Board card interconnection structure and optical module test equipment
The separate design of the board interconnection structure enables flexible replacement of the motherboard and test board, solves the problems of limited lifespan of optical module connectors and inflexible test settings, reduces replacement costs and improves anti-interference capability.
Patent Information
- Application Number
- CN202423237471.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2034-12-26
AI Technical Summary
The limited mating and unmating life of existing optical module connectors leads to unstable signal impedance matching, increases testing costs, and the existing test setup is not flexible enough to quickly adapt to the needs of optical modules with different speeds and package types.
The board interconnection structure adopts a separate design, which realizes high-speed communication interconnection between the motherboard and the test board through the first and second high-speed signal RF connectors and differential wiring layers. It supports flexible replacement of the motherboard and test board to adapt to the testing requirements of optical modules with different speeds and packages, and only the test board needs to be replaced when the optical module connector reaches the end of its life to reduce costs.
It enables flexible replacement of the motherboard and test board while ensuring signal integrity, reduces replacement costs, improves anti-interference capabilities, and adapts to the testing needs of optical modules with different packages.
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Figure CN223584184U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of optical modules, and particularly relates to a board card interconnection structure and an optical module test device. BACKGROUND
[0002] In modern communication systems, a high-speed error code instrument (BERT, Bit Error Rate Tester) is a key tool for evaluating the reliability of a data transmission system. With the continuous improvement of communication rates, especially for 56G PAM4 (Pulse Amplitude Modulation
[0003] 4-level) and higher rate signals such as 112G PAM4, higher requirements are placed on the functional indicators and system performance of the error code instrument. In order to ensure the accuracy of the test, the error code instrument must have the following characteristics:
[0004] Phase synchronization: ensures the synchronization of the clock between the sending end and the receiving end, so as to reduce the error codes caused by clock offset.
[0005] Low jitter: control the time jitter in the signal to avoid data errors caused by jitter.
[0006] Low noise: reduce the noise introduced inside and outside the circuit to ensure the integrity of the signal.
[0007] High bandwidth: support the transmission of high-speed signals to cover the current and future possible communication rate requirements.
[0008] In order to meet the above performance requirements, especially for signals at 56G PAM4 and above, reducing signal attenuation and interference is the key to improving channel bandwidth and error code instrument measurement accuracy. Traditional methods usually include:
[0009] Shorten the signal path: by integrating the main board and the test board on the same printed circuit board (PCB), the length and complexity of the signal transmission path are reduced, thereby reducing signal attenuation and interference during transmission.
[0010] Optimize the PCB design: direct and short-distance connection of signals helps to maintain signal stability and integrity. Integrated design allows designers to precisely control the layout of signal lines, impedance matching, and signal path isolation to optimize signal transmission quality.
[0011] However, in actual applications, especially in large-scale production testing by optical module manufacturers, there are some problems with fixed-position optical module connectors:
[0012] Limited plug-in life: Optical module connectors have a limited service life and can usually only withstand a few hundred plug-in operations. After this number of operations, the signal impedance matching of the connector becomes unstable, which can cause the bit error rate to rise. This makes it difficult to distinguish between problems with the optical module itself or problems caused by the aging of the connector.
[0013] Cost issues: Since optical module connectors cannot be easily disassembled and welded, once their service life is over or they fail, the entire PCB board usually needs to be replaced, which increases testing costs.
[0014] Lack of flexibility: For optical modules of different rates and packaging types, existing test settings are not flexible enough to quickly adapt to new test requirements. Invention content
[0015] The present application aims to at least solve one of the technical problems existing in the prior art, and discloses a board card interconnection structure and an optical module test device.
[0016] In a first aspect, the present application provides a board card interconnection structure for communicating and interconnecting a digital signal processor on a mainboard with an optical module connector on a test board; the board card interconnection structure comprises: a first high-speed signal radio frequency connector and a first differential trace layer arranged on the mainboard, and a second high-speed signal radio frequency connector and a second differential trace layer arranged on the test board.
[0017] The first end of the first high-speed signal radio frequency connector is in communication connection with the digital signal processor through the first differential trace layer, the first end of the second high-speed signal radio frequency connector is in communication connection with the optical module connector through the second differential trace layer, and the second end of the first high-speed signal radio frequency connector is in communication connection with the second end of the second high-speed signal radio frequency connector.
