Battery piece copper strip laminating device

Abstract

The utility model discloses a battery piece copper strip laminating device. The device comprises a supporting base; the rotating turntable comprises a supporting part fixedly arranged on the supporting base and a turntable arranged at the upper end of the supporting part, and a plurality of laminating workbenches are arranged on the surface, away from the supporting base, of the turntable at preset intervals; the lifting driving platform is arranged on the supporting base and is adjacent to the rotating turntable; the copper strip laminating plate is connected with the lifting driving platform, and the copper strip is laminated on the battery piece carried by the laminating workbench along with the lifting driving platform; and each parallelism adjusting mechanism penetrates through one laminating workbench and the rotating disc and is connected with the laminating workbench and the rotating disc so as to adjust the parallelism between the laminating workbench and the copper strip laminating plate. According to the application, the parallelism between the laminating workbench and the copper strip laminating plate is adjusted, so that the problems of fragmentation and subfissure of the battery piece caused by non-parallelism of the laminating workbench and the copper strip laminating plate are solved, and the production efficiency and the success rate of laminating the battery piece with the copper strip are improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, specifically to a copper strip bonding device for battery cells. Background Technology

[0002] Copper strip bonding is a crucial step in the manufacturing of solar cells, directly impacting the electrical performance and mechanical strength of the module. However, current copper strip bonding processes for solar cells have limitations in their bonding platform design, which to some extent restricts improvements in production efficiency and product quality.

[0003] Traditional solar cell copper strip bonding platforms are typically single, flat structures without perforations and with non-adjustable angles. In practice, slight angular deviations may exist between the bonding platform and the copper strip bonding device. During copper strip bonding, these deviations can cause uneven pressure on the solar cells, increasing the risk of cell breakage or microcracks. Utility Model Content

[0004] In view of the above problems, this application provides a battery cell copper strip bonding device to solve the above technical problems.

[0005] This application provides a battery cell copper strip bonding device, comprising:

[0006] Support base;

[0007] A rotary turntable includes a support fixed on a support base and a rotatable turntable located at the upper end of the support base. The side of the turntable away from the support base is provided with multiple contact worktables. The position of the contact worktables is adjusted by rotating the turntable.

[0008] Multiple bonding worktables are set on the turntable at preset intervals to support the battery cells to be bonded with copper strips;

[0009] The lifting drive platform is mounted on the support base and located adjacent to the rotating turntable;

[0010] The copper strip bonding plate is connected to the lifting drive platform. The lifting drive platform drives the copper strip bonding plate to move up and down. The turntable rotates and moves the bonding worktable below the copper strip bonding plate. The copper strip bonding plate is used to support the copper strip and follows the lifting drive platform to bond the copper strip to the battery cell carried by the bonding worktable.

[0011] Multiple parallelism adjustment mechanisms are provided, each of which passes through a bonding worktable and a turntable and is connected to both, to adjust the parallelism between the bonding worktable and the copper strip bonding plate.

[0012] In some embodiments, each parallelism adjustment mechanism includes a plurality of parallelism adjustment screws, a parallelism adjustment nut equal in number to the parallelism adjustment screws, and a parallelism locking nut equal in number to the parallelism adjustment screws;

[0013] Multiple parallelism adjusting screws pass through the fitting worktable, parallelism adjusting nut, turntable and parallelism locking nut from multiple positions;

[0014] The parallelism adjusting nut is located between the bonding worktable and the turntable to adjust the parallelism between the bonding worktable and the copper strip bonding plate.

[0015] The parallelism locking nut is located on the side of the turntable away from the worktable and is used to lock the parallelism adjusting screw.

[0016] In some embodiments, the bonding worktable is provided with a hollow area, and support structures connected to the bonding worktable are provided at intervals within the hollow area.

[0017] In some embodiments, the support structure is integrally formed with the worktable.

[0018] In some embodiments, the bonding table further includes a cylinder interface for connecting an external cylinder drive mechanism to adjust the position of the bonding table during operation of the parallelism adjustment mechanism.

[0019] In some embodiments, a vacuum air passage is provided inside the bonding worktable, and a plurality of vacuum adsorption holes are also provided on the bonding worktable. The vacuum adsorption holes are connected to the vacuum air passage for adsorbing battery cells, and a removable sealing plug is provided at the outlet of the vacuum air passage.

[0020] In some embodiments, the turntable is also connected to an external drive mechanism to be driven by the external drive mechanism to adjust the position of the table.

