Touch substrate

Abstract

The utility model discloses a touch substrate. The touch substrate comprises a substrate base plate and a plurality of touch electrodes, the conductive structure layer comprises an indium tin oxide layer and at least one metal layer which are arranged on the substrate; the conductive structure layer is provided with a plurality of touch electrodes, a plurality of electrode leads and a plurality of binding pads; the plurality of touch electrodes comprise a plurality of first touch electrodes and a plurality of second touch electrodes, and the first touch electrodes and the second touch electrodes are insulated and crossed; the first end of the electrode lead is electrically connected with one touch electrode, the second end of the electrode lead is electrically connected with one binding bonding pad, and the electrode lead comprises a first sub-lead located on the indium tin oxide layer and a second sub-lead located in at least one metal layer; in the thickness direction of the touch substrate, the orthographic projection of the first sub-lead on the substrate is located in the orthographic projection of the second sub-lead on the substrate, and the first sub-lead is in contact with the second sub-lead. According to the touch substrate, the probability of damage to circuits in the touch substrate can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to touch technology field especially, relate to a kind of touch substrate. BACKGROUND

[0002] Touch substrate has important application in modern display technology field, and the requirement of touch substrate is also increasingly higher accordingly.

[0003] In the related art, for example, the circuit in the touch substrate required by vehicle-mounted display is prone to damage, and cannot be repaired after damage. SUMMARY

[0004] The utility model provides a kind of touch substrate, to reduce the probability of line damage in touch substrate, improve the reliability of touch substrate use.

[0005] According to an aspect of the utility model, a kind of touch substrate is provided, comprising:

[0006] Substrate substrate;

[0007] Conductive structure layer, the conductive structure layer includes the indium tin oxide layer being arranged on the substrate substrate and at least one metal layer being located on the side of the indium tin oxide layer away from the substrate substrate;

[0008] The conductive structure layer is provided with multiple touch electrodes, multiple electrode leads and multiple binding pads;

[0009] The multiple touch electrodes include multiple first touch electrodes and multiple second touch electrodes, and the first touch electrode and the second touch electrode are insulated and crossed;

[0010] The first end of the electrode lead is electrically connected with one of the touch electrodes, and the second end of the electrode lead is electrically connected with one of the binding pads, the electrode lead includes the first sub-lead located in the indium tin oxide layer and the second sub-lead located in the at least one metal layer;Along the thickness direction of the touch substrate, the orthographic projection of the first sub-lead on the substrate substrate is located in the orthographic projection of the second sub-lead on the substrate substrate, and the first sub-lead is in contact with the second sub-lead.

[0011] Optionally, the binding pad includes the first sub-pad located in the indium tin oxide layer.

[0012] Optionally, the electrode lead includes the first electrode lead electrically connected with the first touch electrode and the second electrode lead electrically connected with the second touch electrode;

[0013] The at least one metal layer comprises a first metal layer adjacent to the ITO layer; the second sub-lead of the first electrode lead is located on the first metal layer, and the second sub-lead of the first electrode lead covers the first sub-lead of the first electrode lead.

[0014] Optionally, the at least one metal layer further comprises a second metal layer located on a side of the first metal layer away from the ITO layer.

[0015] The touch substrate further comprises a first insulating layer located between the first metal layer and the second metal layer.

[0016] The second sub-lead of the second electrode lead is located on the second metal layer, the first insulating layer is provided with at least one groove corresponding to the position of the second electrode lead, the groove exposes the first sub-lead of the second electrode lead, and the second sub-lead of the second electrode lead extends along the inner wall of the groove and contacts the first sub-lead.

[0017] Optionally, the touch substrate comprises touch areas and binding areas arranged along a first direction, the touch electrodes are arranged on the touch areas, and the binding pads are arranged on the binding areas.

[0018] The groove corresponds to the part of the second electrode lead extending along a second direction; at least part of the second electrode lead extending along the second direction corresponds to at least part of the groove arranged along the first direction and connected.

[0019] Optionally, along the thickness direction of the touch substrate, the orthogonal projection of the ITO layer on the substrate is coincident with the orthogonal projection of the first metal layer on the substrate.

[0020] The at least one metal layer further comprises a second metal layer located on a side of the first metal layer away from the ITO layer.

[0021] The touch substrate further comprises a first insulating layer located between the first metal layer and the second metal layer.

[0022] The second sub-lead of the second electrode lead is located on the first metal layer, the second electrode lead further comprises a third sub-lead located on the second metal layer, the first insulating layer is provided with at least one groove corresponding to the position of the third sub-lead, the groove exposes the second sub-lead of the second electrode lead, and the third sub-lead of the second electrode lead extends along the inner wall of the groove and contacts the second sub-lead.

[0023] Optionally, the first touch electrode includes a first sub-electrode located at the ITO layer and a second sub-electrode located at the first metal layer, and the second touch electrode is located at the second metal layer.

[0024] Optionally, a second sub-lead of the second electrode lead is located at the first metal layer, and the second sub-lead of the second electrode lead covers the first sub-lead of the second electrode lead.

[0025] Optionally, the first touch electrode includes a first sub-electrode located at the ITO layer and a second sub-electrode located at the first metal layer; the second sub-electrode covers the first sub-electrode and is disconnected at the overlapping part of the first touch electrode and the second touch electrode; and the first sub-electrode is continuous at the overlapping part of the first touch electrode and the second touch electrode.

[0026] The touch substrate further includes a first insulating layer covering the part of the first sub-electrode located at the overlapping part of the first touch electrode and the second touch electrode; the second touch electrode is located at the first metal layer, and the part of the second touch electrode located at the overlapping part is provided with the first insulating layer between the part of the first sub-electrode located at the overlapping part.

[0027] Optionally, the first touch electrode includes a first sub-electrode located at the ITO layer and a second sub-electrode located at the first metal layer; the second sub-electrode covers the first sub-electrode and is disconnected at the overlapping part of the first touch electrode and the second touch electrode; and the first sub-electrode is continuous at the overlapping part of the first touch electrode and the second touch electrode.

