Device for detecting wafer iron ring
By designing a device for inspecting wafer iron rings, utilizing a base platform, wafer iron ring inspection grooves and pick-up slots, and a horizontal inspection plate/ruler, the problem of product abnormalities caused by wafer iron ring deformation or warping is solved, enabling timely inspection and rejection, and improving operational safety.
Patent Information
- Application Number
- CN202520052682.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-09
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2035-01-09
AI Technical Summary
In existing technologies, deformed or warped wafer iron rings are prone to getting stuck in the machine or fixture, affecting subsequent product operations and causing product abnormalities.
Design a device for detecting iron rings on wafers, including a base platform and a wafer iron ring inspection groove. The contour of the groove matches the standard contour of the wafer iron ring to be inspected. The deformation and warping of the wafer iron ring are detected by picking up the groove and using a horizontal inspection plate or ruler, and abnormal iron rings are promptly rejected.
It can promptly detect and eliminate deformed or warped wafer iron rings, preventing them from affecting subsequent product operations and improving operational safety.
Smart Images
Figure CN223596771U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor integrated circuit manufacturing technology, and relates to a device for detecting iron rings on wafers. Background Technology
[0002] In the semiconductor packaging process, the thinned wafer needs to be cut into individual dies. Before wafer cutting, a cutting adhesive film needs to be attached to the back of the wafer as a substrate for the dies to prevent the wafer from scattering after cutting. When attaching the cutting adhesive film, the area needs to be larger than the wafer area. At this time, a wafer iron ring is needed as a support for the cutting adhesive film.
[0003] In the dicing and subsequent tape-and-reel processes, wafer ferrules play a crucial role as tools supporting the wafer and the dicing adhesive film. To ensure smooth wafer handling and operations during dicing and subsequent processes, the wafer ferrules need to maintain a fixed shape, meaning they cannot deform or warp; otherwise, they will get stuck in the machine or fixture, causing product abnormalities. Furthermore, since wafer ferrules are used repeatedly over long periods, they are prone to deformation or warping. Before fixing the dicing adhesive film onto the wafer ferrules, deformed or warped ferrules must be promptly detected and discarded to avoid affecting wafer dicing.
[0004] Therefore, how to provide a device for detecting wafer iron rings and promptly detect deformed or warped wafer iron rings to avoid affecting subsequent product operations and improve safety has become an important problem that urgently needs to be solved by those skilled in the art.
[0005] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this application. Utility Model Content
[0006] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a device for detecting wafer iron rings, which solves the problem in the prior art where deformed or warped wafer iron rings get stuck in the machine or fixture, affecting subsequent product operations and causing product abnormalities.
[0007] To achieve the above and other related objectives, this utility model provides a device for detecting iron rings on wafers, comprising:
[0008] The base platform includes a first side and a second side that are positioned opposite to each other.
[0009] A wafer iron ring inspection groove is formed on the first surface of the base platform, and the outline of the wafer iron ring inspection groove matches the standard outline of the wafer iron ring to be inspected.
[0010] at least one taking slot, the taking slot being open from the first surface of the base platform and extending towards the second surface of the base platform, the taking slot being in communication with the wafer ring inspection groove and protruding outside the outer sidewall and / or the inner sidewall of the wafer ring inspection groove in the plane where the base platform is located.
[0011] Optionally, the number of the taking slots is multiple.
[0012] Optionally, the multiple taking slots are uniformly distributed on the track of the wafer ring inspection groove.
[0013] Optionally, the taking slot does not penetrate the base platform, and the depth of the taking slot is greater than the depth of the wafer ring inspection groove; or the taking slot penetrates the base platform.
[0014] Optionally, the opening shape of the taking slot is one of capsule shape, rectangular shape, circular shape and triangular shape.
[0015] Optionally, further comprising a horizontal inspection plate, the horizontal inspection plate being placed on the first surface of the base platform and covering the wafer ring inspection groove.
[0016] Optionally, further comprising a horizontal inspection ruler, the length of the horizontal inspection ruler being greater than the farthest distance of the opposite outer sidewalls of the wafer ring inspection groove.
[0017] Optionally, further comprising a horizontal inspection ruler receiving groove, the horizontal inspection ruler receiving groove being located on the first surface of the base platform and not being in communication with the wafer ring inspection groove, and the horizontal inspection ruler being received in the horizontal inspection ruler receiving groove.
[0018] Optionally, further comprising a dustproof cover, the dustproof cover being movably connected to one side of the base platform.