[0021] In some embodiments, the lifting drive platform includes: a drive mechanism and a copper strip bonding plate connecting rod;

[0022] The drive mechanism is mounted on the support base and connected to the copper strip bonding plate via a copper strip bonding plate connecting rod, so as to drive the copper strip bonding plate to move along the copper strip bonding part connecting rod.

[0023] The battery cell copper strip bonding device provided in this application is equipped with a parallelism adjustment mechanism that runs through the bonding worktable and the turntable. The parallelism adjustment mechanism is connected to both the bonding worktable and the turntable, thereby realizing the adjustment of the parallelism between the bonding worktable and the copper strip bonding plate. This solves the problem of battery cell fragmentation and microcracks caused by the non-parallelism between the bonding worktable and the copper strip bonding plate, and improves the production efficiency and success rate of battery cell bonding with copper strip.

[0024] These or other aspects of this application will become more apparent in the following description of the embodiments. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 A top view of the battery cell copper strip bonding device provided in an embodiment of this application is shown.

[0027] Figure 2 A side view of the battery cell copper strip bonding device provided in an embodiment of this application is shown.

[0028] Figure 3 A top view of the fitting worktable provided in an embodiment of this application is shown.

[0029] Figure 4 A side view of the fitting worktable provided in an embodiment of this application is shown.

[0030] Figure 5 The front view of the fitting worktable provided in an embodiment of this application is shown.

[0031] Icon labels:

[0032] 100. Support base; 200. Rotating turntable; 210. Support section; 220. Turntable; 300. Fitting worktable; 310. Hollowed-out area; 320. Support structure; 330. Cylinder interface; 340. Vacuum air passage; 350. Vacuum adsorption hole; 360. Sealing plug; 400. Lifting drive platform; 410. Drive mechanism; 420. Copper strip bonding plate connecting rod; 500. Copper strip bonding plate; 600. Parallelism adjustment mechanism; 610. Parallelism adjustment screw; 620. Parallelism adjustment nut; 630. Parallelism locking nut; 640. Through hole; Detailed Implementation

[0033] To enable those skilled in the art to better understand the solutions of this application, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0034] Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0035] Furthermore, in the embodiments of this application, "multiple" refers to two or more. Therefore, in the embodiments of this application, "multiple" can also be understood as "at least two". "At least one" can be understood as one or more, such as one, two, or more. For example, including at least one means including one, two, or more, and is not limited to which ones are included. For example, including at least one of A, B, and C, then it could include A, B, C, A and B, A and C, B and C, or A and B and C.

[0036] This application provides a battery cell copper strip bonding device, such as... Figures 1 to 5 As shown, the battery cell copper strip bonding device includes a support base 100, a rotating turntable 200, a bonding worktable 300, a lifting drive platform 400, a copper strip bonding plate 500, and a parallelism adjustment mechanism 600.

[0037] Optionally, the rotating turntable 200 includes a support portion 210 fixed on the support base 100 and a rotatable turntable 220 disposed on the upper end of the support portion 210. A plurality of bonding worktables 300 are provided on the side of the turntable 220 away from the support base 100. Each bonding worktable 300 is disposed on the turntable 220 at a preset distance. The turntable 220 adjusts the position of the bonding worktables 300 by rotating, so that when the battery cell to be bonded with copper strip is carried on the bonding worktable 300, the bonding worktable 300 is aligned with the copper strip bonding plate 500. A lifting drive platform 400 is mounted on the support base 100 and adjacent to the rotating turntable 200. A copper strip bonding plate 500 is connected to the lifting drive platform 400. After the bonding worktable 300 is aligned with the copper strip bonding plate 500, the lifting drive platform 400 pushes the copper strip bonding plate 500 down until the copper strip is bonded to the battery cell supported by the bonding worktable 300. After the copper strip is bonded to the battery cell, the lifting drive platform 400 pushes the copper strip bonding plate 500 up. A parallelism adjustment mechanism 600 passes through the bonding worktable 300 and the turntable 200, and is connected to both the bonding worktable 300 and the turntable 220 respectively. During operation, by adjusting the position of the bonding worktable 300, the parallelism between the bonding worktable 300 and the copper strip bonding plate 500 is adjusted, thereby preventing battery cell fragmentation and microcracks during copper strip bonding due to non-parallelism between the bonding worktable 300 and the copper strip bonding plate 500.