[0028] The touch substrate further includes a first insulating layer covering the part of the first sub-electrode located at the overlapping part of the first touch electrode and the second touch electrode; and the at least one metal layer further includes a second metal layer located at the side of the first metal layer away from the ITO layer.

[0029] The second touch electrode includes a third sub-electrode located at the ITO layer and a fourth sub-electrode located at the second metal layer; the fourth sub-electrode covers the third sub-electrode, and the third sub-electrode is disconnected at the overlapping part of the first touch electrode and the second touch electrode; and the fourth sub-electrode is continuous at the overlapping part of the first touch electrode and the second touch electrode.

[0030] The part of the first sub-electrode located at the overlapping part is provided with the first insulating layer between the part of the fourth sub-electrode located at the overlapping part; and the part of the third sub-electrode located at the overlapping part is provided with the first insulating layer between the part of the second sub-electrode located at the overlapping part.

[0031] The technical scheme of the embodiment of the utility model discloses a touch substrate, comprising: substrate substrate;Conductive structure layer, conductive structure layer includes setting on substrate substrate indium tin oxide layer and at least one layer metal layer located indium tin oxide layer far from substrate substrate one side;Conductive structure layer is provided with a plurality of touch electrodes, a plurality of electrode leads and a plurality of binding pads;A plurality of touch electrodes include a plurality of first touch electrodes and a plurality of second touch electrodes, and the first touch electrode and the second touch electrode are insulated and crossed;The first end of electrode lead is electrically connected with a touch electrode, and the second end of electrode lead is electrically connected with a binding pad, and electrode lead includes the first sub-lead located in the indium tin oxide layer and the second sub-lead located in the at least one layer metal layer;Along the thickness direction of touch substrate, the orthographic projection of the first sub-lead on the substrate substrate is located in the orthographic projection of the second sub-lead on the substrate substrate, and the first sub-lead and the second sub-lead contact.Electrode lead includes the conductor in the metal layer in addition to including the conductor in the metal layer, and the conductor in the metal layer is easy to break, and the conductor in the indium tin oxide layer is not easy to break.Through setting electrode lead includes the conductor in the indium tin oxide layer, the probability of the conductor in the first metal layer of electrode lead damaging can be reduced.And when the conductor in the metal layer of electrode lead is broken due to corrosion or other reasons, part in the indium tin oxide layer can still transmit signals, thereby reducing the probability of electrode lead damage, and improving the reliability of electrode lead.

[0032] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the utility model, and is not used to limit the scope of the utility model. Other features of the utility model will become easy to understand through the following description. BRIEF DESCRIPTION OF DRAWINGS

[0033] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the drawings needed to be used in the embodiment description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained according to these drawings without creating labor for those skilled in the art.

[0034] Figure 1 The utility model provides a kind of touch substrate's section view;

[0035] Figure 2 The utility model provides a kind of touch substrate's structure schematic view;

[0036] Figure 3 For Figure 2 Sectional view along A1A2 direction;

[0037] Figure 4 For Figure 2 Sectional view along A3A4 direction;

[0038] Figure 5 is Figure 2 a sectional view along the direction of A5A6;

[0039] Figure 6 is Figure 2 a sectional view along the direction of A7A8;

[0040] Figure 7 is Figure 2 a sectional view along the direction of A9A10;

[0041] Figure 8 is Figure 2 a sectional view along the direction of A5A6;

[0042] Figure 9 is Figure 2 a sectional view along the direction of A7A8;

[0043] Figure 10 is Figure 2 a sectional view along the direction of A9A10;

[0044] Figure 11 is Figure 2 a sectional view along the direction of A3A4;

[0045] Figure 12 is Figure 2 a sectional view along the direction of A5A6;

[0046] Figure 13 is Figure 2 a sectional view along the direction of A3A4;

[0047] Figure 14 is Figure 2 an enlarged view of a middle partial region;

[0048] Figure 15 is Figure 14 a structural schematic view of the indium tin oxide layer;

[0049] Figure 16 is Figure 14 a structural schematic view of the indium tin oxide layer and the first insulating layer;

[0050] Figure 17 is Figure 14 a structural schematic view of the first metal layer;

[0051] Figure 18 is Figure 14 a structural schematic view of the second touch electrode;

[0052] Figure 19 is Figure 14Structure diagram of the second sub-electrode;

[0053] Figure 20 For Figure 14 Sectional view along the A1A2 direction;

[0054] Figure 21 For Figure 2 Enlarged view of the local area;

[0055] Figure 22 For Figure 21 Structure diagram of the indium tin oxide layer;

[0056] Figure 23 For Figure 21 Structure diagram of the first metal layer;

[0057] Figure 24 For Figure 21 Sectional view along the A1A2 direction;

[0058] Figure 25 For Figure 21 Sectional view along the A3A4 direction.

[0059] In the figure: 21, first touch electrode; 21A, first sub-electrode; 21B, second sub-electrode; 22, second touch electrode; 22A, third sub-electrode; 22B, fourth sub-electrode; 23, electrode lead; 231, first electrode lead; 231A, first sub-lead of the first electrode lead; 231B, second sub-lead of the first electrode lead; 232, second electrode lead; 232A, first sub-lead of the second electrode lead; 232B, second sub-lead of the second electrode lead; 232C, third sub-lead of the second electrode lead; 24, binding pad; 241, first sub-pad; 242, second sub-pad; AA, display area; BA, binding area; Gap, groove; M1, first metal layer; M2, second metal layer; OC1, first insulating layer; OC2, second insulating layer; Sub, substrate; T1, indium tin oxide layer; X, first direction; Y, second direction. DETAILED DESCRIPTION

[0060] In order to make the personnel in the technical field better understand the present application scheme, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the person skilled in the art without creative labor should belong to the scope of protection of the present application.

