagram at point A in the middle;

[0043] Figure 5 A partial cross-sectional view of a carrier substrate carrying a silicon wafer, provided in an embodiment of this application;

[0044] Figure 6 A partial top view of the carrier plate body provided in an embodiment of this application;

[0045] Figure 7 This is a schematic diagram of the assembly structure of the carrier and the main body of the carrier plate provided in an embodiment of this application;

[0046] Figure 8 for Figure 7 Enlarged structural diagram at point A in the middle;

[0047] Figure 9 This is a partial structural diagram of a silicon wafer carrier device provided in an embodiment of this application when it carries a silicon wafer.

[0048] Explanation of reference numerals in the attached figures:

[0049] 100. Silicon wafers;

[0050] 1. Carrier plate body; 11. Recess; 12. Embankment; 121. First bearing part; 1211. First bearing surface; 1212. First stop surface; 14. Bottom plate; 141. Air hole;

[0051] 2. Bearing component; 21. Second bearing part; 211. Second bearing surface; 212. Second stop surface; 22. Hollowed-out part; 23. Positioning part. Detailed Implementation

[0052] In order to make the above objectives, features and advantages of the present application more clear and comprehensible, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of different ways beyond the specific embodiments described herein and by one of ordinary skill in the art without departing from the spirit and scope of the present application, and it is therefore intended that all such variations be considered as falling within the scope of the present application. It should be understood that the use of the terms "include", "comprise" or "contain" herein should not be understood as limiting the present application to the features or steps described herein, but rather the use of these terms is intended to cover the presence of the features or steps described herein as well as the presence of other features or steps not described herein.

[0053] In the description of the present application, it should be understood that, if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0054] In addition, if these terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features referred to. Therefore, the features defined with "first", "second" can include at least one of the features explicitly or implicitly. In the description of the present application, if the term "a plurality of" appears, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0055] In the present application, unless otherwise specifically defined and limited, if the terms "mount", "connect", "connect", "fix" and the like appear, these terms should be interpreted broadly. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication or interaction relationship of two elements, unless otherwise specifically limited. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0056] In the present application, unless specifically defined otherwise, if there is a description of a first feature on or above or below a second feature, it can mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature can be above or above and above the second feature, or it can only mean that the first feature is higher in height than the second feature. The first feature can be below or below and below the second feature, or it can only mean that the first feature is lower in height than the second feature.

[0057] It should be noted that if an element is referred to as being "fixed" or "set" on another element, it can be directly on the other element or there can be an intermediate element. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be an intermediate element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are for illustrative purposes only and do not represent the only implementation.

[0058] Figure 1 A top view of a carrier body 1 is shown according to an embodiment of the present application; Figure 2 A top view of a carrier 2 is shown according to an embodiment of the present application; Figure 3 A partial cross-sectional view of a carrier body 1 is shown according to an embodiment of the present application.

[0059] As shown in Figures 1-3 At least one embodiment of the present application provides a silicon wafer carrier device for carrying a silicon wafer 100 (see Figure 5 ) to facilitate the transportation or processing of the silicon wafer 100.

[0060] The silicon wafer carrier device includes a carrier body 1 and a carrier 2. The carrier body 1 is configured with a plurality of recesses 11 arranged at intervals. Adjacent recesses 11 are spaced apart from each other by means of a bank 12. The carrier 2 is detachably arranged in the recess 11. In some embodiments, the bank 12 is arranged on one side surface of the carrier body 1 to define a plurality of recesses 11 arranged at intervals. Of course, in other embodiments, a plurality of recesses 11 can be configured on the carrier body 1, and the banks 12 described above are formed between the recesses 11, which are not limited herein.

[0061] For example, as shown in Figure 1As shown, the carrier plate body 1 is provided with five rows and nine columns of embankments 12 in a crisscross manner, and the carrier plate body 1 is divided into sixty concave parts 11. Of course, the present application does not limit the number and shape of the concave parts 11, and in other embodiments, the carrier plate body 1 and the concave parts 11 can be specifically designed according to the structural parameters (such as length and width) of the silicon wafer 100.