[0038] like Figures 1 to 5 As shown, when the battery cell copper strip bonding device provided in this application is working, the bonding worktable 300 is fed by an external battery cell feeding structure, and the copper strip feeding mechanism also feeds the copper strip bonding plate 500. Then, the turntable 220 moves the fed bonding worktable 300 to below the copper strip bonding plate 500, and the lifting drive platform 400 drives the copper strip bonding plate 500 to descend, pressing the copper strip onto the battery cell on the bonding worktable 300. Finally, the lifting drive platform 400 drives the copper strip bonding plate 500 to rise back to its original position, and the turntable 220 rotates to transport the bonding worktable 300 to the unloading position. The external battery cell unloading mechanism unloads the battery cell from the bonding worktable 300. Because multiple bonding worktables 300 are provided on one turntable 200, when one bonding worktable 300 is in the unloading position, another bonding worktable 300 is in the feeding position, thereby improving the copper strip bonding efficiency. If it is found that the bonding worktable 300 and the copper strip bonding plate 500 are not parallel, the parallelism between the bonding worktable 300 and the copper strip bonding plate 500 can be adjusted by the parallelism adjustment mechanism 600 to make them parallel before the copper strip bonding work is repeated.

[0039] In some embodiments, such as Figures 1 to 5 As shown, four bonding worktables 300 are provided on the turntable 220 to improve the bonding efficiency of copper strips and to keep the turntable 220 in a balanced state.

[0040] The battery cell copper strip bonding device provided in this application is equipped with a parallelism adjustment mechanism that runs through the bonding worktable and the turntable. The parallelism adjustment mechanism is connected to both the bonding worktable and the turntable, thereby realizing the adjustment of the parallelism between the bonding worktable and the copper strip bonding plate using the parallelism adjustment mechanism. This solves the problem of battery cell fragmentation and microcracks caused by the non-parallelism between the bonding worktable and the copper strip bonding plate, and improves the production efficiency and success rate of battery cell bonding to copper strip.

[0041] In some embodiments, such as Figures 1 to 5 As shown in the embodiment of this application, the parallelism adjustment mechanism 600 includes a plurality of parallelism adjustment screws 610, a parallelism adjustment nut 620 of the same number as the parallelism adjustment screws 610, and a parallelism locking nut 630 of the same number as the parallelism adjustment screws 610.

[0042] Optionally, multiple parallelism adjusting screws 610 pass through the bonding worktable 300, parallelism adjusting nut 620, turntable 220, and parallelism locking nut 630 from multiple positions. The parallelism adjusting nut 620 is positioned between the bonding worktable 300 and the turntable 220 to adjust the parallelism between the bonding worktable 300 and the copper strip bonding plate 500. When adjusting the parallelism of the bonding worktable 300, the parallelism adjusting nut 620 is spaced a certain distance from the bonding worktable 300, and then the position of the bonding worktable 300 is moved to adjust its parallelism. After adjustment, the parallelism adjusting nut 620 is brought back into contact with the bonding worktable 300 through the parallelism adjusting screws 610 to fix the bonding worktable 300. The parallelism locking nut 630 is located on the side of the turntable 220 away from the worktable 300, and is used to lock the parallelism adjusting screw 610, thereby achieving the purpose of locking the turntable 220 and the parallelism adjusting screw 610.

[0043] The battery cell copper strip bonding device provided in this application embodiment can adjust the parallelism between the bonding worktable and the copper strip bonding plate by adjusting the parallelism adjusting nut to change the position of the bonding worktable, thereby causing the bonding worktable to shift and making the bonding worktable parallel to the copper strip bonding plate. Finally, the parallelism adjusting screw is locked by adjusting the parallelism locking nut.

[0044] It is understood that the battery cell copper strip bonding device in this application embodiment does not limit the number and position of the parallelism adjusting screw, parallelism adjusting nut, and parallelism locking nut. Specifically, the number and arrangement of these adjusting components can be flexibly adjusted according to actual needs to adapt to bonding worktables of different sizes and shapes. For example, as shown... Figures 1 to 5In the shown battery cell copper strip bonding device, multiple parallelism adjusting screws / parallelism adjusting nuts / parallelism locking nuts are respectively installed in the through holes 640 at the four corners of the bonding worktable. This design not only ensures high-precision parallelism between the bonding worktable and the bonding pressure plate, but also allows for convenient and quick fine-tuning to adapt to different production and maintenance requirements. Furthermore, depending on the actual application scenario, the number and position of the parallelism adjusting screws / parallelism adjusting nuts / parallelism locking nuts can be increased or decreased to achieve optimal bonding results and higher production efficiency.