[0061] It should be noted that the terms "first", "second", and the like in the description and claims of the present application and above drawings are used to distinguish similar objects, and do not necessarily indicate a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0062] Embodiment one

[0063] Embodiment one please refer to Figure 1 . Figure 1 A cross-sectional view of a touch substrate is provided. The touch substrate includes: a substrate Sub and a conductive structure layer. The conductive structure layer includes an indium tin oxide layer T1 disposed on the substrate Sub and at least one metal layer (for example, a first metal layer M1) located on the side of the indium tin oxide layer T1 away from the substrate Sub. The conductive structure layer is provided with a plurality of touch electrodes, a plurality of electrode leads and a plurality of binding pads. The plurality of touch electrodes includes a plurality of first touch electrodes and a plurality of second touch electrodes, and the first touch electrodes and the second touch electrodes are insulated and crossed. The first end of the electrode lead is electrically connected to a touch electrode, and the second end of the electrode lead is electrically connected to a binding pad. The electrode lead includes a first sub-lead (for example, the first electrode lead 231A in the first electrode lead) located in the indium tin oxide layer T1 and a second sub-lead (for example, the second electrode lead 231B in the first electrode lead) located in the at least one metal layer. In the thickness direction of the touch substrate, the orthographic projection of the first sub-lead on the substrate Sub is located in the orthographic projection of the second sub-lead on the substrate Sub, and the first sub-lead and the second sub-lead are in contact. For example, the orthographic projection of the first sub-lead 231A of the first electrode lead on the substrate Sub is located in the orthographic projection of the second sub-lead 231B of the first electrode lead on the substrate Sub, and the first sub-lead 231A of the first electrode lead and the second sub-lead 231B of the first electrode lead are in contact. Figure 1 Figure 1

[0064] ​​In particular, the touch substrate can be applied in a touch module, for example, can be attached with a display panel to form a touch module. The substrate substrate in the touch substrate plays a supporting role. The substrate substrate Sub can be a rigid substrate such as glass, etc. The substrate substrate Sub can also be a flexible substrate such as polyimide (PI), etc. The substrate substrate Sub can also be a structural reuse in the display panel, for example, can be reused by the cover plate in the display panel.

[0065] The conductive structure layer includes an indium tin oxide layer T1 and at least one metal layer. The material of the conductive lines in the indium tin oxide layer T1 is indium tin oxide ITO, and the material of the conductive lines in the metal layer is metal. In the embodiment, each electrode lead includes a first electrode lead and a second electrode lead. In the thickness direction of the touch substrate, the orthographic projection of the first electrode lead on the substrate substrate is located in the orthographic projection of the second electrode lead on the substrate substrate, for example, the orthographic projection of the first sub-lead on the substrate substrate can coincide with the orthographic projection of the second sub-lead on the substrate substrate. That is, the electrode lead includes a conductive line in the indium tin oxide layer in addition to a conductive line in the metal layer. The conductive line in the metal layer is prone to breakage, while the conductive line in the indium tin oxide layer is not prone to breakage. By arranging the electrode lead to include a conductive line in the indium tin oxide layer, the probability of damage to the conductive line in the first metal layer of the electrode lead can be reduced. When the conductive line in the metal layer of the electrode lead is broken due to corrosion or other reasons, the signal can still be transmitted through the part in the indium tin oxide layer, thereby reducing the probability of damage to the electrode lead and improving the reliability of the electrode lead. In addition, the electrode lead includes a conductive line in the indium tin oxide layer and a conductive line in the metal layer. On the one hand, the conductive line in the metal layer has a small impedance. On the other hand, the overall thickness of the electrode lead is relatively thick. The above two factors make the overall impedance of the electrode lead relatively small.

[0066] The technical solution of this embodiment uses a touch substrate, including: a substrate Sub; a conductive structure layer, the conductive structure layer including an indium tin oxide layer disposed on the substrate and at least one metal layer located on the side of the indium tin oxide layer away from the substrate; the conductive structure layer is provided with multiple touch electrodes, multiple electrode leads and multiple bonding pads; the multiple touch electrodes include multiple first touch electrodes and multiple second touch electrodes, the first touch electrodes and the second touch electrodes being insulated from each other and intersecting; a first end of an electrode lead is electrically connected to a touch electrode, and a second end of an electrode lead is electrically connected to a bonding pad; the electrode lead includes a first sub-lead located in the indium tin oxide layer and a second sub-lead located in the at least one metal layer; along the thickness direction of the touch substrate, the orthographic projection of the first sub-lead on the substrate lies within the orthographic projection of the second sub-lead on the substrate, and the first sub-lead and the second sub-lead are in contact. In addition to the wires located in the metal layer, the electrode leads also include wires located in the indium tin oxide layer; the wires located in the metal layer are easily broken, while the wires located in the indium tin oxide layer are not easily broken. By including conductors within the indium tin oxide (ITO) layer in the electrode leads, the probability of damage to the conductors within the first metal layer can be reduced. Furthermore, even if the conductors within the metal layer break due to corrosion or other reasons, signals can still be transmitted through the portion located within the ITO layer, thereby reducing the probability of electrode lead damage and improving the reliability of the electrode leads.

[0067] The above is the core idea of ​​this utility model. The following describes this utility model in further detail with reference to specific embodiments.

[0068] Example 2

[0069] Please refer to Example 2. Figures 1 to 6 . Figure 2 This is a schematic diagram of the structure of a touch substrate provided by this utility model. Figure 3 for Figure 2 Cross-sectional view along the A1A2 direction. Figure 4 for Figure 2 Cross-sectional view along the A3A4 direction. Figure 5 for Figure 2 Cross-sectional view along the A5A6 direction. Figure 6 for Figure 2 A cross-sectional view along the A7A8 direction. Optionally, based on Embodiment 1, refer to... Figure 2 and Figure 4 The bonding pad 24 includes a first sub-pad 241 located in the indium tin oxide layer T1. That is, the material of the first sub-pad 241 is indium tin oxide, and the first sub-pad 241 is less susceptible to corrosion than metal. Therefore, setting the bonding pad 24 to include the first sub-pad 241 can greatly reduce the probability of the bonding pad 24 being corroded, and further improve the reliability of the touch substrate.

