Auxiliary bearing device

Abstract

The utility model provides an auxiliary bearing device. The auxiliary bearing device comprises a base, a lifting mechanism fixedly arranged on the base and a bearing mechanism fixed to a lifting structure of the lifting mechanism. The bearing mechanism comprises a bearing platform and at least one expansion platform located below the bearing platform, and the bearing platform is connected with the expansion platform through a sliding assembly so that the expansion platform can move relative to the bearing platform in the horizontal direction through the sliding assembly. According to the auxiliary bearing device, the semiconductor equipment is lifted through the bearing mechanism, manual lifting is avoided, the safety and convenience in the maintenance process are effectively improved, the bearing area of the bearing mechanism is changed through the extension platform, and therefore the practicability of the auxiliary bearing device is improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor, and relates to a semiconductor device, in particular to an auxiliary load bearing device. BACKGROUND

[0002] In order to ensure the stability of the semiconductor device, it is necessary to regularly maintain and repair the semiconductor device, such as a chemical vapor deposition device or a physical vapor deposition device, so as to find the faults and damages in the device in time. However, due to the limitation of the operation space of the device, it is difficult to overhaul the parts of the semiconductor device, especially the bottom parts, and generally, the operator needs to lift the semiconductor device or place it on a fixed platform for maintenance. However, the process of manual lifting is not stable, and when the area of the fixed platform is smaller than the bottom surface of the semiconductor device, placing the semiconductor device is also prone to cause the semiconductor device to fall over or the parts to fall off, resulting in damage to the semiconductor device or injury to the operator, and the safety is low.

[0003] Therefore, how to safely and conveniently maintain and repair the semiconductor device is an urgent problem to be solved by those skilled in the art. SUMMARY

[0004] The application aims to provide an auxiliary load bearing device to solve the problem that in the prior art, when regularly maintaining and repairing the semiconductor device, the operator needs to lift or place the semiconductor device on a fixed platform, and the risk of the semiconductor device falling over or the parts falling off is relatively large, and the safety is not good.

[0005] In a first aspect, the application provides an auxiliary load bearing device, comprising a base, a lifting mechanism fixedly arranged on the base, and a load bearing mechanism fixed to a lifting structure of the lifting mechanism;

[0006] The load bearing mechanism comprises a load bearing platform and at least one extension platform located below the load bearing platform, and the load bearing platform and the extension platform are connected through a sliding assembly to enable the extension platform to move relative to the load bearing platform in the horizontal direction through the sliding assembly.

[0007] In the application, the semiconductor device is lifted by the load bearing mechanism which can be lifted, avoiding manual lifting, so that the semiconductor device can be placed stably during maintenance and repair, thereby improving the safety and convenience, and the extension platform can change the load bearing area of the load bearing mechanism, thereby adapting to more types or models of semiconductor devices, and further improving the practicality of the auxiliary load bearing device.

[0008] In an embodiment of the present application, the sliding assembly comprises a load-bearing slider and an extension slider which are arranged in pairs, the load-bearing slider is fixed to the lower surface of the load-bearing platform, and the extension slider is fixed to the upper surface of the extension platform.

[0009] When the load-bearing slider is a sliding rail, the extension slider is a sliding rail or a sliding block which is arranged in pairs with the load-bearing slider; when the load-bearing slider is a sliding block, the extension slider is a sliding rail which is arranged in pairs with the load-bearing slider.

[0010] In an embodiment of the present application, at least one locking hole is arranged on the load-bearing slider and the extension slider; the sliding assembly further comprises a locking member; the locking member penetrates through the locking holes on the load-bearing slider and the extension slider to realize the relative fixation of the extension platform and the load-bearing platform.

[0011] In an embodiment of the present application, the load-bearing mechanism comprises a plurality of the extension platforms, and each of the extension platforms is arranged under the load-bearing platform through a sliding assembly.

[0012] In an embodiment of the present application, the load-bearing mechanism further comprises a rotating member and a stabilizing assembly, one end of the stabilizing assembly is fixed to the edge of the extension platform through the rotating member, and the other end of the stabilizing assembly is a clamping end; when the external device is placed on the load-bearing platform, the stabilizing assembly rotates around the rotating member until the clamping end is located above the extension platform; when the external device is not placed on the load-bearing platform, the stabilizing assembly rotates around the rotating member until the clamping end is located below the extension platform.

[0013] In an embodiment of the present application, the clamping end of the stabilizing assembly is provided with a stabilizing member, and the end of the stabilizing member close to the external device is covered by a soft film layer.

