Semiconductor laser

Abstract

A semiconductor laser comprises a laser cavity and a front cover, a water inlet channel and a water outlet channel are vertically formed in the laser cavity, and the water inlet channel and the water outlet channel are communicated through a module sub-module; the water inlet channel and the water outlet channel are symmetrically divided into a plurality of independent sub-water channels in parallel in the vertical direction; a plurality of groups of module sub-modules are arranged in parallel in the vertical direction, and each group of module sub-modules comprises an independent cavity; the plurality of independent water inlet sub-water channels are sequentially and correspondingly communicated with the plurality of independent water outlet sub-water channels through the independent cavities of the plurality of groups of module sub-modules; water flow flows into the water inlet channel from the water inlet and is divided into water inlet independent sub-water channels, the independent cavities of the module sub-modules correspond to the water inlet independent sub-water channels respectively and are communicated with water for heat dissipation, and then the independent cavities flow out, converge into the water outlet independent sub-water channels respectively and flow out from the water outlet. Current is input from the positive electrode of the lead electrode and flows through the laser chips packaged on the module sub-modules, and the module sub-modules are connected in series to work. The utility model has the advantages of product miniaturization, convenience in after-sales maintenance and the like.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor laser, specifically relates to a semiconductor laser. BACKGROUND

[0002] With the change of market, the requirement of laser on market also increases, on the basis of guaranteeing quality, the model of customer demand is also various, among which there are damaged lasers needing after-sales maintenance, and the after-sales maintenance is time-consuming and high in round-trip cost.

[0003] The existing laser is single-row integral packaging, and because of large packaging surface, stress is large in high-low temperature cycle and water flow impact use, and there is a great risk of burning or even breaking of single or multiple laser chips, and the laser needs to be returned to the factory for re-melting of packaging solder, removal of abnormal chips and replacement of chips, so that the maintenance cost is high and the duration is long.

[0004] The single-row sub-module packaging scheme of the existing laser is complex in maintenance and disassembly, has many parts, and when one sub-module is disassembled, the remaining sub-modules are in loose state, which requires high operation ability of the customer and needs to be returned to the factory for maintenance.

[0005] The modular subassembly of the existing laser is designed in a split type, which can solve the packaging and use stress problems, but still cannot guarantee the convenience in after-sales maintenance, and still needs to be returned to the factory for maintenance, which is low in efficiency and high in cost. SUMMARY

[0006] In order to overcome the deficiencies of the prior art, the utility model aims at providing a semiconductor laser, which solves the risk of virtual connection of circuit connection through the water and electricity design structure and packaging performance of multiple modular submodules, realizes the convenience of quick disassembly and maintenance of modular submodules, has the advantages of solving the after-sales service problem of terminal customers, saves the maintenance cost of customers and improves the product use efficiency.

[0007] In order to achieve the above purpose, the utility model adopts the technical scheme of:

[0008] A semiconductor laser comprises a laser cavity 101 and a front cover 102 matched with the laser cavity 101, a water inlet channel 1011 and a water outlet channel 1012 are vertically arranged in the laser cavity 101, and the water inlet channel 1011 and the water outlet channel 1012 are connected through a modular sub-module 104;

[0009] The water inlet channel 1011 is provided with multiple water inlet independent sub-channels 1015 in parallel in the vertical direction, and the water outlet channel 1012 is provided with multiple water outlet independent sub-channels 1016 in parallel in the vertical direction, and the multiple water inlet independent sub-channels 1015 and the multiple water outlet independent sub-channels 1016 are arranged in parallel in the vertical direction in one-to-one correspondence.

[0010] The module sub-module 104 is provided with multiple groups in parallel in the vertical direction, and each group of module sub-modules 104 includes an independent chamber, and the chamber is provided with a heat dissipation tooth inside;

[0011] The multiple water inlet independent sub-channels 1015 of the water inlet channel 1011 are sequentially connected in communication with the multiple water outlet independent sub-channels 1016 of the water outlet channel 1012 through the independent chambers of the multiple groups of module sub-modules 104;

[0012] The multiple water inlet independent sub-channels 1015 of the water inlet channel 1011 are connected in communication with the water inlet 1013 provided at the bottom of the laser cavity 101, and the multiple water outlet independent sub-channels 1016 of the water outlet channel 1012 are connected in communication with the water outlet 1014 provided at the bottom of the laser cavity 101.