[0062] As shown in the embodiments of the present application, Figure 2 and Figure 3 The embankment 12 corresponding to each concave part 11 is provided with a first bearing part 121, and the bearing part 2 is provided with a second bearing part 21 closer to the geometric center of the concave part 11 than the first bearing part 121, and the first bearing part 121 and the second bearing part 21 are both used to bear the silicon wafer 100.

[0063] In this way, by providing the first bearing part 121 on the embankment 12 of the carrier plate body 1, the first bearing part 121 bears at least one size of silicon wafer 100. By detachably providing the bearing part 2 in the concave part 11, the second bearing part 21 on the bearing part 2 is used to bear the silicon wafer 100, and the second bearing part 21 is closer to the geometric center of the concave part 11 than the embankment 12, so that the second bearing part 21 and the first bearing part 121 can bear silicon wafers 100 of different sizes. Moreover, since the bearing part 2 is detachably provided on the carrier plate body 1, a plurality of sizes of bearing parts 2 can be flexibly replaced, so that the silicon wafer bearing device can be compatible with bearing a plurality of sizes of silicon wafers 100. The present silicon wafer bearing device meets the bearing requirements of silicon wafers 100 of multiple sizes by replacing the bearing part 2, and does not need to provide multiple first bearing parts 121 on the carrier plate body 1, so as not to increase the thickness of the carrier plate body 1, which is beneficial to reduce the manufacturing difficulty and manufacturing cost of the silicon wafer bearing device.

[0064] It can be understood that the shape of the silicon wafer 100 is usually rectangular, and in some embodiments, the shape of the concave part 11 can be set as rectangular, and the first bearing part 121 and the second bearing part 21 can support the four side edges of the silicon wafer 100, so that the silicon wafer 100 is stably supported and positioned. In other embodiments, the silicon wafer 100 can also be circular, and the shape of the concave part 11 can be correspondingly set as circular, and the first bearing part 121 and the second bearing part 21 can support the circumferential edge of the silicon wafer 100.

[0065] In some embodiments, the first bearing part 121 is configured as a first step part. As shown in Figures 3-5As shown, the first step portion has a first bearing surface 1211 for supporting the lower surface of the silicon wafer 100, and a first stop surface 1212 for stopping the side surface of the silicon wafer 100. In this way, the first bearing surface 1211 of the first bearing portion 121 is spaced apart from the bottom surface of the recess 11, so as to avoid a large contact area between the silicon wafer 100 and the carrier body 1, and thus avoid damage to the silicon wafer 100. This is beneficial for protecting the silicon wafer 100 and facilitating the taking and placing of the silicon wafer 100.

[0066] It should be noted that the inventors of the present application have found that, when the silicon wafer 100 is placed on the first bearing portion 121, the lower surface of the silicon wafer 100 is in contact with the first bearing surface 1211, and the side edge of the silicon wafer 100 is in contact with the first stop surface 1212, so as to form a closed space between the silicon wafer 100 and the recess 11. During the process of taking out the silicon wafer 100 along the depth direction of the recess 11, the volume of the closed space gradually increases, so as to cause the pressure in the closed space to decrease, and thus a negative pressure is formed on the silicon wafer 100, which increases the difficulty of taking out the silicon wafer 100. To solve this problem, in some embodiments, as shown in Figure 6 the bottom surface of the recess 11 is provided with a plurality of air holes 141 in communication with the outside, so that external air can enter the closed space formed by the silicon wafer 100 and the recess 11, and thus the pressure in the closed space is kept stable during the process of taking out the silicon wafer 100, so as to avoid the formation of a negative pressure on the silicon wafer 100, and thus the silicon wafer 100 can be conveniently taken off the first bearing portion 121.

[0067] It should be understood that the second bearing portion 21 can also be configured as a second step portion. As shown in Figures 7-9 the second step portion has a second bearing surface 211 for supporting the lower surface of the silicon wafer 100, and a second stop surface 212 for stopping the side surface of the silicon wafer 100. In this way, the support and positioning of the silicon wafer 100 can be achieved. Similarly, to avoid a large contact area between the silicon wafer 100 and the carrier 2, in some embodiments, referring to Figure 2 the carrier 2 is provided with a hollow portion 22 located at the middle portion of the carrier 2. In this way, a space is provided for the taking and placing of the silicon wafer 100 on the carrier 2. At the same time, by providing the hollow portion 22, the silicon wafer 100 is in gas communication with the air holes 141 on the bottom surface of the recess 11, so as to avoid the formation of a negative pressure on the silicon wafer 100 by the carrier 2, and thus the silicon wafer 100 can be conveniently taken off the second bearing portion 21.