[0014] In an embodiment of the present application, the load-bearing mechanism further comprises an anti-sliding film arranged on the upper surface of the load-bearing platform.

[0015] In an embodiment of the present application, the anti-sliding film comprises a rubber anti-sliding film or a silica gel anti-sliding film.

[0016] In an embodiment of the present application, the lifting mechanism is a pneumatic cylinder lifting mechanism, a hydraulic lifting mechanism or an electric lifting mechanism.

[0017] In an embodiment of the present application, the lifting mechanism is a pneumatic cylinder lifting mechanism, the pneumatic cylinder lifting mechanism comprises a fixing structure and a plurality of the lifting structures, the fixing structure is fixed to the base, all the lifting mechanisms are fixed to the load-bearing mechanism, and the internal spaces of all the lifting structures are connected to each other through the fixing structure.

[0018] As described above, the application provides an auxiliary load bearing device, which stably holds the semiconductor equipment in the maintenance process through the load bearing mechanism without manual holding, reduces the risk of the semiconductor equipment falling or parts falling, and changes the load bearing area of the load bearing mechanism through the expansion platform to adapt to semiconductor equipment with different bottom areas, so that semiconductor equipment of different types and types can be stably held, thereby effectively improving the safety and convenience of semiconductor equipment maintenance. Further, the application also fixes the semiconductor equipment through the stabilizing assembly, further improving the stability of the semiconductor equipment during maintenance. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 The structure schematic diagram of an auxiliary load bearing device according to the embodiment of the application is shown.

[0020] Figure 2 The structure schematic diagram of another auxiliary load bearing device according to the embodiment of the application is shown.

[0021] Figure 3 The connection structure schematic diagram of a load bearing platform and an expansion platform according to the embodiment of the application is shown.

[0022] Figure 4 The connection structure schematic diagram of another load bearing platform and expansion platform according to the embodiment of the application is shown.

[0023] Figure 5 The structure schematic diagram of a load bearing mechanism according to the embodiment of the application is shown.

[0024] Element number explanation

[0025] 100 load bearing mechanism

[0026] 110 load bearing platform

[0027] 120 expansion platform

[0028] 130 sliding assembly

[0029] 131 load bearing sliding piece

[0030] 132 expansion sliding piece

[0031] 133 locking piece

[0032] 140 stabilizing assembly

[0033] 141 stabilizing piece

[0034] 142 soft film layer

[0035] 150 rotating piece

[0036] 200 lifting mechanism

[0037] 210 lifting structure

[0038] 220 fixing structure

[0039] 300 base DETAILED DESCRIPTION

[0040] The present application is herein described, by way of example only, with the application made apparent to those skilled in the art, from this disclosure. The present application can be implemented or applied in other different specific embodiments and with various modifications and changes, all of which do not depart from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other, without conflict.

[0041] It should be noted that the drawings provided in the following embodiments only schematically illustrate the basic concept of the present application, and only the components related to the present application are shown in the drawings, rather than being drawn according to the number, shape and size of the components in actual implementation. The shape, number and proportion of each component in actual implementation can be arbitrarily changed, and the layout pattern of the components can be more complex.

[0042] The following embodiments of the present application provide an auxiliary load-bearing device for lifting a semiconductor device during regular maintenance and repair, so as to facilitate the inspection and maintenance of parts of the semiconductor device, especially the bottom parts, without the need for manual lifting, thereby improving the stability of the semiconductor device during maintenance and repair, reducing the risk of the semiconductor device falling over or parts falling off, and thereby improving the safety of the semiconductor device during maintenance and repair.

[0043] The principle of the auxiliary load-bearing device of the present embodiment, i.e. the embodiment, will be described in detail below with reference to the drawings, so that those skilled in the art can understand the auxiliary load-bearing device of the present embodiment without creative labor.

[0044] The present embodiment provides an auxiliary load-bearing device for lifting a semiconductor device for maintenance and repair. Specifically, as shown in Figure 1As shown, the auxiliary load-bearing device comprises a base 300, a lifting mechanism 200 fixedly arranged on the base 300, and a load-bearing mechanism 100 fixedly arranged on the lifting mechanism 200. The load-bearing mechanism 100 comprises a load-bearing platform 110 for lifting external equipment, i.e. semiconductor equipment that needs to be maintained, and the lifting mechanism 200 is used to lift the load-bearing mechanism 100, so as to change the height of the semiconductor equipment on the load-bearing mechanism 100, thereby facilitating the maintenance of the semiconductor equipment by the operator, without the need for manpower to lift, so that the semiconductor equipment remains stable during maintenance, thereby improving the safety of the maintenance process.

