Test socket for chip wafer production
By designing a test socket for chip wafer production, and utilizing a combination of a base, support plate, and positioning plate, the problems of unstable positioning and easy damage in wafer testing were solved, achieving stable wafer positioning and convenient operation.
Patent Information
- Application Number
- CN202422783828.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-15
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-11-15
AI Technical Summary
Existing wafer testing machines lack positioning devices, which makes the wafers prone to displacement during testing, affecting the accuracy of test results. Furthermore, the clamping method can easily damage the wafers and is inconvenient for handling.
A test socket for chip wafer production has been designed, comprising a base, a support plate, an extension plate, and an annular groove. The combination of the positioning plate with the annular structure and the support rod enables stable positioning and convenient placement and removal of the wafer.
This improves the stability of wafers during the testing process, ensures the accuracy of test results, simplifies wafer handling, and avoids wafer damage.
Smart Images

Figure CN223597714U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer detection technical field, especially a chip wafer production test socket. BACKGROUND
[0002] The existing wafer testing machine is directly placed on the test table when testing the wafer, and lacks a positioning device for the wafer, which leads to the stability of the wafer not being guaranteed during the testing process, and displacement is likely to occur, thereby reducing the accuracy of the test results.
[0003] For example, a wafer testing machine with publication number CN219873483U includes a wafer testing table, a support, a wafer overturning positioning mechanism, and a wafer testing assembly. The support is provided on the wafer testing table, the wafer overturning positioning mechanism is provided on the support, and the wafer testing assembly is provided on the support. The wafer overturning positioning mechanism includes an overturning positioning unit and a driving assembly. The overturning positioning unit is provided on the support, and two groups of the overturning positioning unit are symmetrically arranged. The driving assembly is provided on the support and on the overturning positioning unit. The utility model relates to the technical field of wafer testing, and specifically provides a wafer testing machine that facilitates positioning of the wafer, helps to improve the stability of the wafer during the testing process, and facilitates automatic overturning of the wafer.
[0004] The above technical solution has some problems in actual application. The wafer is fixed by clamping, which can easily damage the wafer and is not convenient to take out and place.
[0005] Therefore, it is necessary to invent a chip wafer production test socket to solve the above problems. UTILITY MODEL CONTENTS
[0006] The utility model aims at providing a chip wafer production test socket to solve the problems in the background art.
[0007] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a chip wafer production test socket, including a base, the upper side of the base is provided with a supporting plate, the outer side of the supporting plate is provided with an extension plate, an annular groove is arranged between the supporting plate and the extension plate, a positioning plate with an annular structure is arranged inside the annular groove, a through groove is arranged in the middle of the supporting plate, a supporting rod is arranged inside the through groove, a plurality of supporting arms are movably arranged at the bottom end of the outer side wall of the supporting rod through a pin shaft, a plurality of connecting blocks are arranged around the bottom end of the positioning plate, the supporting arm is arranged in a "√" shape structure, and one end of the supporting arm is movably connected to the bottom end of the connecting block through a pin shaft, a sliding rod is fixedly arranged in the middle of the supporting arm, and a movable frame is arranged on the outer side of the sliding rod.
[0008] Preferably, the bottom end of the movable frame is fixedly provided with a connecting seat, and the connecting seat is fixedly arranged above the base.
[0009] Preferably, the bottom end of the supporting rod is provided with a groove, the groove bottom is fixedly provided with a top spring, and the top spring is fixedly arranged above the base.
[0010] Preferably, the top end of the supporting rod is fixedly provided with a supporting plate, and the upper surface of the supporting plate is provided with a circular groove corresponding to the supporting plate.
[0011] Preferably, the upper surface of the extending plate is provided with a plurality of arc-shaped grooves, the outer side wall of the positioning plate is provided with a plurality of arc-shaped blocks at the top, and the plurality of arc-shaped blocks correspond to the plurality of arc-shaped grooves.
[0012] Preferably, a plurality of supporting studs are fixedly arranged between the supporting plate, the extending plate and the base.
[0013] The technical effects and advantages of the present application are as follows:
[0014] 1. The base is provided, the upper surface of the base is provided with a supporting plate and an extending plate, the supporting plate can support the wafer, the annular groove is arranged between the supporting plate and the extending plate, the annular groove is provided with a positioning plate of annular structure, the positioning plate can slide upward, and the positioning plate can position the wafer after sliding upward, so as to ensure the stability of the wafer during detection, and the slidable design of the positioning plate facilitates the taking and placing of the wafer.
[0015] 2. The through groove is arranged in the middle of the supporting plate, the supporting rod is arranged in the through groove, the bottom end of the supporting rod is connected with the positioning plate through the supporting arm, the wafer can press the supporting rod downward under the action of gravity, the supporting rod drives the positioning plate to move through the supporting arm, so as to realize the automatic rising of the positioning plate after the wafer is placed, and the upward lifting of the supporting rod can be realized by pressing the positioning plate downward, so as to facilitate the taking of the wafer. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 It is a whole structure schematic view of the present application.
[0017] Figure 2 It is a supporting plate structure schematic view of the present application.
[0018] Figure 3 It is a whole structure sectional view schematic view of the present application.
[0019] Figure 4 It is a supporting arm structure schematic view of the present application.
[0020] In the figure: 1, base; 2, support plate; 3, extension plate; 4, annular groove; 5, positioning plate; 6, through groove; 7, support rod; 8, support arm; 9, connecting seat; 10, sliding rod; 11, movable frame; 12, connecting seat; 13, recess; 14, top spring; 15, supporting plate; 16, circular groove; 17, arc-shaped groove; 18, arc-shaped block; 19, support stud. DETAILED DESCRIPTION
[0021] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.
