Wafer cutting mechanism

Abstract

The utility model relates to the technical field of wafer cutting equipment, in particular to a wafer cutting mechanism, which comprises a frame body, a laser cutting head arranged on the frame body and used for cutting a wafer, a bearing disc positioned below the laser cutting head and used for placing and fixing the wafer, and a vacuum adsorption assembly, the vacuum adsorption assembly comprises a negative pressure cavity formed in the bearing disc, a first pipeline inserted into the negative pressure cavity and a vacuum generator communicated with the negative pressure cavity through the first pipeline and used for generating and maintaining negative pressure in the negative pressure cavity, and a plurality of vacuum adsorption holes communicated with the negative pressure cavity are formed in the end face of the bearing disc. A cleaning assembly used for cleaning scraps in the bearing disc is further arranged at the bottom of the bearing disc. According to the utility model, silicon crystal chips generated in the wafer cutting process can be removed through the cleaning assembly, and the chips are prevented from blocking the vacuum adsorption holes, so that the adsorption stability of the bearing disc is prevented from being influenced.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer cutting equipment technical field especially relates to a wafer cutting mechanism. BACKGROUND

[0002] Wafer is the basic material in semiconductor manufacturing process, usually made of high purity monocrystalline silicon, can be made into thousands of integrated circuits (ICs) on wafer, and each IC on wafer is called a "die" (Die). After wafer completes all integrated circuit manufacturing processes, each individual integrated circuit needs to be separated from wafer by cutting.

[0003] Vacuum adsorption is usually used in wafer cutting machine to firmly fix wafer on the carrier plate, to ensure that wafer does not move during cutting, to ensure the accuracy and safety of cutting. However, silicon crystal debris will be generated during wafer cutting, which is easy to enter the negative pressure cavity from the adsorption hole or adhere to the adsorption hole wall, causing the adsorption hole to be blocked, so that the adsorbed wafer moves during cutting. SUMMARY

[0004] In order to solve the problems in the above background art, the utility model provides a wafer cutting mechanism.

[0005] The utility model solves the technical problem and adopts the scheme: a wafer cutting mechanism, including frame body, the laser cutting head for cutting wafer arranged on the frame body, the carrier plate for placing and fixing wafer below the laser cutting head and vacuum adsorption assembly, the vacuum adsorption assembly includes the negative pressure cavity arranged in the carrier plate, the first pipeline inserted into the negative pressure cavity and the vacuum generator for generating and maintaining the negative pressure in the negative pressure cavity in communication with the negative pressure cavity, the carrier plate end face is provided with a plurality of vacuum adsorption holes in communication with the negative pressure cavity, the carrier plate bottom is also provided with the cleaning assembly for cleaning the internal debris of carrier plate, the cleaning assembly includes the vacuum pump arranged in the carrier plate bottom and the second pipeline connected with the vacuum pump and inserted into the bottom of the negative pressure cavity.

[0006] Through the above technical scheme, the vacuum pump can generate suction force to suck up the debris in the carrier plate and discharge through the second pipeline, and regular cleaning can ensure the adsorption stability of wafer during cutting.

[0007] Further, the first pipeline and the second pipeline are respectively provided with a first stop valve and a second stop valve.

[0008] Through the above technical scheme, when the first stop valve is opened, the vacuum generator can provide continuous negative pressure for the negative pressure cavity, so that the wafer is stably adsorbed on the carrier plate, and when the first stop valve is closed, the negative pressure can be cut off in time.

[0009] Further, a filter screen is arranged between the first pipeline and the negative pressure cavity.

[0010] By adopting the above technical scheme, the tiny particles generated in the cutting process can be prevented from entering the vacuum system, so that the vacuum generator is protected from being blocked or damaged

[0011] Further, the cross-sectional area of each vacuum adsorption hole gradually decreases from the bottom to the top.

[0012] By adopting the above technical scheme, the smaller top opening can reduce the entry of debris into the adsorption hole.

[0013] Further, the bottom of the bearing disc is further provided with a moving seat, and an electric sliding rail is arranged on the end face of the moving seat.

[0014] By adopting the above technical scheme, the electric sliding rail can control the linear motion of the bearing disc along the sliding rail according to the preset program instructions, and cooperate with the laser cutting head to cut the wafer.