[0068] In some embodiments, as shown in Figure 8As shown, the carrier 2 is provided with a positioning portion 23 cooperating with the bank portion 12. The positioning portion 23 cooperates with the bank portion 12 to position the carrier 2. It can be understood that, to stably support and position the carrier 2 with the main body 1 of the carrier plate, the positioning portion 23 needs to be adapted to the configuration of at least part of the structure of the bank portion 12, so as to avoid relative movement of the carrier 2 during the transfer and processing of the silicon wafer 100, and thus cause damage to the silicon wafer 100 or affect the processing precision.

[0069] As shown in Figure 7 and Figure 8 , the carrier 2 is provided with a hollow portion 22 at the middle of the carrier 2, the positioning portion 23 is located on the side of the carrier 2 away from the hollow portion 22, and the second carrier portion 21 is located on the other side of the carrier 2 close to the hollow portion 22. That is, the positioning portion 23 is arranged on the side of the carrier 2 away from the geometric center of the recess 11, and the second carrier portion 21 is arranged on the other side of the carrier 2 close to the geometric center of the recess 11. When the carrier 2 is installed in the recess 11, the positioning portion 23 on the outer side of the carrier 2 cooperates with the bank portion 12 to position, the hollow portion 22 in the middle of the carrier 2 accommodates the silicon wafer 100, and the second carrier portion 21 close to the hollow portion 22 supports the side edge of the silicon wafer 100.

[0070] As shown in Figure 7 and Figure 8 , the bank portion 12 is provided with a cooperating portion adapted to the positioning portion 23, and the first carrier portion 121 is multiplexed as the cooperating portion. When the carrier 2 is installed, the positioning portion 23 is adapted to the first carrier portion 121 to position the carrier 2. In some embodiments, the first carrier portion 121 is configured as a first stepped portion, and the positioning portion 23 is configured as a flange adapted to the first stepped portion. By configuring the positioning portion 23 as a flange, the flange is supported on the first stepped portion, thereby achieving stable installation of the carrier 2. When the carrier 2 is installed, the carrier 2 is directly placed into the recess 11, so that the flange as the positioning portion 23 is supported on the first stepped portion as the first carrier portion 121, and when the carrier 2 is disassembled, the carrier 2 is directly taken out of the recess 11, which is convenient for disassembly and assembly. In other embodiments, the positioning portion 23 can also be arranged on the bottom side of the carrier 2, and a cooperating portion adapted to the positioning portion 23 is arranged on the bottom side of the recess 11, and the positioning portion 23 cooperates with the cooperating portion to position the carrier 2. For example, the positioning portion 23 and the cooperating portion can be arranged to be mutually clamped, for example, the cooperating portion is configured as a clamping groove, and the positioning portion 23 is configured as a clamping protrusion.

[0071] In some embodiments, when the positioning portion 23 of the carrier 2 is fitted to the fitting portion, the side surface of the carrier 2 away from the bottom surface of the recess 11 is flush with the upper surface of the bank 12. By setting the side surface of the carrier 2 away from the bottom surface of the recess 11 to be flush with the upper surface of the bank 12, the thickness of the silicon wafer carrying device is prevented from being increased due to the installation of the carrier 2, thereby ensuring the normal application of the silicon wafer carrying device in other processing or transfer equipment.

[0072] In some embodiments, when the positioning portion 23 of the carrier 2 is fitted to the fitting portion, the side surface of the carrier 2 facing the bottom surface of the recess 11 abuts against the bottom surface of the recess 11. By supporting the carrier 2 with the bottom surface of the recess 11, the firmness of the installation of the carrier 2 in the recess 11 is further improved.