[0019] Optionally, multiple wafer ring inspection grooves with different sizes are arranged in the base platform.
[0020] As described above, the device for detecting wafer iron ring of the utility model, including base platform, wafer iron ring inspection groove and at least one take slot, wherein, the base platform includes the first face and the second face of opposite setting, wafer iron ring inspection groove is set up in the first face of base platform, the profile of wafer iron ring inspection groove is matched with the standard profile of the wafer iron ring to be detected, take slot is opened from the first face of base platform, and extends to the second face direction of base platform, and take slot is communicated with wafer iron ring inspection groove and protrudes from the outer side wall and / or inner side wall of wafer iron ring inspection groove on the plane where base platform is located. The device for detecting wafer iron ring of the utility model can detect the wafer iron ring of deformation or warping in time, can eliminate the abnormal wafer iron ring in time, avoid the follow-up operation of product being influenced, improve the operation safety. BRIEF DESCRIPTION OF DRAWINGS
[0021] Figure 1 It is shown as the structure top view of the device for detecting wafer iron ring of the utility model.
[0022] Figure 2 It is shown as Figure 1 It is shown as the section view along the direction of the device for detecting wafer iron ring of the utility model in AA'.
[0023] Figure 3 It is shown as another structure top view of the device for detecting wafer iron ring of the utility model.
[0024] Figure 4 It is shown as Figure 3 It is shown as the section view along the direction of the device for detecting wafer iron ring in BB'.
[0025] Figure 5 It is shown as the top view of still another structure of the device for detecting wafer iron ring of the utility model.
[0026] Figure 6 It is shown as the top view of still another structure of the device for detecting wafer iron ring of the utility model.
[0027] REFERENCE SIGNS
[0028] 1 base platform
[0029] 2 wafer iron ring inspection groove
[0030] 3 take slot
[0031] 4 horizontal inspection plate
[0032] 5 horizontal inspection ruler
[0033] 6 horizontal inspection ruler storage groove
[0034] 7 dustproof cover
[0035] 8 hinge
[0036] D1 depth of the pickup slot
[0037] D2 depth of the wafer ring detection groove
[0038] L length of the level
[0039] W the farthest distance of the wafer ring detection groove from the opposite outer sidewall DETAILED DESCRIPTION
[0040] The above objects and other advantages of the present application will become more apparent by describing in detail the embodiments thereof with reference to the attached drawings in which:
[0041] It should be emphasized that the term "comprises / comprising" when used in this specification is taken to mean the presence of stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps, components or groups thereof.
[0042] Features described and / or illustrated with respect to one embodiment can be used in the same or similar manner in one or more other embodiments in combination with or in place of features of other embodiments.
[0043] As described in the detailed description of the embodiments of the present application, in order to facilitate the description, the schematic diagram showing the structure of the device will be partially enlarged without the general proportion, and the schematic diagram is only an example, which should not limit the scope of protection of the present application. In addition, the three-dimensional spatial dimensions of length, width and depth should be included in the actual manufacture.
[0044] For the convenience of description, spatial relationship words such as "under", "below", "lower", "underneath", "above", "upper" and the like can be used herein to describe the relationship of one element or feature to other elements or features shown in the drawings. It will be understood that these spatial relationship words are intended to include other orientations of the device in use or operation in addition to the orientations depicted in the drawings. In addition, when a layer is referred to as "between" two layers, it can be the only layer between the two layers, or one or more intervening layers can also be present.
[0045] In the context of the present application, the structure described with the first feature "on" the second feature can include the embodiment in which the first and second features form direct contact, and can also include the embodiment in which another feature is formed between the first and second features, so that the first and second features can not be in direct contact.
[0046] It needs to be explained that the diagram provided in the embodiment only illustrates the basic concept of the utility model in a schematic way, and only shows the components related to the utility model in the diagram, not drawn according to the number, shape and size of the components in actual implementation. The shape, number and proportion of each component in actual implementation can be changed arbitrarily, and the component layout type can be more complex.
[0047] Please refer to Figure 1 , which shows a structure top view of the device for detecting wafer iron ring, the device for detecting wafer iron ring includes base platform 1, wafer iron ring inspection groove 2 and at least one taking slot 3, wherein the base platform 1 includes oppositely arranged first face and second face, the wafer iron ring inspection groove 2 is opened on the first face of the base platform 1, the contour of the wafer iron ring inspection groove 2 matches the standard contour of the wafer iron ring to be detected, the taking slot 3 is opened from the first face of the base platform 1 and extends to the second face of the base platform 1, the taking slot 3 is in communication with the wafer iron ring inspection groove 2 and protrudes from the outer side wall and / or inner side wall of the wafer iron ring inspection groove 2 on the plane where the base platform 1 is located.