[0015] In summary, the beneficial effects of the present application are as follows: the cleaning assembly composed of a vacuum pump and a second pipeline is additionally arranged, which can timely remove the debris in the adsorption hole and the negative pressure cavity, ensure the smoothness of the adsorption hole, and thus ensure the adsorption stability during wafer cutting.

[0016] The above description is only a summary of the technical scheme of the present application, in order to more clearly understand the technical means of the present application, the content of the specification can be implemented, and in order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following preferred embodiments are described in detail, and the accompanying drawings are as follows. BRIEF DESCRIPTION OF DRAWINGS

[0017] Fig. 1 It is a schematic view of the overall structure of the embodiment;

[0018] Fig. 2 It is a sectional view of the embodiment.

[0019] In the figure: 1, frame body; 11, laser cutting head; 2, bearing disc; 21, vacuum adsorption hole; 22, sliding block; 3, vacuum adsorption assembly; 31, negative pressure cavity; 32, first pipeline; 321, first stop valve; 33, vacuum generator; 41, vacuum pump; 42, second pipeline; 421, second stop valve; 5, filter screen; 6, moving seat; 61, electric sliding rail. DETAILED DESCRIPTION

[0020] In order to make the content of the utility model can be more easily and clearly understood, the following according to specific embodiments and combining with the drawings, the utility model is further explained.

[0021] It should be noted that the terms "center", "upper", "lower", "front", "rear", "left", "right", "inner", "outer" and the like used herein indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model. Unless otherwise specified, the meaning of "a plurality of" is two or more.

[0022] Unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the communication inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood through specific circumstances.

[0023] As Figs. 1-2 As shown in a wafer cutting mechanism, wherein the embodiment includes frame body 1, laser cutting head 11 for cutting wafer arranged on frame body 1, the load plate 2 for placing and fixing wafer below laser cutting head 11 and vacuum adsorption assembly 3, the vacuum adsorption assembly 3 includes negative pressure cavity 31 arranged in load plate 2, first pipe 32 inserted into negative pressure cavity 31 and vacuum generator 33 for generating and maintaining negative pressure in negative pressure cavity 31 by first pipe 32 and negative pressure cavity 31, the load plate 2 end face is provided with a plurality of vacuum adsorption holes 21 communicated with negative pressure cavity 31, and cleaning assembly for cleaning the internal debris of load plate 2 is further arranged on the bottom of load plate 2, and the cleaning assembly specifically includes vacuum pump 41 arranged on the bottom of load plate 2 and second pipe 42 connected with vacuum pump 41 and inserted into the bottom of negative pressure cavity 31.

[0024] The embodiment is to set the laser cutting head 11 on the frame body 1 to cut the wafer on the lower bearing disc 2 along the predetermined path. The vacuum generator 33 is connected to the first pipeline 32, and the cavity is arranged in the bearing disc 2 as the negative pressure cavity 31. The first pipeline 32 is inserted into the negative pressure cavity 31, and the vacuum generator 33 provides continuous negative pressure to the negative pressure cavity 31 in the bearing disc 2 through the first pipeline 32, so that the wafer is tightly adsorbed on the bearing disc 2, and the wafer is not moved during the cutting process. The cleaning assembly including the vacuum pump 41 and the second pipeline 42 is arranged at the bottom of the bearing disc 2. When the vacuum adsorption hole 21 is blocked by debris or the negative pressure cavity 31 needs to be cleaned, the vacuum pump 41 is started to generate suction through the second pipeline 42 inserted into the bottom of the negative pressure cavity 31, so that the negative pressure cavity 31 (especially the debris attached to the wall surface of the vacuum adsorption hole 21) is sucked and discharged to the dust collection device through the second pipeline 42, effectively cleaning the vacuum adsorption hole 21 and the internal debris, and ensuring the adsorption stability of the wafer during cutting.

[0025] As shown in Fig. 2 , the first pipeline 32 and the second pipeline 42 of the embodiment are respectively provided with a first stop valve 321 and a second stop valve 421. The first stop valve 321 is installed on the first pipeline 32 connecting the vacuum generator 33 and the negative pressure cavity 31 in the bearing disc 2, and the second stop valve 421 is installed on the second pipeline 42 connecting the vacuum pump 41 and the negative pressure cavity 31 in the bearing disc 2. During the cutting operation, the first stop valve 321 is usually opened to ensure that the wafer is stable and immovable, and the second stop valve 421 is closed to avoid interference with the cutting process by suction; when cleaning is needed, the first stop valve 321 is closed to stop the negative pressure supply, and the second stop valve 421 is opened to start the cleaning process.