[0073] In some embodiments, the bank 12 corresponding to each recess 11 is provided with a plurality of first bearing portions 121, and each first bearing portion 121 has a first bearing surface 1211. The plurality of first bearing surfaces 1211 are arranged staggered in the direction in which the bank 12 points to the geometric center of the recess 11, and the plurality of first bearing surfaces 1211 are arranged staggered in the depth direction of the recess 11. In this way, the plurality of first bearing surfaces 1211 have different distances to the geometric center of the recess 11, so that the first bearing portions 121 can carry silicon wafers 100 of different sizes. Further, to ensure the stable installation of the carrier 2, at least one first bearing portion 121 is reused as a fitting portion. For example, in some embodiments, the number of positioning portions 23 is one, and each positioning portion 23 is fitted to one of the plurality of first bearing portions 121. In other embodiments, the number of positioning portions 23 can also be multiple, and each positioning portion 23 is fitted to one first bearing portion 121, which is not limited herein.

[0074] In some embodiments, an axis passing through the geometric center of the recess 11 and parallel to the depth direction of the recess 11 is defined as a reference axis, and each first bearing portion 121 corresponding to each recess 11 is configured to be at least partially arranged around the reference axis. By arranging the first bearing portion 121 around the reference axis, the first bearing portion 121 provides support to the silicon wafer 100 at least around part of the edge of the silicon wafer 100, which is conducive to improving the stability of the support of the first bearing portion 121 to the silicon wafer 100. For example, when the silicon wafer 100 is rectangular, the first bearing portion 121 can provide support to all four sides of the silicon wafer 100, or can provide support to two opposite sides or three sides of the silicon wafer 100.

[0075] Further, in an embodiment, each first bearing portion 121 corresponding to each recess 11 is configured as a continuous structure around the reference axis, so that the first bearing portion 121 provides continuous support to the silicon wafer 100, which is conducive to increasing the contact area between the first bearing portion 121 and the silicon wafer 100, thereby preventing damage to the silicon wafer 100 caused by the first bearing portion 121.

[0076] It is emphasized that in other embodiments, each recess 11 can also correspond to a first bearing portion 121 configured as a discrete structure surrounding the reference axis, which is also capable of providing support to the silicon wafer 100. For example, the first bearing portion 121 comprises a plurality of first sub-bearing portions arranged at intervals, which are arranged around the aforementioned reference axis.

[0077] In some embodiments, in combination with Figure 8 and Figure 9 As shown, the first bearing surface 1211 and the second bearing surface 211 are arranged staggered in the direction in which the bank 12 points to the geometric center of the recess 11. In this way, the first bearing surface 1211 and the second bearing surface 211 are arranged at different distances to the geometric center of the recess 11, so that the first bearing portion 121 and the second bearing portion 21 are capable of bearing silicon wafers 100 of different sizes.

[0078] In some embodiments, the first bearing surface 1211 is arranged parallel to the second bearing surface 211, so that the silicon wafer 100 borne by the first bearing surface 1211 is parallel to the silicon wafer 100 borne by the second bearing surface 211, facilitating the positioning of the silicon wafer 100, and in turn facilitating the taking and placing of the silicon wafer 100 by a mechanical hand or other automated equipment. In some embodiments, the first bearing surface 1211 and the second bearing surface 211 are both parallel to the bottom surface of the recess 11. On the one hand, when the silicon wafer bearing device is placed horizontally, the first bearing surface 1211 and the second bearing surface 211 can remain horizontal, which is conducive to the stable placement of the silicon wafer 100 on the first bearing surface 1211 and the second bearing surface 211; on the other hand, it can keep a uniform spacing between the silicon wafer 100 and the bottom surface of the recess 11. When the closed space surrounded by the silicon wafer 100 and the recess 11 is used to build a negative pressure environment to adsorb the silicon wafer 100, the negative pressure is generated by the air extraction through the air holes 141 on the bottom plate 14, and the uniform spacing between the silicon wafer 100 and the bottom surface of the recess 11 is conducive to providing uniform adsorption force to the silicon wafer 100. When the silicon wafer 100 is taken away from the bearing member 2, the negative pressure environment of the closed space surrounded by the silicon wafer 100 and the recess 11 needs to be destroyed, and at this time, the uniform spacing between the silicon wafer 100 and the bottom surface of the recess 11 is conducive to the uniformity of the air intake of the closed space, and is more conducive to keeping the pressure in the closed space stable.

