Gluing and developing machine with back printing improving assembly

Abstract

The utility model discloses a gluing developing machine with a back printing improvement assembly, which comprises a main control module, a machine table with a developing cavity, a wafer bearing assembly arranged in the developing cavity, a developing solution assembly, a cleaning assembly, a nitrogen supply assembly and a flatness monitoring assembly for monitoring the flatness of a back bearing wafer, according to the utility model, the nitrogen supply assembly and the cleaning assembly are additionally arranged in the developing cavity, and the nitrogen supply hole site and the flushing hole site are arranged on the wafer bearing assembly, so that the gluing developing machine integrates a nitrogen supply function and a wafer back cleaning function, and the cleaning efficiency of back printing during wafer developing is greatly improved; besides, the flatness monitoring assembly is additionally arranged to monitor the flatness information of the wafer borne on the wafer bearing assembly, so that the supply quantity of the nitrogen supply assembly and the cleaning assembly is flexibly controlled through the main control module according to the flatness information, and the adaptability is better.

Description

TECHNICAL FIELD

[0001] The utility model belongs to semiconductor processing device technical field, concretely relates to a kind of gluing developing machine with back printing improvement component. BACKGROUND

[0002] Photoetching is a crucial link in chip manufacturing process, which uses photochemical reaction principle to transfer the pattern on mask to substrate with photoresist (also known as photoetching glue). Photoetching process mainly includes three processes of gluing, exposure and development, and development is the last step of photoetching process. Development refers to coating developing solution on the surface of exposed wafer, and the exposed area of positive photoresist and the non-exposed area of negative photoresist are dissolved in developing solution. After further washing the reaction polymer and developing solution residue with water, the pattern in photoetching glue can be shown.

[0003] Common development steps include:

[0004] 1. Pre-spraying: first spray a little deionized water on the surface of wafer;

[0005] 2. Development spraying: coating developing solution on the surface of wafer;

[0006] 3. Developing solution surface residence: in order to let developing solution fully react with photoetching glue, developing solution needs to stay on the surface of wafer for tens of seconds to one or two minutes after spraying;

[0007] 4. Developing solution removal and cleaning: after reaching development time, flush the surface of wafer;

[0008] 5. Drying: in order to dry the surface deionized water, rotate the wafer to high speed.

[0009] Taking silicon carbide wafer as an example, the flatness of silicon carbide wafer is good when it is manufactured and delivered, but the flatness of wafer will change greatly and different degrees of warping phenomenon will occur during the process of making chip. Therefore, in the above development process, the developing solution coated on the surface of silicon carbide wafer will easily flow to the back due to different warping of wafer, especially at the place where silicon carbide wafer contacts with chuck (used to suck wafer from the bottom of wafer for related operation), which causes the occurrence of developing solution ring printing on the back of silicon carbide wafer.

[0010] Traditional cleaning modes are manual cleaning and back washing cleaning. Manual cleaning has large labor cost and safety hazards. In addition, the existing back washing cleaning method needs to transfer wafer to special back washing cavity, and the back washing flow is fixed. For wafers with different degrees of warping, the same back washing flow cannot completely remove the wafer. When the wafer warping degree is large, small flow cannot clean the back of wafer completely, i.e. there is the situation of incomplete cleaning. Both methods will cause low product yield and cost waste. Utility model content

[0011] The utility model discloses a kind of gluing developing machines with back printing improvement components, to improve the cleaning efficiency of back printing when wafer developing;The utility model is realized by the following scheme.

[0012] A gluing developing machine with back printing improvement components, comprising: a machine table with a developing cavity, a wafer bearing assembly and a developing liquid assembly arranged in the developing cavity, and a main control module electrically connected with the wafer bearing assembly and the developing liquid assembly;Characterized in that, further comprising:

[0013] A cleaning assembly has a rinse hole site arranged on the wafer bearing assembly and facing the back surface of the wafer being carried.

[0014] A nitrogen supply assembly has a nitrogen supply hole site arranged on the wafer bearing assembly and facing the back surface of the wafer being carried.

[0015] A flatness monitoring assembly is arranged above the wafer bearing assembly and faces the side surface of the wafer being carried, for monitoring the flatness information of the wafer being carried.

[0016] The main control module is electrically connected with the cleaning assembly and the nitrogen supply assembly, receives the flatness information and sends control instructions to the cleaning assembly and the nitrogen supply assembly.

[0017] As a preferred technical solution, the flatness monitoring assembly includes at least one set of transversely arranged photoelectric sensors. The light emitting end and the light receiving end of each set of photoelectric sensors are arranged on opposite sides of the wafer being carried.

[0018] As a preferred technical solution, the height of the thickness center line of the wafer being carried without deformation is h1, the height of the upper surface is h2, and the height of the lower surface is h3. The flatness monitoring assembly includes three sets of photoelectric sensors. The height H1 of the light path of the first set of photoelectric sensors is h1, the height H2 of the light path of the second set of photoelectric sensors is h2+a, and the height H3 of the light path of the third set of photoelectric sensors is h3-a. a is the minimum recognition amplitude of the up and down warping deformation of the wafer.

[0019] As a preferred technical solution, the flatness monitoring assembly further includes a bracket and a ring-shaped turntable. The bracket is arranged in the developing cavity, and the ring-shaped turntable is rotatably arranged on the bracket and located at the periphery of the wafer being carried. The photoelectric sensors are arranged on the ring-shaped turntable.

[0020] As a preferred technical scheme, the cleaning assembly comprises a cleaning liquid supply tank, a cleaning liquid pipeline, a cleaning liquid switch valve and a liquid volume regulating mechanism; one end of the cleaning liquid pipeline is connected to the cleaning liquid supply tank, and the other end is connected to the flushing hole position; the cleaning liquid switch valve and the liquid volume regulating mechanism are arranged on the cleaning liquid pipeline and connected to the main control module.

[0021] As a preferred technical scheme, the cleaning assembly further comprises a cleaning liquid flow meter arranged on the cleaning liquid pipeline and connected to the main control module.

[0022] As a preferred technical scheme, the nitrogen supply assembly comprises a nitrogen supply tank, a nitrogen pipeline, a nitrogen switch valve and a nitrogen volume regulating mechanism; one end of the nitrogen pipeline is connected to the nitrogen supply tank, and the other end is connected to the nitrogen supply hole position; the nitrogen switch valve and the nitrogen volume regulating mechanism are arranged on the nitrogen pipeline and connected to the main control module.

[0023] As a preferred technical scheme, the nitrogen supply assembly further comprises a nitrogen flow meter arranged on the nitrogen pipeline and connected to the main control module.

[0024] As a preferred technical scheme, the wafer bearing assembly comprises a bearing seat and a suction cup arranged in the center of the bearing seat, the suction cup being used for adsorbing the bottom center of the wafer to be carried thereon; the flushing hole position and the nitrogen supply hole position are both vertical straight holes arranged on the bearing seat; the nitrogen supply hole position is arranged on the periphery of the suction cup, and the flushing hole position is arranged on the periphery of the nitrogen supply hole position.

[0025] As a preferred technical scheme, the number of the nitrogen supply hole positions is greater than that of the flushing hole positions, and the flushing hole positions and the nitrogen supply hole positions are arranged at equal angles.

[0026] The back printing improving assembly provided by the utility model is used for improving the back printing of the wafer in the process of developing the wafer, and the back printing improving assembly comprises a wafer bearing assembly, a flushing assembly and a nitrogen supply assembly. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 The back printing improving assembly provided by the utility model is used for improving the back printing of the wafer in the process of developing the wafer, and the back printing improving assembly comprises a wafer bearing assembly, a flushing assembly and a nitrogen supply assembly.

[0028] Figure 2 The back printing improving assembly provided by the utility model is used for improving the back printing of the wafer in the process of developing the wafer, and the back printing improving assembly comprises a wafer bearing assembly, a flushing assembly and a nitrogen supply assembly.

[0029] Figure 3 In the multi-device networking method provided by the embodiment of the present application, the cloud server constructs a routing configuration information table and an interactive diagram for the operation control of the smart device bound to the user terminal.

[0030] Figure 4 In the multi-device networking method provided by the embodiment of the present application, a flow chart of another implementation method of the first smart device to which the new routing information is configured and connected.

[0031] Figure 5 In the multi-device networking method provided by the embodiment of the present application, a flow chart of another implementation method of the first smart device to which the new routing information is configured and connected.

[0032] Figure 6 In the multi-device networking method provided by the embodiment of the present application, a flow chart of another implementation method of the first smart device to which the new routing information is configured and connected.

[0033] Figure 7 In the multi-device networking method provided by the embodiment of the present application, a flow chart of another implementation method of the first smart device to which the new routing information is configured and connected.

[0034] BRIEF DESCRIPTION OF DRAWINGS 10- machine table, 20- wafer bearing assembly, 30- developing liquid assembly, 40- cleaning assembly, 50- nitrogen supply assembly, 60- flatness monitoring assembly, 70- main control module, 21- bearing seat, 22- suction cup, wafer 200, 31- developing liquid spraying mechanical arm, 32- developing liquid nozzle, 41- cleaning liquid supply tank, 42- cleaning liquid pipeline, 43- cleaning liquid switch valve, 44- liquid volume control mechanism, 45- cleaning liquid flow meter, 46- flushing hole position, 51- nitrogen supply tank, 52- nitrogen pipeline, 53- nitrogen switch valve, 54- nitrogen volume control mechanism, 55- nitrogen flow meter, 56- nitrogen supply hole position, 61- light emitting end, 62- light receiving end, 601- first group of reflective photoelectric sensors, 602- second group of reflective photoelectric sensors, 603- third group of reflective photoelectric sensors. DETAILED DESCRIPTION

[0035] The technical solutions of the present utility model embodiments will be explained and described below with reference to the accompanying drawings. However, the following embodiments are only preferred embodiments of the present utility model and not all of them. In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "front", "back", etc., indicating the orientation or positional relationship, are all based on the orientation or relative positional relationship shown in the accompanying drawings. They are intended to facilitate a clear description of the structure of the product or device and are not used to limit the actual orientation of the product or device during production, use, sales, etc.

[0036] Furthermore, the terms "first" and "second" are used only for distinguishing purposes in the description and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more, unless otherwise expressly defined.

[0037] The specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Under the premise that they do not conflict with each other, the technical features in each specific embodiment can be used interchangeably.

[0038] like Figure 1 As shown, the coating and developing machine with back printing improvement components provided in this embodiment includes: machine base 10, wafer carrier component 20, developer component 30, cleaning component 40, nitrogen supply component 50, flatness monitoring component 60 and main control module 70.

[0039] The machine 10 has a developing chamber, and a wafer carrier assembly 20 and a developer assembly 30 are disposed within the developing chamber. The wafer carrier assembly 20 includes a carrier base 21 and a suction cup 22. The suction cup 22 is positioned at the center of the carrier base 21 and is appropriately higher than a preset height of the carrier base. The suction cup 22 is used to adhere the bottom center of the wafer 200 to it. The suction cup 22 rotates relative to the carrier base 21, allowing the wafer 200 to be rotated, making it easier to perform developing and cleaning operations.

[0040] The developer assembly 30 is disposed above the wafer carrier assembly 20 and is used to spray developer onto the upper surface of the supported wafer 200; specifically, the developer assembly 30 includes a developer spraying robotic arm 31 and a developer nozzle 32.

[0041] The flatness monitoring assembly 60 is arranged above the wafer carrying assembly 20 and faces the side of the carried wafer 200, for monitoring the flatness information of the carried wafer 200. The main control module 70 is arranged on the machine 10 in an integrated manner or independently, but ensures that the main control module 70 is electrically connected with the wafer carrying assembly 20, the developing liquid assembly 30, the cleaning assembly 40, the nitrogen supply assembly 50, and the flatness monitoring assembly 60. In addition to controlling the actions of the wafer carrying assembly 20 and the developing liquid assembly 30 according to the input instructions or preset programs, the main control module 70 also receives the flatness information of the carried wafer 200 monitored by the flatness monitoring assembly 60, and then sends corresponding control instructions to the cleaning assembly 40 and the nitrogen supply assembly 50 to control the specific operations of the cleaning assembly 40 and the nitrogen supply assembly 50.

[0042] Continuing to refer to Figure 1 As shown, the cleaning assembly 40 includes a cleaning liquid supply tank 41, a cleaning liquid pipeline 42, a cleaning liquid switch valve 43, a liquid amount regulating mechanism 44, a cleaning liquid flow meter 45, and a flushing hole position 46 (combined with Figure 2 As shown, the flushing hole position 46 is arranged on the carrying seat 21 of the wafer carrying assembly 20 and faces the back of the carried wafer 200. The cleaning liquid supply tank 41 is used to store cleaning liquid, such as ultrapure water. One end of the cleaning liquid pipeline 42 is connected to the cleaning liquid supply tank 41, and the other end is connected to the flushing hole position 46. The cleaning liquid switch valve 43, the liquid amount regulating mechanism 44, and the cleaning liquid flow meter 45 are arranged on the cleaning liquid pipeline 42 and connected with the main control module 70.

[0043] Continuing to refer to Figure 1 As shown, the nitrogen supply assembly 50 includes a nitrogen gas supply tank 51, a nitrogen gas pipeline 52, a nitrogen gas switch valve 53, a nitrogen amount regulating mechanism 54, a nitrogen gas flow meter 55, and a nitrogen supply hole position 56 (combined with Figure 2 As shown, the nitrogen supply hole position 56 is arranged on the carrying seat 21 of the wafer carrying assembly 20 and faces the back of the carried wafer 200. The nitrogen gas supply tank 51 is used to store nitrogen gas. One end of the nitrogen gas pipeline 52 is connected to the nitrogen gas supply tank 51, and the other end is connected to the nitrogen supply hole position 56. The nitrogen gas switch valve 53, the nitrogen amount regulating mechanism 54, and the nitrogen gas flow meter 55 are arranged on the nitrogen gas pipeline 52 and connected with the main control module 70.

[0044] In this embodiment, the flushing hole position 46 and the nitrogen supply hole position 56 are both longitudinal straight holes arranged on the carrying seat 21. The nitrogen supply hole position 56 is arranged at the periphery of the suction cup 22, and the flushing hole position 46 is arranged at the periphery of the nitrogen supply hole position 56. Specifically, the flushing hole position 46 is greater than or equal to three and is arranged at equal angles. The number of the nitrogen supply hole position 56 is greater than that of the flushing hole position 46, and is arranged at equal angles.

[0045] In the above scheme, nitrogen is delivered from the nitrogen supply tank 51 to the nitrogen hole site 56, so that the wafer 200 can be evenly sprayed when developing, and the function of preventing backflow of the developing solution is realized. In addition, the cleaning liquid such as ultrapure water is delivered from the cleaning liquid supply tank 41 to the flushing hole site 46, so that backwashing is performed when the wafer is developed, and the function of preventing backflow of the developing solution to form back printing is realized.

[0046] Continuing to refer to Figure 1 As shown, the flatness monitoring assembly 60 includes at least one set of transversely arranged light emitting and receiving pairs of photoelectric sensors, and the light emitting end 61 and the light receiving end 62 of each set of light emitting and receiving pairs of photoelectric sensors are arranged on opposite sides of the wafer 200 being carried. When the wafer 200 is transported into the developing cavity by the transport robot and is carried on the wafer carrying assembly 20, the flatness monitoring assembly 60 detects the flatness of the wafer 200 being carried. In combination with Figure 3 As shown, if the edge of the wafer 200 being carried is deformed, such as warping, the light path of the light emitting and receiving pairs of photoelectric sensors is blocked, and the receiving signal of the light receiving end 62 is abnormal. At this time, the flatness information is provided to the main control module 70, and the main control module 70 controls the specific operation of the cleaning assembly 40 and the nitrogen supply assembly 50 according to the flatness information.

[0047] As an optional embodiment, the flatness monitoring assembly 60 further includes a support and a ring-shaped turntable, the support is arranged in the developing cavity, the ring-shaped turntable is rotatably arranged on the support and located at the periphery of the wafer being carried, and the light emitting and receiving pairs of photoelectric sensors are arranged on the ring-shaped turntable. Through this optional embodiment, the monitoring angle of the light emitting and receiving pairs of photoelectric sensors can be adjusted, and the flatness of the wafer 200 being carried can be monitored at different angles.

[0048] In combination with Figure 4 , Figure 5 and Figure 6 As a specific embodiment, the flatness monitoring assembly 60 includes a first set of light emitting and receiving pairs of photoelectric sensors 601, a second set of light emitting and receiving pairs of photoelectric sensors 602, and a third set of light emitting and receiving pairs of photoelectric sensors 603. The three sets of light emitting and receiving pairs of photoelectric sensors are longitudinally spaced apart. Specifically, a wafer 200 being carried is not deformed, the height of the thickness center line is h1, the height of the upper surface is h2, and the height of the lower surface is h3. The height H1 of the light path of the first set of light emitting and receiving pairs of photoelectric sensors is h1, the height H2 of the light path of the second set of light emitting and receiving pairs of photoelectric sensors is h2+a, and the height H3 of the light path of the third set of light emitting and receiving pairs of photoelectric sensors is h3-a, where a is the minimum identification amplitude of the up-down warping deformation of the wafer. For example, for a 380nm thick silicon carbide product, when the spacing between the three sets of light emitting and receiving pairs of photoelectric sensors is greater than 1mm, it can be determined that the wafer has warping.

[0049] In combination with Figure 7As shown, based on the above three groups of setting scheme of the pair of light emitting photoelectric sensor, the monitoring result of wafer flatness in this embodiment is divided into three kinds: wafer upward warping, wafer downward warping and wafer without warping; at the same time, for the three cases, different N2 and back washing cleaning fluid flow are corresponded respectively, which are explained as follows.

[0050] I. Wafer without warping:

[0051] In combination with Figure 4 As shown, if the first group of pair of light emitting photoelectric sensor 601 and the third group of pair of light emitting photoelectric sensor 603 respectively emit light path and receive signals, and the second group of pair of light emitting photoelectric sensor 602 emits light path but does not receive signals, the corresponding optical signals are converted into electrical signals and uploaded to the main control module 70, the main control module 70 determines that the current wafer has no abnormal warping, and thus sends signals to the liquid control mechanism 44 and the nitrogen control mechanism 54, which are adjusted to normal flow. Taking a six-inch 380 silicon carbide wafer as an example, the back washing cleaning fluid flow is controlled at 150 ml / min, and the nitrogen flow is controlled at 250 ml / min.

[0052] II. Wafer upward warping:

[0053] In combination with Figure 5 As shown, if the third group of pair of light emitting photoelectric sensor 603 emits light path and receives signals, while the first group of pair of light emitting photoelectric sensor 601 and the second group of pair of light emitting photoelectric sensor 602 respectively emit light path and do not receive signals, the corresponding optical signals are converted into electrical signals and uploaded to the main control module 70, the main control module 70 determines that the current wafer is upward warping, and thus sends signals to the liquid control mechanism 44 and the nitrogen control mechanism 54. At this time, because the wafer is upward warping, it is adjusted to small flow. Taking a six-inch 380 silicon carbide wafer as an example, the back washing cleaning fluid flow is controlled at 100 ml / min, and the nitrogen flow is controlled at 350 ml / min.

[0054] III. Wafer downward warping:

[0055] In combination with Figure 6 As shown, if the first group of pair of light emitting photoelectric sensor 601 emits light path and receives signals, while the second group of pair of light emitting photoelectric sensor 602 and the third group of pair of light emitting photoelectric sensor 603 respectively emit light path and do not receive signals, the corresponding optical signals are converted into electrical signals and uploaded to the main control module 70, the main control module 70 determines that the current wafer is downward warping, and thus sends signals to the liquid control mechanism 44 and the nitrogen control mechanism 54. At this time, because the wafer is downward warping, it is adjusted to large flow. Taking a six-inch 380 silicon carbide wafer as an example, the back washing cleaning fluid flow is controlled at 200 ml / min, and the nitrogen flow is controlled at 150 ml / min.

[0056] In the back washing process, the real-time flow can be viewed through the flow meter, so that the machine can start the formal development, thereby ensuring that the developing solution does not penetrate to the back surface to contaminate the wafer during the whole process.

[0057] The operation process of the glue coating and developing machine with the back printing improvement assembly is described below by taking the improvement of the back printing of the silicon carbide wafer as an example.

[0058] Step 1: When the wafer is transferred into the developing cavity after exposure, the flatness monitoring assembly 60 monitors the flatness of the wafer and uploads it to the main control module 70.

[0059] Step 2: The main control module 70 determines whether the wafer has abnormal warping such as upward warping and downward warping according to the flatness signal, determines the flow of the cleaning solution and the flow of N2 for back washing, and then sends corresponding control signals to the liquid amount control mechanism 44 and the nitrogen amount control mechanism 54 to adjust the flow to the required flow, thereby performing normal development.

[0060] Step 3: The developing solution assembly 30 sprays the developing solution on the wafer surface, and then uses the self-rotation centrifugal force to spread the developing solution on the whole wafer, and the nitrogen on-off valve 53 is opened to prevent the backflow of the developing solution to the back surface to contaminate the wafer.

[0061] Step 4: After the developing solution is fully developed, the developing solution assembly 30 moves above the wafer to spray ultrapure water on the wafer for rinsing, and at the same time, the nitrogen on-off valve 53 is closed and the cleaning solution on-off valve 43 is opened to perform the whole back washing process on the back surface of the wafer.

[0062] Step 5: After the ultrapure water rinses the front surface of the wafer, the ultrapure water is turned off and the self-rotation speed of the wafer carrying assembly 20 is increased to dry the wafer, and at the same time, the cleaning solution on-off valve 43 is closed and the nitrogen on-off valve 53 is opened to dry the back surface of the wafer.

[0063] Step 6: After the wafer is dried, the whole developing step is completed, the cleaning solution on-off valve 43 is closed, the nitrogen on-off valve 53 is closed, and the wafer is transferred out of the developing cavity by the transfer robot.

[0064] In summary, the glue coating and developing machine with the back printing improvement assembly provided by the utility model has the functions of nitrogen supply and wafer back cleaning, greatly improves the cleaning efficiency of the back printing during wafer development, and realizes the improvement of the back printing. In addition, the flatness monitoring assembly is installed to monitor the flatness information of the carried wafer, and the main control module flexibly controls the fluid supply amount of the nitrogen supply assembly and the cleaning assembly according to the flatness information, so that the adaptability is better.

[0065] The above descriptions are only the preferred embodiment of the application, of course, cannot be used to limit the scope of the application, thus the equivalent variations made by the claims of the application, still belongs to the scope of the application covered.

Claims

1. A gummed developing machine with back printing improvement assembly, comprising: The machine table with a developing cavity, a wafer carrying assembly and a developing liquid assembly arranged in the developing cavity, and a main control module electrically connected with the wafer carrying assembly and the developing liquid assembly; characterized in that further comprising: a cleaning assembly having a plurality of washing hole positions arranged on the wafer carrying assembly and facing the back surface of the carried wafer; a nitrogen supply assembly having a plurality of nitrogen supply hole positions arranged on the wafer carrying assembly and facing the back surface of the carried wafer; a flatness monitoring assembly arranged above the wafer carrying assembly and facing the side surface of the carried wafer, for monitoring the flatness information of the carried wafer, the main control module is electrically connected with the cleaning assembly and the nitrogen supply assembly, receives the flatness information, and sends control instructions to the cleaning assembly and the nitrogen supply assembly.

2. The gum coating and developing machine with improved back printing assembly according to claim 1, wherein: The flatness monitoring assembly includes at least one set of transverse arranged light emitting and receiving type photoelectric sensors, and the light emitting end and the light receiving end of each set of light emitting and receiving type photoelectric sensors are arranged on the opposite sides of the carried wafer.

3. The gum coating and developing machine with improved back printing assembly according to claim 2, wherein: The flatness monitoring assembly includes three sets of light emitting and receiving type photoelectric sensors; the height of the middle line of the thickness of the carried wafer is h1, the height of the upper surface is h2, and the height of the lower surface is h3; the height H1 of the light path of the first set of light emitting and receiving type photoelectric sensors is h1, the height H2 of the light path of the second set of light emitting and receiving type photoelectric sensors is h2+a, the height H3 of the light path of the third set of light emitting and receiving type photoelectric sensors is h3-a, and a is the minimum identification amplitude of the wafer upper and lower warping deformation.

4. The gum coating and developing machine with improved back printing assembly according to claim 2 or 3, characterized in that: The flatness monitoring assembly further includes a support arranged in the developing cavity and a ring-shaped turntable rotatably arranged on the support and located at the periphery of the carried wafer. The light emitting and receiving type photoelectric sensors are arranged on the ring-shaped turntable.

5. The adhesive applicator and developer machine with improved back printing assembly of claim 1, wherein: The cleaning assembly includes a cleaning liquid supply tank, a cleaning liquid pipeline, a cleaning liquid switch valve, and a liquid volume control mechanism; one end of the cleaning liquid pipeline is connected to the cleaning liquid supply tank, and the other end is connected to the washing hole position; the cleaning liquid switch valve and the liquid volume control mechanism are arranged on the cleaning liquid pipeline and connected with the main control module.

6. The gum coating and developing machine with improved back printing assembly according to claim 5, wherein: The cleaning assembly further includes a cleaning liquid flow meter arranged on the cleaning liquid pipeline and connected with the main control module.

7. The adhesive applicator and developer machine with improved back printing assembly of claim 1, wherein: The nitrogen supply assembly includes a nitrogen gas supply tank, a nitrogen gas pipeline, a nitrogen gas switch valve, and a nitrogen volume control mechanism; one end of the nitrogen gas pipeline is connected to the nitrogen gas supply tank, and the other end is connected to the nitrogen supply hole position; the nitrogen gas switch valve and the nitrogen volume control mechanism are arranged on the nitrogen gas pipeline and connected with the main control module.

8. The gum coating and developing machine with improved back printing assembly according to claim 7, wherein: The nitrogen supply assembly further includes a nitrogen gas flow meter arranged on the nitrogen gas pipeline and connected with the main control module.

9. The adhesive applicator and developer machine with improved back printing assembly of claim 1, wherein: The wafer carrying assembly includes a carrying seat and a suction cup arranged in the center of the carrying seat, the suction cup is used for adsorbing the bottom center of the carried wafer thereon; the washing hole position and the nitrogen supply hole position are both vertical straight holes arranged on the carrying seat; the nitrogen supply hole position is arranged at the periphery of the suction cup, and the washing hole position is arranged at the periphery of the nitrogen supply hole position.

10. The gum coating and developing machine with improved back printing assembly according to claim 9, wherein: The number of the nitrogen supply hole positions is greater than that of the washing hole positions, and they are arranged at equal angles.

Images