[0018] In some possible embodiments, the first high-speed signal radio frequency connector comprises a plurality of first connection sleeves and a plurality of first connection cable cores inserted into the plurality of first connection sleeves; the second high-speed signal radio frequency connector comprises a plurality of second connection sleeves and a plurality of second connection cable cores inserted into the plurality of second connection sleeves; wherein,
[0019] The first connection sleeve and the second connection sleeve are arranged on the side of the mainboard and the test board opposite to each other, respectively;
[0020] The first end of the first connection cable core is in communication connection with the digital signal processor on the mainboard, the first end of the second connection cable core is in communication connection with the optical module connector on the test board, and the second ends of the first connection cable core and the second connection cable core are in plug-in communication connection.
[0021] In some possible embodiments, the board card interconnection structure further comprises a radio frequency connection cable, the radio frequency connection cable comprising a radio frequency connection sleeve and a connection cable core inserted into the radio frequency connection sleeve;
[0022] The first high-speed signal radio frequency connector comprises a first radio frequency cable seat welded to the main board and a first connection cable core inserted into the first radio frequency cable seat, and the second high-speed signal radio frequency connector comprises a second radio frequency cable seat welded to the test board and a second connection cable core inserted into the second radio frequency cable seat;
[0023] The first end of the first connection cable core is in communication connection with the digital signal processor on the main board, the first end of the second connection cable core is in communication connection with the optical module connector on the test board, and the two ends of the connection cable are respectively in plug-in communication connection with the second ends of the first connection cable core and the second connection cable core.
[0024] In some possible embodiments, the board card interconnection structure further comprises a radio frequency connection cable, the radio frequency connection cable comprising a radio frequency connection sleeve and a connection cable core inserted into the radio frequency connection sleeve;
[0025] The first high-speed signal radio frequency connector comprises a first radio frequency cable seat mechanically fixed to the main board, and the second high-speed signal radio frequency connector comprises a second radio frequency cable seat mechanically fixed to the test board;
[0026] The first end of the connection cable core is inserted into the first radio frequency cable seat and in communication connection with the digital signal processor, and the second end of the connection cable core is inserted into the second radio frequency cable seat and in communication connection with the optical module connector.
[0027] In some possible embodiments, the first radio frequency cable seat is fixed to the main board by a first fastener, and / or the second radio frequency cable seat is fixed to the test board by a second fastener.
[0028] In some possible embodiments, two of the first high-speed signal radio frequency connectors are symmetrically arranged on the main board, one of the first high-speed signal radio frequency connectors serving as a signal transmitter and the other serving as a signal receiver;
[0029] Two of the second high-speed signal radio frequency connectors are symmetrically arranged on the test board, one of the second high-speed signal radio frequency connectors serving as a signal transmitter and the other serving as a signal receiver.
[0030] In some possible embodiments, the second differential trace layer comprises a plurality of groups of differential trace sub-layers, and an isolation ground copper and / or an isolation ground hole is arranged between each group of differential trace sub-layers.
[0031] In some possible embodiments, the first row of gold finger high-speed signal lines and the second row of gold finger high-speed signal lines of the optical module connector are located in different differential wiring sub-layers, and at least one isolation layer is arranged between the different differential wiring sub-layers.
[0032] In some possible embodiments, the lengths of the differential wirings in each group of differential wiring sub-layers are consistent.
[0033] In the second aspect, the embodiments of the present application provide an optical module test device, which comprises the board interconnection structure described above.
[0034] Advantages:
[0035] The embodiments of the present application provide a board interconnection structure and an optical module test device. The main board on which a digital signal processor is located and the test board on which an optical module connector is located are designed separately, and the first high-speed signal radio frequency connector, the second high-speed signal radio frequency connector, the first differential wiring layer and the second differential wiring layer are arranged, so that the high-speed communication and interconnection between the digital signal processor on the main board and the optical module connector on the test board are ensured, the rate can be upgraded or downgraded flexibly by replacing the main board under the condition of ensuring signal integrity, different packaged optical modules can be tested flexibly by replacing the test board, and the test board only needs to be replaced when the service life of the optical module connector reaches the upper limit, so that the cost of the board interconnection structure is effectively reduced. In addition, the differential wiring is less affected by external crosstalk because the effective value of the transmitted signal is the differential mode signal on the differential line, the crosstalk influence of the common mode electromagnetic field can be effectively suppressed, and the anti-interference ability is effectively improved. BRIEF DESCRIPTION OF DRAWINGS
[0036] The above and other features, advantages, and aspects of the embodiments of the present application will become more apparent with reference to the following detailed description when taken in conjunction with the accompanying drawings. Throughout the drawings, the same or similar reference numerals are used to represent the same or similar elements. It should be understood that the drawings are schematic, and elements and elements are not necessarily drawn to scale.