[0045] In some embodiments, such as Figures 1 to 5 As shown in this embodiment, the bonding worktable 300 is provided with a hollowed-out area 310, and support structures 320 connected to the bonding worktable 300 are spaced apart within the hollowed-out area 310. Optionally, providing a hollowed-out area 310 on the bonding worktable 300 can effectively reduce the occurrence of debris or foreign objects on the bonding surface, and can also prevent foreign objects on the battery cells from directly contacting the bonding worktable 300. Multiple support structures 320 are provided, spaced apart within the hollowed-out area 310, thereby maintaining the rigidity and stability of the bonding worktable 300 and preventing instability caused by an excessively large hollowed-out area 310. Furthermore, the design of the hollowed-out area 310 makes the bonding worktable 300 easier to clean, reduces the possibility of foreign object accumulation, and helps maintain the cleanliness of the production environment and improve production efficiency.

[0046] The battery cell copper strip bonding device provided in this application reduces the accumulation of dust, debris and other foreign objects on the bonding table by setting a hollow area on the bonding worktable. This further avoids the problem that these foreign objects will damage the battery cells during the pressure applied by the copper strip bonding device, leading to battery cell damage or performance degradation.

[0047] It is understood that the battery cell copper strip bonding device in this application embodiment does not limit the specific shape and position of the hollowed-out area. Specifically, the design of the hollowed-out area can be flexibly adjusted according to actual needs to optimize various performance indicators during the bonding process. For example, as shown in... Figures 1 to 5 In the shown solar cell copper strip bonding device, the cutout area is located in the middle of the bonding table to minimize the contact area between the bonding table and the solar cell, and to avoid conflict between the cutout area and other components on the bonding table (such as the parallelism adjustment mechanism). This design not only reduces the direct contact area between the bonding table and the solar cell, lowering the risk of damage to the solar cell caused by foreign objects, but also avoids mutual interference between key components such as the parallelism adjustment mechanism and the cutout area, ensuring the structural stability and reliability of the device.

[0048] In some embodiments, such as Figures 1 to 5As shown in the embodiment of this application, the support structure and the bonding worktable 300 are integrally formed. Optionally, the hollowed-out area 310 is obtained by directly etching the bonding worktable 300, and the shape of the hollowed-out area 310 is etched as follows: Figure 5 Given the shape of the hollowed-out area shown, the remaining part of the fitting worktable 300 located within the hollowed-out area is the support structure 320.

[0049] In some embodiments, such as Figures 1 to 5 As shown in this embodiment, the bonding worktable 300 further includes a cylinder interface 330, which is used to connect to an external cylinder drive mechanism to adjust the position of the bonding worktable 300 when the parallelism adjustment mechanism 600 is running. Optionally, when the parallelism of the bonding worktable 300 is not adjusted, the parallelism adjusting nut 620 of the parallel adjustment part contacts the bonding worktable 300 through the parallelism adjusting screw 610 to fix the bonding worktable 300; when adjusting the parallelism of the bonding worktable 300, the parallelism adjusting nut 620 is spaced a certain distance from the bonding worktable 300, and then the position of the bonding worktable 300 is moved by the external cylinder drive mechanism. After the adjustment is completed, the parallelism adjusting nut 620 is brought back into contact with the bonding worktable 300 through the parallelism adjusting screw 610 to fix the bonding worktable 300.

[0050] In some embodiments, such as Figures 1 to 5 As shown in this embodiment, the bonding worktable 300 is provided with a vacuum passage 340, and the bonding worktable 300 is also provided with a plurality of vacuum adsorption holes 350. The vacuum adsorption holes are connected to the vacuum passage 340 for adsorbing the battery cells. A removable sealing plug 360 is provided at the outlet of the vacuum passage 340. Optionally, when the bonding worktable 300 is loading materials, the battery cells are adsorbed by drawing a vacuum. After the copper strip of the battery cells is bonded, the bonding worktable 300 unloads the cells by releasing the vacuum.

[0051] In some embodiments, such as Figures 1 to 5 As shown in the embodiment of this application, the turntable 220 is also connected to an external drive mechanism so that it can be driven by the external drive mechanism to rotate and adjust the position of the worktable 300.

[0052] It is understood that the structure of the external drive mechanism is not limited in the embodiments of this application. For example, the drive mechanism can be set as a motor device to control the turntable 220 to rotate at a certain angle.

[0053] In some embodiments, such as Figures 1 to 5As shown in the embodiment of this application, the lifting drive platform 400 includes a drive mechanism 410 and a copper strip bonding plate connecting rod 420. Optionally, the drive mechanism is disposed on the support base 100 and connected to the copper strip bonding plate 500 through the copper strip bonding plate connecting rod, so as to drive the copper strip bonding plate 500 to move along the copper strip bonding plate 500 connecting rod.

[0054] It is understood that the drive mechanism structure of the lifting drive platform 400 is not limited in this application embodiment. For example, the drive mechanism of the lifting drive platform 400 can be set as a motor device to control the copper strip bonding plate 500 to upgrade.