[0079] In some embodiments, the bearing member 2 is provided with a plurality of second bearing portions 21, and the plurality of second bearing surfaces 211 on the same bearing member 2 are arranged staggered in the direction in which the bank 12 points to the geometric center of the recess 11, and the plurality of second bearing surfaces 211 on the same bearing member 2 are arranged staggered in the depth direction of the recess 11. In this way, the plurality of second bearing portions 21 on the bearing member 2 are arranged in a stepped manner, realizing the bearing and positioning of silicon wafers 100 of multiple sizes.

[0080] Specifically, the plurality of second bearing surfaces 211 on the same bearing member 2 gradually move away from the bottom surface of the recess 11 from the geometric center of the recess 11 to the direction away from the geometric center of the recess 11, so as to avoid the second bearing part 21 close to the geometric center of the recess 11 interfering with the silicon wafer 100 on the second bearing part 21 away from the geometric center of the recess 11.

[0081] In some embodiments, one of the plurality of second bearing surfaces 211 on the same bearing member 2 is in the same plane as the first bearing surface 1211, so as to facilitate positioning of the second bearing part 21 of the one, and the other second bearing parts 21 can be positioned with reference to the second bearing part 21 of the one, so as to position the silicon wafer 100 on the second bearing part 21, facilitating taking and placing the silicon wafer 100 by a robot or other automated equipment.

[0082] In some embodiments, the second bearing part 21 corresponding to each recess 11 is at least partially configured to be disposed around a reference axis. By disposing the second bearing part 21 around the reference axis, the second bearing part 21 supports the silicon wafer 100 at least around part of the edge of the silicon wafer 100, which is conducive to improving the stability of the second bearing part 21 supporting the silicon wafer 100.

[0083] In an embodiment, the second bearing part 21 corresponding to each recess 11 is configured as a continuous structure around the reference axis, so that the second bearing part 21 provides continuous support to the silicon wafer 100, which is conducive to increasing the contact area between the second bearing part 21 and the silicon wafer 100, thereby preventing damage to the silicon wafer 100 by the second bearing part 21.

[0084] In another embodiment, the second bearing part 21 corresponding to each recess 11 is configured as a discrete structure around the reference axis, which can also provide support to the silicon wafer 100. For example, the second bearing part 21 includes a plurality of second sub-bearing parts arranged at intervals, and the plurality of second sub-bearing parts are disposed around the aforementioned reference axis.

[0085] In some embodiments, in combination with Figure 8 and Figure 9 As shown, the silicon wafer 100 bearing device includes bearing members 2 of multiple specifications, so that the bearing member 2 of an appropriate specification can be selected and installed in the recess 11 according to the size of the silicon wafer 100 to be actually borne.

[0086] In the bearing member 2, the second stop surface 212 for stopping the side edge of the silicon wafer 100 is provided, and the second stop surface 212 of the bearing member 2 of different specifications closest to the bank 12 is not equal in distance from the bank 12 in the direction in which the bank 12 points to the geometric center of the recess 11. By providing the second stop surface 212 to stop the side edge of the silicon wafer 100, the size of the silicon wafer 100 that can be borne by the second bearing part 21 is limited, and the silicon wafer 100 is prevented from moving randomly on the second bearing part 21.

[0087] For example, in Figure 4 and Figure 7 In the illustrated embodiment, the first support portion 121 has a first stop surface 1212, and the second support portion 21 has a second stop surface 212. The first stop surface 1212 and the second stop surface 212 are not equidistant from the embankment 12 in the direction pointing from the geometric center of the recess 11 to the embankment 12, thus allowing the support of silicon wafers 100 of different specifications. Similarly, the multiple second stop surfaces 212 of multiple second support portions 21 are not equidistant from the embankment 12 in the direction pointing from the geometric center of the recess 11, also allowing the support of silicon wafers 100 of various specifications. When the support member 2 is provided with multiple second support portions 21, the side of the second support portion 21 that is far from the geometric center of the recess 11 among two adjacent second support portions 21 can serve as the second stop surface 212 of the second support portion 21 that is close to the geometric center of the recess 11.

[0088] This application also provides a solar cell production system, including a conveying device, a silicon wafer processing device, and a silicon wafer carrier device as described in any of the above embodiments. The conveying device is used to convey the silicon wafer carrier device carrying the silicon wafer 100 to the silicon wafer processing device, and the silicon wafer processing device is used to process the conveyed silicon wafer 100.