[0037] Figure 1 FIG. 1 is a structural schematic diagram of a board interconnection structure according to an embodiment of the present application;
[0038] Figure 2 FIG. 2 is a structural schematic diagram of a board interconnection structure according to another embodiment of the present application;
[0039] Figure 3 FIG. 3 is a structural schematic diagram of a board interconnection structure according to another embodiment of the present application;
[0040] Figure 4 FIG. 4 is a structural schematic diagram of a board interconnection structure according to another embodiment of the present application;
[0041] Figure 5 A schematic diagram of a second differential trace layer on a test board of another embodiment of the present application. DETAILED DESCRIPTION
[0042] In order to better understand the technical solutions of the present application, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the described embodiments of the present application, all other embodiments obtained by those skilled in the art without any creative effort fall within the scope of protection of the present application.
[0043] Unless otherwise specifically defined, the technical terms or scientific terms used in the embodiments of the present application shall be understood as the common meanings thereof by those skilled in the art to which the present application belongs. The embodiments of the present application use “include” or “contain” and the like neither limit the mentioned shapes, numbers, steps, actions, operations, components, elements and / or their groups, nor exclude the presence or addition of one or more other different shapes, numbers, steps, actions, operations, components, elements and / or their groups, or addition of these. In addition, the terms “first”, “second” are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number and order of the indicated technical features. Therefore, the features with “first”, “second” can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, the meaning of “multiple” is two or more, unless otherwise specifically limited.
[0044] Unless otherwise specifically defined, the relative arrangement of the components and steps, numerical expressions and values of the components and steps set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for the convenience of description, the sizes of the various parts shown in the drawings are not drawn in accordance with the actual proportional relationship, and the technology, method and equipment known to those skilled in the related art can not be discussed in detail, but in appropriate cases, the shown technology, method and equipment should be regarded as part of the authorized specification. In all the examples shown and discussed here, any specific other example can have different values. It should be noted that similar symbols and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.
[0045] In the description of the embodiments of the present application, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the embodiments of the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the embodiments of the present application and the features of the different embodiments or examples without contradiction.
[0046] Figure 1 The structural diagram of the board card interconnection structure of the embodiments of the present application is shown. As shown in Figure 1 The board card interconnection structure 100 of the embodiments of the present application is used to communicate and interconnect the digital signal processor 201 on the main board 200 and the optical module connector 301 on the test board 300. The board card interconnection structure 100 comprises: the first high-speed signal radio frequency connector 110 and the first differential wire layer 120 arranged on the main board 200, and the second high-speed signal radio frequency connector 130 and the second differential wire layer 140 arranged on the test board 300.
[0047] Specifically, as shown in Figure 1 The first end of the first high-speed signal radio frequency connector 110 is connected in communication with the digital signal processor 201 through the first differential wire layer 120, the first end of the second high-speed signal radio frequency connector 130 is connected in communication with the optical module connector 301 through the second differential wire layer 140, and the second end of the first high-speed signal radio frequency connector 110 is connected in communication with the second end of the second high-speed signal radio frequency connector 130.
[0048] The board card interconnection structure of the embodiments of the present application separates the main board where the digital signal processor is located and the test board where the optical module connector is located, and through the first high-speed signal radio frequency connector, the second high-speed signal radio frequency connector, the first differential wire layer and the second differential wire layer, the high-speed communication and interconnection of the digital signal processor on the main board and the optical module connector on the test board is ensured, the rate upgrade and downgrade of the main board can be flexibly replaced under the condition of ensuring the integrity of the signal, and the test board can also be flexibly replaced for testing different packaged optical modules, in addition, when the service life of the optical module connector reaches the upper limit, only the test board needs to be replaced, which effectively reduces the cost of the board card interconnection structure. In addition, the differential wire is less affected by external crosstalk because the effective value of the transmitted signal is the differential mode signal on the differential wire, which can effectively suppress the crosstalk of the common mode electromagnetic field and effectively improve the anti-interference ability.