[0045] It should be noted that the lifting mechanism 200 includes but is not limited to a pneumatic cylinder lifting mechanism, a hydraulic lifting mechanism, or an electric lifting mechanism, as long as it can realize the lifting of the load-bearing mechanism 100, which is not specifically limited in the present application. Exemplarily, as shown in Figure 2 The lifting mechanism 200 is a pneumatic cylinder lifting mechanism, and a gas inlet (not shown in the figure) is arranged at the bottom, through which compressed air is injected into the lifting mechanism 200 to realize the lifting of the load-bearing mechanism 100.

[0046] Further, in order to improve the stability of the load-bearing mechanism 100 during lifting, the lifting mechanism 200 comprises a fixing structure 220 and a plurality of lifting structures 210, the fixing structure 220 is fixed on the base 300, and all the lifting structures 210 are fixed on the fixing structure 220, so as to realize the lifting of the load-bearing mechanism 100. Through the support of the plurality of lifting structures 210, the stability of the load-bearing mechanism 100 is improved, so that the semiconductor equipment placed on the load-bearing mechanism 100 remains stable during lifting, avoiding the semiconductor equipment from falling over or parts falling off, effectively improving the safety of the load-bearing mechanism 100 during lifting.

[0047] Exemplarily, as shown in Figure 2 The lifting mechanism 200 is a pneumatic cylinder lifting structure, and the internal spaces of all the lifting structures 210 are connected to each other through the fixing structure 220, so that the air pressures in all the lifting structures 210 remain equal, thereby realizing the synchronous lifting of all the lifting structures 210, and achieving the stable lifting of the load-bearing mechanism 100.

[0048] It should be noted that since various types of semiconductor equipment have different volumes, when the bottom area of the semiconductor equipment is larger than the area of the load-bearing platform 110, the semiconductor equipment is prone to position deviation when placed on the load-bearing platform 110, resulting in different gravitational forces on both sides of the semiconductor equipment and causing the semiconductor equipment to fall over. Based on this, in some optional embodiments, as shown in Figure 1As shown, the load bearing mechanism 100 of the embodiment further comprises an extension platform 120, which is used to expand the load bearing area of the load bearing mechanism 100 when the bottom surface area of the semiconductor device is too large, so as to avoid the semiconductor device from falling down due to position deviation. In other words, the load bearing area of the load bearing mechanism 100 can be changed through the extension platform 120, so as to adapt to more types or models of semiconductor devices, and effectively improve the practicability of the auxiliary load bearing device provided by the embodiment.

[0049] Further, the extension platform 120 is relatively moved with the load bearing platform 110 through a sliding assembly 130, so as to change the load bearing area. Specifically, as shown in Figures 3-4 The load bearing mechanism 100 comprises the load bearing platform 110, the sliding assembly 130 below the load bearing platform 110, and the extension platform 120 below the sliding assembly 130, wherein the lower surface of the load bearing platform 110 is fixed with the sliding assembly 130, and the upper surface of the extension platform 120 is fixed with the sliding assembly 130. The load bearing area is changed by driving the extension platform 120 to move relative to the load bearing platform 110 through the sliding assembly 130. For example, as shown in Figure 1 The sliding assembly 130 drives the extension platform 120 to move to the left or right side beyond the edge of the load bearing platform 110, so as to expand the load bearing area, so as to adapt to semiconductor devices with larger bottom surface area. Meanwhile, the extension platform 120 can also be used to place the disassembled parts during maintenance of the semiconductor device, and further improve the convenience of maintenance of the semiconductor device. Alternatively, the sliding assembly 130 drives the extension platform 120 to retract below the load bearing platform 110, so as to reduce the load bearing area, and further reduce the volume of the auxiliary load bearing device, so as to facilitate the normal use of the auxiliary load bearing device in a space-limited scene, and effectively improve the practicability of the auxiliary load bearing device provided by the embodiment.

[0050] Specifically, the sliding assembly 130 comprises a load bearing sliding piece 131 and an extension sliding piece 132 arranged in pairs. The lower surface of the load bearing platform 110 is fixed with the load bearing sliding piece 131, and the upper surface of the extension platform 120 is fixed with the extension sliding piece 132. The relative movement between the load bearing sliding piece 131 and the extension sliding piece 132 can drive the relative movement between the extension platform 120 and the load bearing platform 110, so as to change the load bearing area.