[0070] It should be noted that the conductive structure layer is formed on the substrate to form the touch electrodes, the electrode leads and the bonding pads 24. The bonding pads 24 can be bonded with a display panel or a driving chip to receive a touch signal and transmit a detection signal on the touch electrode to the corresponding display panel or driving chip. The touch electrodes include the first touch electrodes 21 and the second touch electrodes 22. The first touch electrodes 21 can extend along the second direction Y, and a plurality of the first touch electrodes 21 are arranged along the first direction X. The second touch electrodes 22 can extend along the first direction X, and a plurality of the second touch electrodes 22 are arranged along the second direction Y. One of the first touch electrodes 21 and the second touch electrodes 22 serves as a transmitting electrode, and the other serves as a detection electrode. The specific functions of the touch electrodes when implementing touch are well known to those skilled in the art, and will not be described here.

[0071] In the embodiment, the touch electrodes are in a metal mesh structure, i.e., each touch electrode is in a metal mesh structure. The touch electrodes in the metal mesh structure have a small impedance.

[0072] The touch substrate includes a display area AA and a non-display area at least partially surrounding the display area AA, and the non-display area includes a bonding area BA. The display area AA corresponds to a display area of a display panel. The touch electrodes are located in the display area AA, and the bonding pads 24 are located in the bonding area BA. The display area AA and the bonding area BA are arranged along the first direction X. The first touch electrodes 21 are electrically connected to the bonding pads 24 in the bonding area BA through one or two electrode leads. When one first touch electrode 21 is connected to one electrode lead, the electrode lead can be connected to one side of the touch electrode. When one first touch electrode 21 is connected to two electrode leads, the two electrode leads are respectively connected to two opposite sides of the first touch electrode 21 along the second direction Y. Each second touch electrode 22 is electrically connected to one bonding pad through one electrode lead. It should be noted that the electrode leads are located in the non-display area.

[0073] Optionally, referring to Figure 2 and Figure 3 The electrode leads 23 include the first electrode leads 231 electrically connected to the first touch electrodes 21 and the second electrode leads 232 electrically connected to the second touch electrodes 22. The at least one metal layer includes a first metal layer M1 adjacent to the indium tin oxide layer T1. The second sub-lead 231B of the first electrode lead 231 is located in the first metal layer M1, and the second sub-lead 231B of the first electrode lead 231 covers the first sub-lead 231A of the first electrode lead 231.

[0074] Specifically, in the embodiment, the second sub-lead 231B of the first electrode lead 231 completely covers the first sub-lead 231A of the first electrode lead 231, that is, the surface where the first sub-lead 231A of the first electrode lead 231 meets the second sub-lead 231B of the first electrode lead 231 is in contact everywhere, and when the second sub-lead 231B of the first electrode lead 231 is broken at any position due to corrosion or the like, the signal can still be transmitted through the first sub-lead 231A of the first electrode lead 231. In addition, the second sub-lead 231B of the first electrode lead 231 covers the first sub-lead 231A, so that the thickness of the first electrode lead 231 is thicker, and the impedance of the first electrode lead 231 is smaller.

[0075] Optionally, referring to Figure 2 and Figure 5 , the at least one metal layer further comprises a second metal layer M2 located on the side of the first metal layer M1 away from the indium tin oxide layer T1; the touch substrate further comprises a first insulating layer OC1 located between the first metal layer M1 and the second metal layer M2; the second sub-lead 232B of the second electrode lead 232 is located on the second metal layer M2, and the first insulating layer OC1 is provided with at least one groove Gap corresponding to the position of the second electrode lead 232, the groove Gap exposes the first sub-lead 232A of the second electrode lead 232, and the second sub-lead 232B of the second electrode lead 232 extends along the inner wall of the groove Gap and is in contact with the first sub-lead 232A of the second electrode lead 232.

[0076] Specifically, in the embodiment, the first sub-lead 231A of the first electrode lead 231 is located on the indium tin oxide layer T1, and the second sub-lead 231B of the first electrode lead 231 is located on the first metal layer M1. The first sub-lead 232A of the second electrode lead 232 is located on the indium tin oxide layer T1, and the second sub-lead 232B of the second electrode lead 232 is located on the second metal layer M2. The first metal layer M1 and the second metal layer M2 are provided with the first insulating layer OC1, and by providing the groove Gap on the first insulating layer OC1 and setting the second sub-lead 232B of the second electrode lead 232 to extend along the inner wall of the groove Gap so that the second sub-lead 232B of the second electrode lead 232 is in contact with the first sub-lead 232A of the second electrode lead 232, the probability of damage to the second sub-lead 232B of the second electrode lead 232 can be reduced. And when the second sub-lead 232B of the second electrode lead 232 is broken due to corrosion or the like, the signal can be transmitted through the first sub-lead 232A of the second electrode lead 232. In addition, in the embodiment, the second sub-lead 231B of the first electrode lead 231 and the second sub-lead 232B of the second electrode lead 232 are located in different metal layers, which can reduce the wiring difficulty.

[0077] Optionally, continuing to refer to Figure 2The grooves Gap correspond to portions of the second electrode lead 232 extending in the second direction Y; the portions of the at least part of the second electrode lead 232 extending in the second direction Y correspond to the at least part of the grooves Gap arranged in the first direction X and communicated; the first direction X intersects the second direction Y.

[0078] Specifically, in the embodiment, the first direction X is, for example, a column direction of pixel arrangement in the display panel, and the second direction Y is, for example, a row direction of pixel arrangement in the display panel. The second electrode lead 232 can extend into the binding area BA in the form of a broken line. Therefore, the second electrode lead 232 includes a portion extending in the first direction X and a portion extending in the second direction Y. The grooves Gap can be arranged at any position of the second electrode lead 232, and each second electrode lead 232 can correspond to a plurality of grooves Gap. The plurality of grooves Gap can be uniformly distributed on the second electrode lead 232. Preferably, the grooves Gap are arranged in the second electrode lead 232 corresponding to the portion arranged in the second direction Y. Further, the grooves Gap on the plurality of second electrode leads 232 can be arranged in the first direction X and communicated, that is, when the grooves Gap are formed on the first insulating layer OC1, a larger groove is directly formed. The larger groove includes a plurality of grooves Gap corresponding to the second electrode lead 232 and a portion communicated between the grooves Gap corresponding to the adjacent two second electrode leads 232. It can be understood that, when the second sub-lead 232B of the second electrode lead 232 in the second metal layer M2 is formed, the same groove Gap insulates different second sub-leads 232B, that is, the portion of the larger groove for communicating the two grooves Gap has no metal structure. The arrangement of the embodiment, that is, the communication of the grooves Gap between different second electrode leads 232, does not need to form more and smaller grooves Gap when the touch substrate is prepared, and the preparation difficulty is lower.