[0049] For example, Figure 2 This is a schematic diagram of a board interconnection structure according to another embodiment of this application. Figure 2 As shown, the first high-speed signal RF connector 110 includes multiple first connecting sleeves and multiple first connecting cable cores coaxially inserted within the multiple first connecting sleeves. The second high-speed signal RF connector 130 includes multiple second connecting sleeves and multiple second connecting cable cores coaxially inserted within the multiple second connecting sleeves. In other words, both the first high-speed signal RF connector 110 and the second high-speed signal RF connector 130 use coaxial connectors. The coaxial design effectively isolates internal signals from external interference sources, greatly reducing crosstalk between different signal lines. Furthermore, the coaxial design helps maintain signal integrity, especially for high-frequency signals, as its design minimizes signal reflection, attenuation, and other forms of loss.
[0050] Specifically, such as Figure 2 As shown, the first connecting sleeve and the second connecting sleeve are respectively disposed on the opposite sides of the motherboard 200 and the test board 300. That is to say, as Figure 2 As shown, the first connecting sleeve can be fixed to the end of the motherboard 200 facing the test board 300, and the second connecting sleeve can be fixed to the end of the test board 300 facing the motherboard 200. Furthermore, the first end of the first connecting cable core is communicatively connected to the digital signal processor 201 on the motherboard 200, and the first end of the second connecting cable core is communicatively connected to the optical module connector 301 on the test board 300. The second ends of the first connecting cable core and the second connecting cable core are plugged into each other for communication, thereby realizing board-to-board interconnection between the motherboard 200 and the test board 300, eliminating the need for cable structures, and making it suitable for use in compact devices.
[0051] For example, Figure 3 This is a schematic diagram of a board interconnection structure according to another embodiment of this application. Figure 3As shown, the board card interconnection structure 100 further comprises a radio frequency connection cable 150, which comprises a radio frequency connection sleeve and a plurality of connection cable cores coaxially inserted into the radio frequency connection sleeve. That is, the radio frequency connection cable 150 can be a plurality of radio frequency connection cables. The first high-speed signal radio frequency connector 110 comprises a first radio frequency cable seat welded to the main board 200 and a first connection cable core coaxially inserted into the first radio frequency cable seat, and the second high-speed signal radio frequency connector 130 comprises a second radio frequency cable seat welded to the test board 300 and a second connection cable core coaxially inserted into the second radio frequency cable seat. The first end of the first connection cable core is in communication connection with the digital signal processor 201 on the main board 200, and the first end of the second connection cable core is in communication connection with the optical module connector 301 on the test board 300. The two ends of the connection cable core are respectively in plug-in communication connection with the second ends of the first connection cable core and the second connection cable core.
[0052] The board card interconnection structure of the embodiment of the present application, by welding corresponding radio frequency cable seats on the main board and the test board, the radio frequency welding seats are usually designed to be very strong and can withstand certain mechanical stress without affecting the performance. They are directly fixed on the main board and the test board by welding, providing extremely high mechanical stability, reducing the problem of poor contact caused by vibration or impact. In addition, high-quality radio frequency connectors use precision manufacturing processes to ensure stable electrical characteristics such as impedance matching, low insertion loss and low reflection coefficient, which helps to maintain signal integrity and reduce errors in transmission.
[0053] Exemplary, Figure 4 The structural schematic diagram of the board card interconnection structure of another embodiment of the present application. As Figure 4 As shown, the first high-speed signal radio frequency connector 110 comprises a first radio frequency cable seat mechanically fixed on the main board 200, and the second high-speed signal radio frequency connector 130 comprises a second radio frequency cable seat mechanically fixed on the test board 300. The first end of the connection cable core is inserted into the first radio frequency cable seat and in communication connection with the digital signal processor 201, and the second end of the connection cable core is inserted into the second radio frequency cable seat and in communication connection with the optical module connector 301.
[0054] The board card interconnection structure of the embodiment of the application directly fixes the RF cable seat of the high-speed signal RF connector on the main board and the test board through a mechanical structure, and directly fixes the cable core of the RF cable on the solder pad of the main board and the test board, thereby avoiding the disadvantages of RF cable seat welding, such as high requirements for the welding factory, strict control of the tin amount and welding temperature curve, otherwise tin overflow, tin climbing, tin deficiency and virtual welding will cause impedance mutation in the transmission link. In addition, this fixing mode can also ensure the integrity of the RF signal and the performance is not affected, mainly in the design of the size of the solder pad and the control of the through-hole precision to ensure that the center of the cable transmission line corresponds to the center of the solder pad, thereby ensuring the impedance continuity of the transmission line, and the detachable form further reduces the cost of the main board and the test board when they are replaced.