[0051] For example, as shown in Figure 3As shown, the load-bearing sliding member 131 and the extension sliding member 132 are two matching slide rails, which enable the relative movement between the extension platform 120 and the load-bearing platform 110 through the relative movement between the load-bearing sliding member 131 and the extension sliding member 132. Specifically, when the extension sliding member 132 slides outward along the load-bearing sliding member 131, it can drive the extension platform 120 to slide outward, thereby increasing the load-bearing area of ​​the load-bearing mechanism 100; when the extension sliding member 132 retracts inward along the load-bearing sliding member 131, it can drive the extension platform 120 to retract inward, thereby reducing the load-bearing area of ​​the load-bearing mechanism 100.

[0052] Or, such as Figure 4 As shown, the load-bearing sliding member 131 is a slide rail, and the extended sliding member 132 is a matching slider. By sliding the extended sliding member 132 along the load-bearing sliding member 131, the relative movement between the extended platform 120 and the load-bearing platform 110 is driven, thereby changing the load-bearing area. For the specific method and principle of change, please refer to the above content, which will not be repeated here.

[0053] Furthermore, the extended slider 132 is equipped with multiple sliders to improve the stability of the extended platform 120 during the sliding process.

[0054] Similarly, the load-bearing sliding member 131 is a slider, and the extended sliding member 132 is a matching slide rail, so as to realize the relative movement between the extended platform 120 and the load-bearing platform 110, thereby changing the load-bearing area. Furthermore, the load-bearing sliding member 131 consists of multiple sliders to improve the stability of the extended platform 120 during the sliding process. For the specific working principle and implementation method, please refer to the above content, which will not be repeated here.

[0055] It should be noted that the above examples provide specific structures for the load-bearing sliding member 131 and the extended sliding member 132, but are not limited thereto. As long as the relative movement between the load-bearing sliding member 131 and the extended sliding member 132 can be achieved, thereby driving the relative movement between the extended platform 120 and the load-bearing platform 110, this application does not impose any specific limitations.

[0056] In some optional embodiments, both the load-bearing sliding member 131 and the extended sliding member 132 are provided with at least one locking hole, such as... Figures 3-4As shown by the dotted line, the sliding assembly 130 also includes a locking member 133. The locking member 133 and the locking hole secure the relative position between the load-bearing sliding member 131 and the extended sliding member 132, thereby securing the relative position between the extended platform 120 and the load-bearing platform 110. This ensures that the load-bearing mechanism 100 maintains a stable state when supporting the semiconductor device, preventing instability caused by the sliding of the extended platform 120 during the support process. Specifically, the extended platform 120 is slid to the desired position, and the locking member 133 passes through the corresponding locking holes on the load-bearing sliding member 131 and the extended sliding member 132, thereby fixing the relative position between the load-bearing sliding member 131 and the extended sliding member 132, thus securing the relative position between the extended platform 120 and the load-bearing platform 110.

[0057] In some optional embodiments, the load-bearing mechanism 100 includes multiple extension platforms 120, which expand the load-bearing area of ​​the load-bearing mechanism 100 in various directions to prevent instability caused by the center of gravity shifting when a single extension platform 120 slides outward. Specifically, each extension platform 120 is disposed under the load-bearing platform 110 via a sliding component 130, so that each extension platform 120 can move relative to the load-bearing platform via the corresponding sliding component 130, thereby changing the load-bearing area and preventing the center of gravity shifting of the auxiliary load-bearing device due to changes in the shape of the load-bearing mechanism 100, further improving the stability of the semiconductor device when placed on the auxiliary load-bearing device.

[0058] For example, such as Figure 5 As shown, the load-bearing mechanism 100 includes two extension platforms 120, located on the left and right sides below the load-bearing platform 110, respectively. The two extension platforms 120 extend to the left or right via corresponding sliding components 130 to change the load-bearing area of ​​the load-bearing mechanism 100. It should be noted that, to ensure the center of gravity of the auxiliary load-bearing device does not shift to the left or right due to the movement of the extension platforms 120, the two extension platforms 120 move the same distance to the left or right via their corresponding sliding components 130. This maintains balance on both sides of the auxiliary load-bearing device, improving the stability of the semiconductor device when placed on it. Of course, the load-bearing mechanism 100 may also include other numbers of extended platforms 120. For example, when the load-bearing platform 110 is square, the load-bearing mechanism 100 includes four extended platforms 120, which are respectively arranged below each side of the square load-bearing platform 110; or, when the load-bearing platform 110 is circular, the load-bearing mechanism 100 includes multiple extended platforms 120 arranged circumferentially along the load-bearing platform 110. As long as the extended platform 120 changes the load-bearing area of ​​the load-bearing mechanism 100, it is possible to avoid the center of gravity of the auxiliary load-bearing device shifting, which would cause the semiconductor device to tip over or fall. This embodiment does not impose specific limitations here.

