Measuring tool for concave-convex degree of wafer ejector pin

Abstract

The utility model discloses a tool for measuring the concave-convex degree of a wafer ejector pin, which comprises a supporting table, a distance sensor and a probe, and is characterized in that the supporting table comprises a bottom surface with at least one part being flat; the probe is telescopically arranged in the supporting table in a penetrating mode in the direction perpendicular to the bottom face. The distance sensor is supported by the supporting table and connected with the probe, and the distance sensor is arranged to sense and output the stretching amount of the probe. According to the utility model, the telescopic probe is arranged to accurately measure and display the protruding or sinking length of the wafer ejector pin, so that after the scheme is implemented, the capability of monitoring the state of a machine table is greatly improved, the wafer ejector pin is ensured to be always kept in the optimal working state, the problem that a wafer is scrapped due to collision is effectively avoided, and the production efficiency is improved. The production efficiency and the product quality are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing field especially relates to a kind of measuring tool of wafer needle concave-convex degree. BACKGROUND

[0002] As Figure 1 And 2 As shown in Figure, wafer pin (wafer pin) on plasma enhanced chemical vapor deposition (PECVD ASM) machine is used to support wafer firmly when heater drops to ensure the accuracy and safety of processing process. However, once the height of these wafer pins is abnormal, it is extremely likely to cause wafer collision during processing, and then cause wafer damage or even scrap, which is undoubtedly a huge loss for semiconductor production.

[0003] Currently, when preventive maintenance (PM) is carried out on plasma enhanced chemical vapor deposition machine, there is no standard tool for accurately measuring the height of wafer pin. Technical personnel can only rely on naked eye observation, which is not only inefficient, but also difficult to ensure the accuracy and consistency of measurement, and there is a great hidden danger.

[0004] Therefore, it is urgent to improve the current machine and accurately measure the height of protrusion and depression of wafer pin. UTILITY MODEL CONTENT

[0005] In order to accurately measure the height of protrusion and depression of wafer pin, the utility model provides a kind of measuring tool of wafer needle concave-convex degree, the length of protrusion or depression of wafer pin is accurately measured and displayed by setting telescopic probe and display screen, after implementing the scheme, the monitoring ability of machine state will be greatly improved, to ensure that wafer pin always keeps in the best working state, to effectively avoid the problem of wafer scrap due to collision, improve production efficiency and product quality.

[0006] According to one aspect of the utility model, a kind of measuring tool of wafer needle concave-convex degree is provided, it includes support table, distance sensor and probe,

[0007] The support table includes at least a part of flat bottom surface;

[0008] The probe is telescopically arranged in the support table along the direction perpendicular to the bottom surface;

[0009] The distance sensor is supported by the support table and connected with the probe, and is set to sense and output the telescopic amount of the probe.

[0010] According to one embodiment of the utility model, the support table bottom has recess, and the tip of the probe extends downward through the recess.

[0011] According to one embodiment of the present application, the distance sensor is provided with a display screen.

[0012] According to one embodiment of the present application, the wafer needle is telescopically inserted into the through hole on the heater top cover, and the tip of the probe can pass through the through hole.

[0013] According to one embodiment of the present application, the telescopic length of the probe is 15-20mm.

[0014] According to one embodiment of the present application, the tip of the probe is conical.

[0015] According to one embodiment of the present application, the vertical section of the groove is circular arc.

[0016] According to one embodiment of the present application, the distance sensor is embedded on the support table, and the probe is inserted into the distance sensor.

[0017] According to one embodiment of the present application, the upper part of the probe is provided with a pressing handle for telescoping the tip of the probe.

[0018] According to one embodiment of the present application, the tip of the probe has a metal coating.

[0019] Compared with the prior art, the present application has the following advantages: the telescopic probe and the display screen are provided to accurately measure and display the length of the wafer needle protruding or recessing, which greatly improves the monitoring ability of the machine state, ensures that the wafer needle always maintains the best working state, effectively avoids the problem of wafer scrapping due to collision, and improves the production efficiency and product quality. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed by the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0021] Figure 1 The structure of the wafer and the wafer needle in the prior art is shown;

[0022] Figure 2 The schematic diagram of the wafer needle in the prior art when the heater is in different states is shown;

[0023] Figure 3The structure diagram of the wafer needle concave-convex degree measuring tool is shown according to one example embodiment of the utility model.

[0024] Marked with reference numerals:

[0025] 1, support table; 2, distance sensor; 3, probe; 4, groove; 5, press handle; 6, display screen. DETAILED DESCRIPTION

[0026] The following detailed description of the embodiments is provided for the purpose of illustrating the principles of the present application, but not for limiting the scope thereof, the present application can be implemented in many different forms, not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of claims.