[0055] In some embodiments, the first RF cable seat is fixed on the main board 200 through a first fastener, and the second RF cable seat is fixed on the test board 300 through a second fastener.
[0056] It should be noted that the first high-speed signal RF connector and the second high-speed signal RF connector mentioned above are both coaxial RF connectors, the head of the RF connector is directly fixed on the corresponding main board and test board through welding or screws, and the coaxial signal line core of the RF connector is welded with the solder pad on the corresponding main board and test board, so as to realize the communication and interconnection of the two.
[0057] For example, as shown in Figure 3 two first high-speed signal RF connectors 110 are symmetrically arranged on the main board 200, one of which is used as a signal transmitter and the other is used as a signal receiver. Two second high-speed signal RF connectors 130 are symmetrically arranged on the test board 300, one of which is used as a signal transmitter and the other is used as a signal receiver.
[0058] For example, Figure 5 is a schematic view of the second differential wiring layer on the test board according to another embodiment of the application. As shown in Figure 5 the second differential wiring layer 140 includes a plurality of groups of differential wiring sub-layers, and an isolation ground copper 141 and / or an isolation ground hole 142 is arranged between each group of differential wiring sub-layers. The board card interconnection structure of the embodiment of the application adopts a plurality of groups of differential wiring forms, the design impedance can be differential 100Ω, and the isolation ground copper and the isolation ground hole between the differential pairs can better suppress common mode noise, reduce electromagnetic radiation, and improve the signal-to-noise ratio (SNR) of the signal.
[0059] Specifically, as shown in Figure 5 A row of isolation ground holes 142 can be punched along the transmission direction of the differential pair, which can effectively confine the electromagnetic field energy between the isolation ground holes 142 and the upper and lower copper skins, avoid the energy coupling out of the differential line to interfere with the adjacent lines, and also prevent external energy from entering the transmission line.
[0060] Exemplarily, as shown in Figure 5 The first row of gold finger high-speed signal lines and the second row of gold finger high-speed signal lines of the optical module connector 301 are located in different differential line sublayers, and at least one isolation ground layer is arranged between the different differential line sublayers.
[0061] Specifically, as shown in Figure 5 In some embodiments, the first row of gold finger high-speed signal lines of the optical module connector 301 can be the second layer, and the second row of gold finger high-speed signal lines can be the seventh layer. There are more isolation ground layers between the two groups of signal lines, which effectively prevent the crosstalk between the radio frequency signals.
[0062] In some embodiments, the lengths of the differential lines in each differential line sublayer can be inconsistent. Preferably, in some embodiments, the lengths of the differential lines in each differential line sublayer are consistent, so that when the optical module is tested, the test results of each channel of the optical module can be ensured to be in the same test environment, and the attenuation of each signal line can be ensured to be consistent. For example, the lengths of the differential signal pairs are strictly equal to <1 mil, which ensures the consistency of the phases of the differential signals, and the lengths of the 16 differential pairs are equal to <1 mil, which ensures the consistency of each group of signals. Finally, the consistency is reflected in the consistency of the bit error rate of each channel of the optical module.
[0063] Based on the same inventive concept, the embodiments of the present application also provide an optical module test device, which comprises the board card interconnection structure described above. The board card interconnection structure can be specifically referred to the related description above, and will not be repeated here.
[0064] The optical module test device of the embodiment of the present application has the board interconnection structure as described above, the main board where the digital signal processor is located and the test board where the optical module connector is located are designed separately, and the high-speed signal radio frequency connector, the second high-speed signal radio frequency connector, the first differential wiring layer and the second differential wiring layer are arranged to ensure the high-speed communication interconnection between the digital signal processor on the main board and the optical module connector on the test board, to realize the flexible replacement of the main board for the upgrade and downgrade of the speed under the condition of ensuring the signal integrity, and the test board can also be replaced flexibly for the test of different packaged optical modules, in addition, when the service life of the optical module connector reaches the upper limit, only the test board needs to be replaced, thereby effectively reducing the cost of the board interconnection structure. In addition, the differential wiring is less affected by external crosstalk because the effective value of the transmission signal is the differential mode signal on the differential line, which can effectively suppress the crosstalk influence of the common mode electromagnetic field and effectively improve the anti-interference ability.