[0013] The multiple water inlet independent sub-channels 1015 of the water inlet channel 1011 and the multiple water outlet independent sub-channels 1016 of the water outlet channel 1012 are all provided as three, the module sub-module 104 is provided as three groups, the three water inlet independent sub-channels 1015 of the water inlet channel 1011 are sequentially connected in communication with the three water outlet independent sub-channels 1016 of the water outlet channel 1012 through the independent chambers of the three groups of module sub-modules 104, and the three groups of module sub-modules 104 are sequentially fixed on the positioning surface of the laser cavity 101 along the vertical direction through the fastening screws 106.

[0014] The laser cavity 101 and the front cover 102 are connected through the main body screw 107.

[0015] A sealing ring 108 is arranged between the laser cavity 101 and the front cover 102, the sealing ring 108 is arranged around the edge of the splicing part of the laser cavity 101 and the front cover 102, and plays a sealing role.

[0016] The inside of the front cover 102 is a hollow structure, which is used for placing the module sub-module 104 on the laser cavity 101.

[0017] The window sheet 105 is installed on the connecting surface of the front cover 102 away from the laser cavity 101.

[0018] The laser chip and the red copper electrode are packaged on the module sub-module 104, a plurality of module sub-modules 104 are connected in series, the module sub-modules 104 at two ends are connected to the positive electrode and the negative electrode of the lead electrode 103 respectively, the positive electrode and the negative electrode of the lead electrode 103 are externally connected to a power supply, input from the positive electrode of the lead electrode 103, flow through the laser chip and the red copper electrode packaged on the module sub-module 104, and output from the negative electrode of the lead electrode 103.

[0019] The input end of the lead electrode 103 is the positive electrode, the output end is the negative electrode, the positive electrode is connected to the input end of the laser chip packaged on the module sub-module 104, and the output end of the laser chip is connected to the negative electrode of the lead electrode 103.

[0020] The utility model discloses beneficial effect:

[0021] In the utility model, a plurality of module sub-modules 104 are packaged and are shunted above multiple channels, can prevent the stress deformation caused by the expansion in the heat dissipation tooth cavity when working under large water pressure.

[0022] In the utility model, the multiple water inlet independent sub-water channels 1015 of the water inlet channel 1011 are sequentially connected in communication with the multiple water outlet independent sub-water channels 1016 of the water outlet channel 1012 through the independent cavities of the multiple module sub-modules 104, one module sub-module 104 can be replaced with a new one when burning out, and the structure design has solved the difficulty and positioning problem of water hole alignment and circuit connection during assembly.

[0023] In the utility model, in the collimation aspect, because the gap between each module sub-module 104 is small, the laser chip spacing between the module sub-modules 104 is basically consistent with the normal packaging chip spacing, so that the product collimation can completely realize parallel light output, and there is no weak light area. ACCURACY

[0024] Fig. 1 is a semiconductor laser waterway structure schematic diagram of the utility model embodiment, wherein, Fig. 1 (a) is a semiconductor laser waterway internal structure schematic diagram, Fig. 1 (b) is the overhead view of semiconductor laser.

[0025] Fig. 2 is a semiconductor laser circuit structure schematic diagram of the utility model embodiment, wherein, Fig. 2 (a) is a semiconductor laser circuit internal structure schematic diagram, Fig. 2 (b) is the solid drawing of semiconductor laser.

[0026] Fig. 3 is a semiconductor laser overall structure schematic diagram of the utility model embodiment, wherein, Fig. 3 (a) is semiconductor laser overall structure schematic diagram A, Fig. 3 (b) is semiconductor laser overall structure schematic diagram B.

[0027] Wherein, 101: laser cavity, 1011: water inlet, 1012: water outlet, 1013: water inlet, 1014: water outlet, 1015: water independent sub-channel, 1016: water independent sub-channel, 102: front cover, 103: lead electrode, 104: module sub-module, 105: window piece, 106: fastening screw, 107: main body screw, 108: sealing ring, 109: first bridge electrode, 110: copper foil tape, 111: second bridge electrode. DETAILED DESCRIPTION

[0028] The utility model will be described in further detail below with reference to the drawings.

[0029] A semiconductor laser comprises a semiconductor laser water and electricity design and a replaceable module sub-module structure design, both of which are designed to facilitate the disassembly of the product and enhance the customer experience without affecting the normal performance.