[0022] The utility model provides a kind of test socket for chip wafer production as shown in Figures 1-4 It includes base 1, the top of base 1 is provided with support plate 2, the outside of support plate 2 is provided with extension plate 3, annular groove 4 is arranged between support plate 2 and extension plate 3, annular structure's positioning plate 5 is arranged in the inside of annular groove 4, through groove 6 is arranged in the middle of support plate 2, support rod 7 is arranged in the inside of through groove 6, multiple support arms 8 are movably arranged on the bottom end of the outer side wall of support rod 7 by pin shaft, multiple connecting blocks 9 are arranged around the bottom end of positioning plate 5, support arm 8 is arranged as " " shape structure, and one end of support arm 8 is movably connected with the bottom end of connecting block 9 by pin shaft, sliding rod 10 is fixedly arranged in the middle of support arm 8, movable frame 11 is arranged on the outside of sliding rod 10, and sliding rod 10 can slide in movable frame 11, to ensure that the rotation of support arm 8 is not interfered;
[0023] Specifically, connecting seat 12 is fixedly arranged at the bottom end of movable frame 11, and connecting seat 12 is fixedly arranged on the top of base 1, recess 13 is formed in the bottom end of support rod 7, top spring 14 is fixedly arranged on the groove bottom of recess 13, and top spring 14 is fixedly arranged on the top of base 1, and the arrangement of top spring 14 ensures that support rod 7 remains in the state of being lifted when wafer is not placed.
[0024] More specifically, supporting plate 15 is fixedly arranged at the top end of support rod 7, circular groove 16 corresponding to supporting plate 15 is formed in the middle of the upper surface of support plate 2, and supporting plate 15 can be pressed into circular groove 16 to ensure the flatness of wafer after being placed.
[0025] Furthermore, multiple arc-shaped grooves 17 are formed around the upper surface of extension plate 3, multiple arc-shaped blocks 18 are arranged around the top end of the outer side wall of positioning plate 5, and multiple arc-shaped blocks 18 correspond to multiple arc-shaped grooves 17 respectively, and the arrangement of arc-shaped blocks 18 facilitates the user to press positioning plate 5 to unload wafer.
[0026] Furthermore, a plurality of support studs 19 are fixedly arranged between the support plate 2, the extension plate 3 and the base 1, and the support studs 19 can realize the connection between the base 1, the support plate 2 and the extension plate 3.
[0027] Principle of the utility model:
[0028] In use, the wafer can be placed above the supporting plate 15, and after the wafer is placed, the supporting plate 15 is driven downward by the wafer to drive the supporting rod 7 to move downward, and the supporting rod 7 drives the supporting arm 8 to move downward, at this time, the other end of the supporting arm 8 drives the connecting block 9 to move upward, and the connecting block 9 drives the positioning plate 5 to move upward, at this time, the positioning plate 5 can realize the positioning of the edge of the wafer to ensure the stability in the wafer detection process, and after the wafer is detected, the positioning plate 5 is driven downward by pressing the arc block 18, at this time, the positioning plate 5 drives the supporting arm 8 to move through the connecting block 9, the supporting arm 8 drives the supporting rod 7 to move, so that the supporting rod 7 drives the supporting plate 15 to move upward and lifts the wafer upward, at this time, the wafer can be quickly unloaded.
[0029] Finally, it should be noted that: the above only for the preferred embodiments of the utility model, and not for limiting the utility model, although the utility model is described in detail with reference to the foregoing embodiments, for the skilled in the art, it still can modify the technical scheme recorded in the foregoing embodiments, or make equivalent replacement to part of the technical features, any modification, equivalent replacement, improvement, etc. within the spirit and principles of the utility model, should be included in the protection scope of the utility model.
Claims
1. A test socket for chip wafer production, comprising a base (1), characterized in that: The upper portion of the base (1) is provided with a support plate (2), the outer side of the support plate (2) is provided with an extension plate (3), an annular groove (4) is arranged between the support plate (2) and the extension plate (3), the inside of the annular groove (4) is provided with a positioning plate (5) of an annular structure, the middle portion of the support plate (2) is provided with a through groove (6), the inside of the through groove (6) is provided with a support rod (7), the outer side wall bottom end of the support rod (7) is movably provided with a plurality of supporting arms (8) through a pin shaft, the bottom end of the positioning plate (5) is surrounded by a plurality of connecting blocks (9), the supporting arm (8) is arranged in a "√" shape structure, and one end of the supporting arm (8) is movably connected with the bottom end of the connecting block (9) through a pin shaft, the middle portion of the supporting arm (8) is fixedly provided with a sliding rod (10), and the outer side of the sliding rod (10) is provided with a movable frame (11).
2. The test socket according to claim 1, wherein: The bottom end of the movable frame (11) is fixedly provided with a connecting seat (12), and the connecting seat (12) is fixedly arranged above the base (1).
3. The test socket according to claim 2, wherein: The bottom end of the support rod (7) is provided with a groove (13), the groove bottom of the groove (13) is fixedly provided with a top spring (14), and the top spring (14) is fixedly arranged above the base (1).
4. The test socket according to claim 3, wherein: The top end of the support rod (7) is fixedly provided with a supporting plate (15), and the upper surface of the support plate (2) is provided with a circular groove (16) corresponding to the supporting plate (15).
5. The test socket according to claim 4, wherein: The upper surface of the extension plate (3) is surrounded by a plurality of arc grooves (17), the outer side wall top end of the positioning plate (5) is surrounded by a plurality of arc blocks (18), and the plurality of arc blocks (18) correspond to the plurality of arc grooves (17) respectively.
6. The test socket according to claim 5, wherein: A plurality of supporting studs (19) are fixedly arranged between the support plate (2), the extension plate (3) and the base (1).
Citation Information
Patent Citations
Wafer testing machine
CN219873483U