Module guiding test mechanism and carrier wave module test device
By using a module-guided testing mechanism and a carrier module testing device, the problems of low connection yield and pin misalignment damage in the testing of single-phase carrier communication modules were solved, achieving efficient and reliable module testing.
Patent Information
- Application Number
- CN202423275157.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2025-11-21
- Estimated Expiration
- 2034-12-30
AI Technical Summary
In the existing technology, the connection yield during the single-phase carrier communication module testing process is not high, and the testing device is prone to causing the carrier module pins to be misaligned and damaged, which affects production efficiency and cost.
A module guiding test mechanism was designed, including a pin fixing plate, a pressing component and a guide positioning block. The guide positioning block cooperates with the module lip to ensure accurate module insertion position, and the pressing component and test probe are used for testing to avoid pin misalignment.
This improved the connection rate of module plug-in, prevented damage to the carrier module due to misaligned pins, and enhanced the reliability of testing and production efficiency.
Smart Images
Figure CN223584192U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to module test technical field, especially a module guiding test mechanism and carrier wave module testing arrangement. BACKGROUND
[0002] At present, the single-phase table carrier wave communication module is tested by the direct contact of the test probe to the power supply, the above-mentioned mode is influenced by the module structure appearance size and the test probe normality, and the connection rate is not high in the plugging process, and the test cost is increased.
[0003] In the electronic manufacturing industry, the assembly quality of the module PCBA is directly related to the performance and reliability of the whole electronic product, therefore, the test link after the PCBA assembly is particularly crucial, the existing device is prone to the problem of the pin skewing and damaging the carrier wave module when docking during the test, and the production efficiency is affected.
[0004] Therefore, the technical personnel in the prior art propose a module guiding test mechanism and carrier wave module testing arrangement to solve the above-mentioned problems. SUMMARY
[0005] This part aims to summarize some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this part and the abstract of the specification and the utility model name to avoid obscuring the purpose of this part, the abstract of the specification and the utility model name, and such simplifications or omissions cannot be used to limit the scope of the utility model.
[0006] In view of the above or the problem of low connection rate in the plugging process of the module test in the prior art, the utility model is proposed.
[0007] Therefore, the purpose of the utility model is to provide a module guiding test mechanism.
[0008] In order to solve the above-mentioned technical problems, the utility model provides the following technical scheme: a module guiding test mechanism, comprising, pin fixing plate and pressing assembly, the surface of pin fixing plate is provided with a plurality of pin test components, the pin test component includes guiding positioning block one, the guiding positioning block one is installed on the surface of pin fixing plate, the surface of guiding positioning block one is installed with guiding positioning block two, the surface of guiding positioning block two is installed with test probe, the pressing assembly is located directly above pin fixing plate, the surface of pressing assembly is installed with connecting assembly, the guiding positioning block one and the guiding positioning block two are all long rectangles, and the size of guiding positioning block two is matched with the size of the lip of the module.
[0009] As an optimal scheme of the module guiding test mechanism, the bottom outer wall of the pin fixing plate is provided with a plurality of probe sleeves, the number of the probe sleeves is consistent with that of the test probes, and one end of the probe sleeve is connected with the test probe.
[0010] As an optimal scheme of the module guiding test mechanism, the lower pressing assembly comprises a lower pressing plate, and the bottom outer wall of the lower pressing plate is provided with a module scratch-proof plate one on both sides.
[0011] As an optimal scheme of the module guiding test mechanism, the lower pressing plate is located directly above the pin fixing plate, and the bottom outer wall of the lower pressing plate is provided with a module scratch-proof plate two at the middle position.
[0012] As an optimal scheme of the module guiding test mechanism, the connecting assembly comprises two guide shafts, and a buffer spring is arranged at one end of the guide shaft.
[0013] As an optimal scheme of the module guiding test mechanism, a linear bearing is arranged on the outer wall of the guide shaft.
[0014] As an optimal scheme of the module guiding test mechanism, a buffer gasket is arranged on the outer wall of the guide shaft, and the buffer gasket is attached below the linear bearing.
[0015] The module guiding test mechanism has the following beneficial effects: the module to be detected is arranged between the pin fixing plate and the lower pressing plate, so that the lip of the module contacts the guide-in angle of the guide positioning block one and the guide positioning block two, when the module moves downward, the lip is pressed and clamped into the surface of the guide positioning block two, the test probe is inserted into the inside of the lip of the module, the module and the test probe are more closely contacted, the guide-in position of the module is ensured to be accurate, after the lower pressing plate is pressed, the test is conducted through the test probe and the probe sleeve, and the connection rate of the module insertion is improved.