[0089] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0090] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A silicon wafer carrier device, characterized in that, include: A carrier plate body having a plurality of spaced-apart recesses; wherein adjacent recesses are spaced apart by means of embankments; and A support member is detachably disposed in the recess; Each of the recesses is provided with a first bearing portion, and the bearing member is provided with a second bearing portion that is closer to the geometric center of the recess than the first bearing portion.

2. The silicon wafer carrier device according to claim 1, characterized in that, The supporting component is provided with a positioning part that cooperates with the embankment.

3. The silicon wafer carrier device according to claim 2, characterized in that, The support member is provided with a hollow portion located in the middle of the support member; The positioning part is located on the side of the support member away from the hollow part, and the second support part is located on the other side of the support member closer to the hollow part.

4. The silicon wafer carrier device according to claim 2, characterized in that, The embankment is provided with a mating part that is adapted to the positioning part; The first supporting part is reused as the mating part.

5. The silicon wafer support device according to claim 4, characterized in that, When the positioning part of the carrier is adapted to the mating part, the side surface of the carrier facing away from the bottom surface of the recess is flush with the upper surface of the embankment.

6. The silicon wafer carrier device according to claim 4, characterized in that, The first bearing portion is constructed as a first stepped portion; The positioning part is constructed as a flange that is adapted to the first bearing part.

7. The silicon wafer carrier device according to claim 6, characterized in that, When the positioning part of the carrier is adapted to the mating part, the side surface of the carrier facing the bottom surface of the recess abuts against the bottom surface of the recess.

8. The silicon wafer carrier device according to any one of claims 1-7, characterized in that, The first supporting part is constructed as a first stepped part; and / or The second supporting part is constructed as a second stepped part.

9. The silicon wafer carrier device according to any one of claims 1-7, characterized in that, The first bearing portion has a first bearing surface, and the second bearing portion has a second bearing surface; The first bearing surface and the second bearing surface are staggered in the direction from the geometric center of the embankment to the recess.

10. The silicon wafer carrier device according to claim 9, characterized in that, The first bearing surface and the second bearing surface are arranged parallel to each other.

11. The silicon wafer carrier device according to claim 9, characterized in that, The carrier is provided with a plurality of second carrier portions; Multiple second bearing surfaces on the same bearing member are staggered in the direction from the geometric center of the embankment to the recess. Multiple second bearing surfaces on the same bearing member are staggered in the depth direction of the recess.

12. The silicon wafer carrier device according to claim 11, characterized in that, One of the plurality of second bearing surfaces on the same bearing member is located in the same plane as the first bearing surface.

13. The silicon wafer carrier device according to any one of claims 1-7, characterized in that, The axis passing through the geometric center of the recess and parallel to the depth direction of the recess is defined as the reference axis; The first support portion corresponding to each of the recesses is configured to be arranged at least partially around the reference axis.

14. The silicon wafer support device according to claim 13, characterized in that, The first bearing portion corresponding to each of the recesses is constructed as a continuous structure surrounding the reference axis.

15. The silicon wafer carrier device according to any one of claims 1-7, characterized in that, The axis passing through the geometric center of the recess and parallel to the recess is defined as the reference axis; The second support portion corresponding to each of the recesses is configured to at least partially surround the reference axis.

16. The silicon wafer carrier device according to claim 15, characterized in that, The second bearing portion corresponding to each of the recesses is constructed as a continuous structure surrounding the reference axis.

17. The silicon wafer carrier according to any one of claims 1-7, characterized in that, The silicon wafer carrier device includes carrier components of various specifications; The second carrier portion has a second stop surface for stopping the side of the silicon wafer. The second stop surface closest to the embankment in different sizes of the carrier portion is not equidistant from the embankment in the direction from the geometric center of the embankment to the recess.

18. A solar cell production system, characterized in that, Includes a conveying device, a silicon wafer processing device, and a silicon wafer carrier as described in any one of claims 1-17; The conveying device is used to convey the silicon wafer carrier carrying the silicon wafer to the silicon wafer processing device, and the silicon wafer processing device is used to process the conveyed silicon wafer.

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