[0027] The present application provides these embodiments are to make the present disclosure thorough and complete, and to the person skilled in the art fully express the scope of the present application. It should be noted that: unless otherwise specified, the relative arrangement of components and steps, the component of material, the numerical expression and the value described in these embodiments should be interpreted as merely exemplary, and not as a limitation.

[0028] It should be noted that, in the description of the present application, unless otherwise specified, the meaning of "a plurality of" is greater than or equal to two; The orientation or position relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer" and the like is only for the convenience of describing the present application and simplifying the description, and is not indicative or implied that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the present application. When the absolute position of the described object changes, the relative position relationship may also change accordingly.

[0029] It should also be noted that, in the description of the present application, unless otherwise specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; It can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances. When it is described that a specific device is located between the first device and the second device, there can be an intermediate device between the specific device and the first device or the second device, or there can be no intermediate device.

[0030] All terms used in the present application have the same meaning as understood by those of ordinary skill in the art to which this disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in a general dictionary should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense, unless expressly defined as such herein.

[0031] Techniques, methods, and apparatus known to those of ordinary skill in the relevant art can not be discussed in detail, but should be considered part of the specification where appropriate.

[0032] As shown in Figure 3 The present application provides a wafer needle convexity and concavity measuring tool, which includes a support table 1, a distance sensor 2, and a probe 3. The support table 1 has a flat bottom surface for supporting the measuring tool to ensure its stability. The probe 3 is retractably inserted into the support table 1 along a direction perpendicular to the bottom surface. The distance sensor 2 is supported by the support table 1 and connected to the probe 3, and is configured to sense and output the retraction amount of the probe 3.

[0033] In some embodiments, the support table 1 has a groove 4 at the bottom, and the tip of the probe 3 extends downward through the groove 4. The probe 3 is retracted up and down by pressing in the middle of the groove 4, thereby ensuring the accurate positioning of the tip of the probe 3 at the desired measurement location. The design of the groove 4 can limit the movement range of the probe 3, preventing the probe 3 from colliding with the wafer needle or other objects uncontrollably, thereby protecting the integrity of the probe 3 and the sample.

[0034] Specifically, the height of the support table 1 is 80 mm, and the thickness is 25 mm.

[0035] Based on the above embodiments, a display screen 6 is provided on the distance sensor 2. The display screen 6 has a calibration zero point and reading function. The display screen 6 can display the data measured by the distance sensor 2 in real time, allowing the user to intuitively understand the distance between the current object and the sensor. Through the display screen 6, the user can more accurately read the measurement data, avoiding errors caused by human judgment or estimation. The display screen 6 can display more information, such as setting parameters, calibration prompts, etc. At the same time, the display screen 6 can also be used as a data recording tool, allowing the user to view historical measurement data or perform data analysis at any time.

[0036] In some embodiments, the measuring tool completes the reading through voice broadcast.

[0037] In some embodiments, the wafer needle is retractably inserted into the through hole on the heater top cover, and the tip of the probe 3 can pass through the through hole.

[0038] In the wafer processing process, such as plasma enhanced chemical vapor deposition (PECVD) process, the wafer needs to be transferred between the heater and the mechanical arm. The retractable design of the wafer needle allows the wafer to be smoothly raised and lowered on the heater, avoiding the shaking or tilting of the wafer during the transfer process, thereby improving the stability of the wafer transfer.

[0039] The probe 3 tip can accurately pass through the through hole, ensuring the accurate contact position between the probe 3 and the wafer needle during measurement, reducing the measurement error caused by the deviation of the contact position, and improving the accuracy and reliability of the measurement.

[0040] On the basis of the above embodiment, the retractable length of the probe 3 is 15-20 mm. Specifically, the retractable length of the probe 3 is 17 mm.

[0041] The retractable range of 15-20 mm allows the operator to fine-tune according to the actual depth of the wafer needle, ensuring that the probe 3 can accurately contact and measure the bottom of the needle, thereby improving the accuracy of the measurement. This design allows the probe 3 to be applicable to wafer needles of different specifications and sizes, enhancing the versatility and flexibility of the measurement.

[0042] By accurately controlling the retractable length of the probe 3, unnecessary collisions between the probe 3 and the wafer or other components can be effectively avoided, thereby protecting the wafer from damage and prolonging the service life of the probe 3.

[0043] The design of the retractable probe 3 makes the measurement process more rapid and efficient, reducing the time and labor cost required for measurement.

[0044] On the basis of the above embodiment, the tip of the probe 3 is conical. The conical tip can more evenly distribute the force during the passage through the through hole, avoiding damage to the wafer needle and other surrounding mechanisms.