[0079] Optionally, referring to Figure 2 and Figure 6 In the embodiment, the first touch electrode 21 can be arranged in the first metal layer M1, and the second touch electrode 22 can be arranged in the second metal layer M2.

[0080] Optionally, Figure 7 For Figure 2 A cross-sectional view in the A9A10 direction, referring to Figure 2 and Figure 7 The second sub-lead 232B of the second electrode lead 232 can extend into the binding area and be electrically connected with the first sub-pad 241. Thus, the second sub-lead 232B of the second electrode lead 232 is also directly electrically connected with the first sub-pad 241, without the need of being electrically connected with the first sub-pad 241 through the first sub-lead 232A of the second electrode lead 232.

[0081] Optionally, with continued reference to Figures 2 to 7 In the embodiment, the touch substrate further comprises a second insulating layer OC2 covering the second metal layer M2.

[0082] Embodiment three

[0083] Embodiment three Figures 2 to 4 , and Figures 8 to 11 On the basis of the embodiment one, optionally, with reference to Figures 2 to 4 The binding pad 24 comprises a first sub-pad 241 located on the indium tin oxide layer T1.

[0084] Optionally, with reference to Figure 2 and Figure 3 The electrode lead 23 comprises a first electrode lead 231 electrically connected with the first touch electrode 21 and a second electrode lead 232 electrically connected with the second touch electrode 22. The at least one metal layer comprises a first metal layer M1 adjacent to the indium tin oxide layer T1; a second sub-lead 231B of the first electrode lead 231 is located on the first metal layer M1, and the second sub-lead 231B of the first electrode lead 231 covers a first sub-lead 231A of the first electrode lead 231.

[0085] Optionally, Figure 8 is Figure 2 is another cross-sectional view along the direction of A5A6, Figure 9 is Figure 2 is another cross-sectional view along the direction of A7A8, Figure 10 is Figure 2 is another cross-sectional view along the direction of A9A10, with reference to Figures 2 to 3 , and Figures 8 to 10 In the thickness direction of the touch substrate, the orthographic projection of the indium tin oxide layer T1 on the substrate Sub coincides with the orthographic projection of the first metal layer M1 on the substrate Sub. The at least one metal layer further comprises a second metal layer M2 located on the side of the first metal layer M1 away from the indium tin oxide layer T1; the touch substrate further comprises a first insulating layer OC1 located between the first metal layer M1 and the second metal layer M2; a second sub-lead 232B of the second electrode lead 232 is located on the first metal layer, and the second electrode lead 232 further comprises a third sub-lead 232C located on the second metal layer M2; the first insulating layer OC1 is provided with at least one groove Gap corresponding to the position of the third sub-lead 232C of the second electrode lead 232, the groove Gap exposes the second sub-lead 232B of the second electrode lead 232, and the third sub-lead 232C of the second electrode lead 232 extends along the inner wall of the groove Gap and contacts the second sub-lead 232B of the second electrode lead 232.

[0086] Specifically, in the embodiment, the orthogonal projection of the first metal layer M1 on the substrate Sub coincides with the orthogonal projection of the indium tin oxide layer T1 on the substrate Sub. The first metal layer M1 can share a mask with the indium tin oxide layer T1, which can reduce the number of masks required for manufacturing the touch substrate and reduce the cost.

[0087] Further, as shown in Figure 9 , the first touch electrode 21 includes a first sub-electrode 21A located in the indium tin oxide layer T1 and a second sub-electrode 21B located in the first metal layer M1, and the second touch electrode 22 is located in the second metal layer M2.

[0088] Specifically, in the embodiment, the orthogonal projection of the first metal layer M1 on the substrate Sub coincides with the orthogonal projection of the indium tin oxide layer T1 on the substrate Sub. That is, the first touch electrode 21 also includes a portion located in the indium tin oxide layer T1 and a portion located in the first metal layer M1. The second sub-electrode 21B in the first touch electrode 21 has a lower probability of being damaged, and when damaged due to corrosion or other reasons, the signal can also be transmitted through the first sub-electrode 21A. Therefore, the scheme of the embodiment can reduce the probability of damage of the first touch electrode 21 and further improve the reliability of the touch substrate.

[0089] Optionally, Figure 11 To Figure 2 , another cross-sectional view along the A3A4 direction is shown in Figure 10 and Figure 11 . In the embodiment, the binding pad 24 includes a first sub-pad 241 located in the indium tin oxide layer T1 and a second sub-pad 242 located in the first metal layer M1, and the second sub-pad 242 covers the first sub-pad 241. Referring to Figure 9 , the second sub-lead 232B in the second electrode lead 232 can extend to the binding area BA and be electrically connected with the second sub-pad 242.

[0090] Embodiment Four

[0091] Embodiment Four, please refer to Figure 2 , Figure 4 , and Figures 12 to 20 . At least one metal layer in the above-mentioned Embodiment Two and Embodiment Three includes two metal layers of the first metal layer M1 and the second metal layer M2. In the embodiment, at least one metal layer only includes the first metal layer M1, which will be described in detail below.

[0092] On the basis of Embodiment One, optionally, referring to Figure 2 and Figure 4 , the binding pad 24 includes a first sub-pad 241 located in the indium tin oxide layer T1.

[0093] Optionally, referring toFigure 2 and Figure 3 The electrode lead 23 includes a first electrode lead 231 electrically connected with the first touch electrode 21 and a second electrode lead 232 electrically connected with the second touch electrode 22. The at least one metal layer includes a first metal layer M1 adjacent to the indium tin oxide layer T1; the second sub-lead 231B of the first electrode lead 231 is located on the first metal layer M1, and the second sub-lead 231B of the first electrode lead 231 covers the first sub-lead 231A of the first electrode lead 231.

