Multilayer ceramic capacitor

Abstract

The utility model relates to the technical field of electronic components, and discloses a multilayer ceramic capacitor, which comprises a ceramic body, a through terminal group and a grounding terminal group. The through terminal group comprises a first through terminal and a second through terminal, and the first through terminal and the second through terminal are oppositely arranged at the two ends of the ceramic body in the first direction; a first groove is formed in the middle of the first side face in the first direction, and a second groove is formed in the middle of the second side face in the first direction; the grounding terminal group comprises a first grounding terminal and a second grounding terminal, the first grounding terminal is arranged in the first groove, and the second grounding terminal is arranged in the second groove. A plurality of through inner electrodes and a plurality of grounding inner electrodes are arranged in the ceramic body, the through inner electrodes and the grounding inner electrodes are alternately arranged along a third direction, one end, along a second direction, of each grounding inner electrode extends to the groove bottom of the first groove to be connected with a first grounding terminal, and the second end of each grounding inner electrode extends to the groove bottom of the second groove to be connected with a second grounding terminal.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic component technical field, in particular to a kind of multilayer ceramic capacitors. BACKGROUND

[0002] With the development of multilayer ceramic capacitor to high capacitance, the dielectric layer and inner electrode of multilayer ceramic capacitor are continuously thinned, and the number of inner electrode layers is continuously increased. In order to reduce the equivalent series inductance of multilayer ceramic capacitor, through type multilayer ceramic capacitor is widely used. Figure 1 It is the appearance drawing of prior art through type multilayer ceramic capacitor. Figure 2 It is the appearance drawing of prior art ceramic body of through type multilayer ceramic capacitor. Figure 3 It is the exploded view of prior art ceramic body of through type multilayer ceramic capacitor. Prior art through type multilayer ceramic capacitor is composed of ceramic body 1', through terminal 2' and ground terminal 3', wherein, through terminal 2' is arranged on two sides of length direction of ceramic body 1' in pairs, ground terminal 3' is arranged on two sides of width direction of ceramic body 1' in pairs, ceramic body 1' contains a plurality of through inner electrodes and a plurality of ground inner electrodes arranged alternately along the thickness direction, through inner electrode is connected with two through terminals 2', ground inner electrode is connected with two ground terminals 3', through inner electrode and ground inner electrode are opposite to each other to form coupling capacitor, which can bypass high-frequency noise in useful signal to ground, and useful signal is transmitted through through inner electrode. In order to prevent short circuit of through terminal 2' and ground terminal 3', the width of ground terminal 3' needs to be set smaller, and then in order to ensure that ground terminal 3' can completely cover the end of ground inner electrode exposed on the side of ceramic body 1' (see Figure 4 ) to prevent moisture intrusion, narrow lead-out part a needs to be arranged on both sides of ground inner electrode, which brings the problem that when stacking ground inner electrode along the thickness direction, the lead-out part a of narrow ground inner electrode is easy to deviate, resulting in that ground terminal 3' cannot completely cover the lead-out part a of ground inner electrode (see Figure 5 ), and moisture will intrude into capacitor from the exposed lead-out part a of ground inner electrode, causing the reliability of capacitor to decrease. The requirement of user for small size and high capacitance of through type multilayer ceramic capacitor promotes the decrease of distance between through terminal and ground terminal and the increase of number of ground inner electrode, so that the deviation of lead-out part of ground inner electrode is more likely to occur.

[0003] Therefore, a multilayer ceramic capacitor is needed to solve the above problems. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a kind of multilayer ceramic capacitors, solve the problem that the lead-out part of ground inner electrode is easy to deviate.

[0005] To achieve the above object, the utility model adopts the following technical scheme:

[0006] A multilayer ceramic capacitor has two two perpendicular first direction, second direction and third direction, including ceramic body, through terminal group and ground terminal group;

[0007] The ceramic body has the first end face and the second end face which are oppositely arranged along the first direction, and the first side face and the second side face which are oppositely arranged along the second direction;

[0008] The through terminal group includes the first through terminal and the second through terminal, and the first through terminal and the second through terminal are oppositely arranged at the two ends of the ceramic body along the first direction;The first side face is provided with the first recess along the middle part of the first direction, and the second side face is provided with the second recess along the middle part of the first direction, and the first recess and the second recess extend along the third direction;The ground terminal group includes the first ground terminal and the second ground terminal, and the first ground terminal is arranged in the first recess, and the second ground terminal is arranged in the second recess;

[0009] The ceramic body is provided with a plurality of through inner electrodes and a plurality of ground inner electrodes, and the through inner electrodes and the ground inner electrodes are alternately arranged along the third direction, and the through inner electrode extends to the first end face and is connected with the first through terminal at one end along the first direction, and extends to the second end face and is connected with the second through terminal at the second end, and the ground inner electrode extends to the bottom of the first recess and is connected with the first ground terminal at one end along the second direction, and extends to the bottom of the second recess and is connected with the second ground terminal at the second end.

[0010] As an improvement of the above technical scheme, the two ends of the through inner electrode along the second direction are both located inside the ceramic body, and the two ends of the ground inner electrode along the first direction are both located inside the ceramic body.

[0011] As an improvement of the above technical scheme, the two ends of the through inner electrode along the second direction are both provided with ground terminal avoiding grooves, so that the through inner electrode and the first ground terminal are spaced apart, and the through inner electrode and the second ground terminal are spaced apart.