[0059] It should be noted that, in order to avoid the instability caused by the position movement of the semiconductor device during the maintenance, the load bearing mechanism 100 further comprises a fixing assembly 140 for fixing the semiconductor device. The fixing assembly 140 is arranged at the edge of the extension platform 120 and is perpendicular to the extension platform 120 and can rotate around the horizontal direction, so as to fix the semiconductor device by the fixing assembly 140 when the semiconductor device is placed on the load bearing platform 110.

[0060] Specifically, as shown in Figure 5 , the load bearing mechanism 100 further comprises a rotating member 150, which is inserted into the edge of the extension platform 120 through one end of the fixing assembly 140, so as to fix the fixing assembly 140 and enable the fixing assembly 140 to rotate around the rotating member 150; the other end of the fixing assembly 140, which is not fixed by the rotating member 150, is a clamping end, and the position of the clamping end changes correspondingly when the fixing assembly 140 rotates around the rotating member 150, i.e., when the semiconductor device is placed on the load bearing platform 110, the fixing assembly 140 rotates around the rotating member 150 so that the clamping end is located above the extension platform 120, thereby enabling the clamping end to contact the semiconductor device and achieve the fixation of the semiconductor device; when the semiconductor device is not placed on the load bearing platform 110, the fixing assembly 140 rotates around the rotating member 150 so that the clamping end is located below the extension platform 120, and at this time, the upper side of the load bearing platform 110 is not blocked, so as to facilitate the placement of the semiconductor device on the load bearing platform 110.

[0061] Further, the clamping end of the fixing assembly 140 is provided with a fixing member 141, which is used to abut against the semiconductor device placed on the load bearing platform 110, so as to achieve the fixation of the semiconductor device.

[0062] Exemplarily, as shown in Figure 5 , the load bearing mechanism 100 comprises two extension platforms 120, which are arranged below the left side and the right side of the load bearing platform 110 respectively, and the outer edges of the two extension platforms 120 are provided with the fixing assemblies 140 fixed by the rotating members 150; when the semiconductor device is placed on the load bearing platform 110, the two extension platforms 120 are moved to the appropriate positions and fixed, and the fixing assemblies 140 arranged at the edges of the extension platforms 120 are rotated so that the clamping ends are located above the extension platforms 120, thereby enabling the fixing members 141 to abut against the semiconductor device, i.e., enabling the left and right sides of the semiconductor device to be abutted by a fixing member 141 respectively, so as to achieve the fixation of the semiconductor device.

[0063] Of course, when more expansion platforms 120 are arranged on the load-bearing mechanism, more stabilizing assemblies 140 can be arranged to fix the semiconductor device in multiple directions, thereby further enhancing the stability of the semiconductor device. For details, refer to the aforementioned arrangement of the load-bearing mechanism 100 including multiple expansion platforms 120, which will not be repeated here.

[0064] Further, to avoid damage to the semiconductor device by the stabilizing member 141 during the fixing process, the stabilizing member 141 is provided with a soft film layer 142 at the end close to the semiconductor device, i.e., the soft film layer 142 covers the end of the stabilizing member 141 close to the semiconductor device, so that the semiconductor device actually contacts the soft film layer 142 when the stabilizing assembly 140 fixes the semiconductor device, thereby avoiding damage to the semiconductor device by the stabilizing member 141 and protecting the semiconductor device.

[0065] In some optional embodiments, the load-bearing mechanism 100 in the present embodiment further includes an anti-sliding film (not shown in the figure) arranged on the upper surface of the load-bearing platform 110 to further fix the position of the semiconductor device on the load-bearing mechanism. Specifically, when the semiconductor device is placed on the load-bearing platform 110, it is actually placed on the anti-sliding film. Since the anti-sliding film has strong friction with the semiconductor device, the probability of sliding of the semiconductor device during maintenance is reduced, thereby improving the stability of the semiconductor device and further improving the safety of the semiconductor device during maintenance.