[0055] The battery cell copper strip bonding device provided in this application embodiment includes a parallelism adjustment mechanism that runs through the bonding worktable and the turntable. The parallelism adjustment mechanism is connected to both the bonding worktable and the turntable. When it is necessary to adjust the parallelism between the bonding worktable and the copper strip bonding plate, the position of the bonding worktable is changed by adjusting the parallelism adjustment nut, causing the bonding worktable to shift within a certain interval, thereby achieving parallelism between the bonding worktable and the copper strip bonding plate. Finally, the parallelism adjustment screw is locked by adjusting the parallelism locking nut. This application embodiment achieves the adjustment of the parallelism between the bonding worktable and the copper strip bonding plate, solving the problem of battery cell fragmentation and microcracks caused by non-parallelism between the bonding worktable and the copper strip bonding plate, and improving the production efficiency and success rate of battery cell bonding with copper strip.

[0056] Furthermore, by setting a hollow area on the bonding worktable, the embodiments of this application reduce the accumulation of foreign objects such as dust and debris on the bonding table surface, further avoiding the problem that these foreign objects will damage the battery cells during the application of pressure by the copper strip bonding device, leading to battery cell damage or performance degradation.

[0057] The above description, in conjunction with specific embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications and substitutions should be considered within the scope of protection of this application.

Claims

1. A battery cell copper strip bonding device, characterized in that, include: Support base; A rotating turntable includes a support portion fixed to the support base and a rotatable turntable located at the upper end of the support portion. The turntable has multiple contact worktables on the side away from the support base, and the position of the contact worktables is adjusted by rotating the turntable. The plurality of bonding worktables are arranged at preset intervals on the turntable to support the battery cells to be bonded with copper strips; A lifting drive platform is mounted on the support base and positioned adjacent to the rotating turntable; A copper strip bonding plate is connected to a lifting drive platform. The lifting drive platform drives the copper strip bonding plate to move up and down. The turntable rotates and moves the bonding worktable below the copper strip bonding plate. The copper strip bonding plate is used to carry the copper strip and follows the lifting drive platform to bond the copper strip to the battery cell carried by the bonding worktable. Multiple parallelism adjustment mechanisms are provided, each of which passes through one of the bonding worktables and the turntable, and is connected to the bonding worktable and the turntable respectively, for adjusting the parallelism between the bonding worktable and the copper strip bonding plate.

2. The battery cell copper strip bonding device as described in claim 1, characterized in that, Each of the parallelism adjustment mechanisms includes a plurality of parallelism adjustment screws, a parallelism adjustment nut equal in number to the parallelism adjustment screws, and a parallelism locking nut equal in number to the parallelism adjustment screws; Multiple parallelism adjusting screws pass through the fitting worktable, the parallelism adjusting nut, the turntable, and the parallelism locking nut from multiple positions respectively; The parallelism adjusting nut is disposed between the bonding worktable and the turntable to adjust the parallelism between the bonding worktable and the copper strip bonding plate; The parallelism locking nut is located on the side of the turntable away from the contact worktable, and is used to lock the parallelism adjusting screw.

3. The battery cell copper strip bonding device as described in claim 1, characterized in that, The bonding worktable has a hollowed-out area, and support structures connected to the bonding worktable are spaced apart within the hollowed-out area.

4. The battery cell copper strip bonding device as described in claim 3, characterized in that, The supporting structure is integrally formed with the fitting worktable.

5. The battery cell copper strip bonding device as described in claim 1, characterized in that, The bonding worktable also includes a cylinder interface for connecting an external cylinder drive mechanism to adjust the position of the bonding worktable during the operation of the parallelism adjustment mechanism.

6. The battery cell copper strip bonding device as described in claim 1, characterized in that, The bonding worktable is provided with a vacuum air passage, and the bonding worktable is also provided with a plurality of vacuum adsorption holes. The vacuum adsorption holes are connected to the vacuum air passage for adsorbing battery cells. The outlet of the vacuum air passage is provided with a removable sealing plug.

7. The battery cell copper strip bonding device as described in claim 1, characterized in that, The turntable is also connected to an external drive mechanism, which drives the rotation to adjust the position of the fitting worktable.

8. The battery cell copper strip bonding device as described in claim 1, characterized in that, The lifting drive platform includes: a drive mechanism and a copper strip bonding plate connecting rod; The driving mechanism is mounted on the support base and connected to the copper strip bonding plate via the copper strip bonding plate connecting rod, so as to drive the copper strip bonding plate to move along the copper strip bonding part connecting rod.

Images