[0048] Specifically, the design of the wafer iron ring has particularity, the standard contour of the wafer iron ring to be detected is the contour when the wafer iron ring to be detected is not deformed and not warped, the wafer iron ring is placed in the wafer iron ring inspection groove 2 in a fixed direction before each use, if the wafer iron ring is deformed, the wafer iron ring will be stuck on the side wall of the wafer iron ring inspection groove 2 and cannot fall to the bottom surface of the wafer iron ring inspection groove 2, the deformed wafer iron ring can be detected in time and scrapped; if the wafer iron ring is warped, the wafer iron ring can be placed in the wafer iron ring inspection groove 2, but the base platform 1 is completely horizontal, the wafer iron ring cannot be completely horizontal with the first face of the base platform 1 in the same horizontal plane, the warped wafer iron ring can be detected in time and scrapped, thereby avoiding affecting the subsequent product operation and improving the safety of the subsequent operation.
[0049] As an example, please refer to Figure 2 , which shows Figure 1 , the device for detecting wafer iron ring along the AA' direction, the depth D1 of the taking slot 3 is greater than the depth D2 of the wafer iron ring detection groove 2, which facilitates taking out the inspected wafer iron ring from the wafer iron ring inspection groove 2.
[0050] As an example, the number of the taking slot 3 is multiple.
[0051] As an example, multiple taking slots 3 are uniformly distributed on the track of the wafer iron ring inspection groove 2.
[0052] As an example, the pick-up groove 3 does not penetrate the base platform 1, and the depth D1 of the pick-up groove 3 is greater than the depth D2 of the wafer iron ring detection groove 2. Please refer to [link / reference]. Figures 3-4 ,in, Figure 3 This is a top view of another structure of the device for detecting iron rings on wafers according to this invention. Figure 4 Displayed as Figure 3 The device shown is a cross-sectional view along the BB' direction for detecting wafer iron rings, or the picking slot 3 penetrates the base platform 1, making it more convenient to pick up the inspected wafer iron rings.
[0053] As an example, the opening shape of the taking groove 3 is one of capsule shape, rectangle, circle and triangle. In this embodiment, the opening shape of the taking groove 3 is capsule shape.
[0054] For example, please refer to Figure 5 The image shows another structural top view of the device for detecting wafer iron rings according to this utility model. The device for detecting wafer iron rings also includes a horizontal inspection plate 4. The horizontal inspection plate 4 is placed on the first surface of the base platform 1 and covers the wafer iron ring detection groove 2 for detecting the warping of the wafer iron ring. In this embodiment, the horizontal inspection plate 4 completely covers the wafer iron ring detection groove 2. In some other embodiments, the horizontal inspection plate 4 may also partially cover the wafer iron ring detection groove 2. By placing the horizontal inspection plate 4 multiple times, the deformation or warping of the wafer iron ring in the wafer iron ring detection groove 2 can also be detected.
[0055] Specifically, after placing the wafer to be tested in the wafer iron ring inspection groove 2, the horizontal inspection plate 4 is placed on the first surface of the base plate platform 1 and covers the wafer iron ring inspection groove 2. If there is a gap between the inspection plate 4 and the first surface of the base plate platform 1, it indicates that the wafer iron ring has warped; otherwise, it indicates that the wafer iron ring has not warped.
[0056] For example, please refer to Figure 6 The image shows another structural top view of the device for detecting wafer iron rings according to the present invention. The device for detecting wafer iron rings also includes a horizontal inspection ruler 5. The length L of the horizontal inspection ruler 5 is greater than the farthest distance W between the opposite outer walls of the wafer iron ring inspection groove 2. The horizontal inspection ruler 5 is used to detect wafer iron rings with very small warping.
[0057] As an example, the system also includes a horizontal inspection ruler storage groove 6, which is located on the first surface of the base platform 1 and is not connected to the wafer iron ring detection groove 2. The horizontal inspection ruler 5 is stored in the horizontal inspection ruler storage groove 6.