[0066] For example, the anti-sliding film includes but is not limited to a rubber anti-sliding film or a silica gel anti-sliding film, as long as the surface of the film layer has a large friction coefficient to generate a large friction force, which is not specifically limited in the present embodiment.

[0067] Further, the surface of the anti-sliding film is provided with a pattern structure to further enhance the friction with the semiconductor device.

[0068] In summary, the auxiliary load-bearing device provided in the present application realizes the lifting of the semiconductor device through the load-bearing mechanism 100, thereby avoiding the instability caused by manual lifting and reducing the risk of overturning or falling of parts of the semiconductor device. At the same time, the present application changes the size of the load-bearing area of the load-bearing mechanism 100 through the expansion platform 120. When the bottom surface area of the semiconductor device to be maintained is large, the expansion platform 120 is used to increase the load-bearing area to adapt to the semiconductor device and avoid overturning caused by the suspension of both sides or a single side. When the bottom surface area of the semiconductor device to be maintained is small, the expansion platform 120 is used to reduce the load-bearing area, thereby reducing the space occupation of the auxiliary load-bearing device to adapt to the operation requirements in a narrow space, effectively improving the practicality of the auxiliary load-bearing device provided in the present application, and having high industrial application value in actual production and application.

[0069] The descriptions of the corresponding flow or structure of each of the above figures are each focused on, and the parts not described in detail in a certain flow or structure can be referred to the related description of other flow or structure.

[0070] The above embodiments are only illustrative of the principles of the present application and its effects, and are not used to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical ideas disclosed by the present application should be covered by the claims of the present application.

Claims

1. An auxiliary load bearing device, characterized in that, The base, the lifting mechanism fixedly arranged on the base, and the load-bearing mechanism fixed to the lifting structure of the lifting mechanism; The load-bearing mechanism comprises a load-bearing platform and at least one extension platform below the load-bearing platform, and the load-bearing platform and the extension platform are connected through a sliding assembly to enable the relative movement of the extension platform and the load-bearing platform in the horizontal direction through the sliding assembly. The sliding assembly comprises a load-bearing sliding member and an extension sliding member arranged in pairs, the load-bearing sliding member is fixed to the lower surface of the load-bearing platform, and the extension sliding member is fixed to the upper surface of the extension platform.

2. The supplemental load bearing device of claim 1, wherein, When the load-bearing sliding member is a sliding rail, the extension sliding member is a sliding rail or a sliding block arranged in pairs with the load-bearing sliding member; when the load-bearing sliding member is a sliding block, the extension sliding member is a sliding rail arranged in pairs with the load-bearing sliding member. At least one locking hole is arranged on the load-bearing sliding member and the extension sliding member; the sliding assembly further comprises a locking member; the locking member penetrates through the locking holes on the load-bearing sliding member and the extension sliding member to realize the relative fixation of the extension platform and the load-bearing platform.

3. The supplemental load bearing device of claim 2, wherein, The load-bearing mechanism comprises a plurality of extension platforms, and each extension platform is arranged below the load-bearing platform through a sliding assembly.

4. The supplemental load bearing device of claim 2, wherein, The load-bearing mechanism further comprises a rotating member and a stabilizing assembly, one end of the stabilizing assembly is fixed to the edge of the extension platform through the rotating member, and the other end of the stabilizing assembly is a clamping end; when the external device is placed on the load-bearing platform, the stabilizing assembly rotates around the rotating member to the clamping end above the extension platform.

5. The supplemental load bearing device of claim 1, wherein, When the external device is not placed on the load-bearing platform, the stabilizing assembly rotates around the rotating member to the clamping end below the extension platform. The clamping end of the stabilizing assembly is provided with a stabilizing member, and the end close to the external device is covered by a soft film layer.

6. The supplemental load bearing device of claim 5, wherein, The load-bearing mechanism further comprises an anti-sliding film arranged on the upper surface of the load-bearing platform.

7. The supplemental load bearing device of claim 1, wherein, The anti-sliding film comprises a rubber anti-sliding film or a silica gel anti-sliding film.

8. The supplemental load bearing device of claim 7, wherein, The lifting mechanism is a pneumatic lifting mechanism, a hydraulic lifting mechanism, or an electric lifting mechanism.

9. The supplemental load bearing device of claim 1, wherein, The lifting mechanism comprises a fixed structure and a plurality of lifting structures, the fixed structure is fixed on the base, all the lifting structures are fixed on the fixed structure, and all the lifting structures are fixed with the load-bearing mechanism.

10. The supplemental load bearing device of claim 1, wherein, ​

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