[0016] In actual use, the pin is prone to be skewed and damage the carrier module when the test is conducted.
[0017] To solve the above technical problems, the utility model also provides the following technical scheme: a carrier module test device, comprising a module guiding test mechanism and a mounting frame, the outer wall of the mounting frame is provided with a top plate near the upper position, a cylinder is arranged on the bottom outer wall of the top plate, and the connecting assembly is arranged at the bottom end of the cylinder.
[0018] As an optimal scheme of the carrier module test device, a plurality of pad seats are arranged on the bottom surface of the mounting frame, and the pin fixing plate is arranged on the surface of the pad seat.
[0019] As a preferred scheme of the utility model module carrier module test device, wherein: the mounting bracket bottom outer wall is close to the both ends of the pin fixed plate and is equipped with telescopic rod, the top of two telescopic rods is equipped with the same carrier, the carrier is between the pin fixed plate and the lower pressure assembly.
[0020] The utility model discloses a carrier module test device's beneficial effect: utilize the carrier and fix the carrier module in the pin fixed plate's just above, utilize the cylinder and drive the lower plate to move down, and then drive the carrier and the carrier module to move down, to make the lip of module contact the lead-in angle of guide positioning block one and guide positioning block two, guarantee the lead-in position of module accurate, thereby avoid the pin skew and damage the carrier module when the butt joint. BRIEF DESCRIPTION OF DRAWINGS
[0021] In order to more clearly illustrate the technical scheme of the embodiment of the utility model, the following will be briefly introduced to the drawing needed to be used in the embodiment description, obviously, the drawing in the following description is only some embodiments of the utility model, for the ordinary skilled person in the art, under the premise of not paying the creative labor, still can obtain other drawings according to these drawings. Wherein:
[0022] Figure 1 It is a kind of module guide test mechanism's overall structure schematic diagram.
[0023] Figure 2 It is a kind of carrier module test device's overall structure schematic diagram.
[0024] Figure 3 It is a kind of carrier module test device's partial solid structure schematic diagram. DETAILED DESCRIPTION
[0025] In order to make the above-mentioned purpose, features and advantages of the utility model more obvious and easy to understand, the specific embodiment of the utility model is described in detail in the following with the drawings of the specification.
[0026] In the following description, a lot of specific details are set forth in order to fully understand the utility model, but the utility model can also be implemented in other ways different from the description herein, and the skilled person in the art can make similar generalization without violating the connotation of the utility model, therefore the utility model is not limited by the following disclosed specific embodiments.
[0027] Secondly, the "one embodiment" or "embodiment" referred to herein means that specific features, structures or characteristics can be included in at least one implementation of the utility model. In this specification, "in one embodiment" does not mean the same embodiment, nor is it a separate or alternative embodiment that excludes other embodiments.
[0028] Embodiment 1
[0029] With reference to Figure 1 For the first embodiment of the utility model, the embodiment provides a module guiding test mechanism, can realize the effect of improving the connection rate of module plugging, it includes the needle fixed plate 100 and the lower pressure subassembly 300, the needle fixed plate 100 surface is provided with a plurality of needle test components 200, and the needle test component 200 includes guiding locating block one 201, guiding locating block one 201 is installed on the surface of needle fixed plate 100, guiding locating block two 202 is installed on the surface of guiding locating block one 201, and test probe 203 is installed on the surface of guiding locating block two 202, and the lower pressure subassembly 300 is located directly above the needle fixed plate 100, and the surface of lower pressure subassembly 300 is installed with connecting assembly 400, guiding locating block one 201 and guiding locating block two 202 are both long rectangles, and the size of guiding locating block two 202 is adapted to the size of the lip of the module.
[0030] Place the module on the surface of needle fixed plate 100, so that the lip of the module contacts the lead-in angle of guiding locating block one 201 and guiding locating block two 202, to ensure the accurate lead-in position of the module, then use connecting assembly 400 and lower pressure subassembly 300 to hold the module, and then test the module through test probe 203.
[0031] Specifically, a plurality of probe sleeves 204 are installed on the bottom outer wall of needle fixed plate 100, the number of probe sleeves 204 is consistent with the number of test probe 203, and one end of probe sleeve 204 is connected with test probe 203.