[0094] Optionally, Figure 12 As shown in FIG. 6, Figure 2 As shown in FIG. 7, the second sub-lead 232B of the second electrode lead 232 is located on the first metal layer M1, and the second sub-lead 232B of the second electrode lead 232 covers the first sub-lead 232A of the second electrode lead 232.

[0095] Specifically, in the embodiment, the second sub-lead 232B of the second electrode lead 232 completely covers the first sub-lead 232A of the second electrode lead 232, that is, the surface where the first sub-lead 232A of the second electrode lead 232 meets the second sub-lead 232B of the second electrode lead 232 is in contact everywhere, and when the second sub-lead 232B of the second electrode lead 232 is broken at any place due to corrosion or the like, the signal can still be transmitted through the first sub-lead 232A of the second electrode lead 232. In addition, the second sub-lead 232B of the second electrode lead 232 covers the first sub-lead 232A of the second electrode lead 232, so that the thickness of the second electrode lead 232 is thicker, and the impedance of the second electrode lead 232 is smaller.

[0096] Optionally, Figure 13 As shown in FIG. 8, Figure 2 As shown in FIG. 9, the electrode lead 23 can extend into the binding area BA and be electrically connected with the binding pad 24. Figure 2 and Figure 13 In the embodiment, the electrode lead 23 can extend into the binding area BA and be electrically connected with the binding pad 24. Figure 2 The cross-sectional view along the A5A6 direction is the same as the cross-sectional view along the A3A4 direction, which will not be described here again. Figure 2 The cross-sectional view along the A5A6 direction is the same as the cross-sectional view along the A3A4 direction, which will not be described here again.

[0097] Optionally, Figure 14 As shown in FIG. 10, Figure 2 As shown in FIG. 11, the structure of the indium tin oxide layer T1 in the embodiment is shown in FIG. 12, Figure 15 As shown in FIG. 13, the structure of the indium tin oxide layer T1 and the first insulating layer M1 in the embodiment is shown in FIG. 14, Figure 14 As shown in FIG. 13, the structure of the indium tin oxide layer T1 and the first insulating layer M1 in the embodiment is shown in FIG. 14, Figure 16 As shown in FIG. 13, the structure of the indium tin oxide layer T1 and the first insulating layer M1 in the embodiment is shown in FIG. 14, Figure 14 As shown in FIG. 13, the structure of the indium tin oxide layer T1 and the first insulating layer M1 in the embodiment is shown in FIG. 14, Figure 17 As shown in FIG. 13, the structure of the indium tin oxide layer T1 and the first insulating layer M1 in the embodiment is shown in FIG. 14, Figure 14Structure diagram of the first metal layer M1, Figure 18 For Figure 14 Structure diagram of the second touch electrode 22, Figure 19 For Figure 14 Structure diagram of the second sub-electrode 21B, Figure 10 For Figure 14 Sectional view along the A1A2 direction, for reference Figures 14 to 20 Wherein, Figure 14 The area in the first touch electrode 21 is Figure 2 The area Z1 in the first touch electrode 21. The first touch electrode 21 includes the first sub-electrode 21A located in the indium tin oxide layer T1 and the second sub-electrode 21B located in the first metal layer M1; the second sub-electrode 21B covers the first sub-electrode 21A and is disconnected at the overlapping part of the first touch electrode 21 and the second touch electrode 22; the first sub-electrode 21A is continuous at the overlapping part of the first touch electrode 21 and the second touch electrode 22; the touch substrate further includes the first insulating layer OC1 covering the part of the first sub-electrode 21A located at the overlapping part of the first touch electrode 21 and the second touch electrode 22, the second touch electrode 22 is located in the first metal layer M1, and the part of the second touch electrode 22 located at the overlapping part is provided with the first insulating layer OC1 between the part of the first sub-electrode 21A located at the overlapping part.

[0098] Specifically, in the embodiment, the at least one metal layer includes only one metal layer, i.e., the first metal layer M1. In the first metal layer M1, the second touch electrode 22 is continuous at the overlapping part with the first touch electrode 21, while the second sub-electrode 21B in the first touch electrode 21 is disconnected at the overlapping part. The first sub-electrode 21A located in the indium tin oxide layer T1 is continuous at the overlapping part, that is, the first sub-electrode 21A can act as a bridge for the second sub-electrode 21B, so that the parts of the second sub-electrode 21B are electrically connected. In addition, the first insulating layer OC1 is arranged at the overlapping part to insulate the first sub-electrode 21A from the second touch electrode 22, preventing the first touch electrode 21 from short-circuiting with the second touch electrode 22. The technical solution of the embodiment makes the first touch electrode 21 include both the conductive wire located in the indium tin oxide layer T1 and the conductive wire located in the first metal layer M1, so that when the conductive wire (i.e., the second sub-electrode 21B) located in the first metal layer M1 of the first touch electrode 21 is damaged due to corrosion or other reasons, the first touch electrode 21 can still transmit signals through the first sub-electrode 21A.

[0099] Optionally, the touch substrate further includes the second insulating layer OC2 covering the first metal layer M1.

[0100] Embodiment five

[0101] Embodiment five please refer to Figure 2 , Figure 4 , Figure 12 , Figure 13and Figures 21 to 25 In the above embodiment two and embodiment three, the at least one metal layer includes two metal layers of the first metal layer M1 and the second metal layer M2. In the present embodiment, the at least one metal layer includes only one metal layer of the first metal layer M1. Details are described below.

[0102] On the basis of the above embodiment one, optionally, referring to Figure 2 and Figure 4 The binding pad 24 includes the first sub-pad 241 located on the indium tin oxide layer T1.

[0103] Optionally, referring to Figure 2 and Figure 3 The electrode lead 23 includes the first electrode lead 231 electrically connected with the first touch electrode 21 and the second electrode lead 232 electrically connected with the second touch electrode 22. The at least one metal layer includes the first metal layer M1 adjacent to the indium tin oxide layer T1; the second sub-lead 231B of the first electrode lead 231 is located on the first metal layer M1, and the second sub-lead 231B of the first electrode lead 231 covers the first sub-lead 231A of the first electrode lead 231.