[0065] It can be understood that the above embodiments are only exemplary embodiments adopted for illustrating the principles of the present application, and the present application is not limited thereto. Various modifications and improvements can be made by those skilled in the art without departing from the spirit and essence of the present application, and these modifications and improvements are also considered as the protection scope of the present application.
Claims
1. A board interconnection structure, characterized by comprising: A digital signal processor on a mainboard is connected with an optical module connector on a test board through a board card interconnection structure; The board card interconnection structure comprises a first high-speed signal radio frequency connector and a first differential trace layer arranged on the mainboard, and a second high-speed signal radio frequency connector and a second differential trace layer arranged on the test board; A first end of the first high-speed signal radio frequency connector is connected with the digital signal processor through the first differential trace layer, a first end of the second high-speed signal radio frequency connector is connected with the optical module connector through the second differential trace layer, and a second end of the first high-speed signal radio frequency connector is connected with a second end of the second high-speed signal radio frequency connector.
2. The board interconnection structure of claim 1, wherein The first high-speed signal radio frequency connector comprises a plurality of first connecting sleeves and a plurality of first connecting cable cores inserted into the plurality of first connecting sleeves; the second high-speed signal radio frequency connector comprises a plurality of second connecting sleeves and a plurality of second connecting cable cores inserted into the plurality of second connecting sleeves; wherein, The first connecting sleeves and the second connecting sleeves are arranged on opposite sides of the mainboard and the test board respectively; A first end of the first connecting cable core is connected with the digital signal processor on the mainboard, a first end of the second connecting cable core is connected with the optical module connector on the test board, and second ends of the first connecting cable core and the second connecting cable core are connected through plug-in.
3. The board interconnection structure of claim 1, wherein, The board card interconnection structure further comprises a radio frequency connecting cable, the radio frequency connecting cable comprises a radio frequency connecting sleeve and a connecting cable core inserted into the radio frequency connecting sleeve; The first high-speed signal radio frequency connector comprises a first radio frequency cable seat welded to the mainboard and a first connecting cable core inserted into the first radio frequency cable seat, and the second high-speed signal radio frequency connector comprises a second radio frequency cable seat welded to the test board and a second connecting cable core inserted into the second radio frequency cable seat; A first end of the first connecting cable core is connected with the digital signal processor on the mainboard, a first end of the second connecting cable core is connected with the optical module connector on the test board, and two ends of the connecting cable are respectively connected with second ends of the first connecting cable core and the second connecting cable core through plug-in.
4. The board interconnection structure of claim 1, wherein The board card interconnection structure further comprises a radio frequency connecting cable, the radio frequency connecting cable comprises a radio frequency connecting sleeve and a connecting cable core inserted into the radio frequency connecting sleeve; The first high-speed signal radio frequency connector comprises a first radio frequency cable seat mechanically fixed to the mainboard, and the second high-speed signal radio frequency connector comprises a second radio frequency cable seat mechanically fixed to the test board; A first end of the connecting cable core is inserted into the first radio frequency cable seat and connected with the digital signal processor, and a second end of the connecting cable core is inserted into the second radio frequency cable seat and connected with the optical module connector.
5. The board interconnection structure of claim 4, wherein The first radio frequency cable seat is fixed to the mainboard through a first fastener, and / or the second radio frequency cable seat is fixed to the test board through a second fastener.
6. The board card interconnection structure according to any one of claims 1 to 5, wherein, The main board is symmetrically provided with two first high-speed signal radio frequency connectors, one of which is used as a signal transmitter and the other is used as a signal receiver. The test board is symmetrically provided with two second high-speed signal radio frequency connectors, one of which is used as a signal transmitter and the other is used as a signal receiver.
7. The board interconnection structure according to any one of claims 1 to 5, wherein The second differential trace layer comprises a plurality of groups of differential trace sub-layers, and an isolation ground copper and / or an isolation ground hole is arranged between each group of differential trace sub-layers.
8. The board interconnection structure of claim 7, wherein, The first row of gold finger high-speed signal lines and the second row of gold finger high-speed signal lines of the optical module connector are located in different differential trace sub-layers, and at least one layer of isolation ground layer is arranged between the different differential trace sub-layers.
9. The board interconnection structure of claim 7, wherein, The lengths of the differential traces in each group of differential trace sub-layers are consistent.
10. An optical module testing apparatus characterized by comprising: The board card interconnection structure comprises the board card interconnection structure according to any one of claims 1 to 9.