[0032] Test using test probe 203 improves the connection rate of module plugging.
[0033] Further, the lower pressure subassembly 300 includes a lower pressure plate 301, and module scratch-proof plate one 302 is installed on both sides of the bottom outer wall of lower pressure plate 301.
[0034] The lower pressure plate 301 is located directly above the needle fixed plate 100, module scratch-proof plate two 303 is installed on the middle position of the bottom outer wall of lower pressure plate 301, and the longitudinal section of the bottom of module scratch-proof plate one 302 and module scratch-proof plate two 303 is wavy.
[0035] The arc setting of the bottom of module scratch-proof plate one 302 and module scratch-proof plate two 303 can avoid bumping the module, and module scratch-proof plate one 302 and module scratch-proof plate two 303 have a protective effect on the module during the pressing process.
[0036] In use, the module is placed on the surface of the pin fixing plate 100, so that the lip of the module contacts the lead-in angle of the guide positioning block one 201 and the guide positioning block two 202, the lead-in position of the module is guaranteed to be accurate, the test probe 203 is used for testing, and the connection rate of the module is improved.
[0037] Embodiment 2
[0038] With reference to Figure 1 For the second embodiment of the utility model, different from the previous embodiment, the connecting assembly 400 comprises two guide shafts 401, one end of the two guide shafts 401 is provided with a buffer spring 404, and one end of the buffer spring 404 is installed on the surface of the lower pressing plate 301.
[0039] In the process of driving the lower pressing plate 301 to move downward through the guide shaft 401, the buffer spring 404 plays a buffering effect, and the lower pressing plate 301 is driven to move downward through the guide shaft 401, so that the module is pressed and fixed.
[0040] Further, the outer wall of the guide shaft 401 is provided with a linear bearing 402.
[0041] The linear bearing 402 is flat, which provides physical support for the guide shaft 401, so that the guide shaft 401 transmits power and guides the movement of the lower pressing plate 301.
[0042] Further, the outer wall of the guide shaft 401 is provided with a buffer gasket 403, and the buffer gasket 403 is attached below the linear bearing 402.
[0043] The buffer gasket 403 absorbs and isolates vibration, reduces the influence on the guide shaft 401, and the linear bearing 402 and the buffer gasket 403 are located outside the guide shaft 401, which ensures the stability of the operation of the guide shaft 401.
[0044] Embodiment 3
[0045] With reference to Figure 2 And Figure 3 For the third embodiment of the utility model, different from the previous embodiment, a carrier wave module testing device comprises a module guide testing mechanism and a mounting frame 500, the outer wall of the mounting frame 500 is provided with a top plate 501 near the upper position, a cylinder 600 is installed on the bottom outer wall of the top plate 501, and the connecting assembly 400 is installed at the bottom end of the cylinder 600.
[0046] The lower pressing plate 301 is driven to move downward through the cylinder 600, so as to perform the pressing and fixing work of the carrier wave module.
[0047] Further, a plurality of pad seats 800 are installed on the bottom surface of the mounting frame 500, and the pin fixing plate 100 is installed on the surface of the pad seat 800.
[0048] Further, the bottom outer wall of the mounting frame 500 is provided with telescopic rods 701 near both ends of the pin fixing plate 100, and the top ends of the two telescopic rods 701 are provided with the same carrier 700, which is located between the pin fixing plate 100 and the pressing assembly 300.
[0049] In use, the air cylinder 600 drives the downward movement of the pressing plate 301, and then drives the downward movement of the carrier 700 and the carrier module, and the telescopic rods 701 below the carrier 700 are retracted, so that the carrier module is close to the pin fixing plate 100, and the lip of the carrier module contacts the lead-in angle of the guide positioning block one 201 and the guide positioning block two 202, so as to ensure the accurate lead-in position of the module, thereby avoiding the damage of the carrier module caused by the skew of the pins during the butt joint.
[0050] In summary, the module guide test mechanism and the carrier module test device can improve the connection rate of the carrier module during the test of the carrier module, and can also avoid the damage of the carrier module caused by the skew of the pins during the butt joint.