[0104] Optionally, referring to Figure 12 The second sub-lead 232B of the second electrode lead 232 is located on the first metal layer M1, and the second sub-lead 232A of the second electrode lead 232 covers the first sub-lead 232A of the second electrode lead.

[0105] Specifically, in the present embodiment, the second sub-lead 232B of the second electrode lead 232 completely covers the first sub-lead 232A of the second electrode lead 232, that is to say, the surface where the first sub-lead 232A of the second electrode lead 232 meets the second sub-lead 232B of the second electrode lead 232 is in contact everywhere. When the second sub-lead 232B of the second electrode lead 232 is broken at any place due to corrosion or other reasons, the signal can still be transmitted through the first sub-lead 232A of the second electrode lead 232. In addition, the second sub-lead 232B of the second electrode lead 232 covers the first sub-lead 232A of the second electrode lead 232, so that the thickness of the second electrode lead 232 is thicker, and the impedance of the second electrode lead 232 is smaller.

[0106] Optionally, referring to Figure 2 and Figure 13 In the present embodiment, the electrode lead 23 can extend into the binding area and be electrically connected with the binding pad 24. It should be noted that in the present embodiment, Figure 2 The cross-sectional view along the A5A6 direction is the same as the cross-sectional view along the A3A4 direction, which will not be described here. Figure 2

[0107] Optionally,​Figure 21 Fig. 1 is a schematic view of a touch panel according to an embodiment of the present application, Figure 2 Fig. 2 is a schematic view of a partial region of the touch panel of Fig. 1, Figure 22 Fig. 3 is a schematic view of a structure of an indium tin oxide layer in the touch panel of Fig. 1, Figure 21 Fig. 4 is a schematic view of a structure of a first metal layer in the touch panel of Fig. 1, Figure 23 Fig. 5 is a schematic view of a structure of a second metal layer in the touch panel of Fig. 1, Figure 21 Fig. 6 is a schematic view of a structure of a third metal layer in the touch panel of Fig. 1, Figure 24 Fig. 7 is a schematic view of a structure of a fourth metal layer in the touch panel of Fig. 1, Figure 21 Fig. 8 is a sectional view along the direction of A1A2, Figure 25 Fig. 9 is a sectional view along the direction of A3A4, Figure 21 Fig. 10 is a sectional view along the direction of A5A6, Figures 21 to 25 Fig. 11 is a schematic view of a region in Fig. 1, Figure 21 Fig. 12 is a schematic view of a region Z1 in Fig. 1. The first touch electrode 21 includes a first sub-electrode 21A located in the indium tin oxide layer T1 and a second sub-electrode 21B located in the first metal layer M1; the second sub-electrode 21B covers the first sub-electrode 21A and is disconnected at the overlapping portion of the first touch electrode 21 and the second touch electrode 22; the first sub-electrode 21A is continuous at the overlapping portion of the first touch electrode 21 and the second touch electrode 22; the touch substrate further includes a first insulating layer OC1 covering the portion of the first sub-electrode 21A located at the overlapping portion of the first touch electrode 21 and the second touch electrode 22, the second touch electrode 22 is located in the first metal layer M1, and the portion of the second touch electrode 22 located at the overlapping portion is provided with the first insulating layer OC1 between the portion of the first sub-electrode 21A located at the overlapping portion. Figure 1 The second touch electrode 22 includes a third sub-electrode 22A located in the indium tin oxide layer T1 and a fourth sub-electrode 22B located in the second metal layer M2; the fourth sub-electrode 22B covers the third sub-electrode 22A, and the third sub-electrode 22A is disconnected at the overlapping portion of the first touch electrode 21 and the second touch electrode 22; the fourth sub-electrode 22B is continuous at the overlapping portion of the first touch electrode 21 and the second touch electrode 22; the portion of the first sub-electrode 21A located at the overlapping portion is provided with the first insulating layer OC1 between the portion of the fourth sub-electrode 22B located at the overlapping portion; the portion of the third sub-electrode 22A located at the overlapping portion is provided with the first insulating layer OC1 between the portion of the second sub-electrode 21B located at the overlapping portion.

[0108]

[0109] ​Specifically, in the embodiment, the at least one metal layer includes only one metal layer, i.e., the first metal layer M1. In the first metal layer M1, the fourth sub-electrode 22B is continuous at the overlapping portion with the first touch electrode 21, while the second sub-electrode 21B is discontinuous at the overlapping portion. The first sub-electrode 21A located in the indium tin oxide layer T1 is continuous at the overlapping portion, while the third sub-electrode 22A is discontinuous at the overlapping portion. That is, the first sub-electrode 21A can act as a bridge for the second sub-electrode 21B, so that the parts of the second sub-electrode 21B are electrically connected. Similarly, the fourth sub-electrode 22B can act as a bridge for the third sub-electrode 22A, so that the parts of the third sub-electrode 22A are electrically connected. In addition, the first insulating layer OC1 is arranged at the overlapping portion to insulate the first sub-electrode 21A from the fourth sub-electrode 22B and insulate the third sub-electrode 22A from the second sub-electrode 21B, preventing the first touch electrode 21 from short-circuiting with the second touch electrode 22. The technical solution of the embodiment makes the first touch electrode 21 and the second touch electrode 22 include not only the conductive wire located in the indium tin oxide layer T1 but also the conductive wire located in the first metal layer M1, which can reduce the probability of damage of the second sub-electrode 21B and the fourth sub-electrode 22B. Even when the conductive wire (i.e., the second sub-electrode 21B) of the first touch electrode 21 and / or the second touch electrode 22 located in the first metal layer M1 is damaged due to corrosion or other reasons, the first touch electrode 21 can still transmit signals through the first sub-electrode 21A, and the second touch electrode can still transmit signals through the third sub-electrode 22A.