[0030] As shown in FIG. 1, in terms of water flow: the water flow flows into the water inlet 1013 of the laser cavity 101, then immediately splits into three water independent sub-channels 1015, while three independent chambers of three module sub-modules 104 correspond to the three water independent sub-channels 1015 for three-row parallel connection water heat dissipation, the water flow flows into the heat dissipation teeth of the chamber, then flows out and respectively flows into the three water independent sub-channels 1016 of the water outlet 1012 of the laser cavity 101, forming three channels, and finally flows out from the water outlet 1014 of the laser cavity 101, the sealing ring 108 is arranged between the laser cavity 101 and the front cover 102 for cavity sealing, and a waterproof hammer effect structure is designed.

[0031] This parallel structure also makes the water flow more smooth, avoids the generation of water flow bubbles, and each water flow is cooled, the cavity is small, and various problems caused by working stress can be more effectively solved, and the three-row heat dissipation teeth independently dissipate heat and do not affect each other, so the heat dissipation performance is better.

[0032] A sealing ring is arranged between the inlet of each module sub-module 104 and the outlet of each water independent sub-channel 1015, and between the outlet of each module sub-module 104 and the inlet of each water independent sub-channel 1016.

[0033] As shown in Figure 2, the circuit aspect: the current from the lead electrode 103 positive input, through the first bridge electrode 109 positive end, and then along the first copper foil tape 110 positive end to the first module sub-module 104 on the package of copper electrode and laser chip, after work current continues to flow to the first copper foil tape 110 negative end, and then through the second bridge electrode 111 to the second module sub-module 104 to work, and so on in the third module sub-module 104 work is completed, through the negative end of the first bridge electrode 109 to the lead electrode 103 negative output, all the laser chip light normal work. The connection between the lead electrode 103, the first bridge electrode 109, the second bridge electrode 111 and the copper foil tape 110 is the fastening screw 106 external force compression, which avoids the risk of virtual connection of the circuit to a certain extent. In the circuit, the three module sub-modules 104 work in series, the circuit connection between the lead electrode 103 and the module sub-module 104 is the first bridge electrode 109, the second bridge electrode 111 interconnects the copper foil tape 110 between each module sub-module 104, ensuring that the circuit is mutually conductive, and the circuit is designed with an insulating structure to insulate the laser cavity 101, as shown by the arrow in Figure 2 for the current direction. The positive and negative of the lead electrode 103 are connected to the external power supply for power supply.

[0034] If customers need higher power laser, just change the longitudinal size of the laser cavity 101 and the front cover 102, stack 3 or more module sub-modules 104 to improve power, where the module sub-module 104, the lead electrode 103 and the rest of the materials are compatible, which saves material costs and improves peak power.

[0035] As shown in Figure 3, the laser, 3 groups of module sub-modules 104, are fixed on the positioning surface of the laser cavity 101 respectively, and are locked by 3 fastening screws 106. In the process of using by the end customer, if one of the module sub-modules 104 is abnormally burned out and cannot be used, it needs to be replaced. If it is returned to the factory for repair, it will consume a lot of manpower, financial resources and time. Therefore, this structure only needs to replace the abnormal module sub-module 104 to realize self-repair, which mainly reflects in:

[0036] ① The module sub-module 104 is prefabricated and produced on demand for standby inventory, and the customer is advised to prepare in advance according to the warranty period.

[0037] ②Remove two main screws 107, take off the front cover 102, then remove the corresponding burned module sub-module 104 rear end of a fastening screw 106, take off the burned module sub-module 104, replace the new one and reinstall, and the circuit and waterway are processed accordingly, without deliberately reassembling or replacing the auxiliary material, with repeated positioning structure for clamping, locking the corresponding screw to complete the repair. Burned module sub-module 104 can be uniformly analyzed and processed later, saving a lot of after-sales cycle and improving work efficiency.

[0038] ③The secondary assembly will not affect the sealing of the laser cavity, the laser cavity 101 and the front cover 102 are air sealed by the sealing ring 108, and the window sheet 105 of the light outlet is bonded by high-temperature resistant silicone rubber, which can ensure the sealing of the laser for a long time.

[0039] With reference to the embodiments, the working principle of the utility model is:

[0040] The water flows into the water inlet 1013 of the laser cavity 101, and then immediately splits into three independent water inlets 1015, while the three independent chambers of the three module sub-modules 104 correspond to the three independent water inlets 1015 for three-row parallel water cooling, and the water flows into the cooling teeth of the chamber, and then flows out and is respectively collected into the three independent water outlets 1016 of the water outlet 1012 of the laser cavity 101, forming three channels, and finally flows out from the water outlet 1014 of the laser cavity 101, and the sealing ring is arranged between each component for waterway sealing;

[0041] The current flows from the positive electrode of the lead electrode 103, flows through the laser chip packaged on the module sub-module 104, and the three module sub-modules 104 are connected in series in the circuit.