[0045] In some embodiments, the vertical cross-section of the groove 4 is circular arc-shaped. The vertical cross-section of the groove 4 is circular arc-shaped, which can ensure that the probe 3 maintains a consistent contact angle with the wafer needle during measurement, thereby improving the accuracy and consistency of the measurement. The radius of the circular arc-shaped groove 4 is 6 mm.

[0046] On the basis of the above embodiment, the distance sensor 2 is embedded in the support table 1, and the probe 3 is inserted into the distance sensor 2.

[0047] The distance sensor 2 can accurately measure the distance between the probe 3 and the wafer needle in real time, thereby achieving precise control of the measurement process. Embedding the distance sensor 2 in the support table 1 can make the entire measurement system more compact and integrated.

[0048] This design reduces the additional connection lines and components, reduces the complexity and maintenance cost of the system. At the same time, the design of the probe 3 passing through the distance sensor 2 also optimizes the guide and support structure of the probe 3, improves the stability and accuracy of the measurement.

[0049] In some embodiments, the upper part of the probe 3 is provided with a pressing handle 5 for manipulating the telescopic tip of the probe 3. The pressing handle 5 enables the operator to easily and quickly control the telescopic tip of the probe 3 without complicated operation steps or additional tools. By pressing the handle 5, the operator can accurately control the extension length or retraction degree of the tip of the probe 3, thereby achieving accurate control of the measurement or sampling depth.

[0050] On the basis of the above embodiments, the tip of the probe 3 has a metal coating. The metal coating, such as gold plating or tungsten, generally has high hardness and wear resistance, which can protect the tip of the probe 3 from wear and corrosion, thereby prolonging the service life of the probe 3. In the long-term, frequent measurement process, the metal coating can maintain the shape and size stability of the tip of the probe 3, ensuring the accuracy and consistency of the measurement results.

[0051] One specific application of the present application is: before use, calibrate the zero point on the plane, after calibration, press the probe 3 into the through hole by pressing the handle 5 and measure, after measurement, complete the reading through the display screen 6.

[0052] The utility model discloses on the basis of the original machine table, the following improvement is carried out: through the configuration telescopic probe 3 and display screen 6, the protruding or recessed length of wafer thimble is accurately measured and intuitively displayed, which will significantly improve the monitoring efficiency of the machine table running state. This improvement can ensure that the wafer thimble is continuously maintained in a good working condition, effectively avoid the damage risk of the wafer caused by collision, can greatly reduce the loss rate in the production process, and further improve the production efficiency and product quality.

[0053] Those skilled in the art should understand that the above discussion of any embodiment is only exemplary and is not intended to limit the scope of the embodiments disclosed by the utility model (including claims) to these examples; under the idea of the embodiments of the utility model, the technical features of the above embodiments or different embodiments can also be combined, and there are many other changes of different aspects of the utility model embodiments as above. In order to be brief, they are not provided in details. Therefore, any omission, modification, equivalent replacement, improvement, etc. made within the spirit and principles of the embodiments of the utility model should be included in the protection scope of the embodiments of the utility model.

Claims

1. A tool for measuring the degree of convexity or concavity of a wafer top pin, characterized by, The support table, the distance sensor and the probe, The support table comprises a bottom surface which is at least partially flat; The probe is telescopically arranged in the support table along a direction perpendicular to the bottom surface; The distance sensor is supported by the support table and connected to the probe, and is configured to sense and output the telescopic length of the probe.

2. The wafer needle tip roughness measuring tool of claim 1, wherein, The support table has a groove at the bottom, and the tip of the probe extends downward through the groove.

3. The wafer needle tip profile measurement tool of claim 1, wherein, The distance sensor is provided with a display screen.

4. The wafer needle tip profile measurement tool of claim 1, wherein, The wafer top needle is telescopically arranged in a through hole in the top cover of the heater, and the tip of the probe can pass through the through hole.

5. The wafer needle tip profile measurement tool of claim 1, wherein, The telescopic length of the probe ranges from 15 to 20 mm.

6. The wafer needle tip profile measurement tool of claim 1, wherein, The tip of the probe is conical.

7. The wafer needle tip profile measurement tool of claim 2, wherein, The vertical cross section of the groove is circular arc-shaped.

8. The wafer top pin bump measurement tool of claim 1, wherein, The distance sensor is embedded in the support table, and the probe is arranged in the distance sensor.

9. The wafer top pin bump level measurement tool of claim 1, wherein, The upper part of the probe is provided with a pressing handle for telescoping the tip of the probe.

10. The wafer top pin bump level measurement tool of claim 1, wherein, The tip of the probe has a metal coating.

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