[0110] Embodiment six

[0111] The utility model also provides a kind of touch display module, touch display module includes the touch substrate and display panel provided by any embodiment of the utility model.The display panel can be liquid crystal display panel, and the touch substrate is arranged on the light exit surface of display panel.Because the touch display module provided by the embodiment of the utility model includes the touch substrate provided by any embodiment of the utility model, thus also has the same beneficial effect, which will not be repeated here.The touch display module can be, for example, a vehicle-mounted display device.

[0112] It should be understood that the various forms of flow shown above can be used to reorder, add or delete steps. For example, the steps described in the utility model can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solutions of the utility model can be achieved, which are not limited herein.

[0113] The above specific embodiments do not constitute a limitation on the scope of protection of the utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the utility model shall be included in the scope of protection of the utility model.

Claims

1. A touch substrate, characterized in that, include: Substrate; A conductive structure layer, the conductive structure layer comprising an indium tin oxide layer disposed on the substrate and at least one metal layer located on the side of the indium tin oxide layer away from the substrate; The conductive structure layer is provided with multiple touch electrodes, multiple electrode leads, and multiple bonding pads; The multiple touch electrodes include multiple first touch electrodes and multiple second touch electrodes, wherein the first touch electrodes and the second touch electrodes are insulated from each other and cross each other; The first end of the electrode lead is electrically connected to a touch electrode, and the second end of the electrode lead is electrically connected to a bonding pad. The electrode lead includes a first sub-lead located in the indium tin oxide layer and a second sub-lead located in the at least one metal layer. Along the thickness direction of the touch substrate, the orthographic projection of the first sub-lead on the substrate is located within the orthographic projection of the second sub-lead on the substrate, and the first sub-lead is in contact with the second sub-lead.

2. The touch substrate according to claim 1, characterized in that, The bonding pad includes a first sub-pad located in the indium tin oxide layer.

3. The touch substrate according to claim 1, characterized in that, The electrode leads include a first electrode lead electrically connected to the first touch electrode and a second electrode lead electrically connected to the second touch electrode; The at least one metal layer includes a first metal layer adjacent to the indium tin oxide layer; the second sub-lead of the first electrode lead is located in the first metal layer, and the second sub-lead of the first electrode lead covers the first sub-lead of the first electrode lead.

4. The touch substrate according to claim 3, characterized in that, The at least one metal layer further includes a second metal layer located on the side of the first metal layer away from the indium tin oxide layer; The touch substrate further includes a first insulating layer located between the first metal layer and the second metal layer; The second sub-lead of the second electrode lead is located in the second metal layer. The first insulating layer has at least one groove corresponding to the position of the second electrode lead. The groove exposes the first sub-lead in the second electrode lead. The second sub-lead in the second electrode lead extends along the inner wall of the groove and contacts the first sub-lead.

5. The touch substrate according to claim 4, characterized in that, The touch substrate includes a touch area and a bonding area arranged along a first direction, the touch electrode is disposed in the touch area, and the bonding pad is disposed in the bonding area; The groove corresponds to the portion of the second electrode lead extending along the second direction; at least a portion of the portion of the second electrode lead extending along the second direction corresponds to at least a portion of the grooves arranged and connected along the first direction; the first direction intersects the second direction.

6. The touch substrate according to claim 3, characterized in that, Along the thickness direction of the touch substrate, the orthographic projection of the indium tin oxide layer on the substrate coincides with the orthographic projection of the first metal layer on the substrate. The at least one metal layer further includes a second metal layer located on the side of the first metal layer away from the indium tin oxide layer; The touch substrate further includes a first insulating layer located between the first metal layer and the second metal layer; The second electrode lead has a second sub-lead located in the first metal layer. The second electrode lead also includes a third sub-lead located in the second metal layer. The first insulating layer has at least one groove corresponding to the position of the third sub-lead. The groove exposes the second sub-lead in the second electrode lead. The third sub-lead in the second electrode lead extends along the inner wall of the groove and contacts the second sub-lead.

7. The touch substrate according to claim 6, characterized in that, The first touch electrode includes a first sub-electrode located in the indium tin oxide layer and a second sub-electrode located in the first metal layer, wherein the second touch electrode is located in the second metal layer.

8. The touch substrate according to claim 3, characterized in that, The second sub-lead of the second electrode lead is located in the first metal layer, and the second sub-lead of the second electrode lead covers the first sub-lead of the second electrode lead.

9. The touch substrate according to claim 8, characterized in that, The first touch electrode includes a first sub-electrode located in the indium tin oxide layer and a second sub-electrode located in the first metal layer; the second sub-electrode covers the first sub-electrode and is disconnected at the overlap of the first touch electrode and the second touch electrode; the first sub-electrode is continuous at the overlap of the first touch electrode and the second touch electrode. The touch substrate further includes a first insulating layer covering the portion of the first sub-electrode located at the overlap of the first touch electrode and the second touch electrode; the second touch electrode is located on the first metal layer, and the first insulating layer is disposed between the portion of the second touch electrode located at the overlap and the portion of the first sub-electrode located at the overlap.

10. The touch substrate according to claim 8, characterized in that, The first touch electrode includes a first sub-electrode located in the indium tin oxide layer and a second sub-electrode located in the first metal layer; the second sub-electrode covers the first sub-electrode and is disconnected at the overlap of the first touch electrode and the second touch electrode; the first sub-electrode is continuous at the overlap of the first touch electrode and the second touch electrode. The touch substrate further includes a first insulating layer covering the portion of the first sub-electrode located at the overlap between the first touch electrode and the second touch electrode; the at least one metal layer further includes a second metal layer located on the side of the first metal layer away from the indium tin oxide layer; The second touch electrode includes a third sub-electrode located in the indium tin oxide layer and a fourth sub-electrode located in the second metal layer; the fourth sub-electrode covers the third sub-electrode, and the third sub-electrode is disconnected at the overlap of the first touch electrode and the second touch electrode; the fourth sub-electrode is continuous at the overlap of the first touch electrode and the second touch electrode. The first insulating layer is disposed between the portion of the first sub-electrode located at the overlapping area and the portion of the fourth sub-electrode located at the overlapping area; the first insulating layer is disposed between the portion of the third sub-electrode located at the overlapping area and the portion of the second sub-electrode located at the overlapping area.

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