[0042] The three module sub-modules 104 are respectively fixed on the positioning surface of the laser cavity 101 and are locked by three fastening screws 106. If the product needs to be repaired, two main screws 107 are removed, the front cover 102 is taken off, then one fastening screw 106 corresponding to the burned module sub-module 104 at the rear end is removed, the burned module sub-module 104 is taken off, and the new one is replaced and reinstalled. The secondary assembly will not affect the sealing of the laser cavity, the laser cavity 101 and the front cover 102 are air sealed by the sealing ring 108, and the window sheet 105 of the light outlet is bonded by high-temperature resistant silicone rubber, which can ensure the sealing of the laser for a long time.

Claims

1. A semiconductor laser, characterized by, Including laser cavity (101) and front cover (102) matched with laser cavity (101), water inlet channel (1011) and water outlet channel (1012) are vertically arranged in laser cavity (101), and water inlet channel (1011) and water outlet channel (1012) are communicated by module submodule (104); Multiple water inlet independent subchannels (1015) of water inlet channel (1011) are arranged in parallel in vertical direction, multiple water outlet independent subchannels (1016) of water outlet channel (1012) are arranged in parallel in vertical direction, and multiple water inlet independent subchannels (1015) and multiple water outlet independent subchannels (1016) are arranged in parallel in vertical direction in one-to-one symmetry; Multiple groups of module submodules (104) are arranged in parallel in vertical direction, each group of module submodules (104) includes an independent chamber, and the chamber is internally provided with heat dissipation teeth; Multiple water inlet independent subchannels (1015) of water inlet channel (1011) are sequentially communicated with multiple water outlet independent subchannels (1016) of water outlet channel (1012) through independent chambers of multiple groups of module submodules (104).

2. A semiconductor laser as claimed in claim 1, characterized in that Multiple water inlet independent subchannels (1015) of water inlet channel (1011) are all communicated with water inlet (1013) arranged at the bottom of laser cavity (101); multiple water outlet independent subchannels (1016) of water outlet channel (1012) are all communicated with water outlet (1014) arranged at the bottom of laser cavity (101).

3. The semiconductor laser of claim 1, wherein Multiple water inlet independent subchannels (1015) of water inlet channel (1011) and multiple water outlet independent subchannels (1016) of water outlet channel (1012) are all provided as 3, module submodules (104) are provided as 3 groups, 3 water inlet independent subchannels (1015) of water inlet channel (1011) are sequentially communicated with 3 water outlet independent subchannels (1016) of water outlet channel (1012) through independent chambers of three groups of module submodules (104); three groups of module submodules (104) are fixedly arranged on the positioning surface of laser cavity (101) along vertical direction through fastening screws (106).

4. The semiconductor laser of claim 1, wherein, Laser cavity (101) and front cover (102) are connected through main body screw (107).

5. The semiconductor laser of claim 1, wherein, Sealing ring (108) is arranged between laser cavity (101) and front cover (102), sealing ring (108) is arranged around the edge of the joint of laser cavity (101) and front cover (102), and plays a sealing role.

6. The semiconductor laser of claim 1, wherein, The inside of front cover (102) is a hollow structure for placing module submodule (104) on laser cavity (101).

7. The semiconductor laser of claim 1, wherein Window sheet (105) is installed on the connecting surface of front cover (102) away from laser cavity (101).

8. The semiconductor laser of claim 1, wherein, The laser chip and the red copper electrode are packaged on the module sub-module (104), the working modes of the plurality of module sub-modules (104) are series connection, the module sub-modules (104) at two ends are connected with the positive and negative poles of the lead electrode (103) respectively, the positive and negative poles of the lead electrode (103) are externally connected with the power supply, the input is from the positive pole of the lead electrode (103), the laser chip and the red copper electrode packaged on the module sub-module (104) are passed through, and the output is from the negative pole of the lead electrode (103).

9. A semiconductor laser as claimed in claim 8, characterized in that The input end of the lead electrode (103) is the positive pole, the output end is the negative pole, the positive pole is connected with the input end of the laser chip packaged on the module sub-module (104), and the output end of the laser chip is connected with the negative pole of the lead electrode (103).

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