[0026] As shown in Fig. 2 , the first pipeline 32 and the negative pressure cavity 31 of the embodiment are further provided with a filter screen 5. The filter screen 5 can prevent the tiny particles generated during the cutting process from entering the vacuum system, thereby protecting the vacuum generator 33 from being blocked or damaged.

[0027] As shown in Fig. 2 , the cross-sectional area of each vacuum adsorption hole 21 of the embodiment gradually decreases from the bottom to the top. The smaller top opening can reduce the probability of debris entering the adsorption hole, and during the cleaning process, the smaller opening can better concentrate the suction force, which helps to more effectively remove the debris in the adsorption hole, especially the fine particles attached to the hole wall.

[0028] As shown in Fig. 1As shown, the bottom of the bearing disc 2 of the embodiment is further provided with a moving seat 6, and an electric sliding rail 61 is arranged at the end face of the moving seat 6, and two sliding blocks 22 are fixedly arranged at the two sides of the bottom of the bearing disc 2, and the sliding blocks 22 are slidably connected to the electric sliding rail 61. The electric sliding rail 61 is driven by a motor, controls the linear motion of the bearing disc 2 along the sliding rail according to the preset program instructions, and controls the moving speed and distance through a control system controller, and cooperates with the upper laser cutting head 11 to realize high-precision cutting of the wafer.

[0029] In conclusion, the embodiment has the following beneficial effects: the embodiment can precisely cut the wafer according to the program preset path through the laser cutting head 11, and can significantly improve the cutting precision in combination with the stable adsorption and precise movement of the bearing disc 2. The cleaning assembly composed of the vacuum pump 41 and the second pipeline 42 can timely remove the debris in the adsorption hole and the negative pressure cavity 31, ensure the unobstructed adsorption hole, and thus ensure the adsorption stability during the wafer cutting. The filter screen 5 arranged between the first pipeline 32 and the negative pressure cavity 31 can effectively block the tiny particles generated in the cutting process from entering the vacuum system.

[0030] The above-described embodiments are only preferred embodiments of the utility model, and cannot be used to limit the protection scope of the utility model, and any non-substantial changes and modifications made by the person skilled in the art on the basis of the utility model all belong to the protection scope of the utility model.

Claims

1. A wafer cutting mechanism, characterized by, The application relates to a wafer cutting device, which comprises a frame, a laser cutting head arranged on the frame and used for cutting a wafer, a bearing disc arranged below the laser cutting head and used for placing and fixing the wafer, and a vacuum adsorption assembly, wherein the vacuum adsorption assembly comprises a negative pressure cavity arranged in the bearing disc, a first pipeline inserted into the negative pressure cavity, and a vacuum generator connected with the negative pressure cavity through the first pipeline and used for generating and maintaining negative pressure in the negative pressure cavity; a plurality of vacuum adsorption holes are arranged on the end face of the bearing disc and communicated with the negative pressure cavity; a cleaning assembly used for cleaning the internal debris of the bearing disc is further arranged on the bottom of the bearing disc, and the cleaning assembly comprises a vacuum pump arranged on the bottom of the bearing disc and a second pipeline connected with the vacuum pump and inserted into the bottom of the negative pressure cavity.

2. The wafer cutting mechanism according to claim 1, wherein First and second stop valves are arranged on the first and second pipelines respectively.

3. The wafer cutting mechanism of claim 2, wherein, A filter screen is further arranged between the first pipeline and the negative pressure cavity.

4. The wafer cutting mechanism of claim 1, wherein, The cross-sectional area of each vacuum adsorption hole gradually decreases from the bottom to the top.

5. The wafer cutting mechanism of claim 1, wherein, The bottom of the bearing disc is further provided with a moving seat, the end face of the moving seat is provided with an electric sliding rail, and sliding blocks are fixedly arranged on the two sides of the bottom of the bearing disc and slidably connected with the electric sliding rail.

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