[0051] Importantly, it should be noted that the constructions and arrangements of the present application shown in the various exemplary embodiments are merely illustrative. Although only a few embodiments have been described in detail in this disclosure, those skilled in the art who review this disclosure will readily appreciate that many modifications are possible (e.g., variations in sizes, dimensions, structures, shapes and proportions of the various elements, values of parameters, mounting arrangements, use of materials, colors, orientations, etc.) without materially departing from the novel teachings and advantages of the subject matter described in this application. For example, elements shown as integrally formed can be constructed of multiple parts or elements, the position of elements can be reversed or otherwise varied, and the nature or number of elements or positions can be altered or varied. Accordingly, all such modifications are intended to be included within the scope of the present application. The order or sequence of any process or method steps can be changed or re-sequenced without departing from the scope of the application. In the claims, any means-plus-function clause is intended to cover the structures described herein as performing the recited function and not only structural equivalents but also equivalent structures. Other substitutions, modifications, changes, and omissions can be made in the design, operating conditions, and arrangement of the exemplary embodiments without departing from the scope of the application. Accordingly, the present application is not limited to particular embodiments described, but extends to various modifications that nevertheless fall within the scope of the appended claims.
[0052] Furthermore, in order to provide a concise description of exemplary embodiments, all features of an actual implementation can not be described (i.e., those unrelated to the best mode of carrying out the present application currently under consideration).
[0053] It is to be understood that the development of the particular implementations described herein was not determined merely by the availability of certain items or materials. Rather and more generally, specific implementations can be determined, for example, based on the particular requirements of the instrument or system to which that implementation relates. For example, a specific implementation of a reagent or kit can be determined based on the number of assays or assays types that are to be performed by the instrument or system that implementation relates to.
[0054] It should be noted that the above examples are only used to illustrate the technical solutions of the present application, not to limit it. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application, and they should be covered in the scope of the claims of the present application.
Claims
1. A modular directed testing mechanism, characterized by: The utility model relates to a module guiding test mechanism, including, the pin fixed plate (100) and the lower pressure subassembly (300), the pin fixed plate (100) surface is provided with a plurality of pin test subassembly (200), the pin test subassembly (200) includes guide locating block one (201), guide locating block one (201) installs on the surface of pin fixed plate (100), the surface of guide locating block one (201) is equipped with guide locating block two (202), the surface of guide locating block two (202) is equipped with test probe (203), the lower pressure subassembly (300) is located in the just above pin fixed plate (100), the surface of lower pressure subassembly (300) is equipped with connecting assembly (400), guide locating block one (201) and guide locating block two (202) are long rectangle. The bottom outer wall of the pin fixed plate (100) is provided with a plurality of probe sleeves (204), the number of the probe sleeves (204) is consistent with that of the test probes (203), and one end of each probe sleeve (204) is connected to the test probe (203).
2. The module guided testing mechanism of claim 1, wherein: The lower pressure subassembly (300) comprises a lower pressure plate (301), and module scratchproof plates (302) are arranged on both sides of the bottom outer wall of the lower pressure plate (301).
3. The module guided testing mechanism of claim 1 or 2, wherein: The lower pressure plate (301) is located just above the pin fixed plate (100), and a module scratchproof plate (303) is arranged at the middle of the bottom outer wall of the lower pressure plate (301).
4. The module guided testing mechanism of claim 3, wherein: The connecting assembly (400) comprises two guide shafts (401), and buffer springs (404) are arranged at one ends of the two guide shafts (401).
5. The module guided testing mechanism of claim 4, wherein: The outer wall of the guide shaft (401) is provided with a linear bearing (402).
6. The module guided testing mechanism of claim 5, wherein: The outer wall of the guide shaft (401) is provided with a buffer gasket (403) that is attached below the linear bearing (402).
7. The module guided testing mechanism of claim 6, wherein: The module guiding test mechanism comprises the module guiding test mechanism according to any one of claims 1-7, and a mounting frame (500), wherein the outer wall of the mounting frame (500) is provided with a top plate (501) near the upper portion, the bottom outer wall of the top plate (501) is provided with an air cylinder (600), and the connecting assembly (400) is arranged at the bottom end of the air cylinder (600).
8. A carrier module testing apparatus, characterized by: The bottom surface of the mounting frame (500) is provided with a plurality of pads (800), and the pin fixed plate (100) is arranged on the surface of the pads (800).
9. The carrier module test apparatus of claim 8, wherein: The bottom outer wall of the mounting frame (500) is provided with telescopic rods (701) near both ends of the pin fixed plate (100), and the same carrier (700) is arranged at the top ends of the two telescopic rods (701), and the carrier (700) is located between the pin fixed plate (100) and the lower pressure subassembly (300).
10. The carrier module test apparatus of claim 9, wherein: