Edge photoresist removing device

Abstract

The utility model relates to the technical field of photoresist removal, in particular to an edge photoresist removal device. Comprising a base, a rotating disc, conveying belt equipment, a connecting frame, a rotating driving mechanism, a cleaning agent nozzle and a nitrogen nozzle; a ball mounting groove is formed in the base, and a plurality of balls are mounted on the inner side of the ball mounting groove; a blanking hole is formed in the base; a plurality of limiting holes are formed in the rotating disc along an annular array, and the rotating disc is rotationally mounted on the base; the connecting frame is arranged in the middle of the rotary disc, a plurality of rotary pressing mechanisms are installed on the connecting frame, and each rotary pressing mechanism comprises a pressing disc, a sealing rubber ring and a movable shaft; the rotary driving mechanism comprises a second rack, a third rack and a driving assembly; the cleaning agent nozzles and the nitrogen nozzles are located on the peripheral side of the rotary disc. And the conveying belt equipment is positioned below the blanking hole. According to the technical scheme, the feeding station, the cleaning station, the dust blowing station and the automatic discharging station are arranged, the whole working rhythm is compact, and the working efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of photoresist removal technology, and in particular to an edge photoresist removal device. Background Technology

[0002] In the photolithography process, photoresist is applied to the wafer surface by spin coating. However, due to centrifugal force, excess photoresist is pushed to the edge of the wafer. Most of it is thrown off the wafer, but some remains on the wafer edge. Because the relative airflow velocity at the wafer edge is very high, the residual photoresist solidifies quickly, forming a raised edge. This results in the photoresist being thicker at the wafer edge. Therefore, EBR (Extended Backing) is usually used to remove the thicker photoresist at the edge.

[0003] Patent CN221946337U discloses an edge photoresist removal device, comprising: a rotating assembly; the rotating assembly consists of a geared motor and a rotating disk; the output end of the geared motor is fixedly connected to the top center of the rotating disk; an anti-slip cover is welded to the bottom center of the rotating disk; and a photoresist radio frequency assembly and a suction assembly are fixed to the bottom of the rotating disk near the outer side of the anti-slip cover by bolts, wherein the photoresist radio frequency assembly is located on one side of the suction assembly.

[0004] The aforementioned patents still have the following technical defects: multiple operations such as feeding, degumming, and unloading are all performed at one station, and only one process can be executed at a time, resulting in low equipment efficiency. Utility Model Content

[0005] The purpose of this invention is to address the problems existing in the background technology by proposing an edge photoresist removal device.

[0006] The technical solution of this utility model is an edge photoresist removal device, comprising:

[0007] The base has a ball bearing mounting groove, and several balls are installed inside the ball bearing mounting groove; the base has a material drop hole; and a bracket is provided at the bottom of the base.

[0008] The turntable has multiple limiting holes arranged in a circular array along its upper edge. The turntable is mounted on a base, and a first servo motor for driving the turntable to rotate is mounted on the base.

[0009] The connecting frame is located in the middle of the turntable. Multiple rotating clamping mechanisms are installed on the connecting frame. Each rotating clamping mechanism includes a pressure plate, a sealing ring, and a movable shaft. The movable shaft moves vertically through the outer end of the connecting frame. The pressure plate is connected to the bottom end of the movable shaft. The sealing ring is located on the bottom outer periphery of the pressure plate.

[0010] A rotary drive mechanism includes a second rack, a third rack, and a drive assembly. The second and third racks are slidably mounted on a mounting bracket, and the drive assembly is used to drive the second and third racks to move synchronously. A toothed ring is provided at the upper end of the movable shaft.

[0011] The cleaning agent nozzle and the nitrogen nozzle are both located on the periphery of the turntable and are mounted on the mounting bracket.

[0012] The conveyor belt equipment is located below the material drop hole.

[0013] Preferably, the mounting bracket is connected to an arc-shaped guide rail, and the upper end of the movable shaft is connected to a top plate.

[0014] Preferably, a vacuum cleaner and a vacuum head are installed on the turntable, with the bottom end of the vacuum head flush with the bottom surface of the turntable, and the input end of the vacuum cleaner connected to the vacuum head.

[0015] Preferably, the drive assembly includes a second servo motor, a first gear, a second gear, and a first rack. The second servo motor is mounted on a mounting bracket, the first gear and the second gear are both mounted on the output shaft of the second servo motor, the first rack is meshed with the first gear, the first rack is connected to the third rack, and the second gear is meshed with the second rack.

[0016] Preferably, multiple rotary clamping mechanisms are configured to correspond one-to-one with multiple limiting holes.

[0017] Preferably, at least four limiting holes are provided.

[0018] Compared with the prior art, the present invention has the following beneficial technical effects:

[0019] 1. This technical solution has at least feeding, cleaning, dust blowing and automatic unloading stations, the whole work rhythm is compact and the work efficiency is improved.

[0020] 2. The presence of several ball bearings reduces friction during wafer movement and rotation, allowing the wafer to move and rotate smoothly.

[0021] 3. The sealing ring can protect the photoresist in the inner area of ​​the wafer. Attached Figure Description

[0022] Figure 1 and Figure 2 All of these are schematic diagrams of the structure of this utility model.

[0023] Figure 3 This is a schematic diagram of the base and turntable in this utility model.

[0024] Figure 4 for Figure 1 A magnified schematic diagram of the structure at point A.

[0025] Reference numerals: 1. Base; 101. Ball bearing mounting groove; 102. Material drop hole; 2. Turntable; 201. Limiting hole; 3. Conveyor belt equipment; 4. Mounting frame; 5. Ball bearing; 6. Bracket; 7. Cleaning agent nozzle; 8. Nitrogen nozzle; 9. Vacuum cleaner; 10. Vacuum head; 11. Pressure plate; 12. Sealing ring; 13. Connecting frame; 14. Movable shaft; 15. Gear ring; 16. Top plate; 17. Arc-shaped guide rail; 18. First servo motor; 19. Second servo motor; 20. First gear; 21. Second gear; 22. First rack; 23. Second rack; 24. Third rack. Detailed Implementation

[0026] Example 1

[0027] like Figures 1-4 As shown, the edge photoresist removal device proposed in this embodiment includes a base 1, a turntable 2, a conveyor belt device 3, a connecting frame 13, a rotary drive mechanism, a cleaning agent nozzle 7, and a nitrogen nozzle 8.

[0028] The base 1 has a ball bearing mounting groove 101, and several balls 5 are installed on the inner side of the ball bearing mounting groove 101. The balls 5 are flush with the upper surface of the base 1, and several drainage holes are provided at the lower end of the ball bearing mounting groove 101. The base 1 has a material discharge hole 102. The bottom end of the base 1 is provided with a bracket 6. The turntable 2 has a number of limiting holes 201 arranged in a circular array. There are at least four limiting holes 201. This arrangement ensures that the equipment has at least feeding, cleaning, dust removal and unloading stations. The turntable 2 is rotatably mounted on the base 1, and the base 1 is equipped with a first servo motor 18 for driving the turntable 2 to rotate.

[0029] The connecting frame 13 is located in the middle of the turntable 2. Multiple rotating clamping mechanisms are installed on the connecting frame 13. The multiple rotating clamping mechanisms are arranged one-to-one with multiple limiting holes 201. The rotating clamping mechanism includes a pressure plate 11, a sealing ring 12 and a movable shaft 14. The movable shaft 14 vertically moves through the outer end of the connecting frame 13. The pressure plate 11 is connected to the bottom end of the movable shaft 14. The sealing ring 12 is located on the bottom outer periphery of the pressure plate 11.

[0030] The rotary drive mechanism includes a second rack 23, a third rack 24, and a drive assembly. The second rack 23 and the third rack 24 are slidably mounted on the mounting bracket 4. The drive assembly is used to drive the second rack 23 and the third rack 24 to move synchronously. The drive assembly includes a second servo motor 19, a first gear 20, a second gear 21, and a first rack 22. The second servo motor 19 is mounted on the mounting bracket 4. The first gear 20 and the second gear 21 are both mounted on the output shaft of the second servo motor 19. The first rack 22 is meshed with the first gear 20 and connected to the third rack 24. The second gear 21 is meshed with the second rack 23. A gear ring 15 is provided at the upper end of the movable shaft 14.

[0031] The cleaning agent nozzle 7 and the nitrogen nozzle 8 are both located on the periphery of the turntable 2, and both the cleaning agent nozzle 7 and the nitrogen nozzle 8 are mounted on the mounting bracket 4.

[0032] The conveyor belt device 3 is located below the discharge hole 102. Furthermore, a sponge is installed on the surface of the conveyor belt of the conveyor belt device 3 to enhance the cushioning effect.

[0033] Specifically, during the removal of photoresist from the wafer edge, the wafer is placed inside the limiting hole 201. Before placement, the corresponding movable shaft 14 is lifted upwards. After the wafer is placed, the movable shaft 14 is released. At this time, the sealing ring 12 presses against the upper end of the wafer. The ball bearing 5 reduces the friction generated during the wafer's movement or rotation. When the wafer moves to the cleaning agent nozzle 7, it stops. The first servo motor 18 drives the turntable 2 to rotate intermittently, and the single rotation angle of the turntable 2 is 360 / N (N is the number of limiting holes 201). The pump pumps the photoresist cleaning agent into the cleaning agent nozzle 7, and finally ejects it through the cleaning agent nozzle 7 to the outer periphery of the wafer, thereby dissolving the excess photoresist on the wafer's periphery. During this process, the drive assembly drives the second rack 23 and the third rack 24 to move outwards synchronously. During the movement of the second rack 23... The toothed ring 15 at the cleaning station (the area adjacent to the cleaning agent nozzle 7) is driven to rotate, which in turn drives the movable shaft 14, pressure plate 11, sealing ring 12, and wafer to rotate, so that the cleaning agent can be evenly sprayed onto the periphery of the wafer. Then, the turntable 2 is continuously driven to rotate. When the wafer moves to the position of the nitrogen nozzle 8, it stops. The station corresponding to the nitrogen nozzle 8 is the dust removal station. The nitrogen nozzle 8 blows nitrogen gas to dissolve excess photoresist, so that the excess photoresist is removed from the periphery of the wafer. During this process, the third rack 24 drives the toothed ring 15 in the dust removal station area to rotate, so that the periphery of the wafer can be evenly blown with nitrogen gas. Then, the turntable 2 is driven to rotate continuously. When the wafer moves to the position above the drop hole 102, the wafer falls onto the conveyor belt device 3 and is transported to the next station. Furthermore, the technical solution also includes a PLC controller to control the operation of multiple devices.

[0034] Example 2

[0035] like Figure 1 As shown, in this embodiment, an edge photoresist removal device is proposed. Compared with the first embodiment, in this embodiment, the mounting frame 4 is connected to an arc-shaped guide rail 17, and the upper end of the movable shaft 14 is connected to a top plate 16. The protruding apex of the arc-shaped guide rail 17 is placed at the feeding station. As the top plate 16 continues to move, when the top plate 16 and the arc-shaped guide rail 17 just begin to contact, the top plate 16 gradually moves upward, which drives the movable shaft 14 to move. When the top plate 16 moves to the protruding point of the arc-shaped guide rail 17, the movable shaft 14 moves to the upper limit position, and the turntable 2 is in a stationary state, which facilitates the placement of the wafer. When the top plate 16 separates from the arc-shaped guide rail 17, the sealing ring 12 automatically falls onto the upper surface of the wafer.

[0036] Example 3

[0037] like Figure 1 As shown, the edge photoresist removal device proposed in this embodiment, compared with the first embodiment, has a vacuum cleaner 9 and a vacuum head 10 installed on the turntable 2. The bottom end of the vacuum head 10 is flush with the lower end surface of the turntable 2, and the input end of the vacuum cleaner 9 is connected to the vacuum head 10. The vacuum cleaner 9 is a wet and dry vacuum cleaner. When the vacuum cleaner 9 is started, the vacuum head 10 sucks up the water stains and debris in the ball bearing mounting groove 101.

[0038] It should be added that, in order to remove moisture from the surface of turntable 2, a drying fan is installed on the mounting frame 4. Activating the drying fan can dry the water stains on turntable 2, pressure plate 11, and sealing ring 12.

[0039] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited thereto. Various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention.

Claims

1. An edge photoresist removal device, characterized in that, include: The base (1) has a ball bearing mounting groove (101) and a number of balls (5) are installed inside the ball bearing mounting groove (101); the base (1) has a material drop hole (102); and the bottom of the base (1) is provided with a bracket (6). Turntable (2), with multiple limiting holes (201) arranged in a ring array on the turntable (2), the turntable (2) is rotatably mounted on the base (1), and the base (1) is equipped with a first servo motor (18) for driving the turntable (2) to rotate; A connecting frame (13) is located in the middle of the turntable (2). Multiple rotating clamping mechanisms are installed on the connecting frame (13). The rotating clamping mechanism includes a pressure plate (11), a sealing ring (12), and a movable shaft (14). The movable shaft (14) moves vertically through the outer end of the connecting frame (13). The pressure plate (11) is connected to the bottom end of the movable shaft (14). The sealing ring (12) is located on the bottom outer periphery of the pressure plate (11). A rotary drive mechanism includes a second rack (23), a third rack (24), and a drive assembly. The second rack (23) and the third rack (24) are slidably mounted on the mounting bracket (4). The drive assembly is used to drive the second rack (23) and the third rack (24) to move synchronously. A toothed ring (15) is provided at the upper end of the movable shaft (14). Cleaning agent nozzle (7) and nitrogen nozzle (8) are both located on the periphery of turntable (2) and are mounted on mounting bracket (4). Conveyor belt device (3) is located below the discharge hole (102).

2. The edge photoresist removal device according to claim 1, characterized in that, The mounting bracket (4) is connected to an arc-shaped guide rail (17), and the upper end of the movable shaft (14) is connected to a top plate (16).

3. The edge photoresist removal device according to claim 1, characterized in that, A vacuum cleaner (9) and a vacuum head (10) are installed on the turntable (2). The bottom end of the vacuum head (10) is flush with the bottom surface of the turntable (2), and the input end of the vacuum cleaner (9) is connected to the vacuum head (10).

4. The edge photoresist removal device according to claim 1, characterized in that, The drive assembly includes a second servo motor (19), a first gear (20), a second gear (21), and a first rack (22). The second servo motor (19) is mounted on a mounting bracket (4). The first gear (20) and the second gear (21) are both mounted on the output shaft of the second servo motor (19). The first rack (22) is meshed with the first gear (20). The first rack (22) is connected to the third rack (24). The second gear (21) is meshed with the second rack (23).

5. The edge photoresist removal apparatus according to claim 1, characterized in that, Multiple rotary clamping mechanisms are set one-to-one with multiple limiting holes (201).

6. The edge photoresist removal apparatus according to claim 5, characterized in that, At least four limiting holes (201) are provided.

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