[0058] Specifically, when the warping degree of the wafer iron ring is very small, the operator cannot judge the small gap between the horizontal test plate 4 and the first surface of the base platform 1 by naked eye, the horizontal test ruler 5 is taken out from the horizontal test ruler storage groove 6 and placed on the wafer iron ring test groove 2, and whether the plane is horizontal can be used to judge whether the wafer iron ring is warped, which can further improve the accuracy of detecting the wafer iron ring.
[0059] As an example, the device for detecting the wafer iron ring further comprises a dust cover 7 movably connected to one side of the base platform 1, and in this embodiment, the dust cover 7 is hinged to one side of the base platform 1 through a hinge 8, so as to prevent dust particles from entering the wafer test groove 2 and avoid errors in the inspection results.
[0060] Specifically, when detecting the wafer iron ring, the wafer iron ring needs to be placed in the wafer iron ring groove 2, and the wafer iron ring groove 2 needs to be kept clean. If dust particles exist in the wafer iron ring groove 2, the warping detection of the wafer iron ring will be affected, and a qualified (non-warping) wafer iron ring may be misjudged as a warped wafer iron ring, so that the inspection results are wrong.
[0061] As an example, the base platform 1 is provided with a plurality of wafer iron ring detection grooves 2 of different sizes, so that different sizes of wafer iron rings can be detected at the same time.
[0062] In summary, the device for detecting the wafer iron ring of the utility model, including base platform, wafer iron ring test groove and at least one take slot, wherein, the base platform includes the first surface and the second surface which are oppositely arranged, the wafer iron ring test groove is opened in the first surface of the base platform, the contour of the wafer iron ring test groove matches the standard contour of the wafer iron ring to be detected, the take slot is opened from the first surface of the base platform and extends to the second surface of the base platform, and the take slot is communicated with the wafer iron ring test groove and protrudes from the outer wall and / or inner wall of the wafer iron ring test groove on the plane of the base platform. The device for detecting the wafer iron ring of the utility model can detect the wafer iron ring that is deformed or warped in time, can eliminate the abnormal wafer iron ring in time, avoid the influence on the subsequent operation of the product, and improve the operation safety. Therefore, the utility model effectively overcomes the shortcomings in the prior art and has high industrial utilization value.
[0063] The above embodiments only exemplarily illustrate the principles and effects of the present application, and are not used to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the present application should be covered by the claims of the present application.
Claims
1. A device for detecting iron rings on a wafer, characterized in that, The utility model relates to a wafer iron ring detection device, including: A base platform includes a first face and a second face arranged oppositely; A wafer iron ring detection groove is opened in the first face of the base platform, and the profile of the wafer iron ring detection groove matches the standard profile of a wafer iron ring to be detected; At least one pickup slot is opened from the first face of the base platform and extends in the direction of the second face of the base platform, the pickup slot is in communication with the wafer iron ring detection groove and protrudes from the outer sidewall and / or the inner sidewall of the wafer iron ring detection groove in the plane where the base platform is located.
2. The apparatus for detecting a wafer iron ring according to claim 1, wherein: The number of pickup slots is multiple.
3. The apparatus for detecting a wafer iron ring according to claim 2, wherein: Multiple pickup slots are uniformly distributed on the track of the wafer iron ring detection groove.
4. The apparatus for detecting a wafer iron ring according to claim 1, wherein: The pickup slot does not penetrate the base platform, and the depth of the pickup slot is greater than the depth of the wafer iron ring detection groove; or the pickup slot penetrates the base platform.
5. The apparatus for detecting a wafer iron ring according to claim 1, wherein: The opening shape of the pickup slot is one of a capsule shape, a rectangular shape, a circular shape, and a triangular shape.
6. The apparatus for detecting a wafer iron ring according to claim 1, wherein: It also includes a horizontal detection plate placed on the first face of the base platform and covering the wafer iron ring detection groove.
7. The apparatus for detecting a wafer iron ring according to claim 1, wherein: It also includes a horizontal detection ruler with a length greater than the farthest distance between the opposite outer sidewalls of the wafer iron ring detection groove.
8. The apparatus for detecting a wafer iron ring according to claim 7, wherein: It also includes a horizontal detection ruler storage groove located on the first face of the base platform and not in communication with the wafer iron ring detection groove, and the horizontal detection ruler is stored in the horizontal detection ruler storage groove.
9. The apparatus for detecting a wafer iron ring according to claim 1, wherein: It also includes a dustproof cover movably connected to one side of the base platform.
10. The apparatus for detecting a wafer iron ring according to claim 1, wherein: Multiple wafer iron ring detection grooves with different sizes are provided in the base platform.