[0012] As the improvement of the above technical scheme, the ceramic body further has a third side face and a fourth side face oppositely arranged along the third direction, the first through terminal covers the first end face and extends to the first side face, the second side face, the third side face and the fourth side face, the second through terminal covers the second end face and extends to the first side face, the second side face, the third side face and the fourth side face, and the first through terminal is arranged spaced apart from the second through terminal.

[0013] As the improvement of the above technical scheme, the first ground terminal and the first through terminal, the first ground terminal and the second through terminal, the second ground terminal and the first through terminal, and the second ground terminal and the second through terminal are all arranged spaced apart.

[0014] As the improvement of the above technical scheme, the thickness of the through inner electrode is 0.5 μm-1 μm, and the thickness of the ground inner electrode is 0.5 μm-1 μm.

[0015] As the improvement of the above technical scheme, the distance between the ground inner electrode and the first end face is 50 μm-200 μm, and the distance between the ground inner electrode and the second end face is 50 μm-200 μm.

[0016] As the improvement of the above technical scheme, the length of the ceramic body along the first direction is L, and the width of the groove is W, and W / L is 0.1-0.2.

[0017] As the improvement of the above technical scheme, the first through terminal, the second through terminal, the first ground terminal and the second ground terminal all include a copper layer, a nickel layer and a tin layer.

[0018] As the improvement of the above technical scheme, the number of the through inner electrode and the ground inner electrode is 100-500.

[0019] Compared with the prior art, the utility model has the advantages of:

[0020] The multilayer ceramic capacitor of the utility model, the through inner electrode extends to the first end face and the first through terminal connection along the one end of the first direction X, the second end extends to the second end face and the second through terminal connection, thereby can conduct current between the first through terminal and the second through terminal, can be used for transmission useful signal. The ground inner electrode extends to the first recess groove bottom and the first ground terminal connection along the one end of the second direction Y, the second end extends to the second recess groove bottom and the second ground terminal connection, thereby can conduct current between the first ground terminal and the second ground terminal, when welding the multilayer ceramic capacitor to the circuit board, the first ground terminal and the second ground terminal ground, can bypass the high-frequency noise in the useful signal transmission between the first through terminal and the second through terminal to the ground. The multilayer ceramic capacitor of the utility model, by setting the first recess groove and the second recess groove on the ceramic body, the ground inner electrode exposes in the first recess groove and the second recess groove bottom, and the first ground terminal is set in the first recess groove, and the second ground terminal is set in the second recess groove, while realizing the connection conduction of the ground inner electrode and the first ground terminal and the second ground terminal, without setting narrow lead-out part on the ground inner electrode, can avoid the problem of lead-out part deviation, thereby improve the reliability of the multilayer ceramic capacitor. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is the structure schematic diagram of prior art multilayer ceramic capacitor provided in the background art of the utility model;

[0022] Figure 2 It is the structure schematic diagram of prior art ceramic body of multilayer ceramic capacitor provided in the background art of the utility model;

[0023] Figure 3 It is the explosion view of prior art ceramic body of multilayer ceramic capacitor provided in the background art of the utility model;

[0024] Figure 4 It is the schematic diagram of prior art ground terminal of multilayer ceramic capacitor completely covering the end portion of ground inner electrode provided in the background art of the utility model;

[0025] Figure 5 It is the schematic diagram of prior art ground terminal of multilayer ceramic capacitor not completely covering the end portion of ground inner electrode provided in the background art of the utility model;

[0026] Figure 6 It is the structure schematic diagram of multilayer ceramic capacitor provided in the embodiment of the utility model;

[0027] Figure 7 It is the structure schematic diagram of ceramic body of multilayer ceramic capacitor provided in the embodiment of the utility model;

[0028] Figure 8The cross section of the multilayer ceramic capacitor provided by the embodiment of the present utility model Figure 1 ;

[0029] Figure 9 The cross section of the multilayer ceramic capacitor provided by the embodiment of the present utility model Figure 2 ;

[0030] Figure 10 The cross section of the multilayer ceramic capacitor provided by the embodiment of the present utility model Figure 3 ;

[0031] Figure 11 The through inner electrode thin film printing pattern provided by the embodiment of the present utility model

[0032] Figure 12 The through inner electrode thin film printing pattern provided by the embodiment of the present utility model

[0033] Figure 13 The structure schematic view of cutting the laminated body mother plate into laminated body blocks provided by the embodiment of the present utility model

[0034] Figure 14 The structure schematic view of the protective sheet mother plate provided by the embodiment of the present utility model

[0035] Figure 15 The schematic view of joining the protective sheet and the laminated body block provided by the embodiment of the present utility model

[0036] Figure 16 The structure schematic view of the protective sheet and the laminated body block provided by the embodiment of the present utility model after joining

[0037] Figure 17 The structure schematic view of cutting the laminated body block covered with the protective sheet into green ceramic sheets provided by the embodiment of the present utility model

[0038] Figure 18 The structure schematic view of the green ceramic sheet provided by the embodiment of the present utility model.

[0039] In the drawing:

[0040] 1', ceramic body; 2', through terminal; 3', ground terminal; a, lead-out part;

[0041] X, first direction; Y, second direction; Z, third direction;

[0042] 1, ceramic body; 11, first end face; 12, second end face; 13, first side face; 14, second side face; 15, third side face; 16, fourth side face; 17, through inner electrode; 18, ground inner electrode;

[0043] 2, through terminal group; 21, first through terminal; 22, second through terminal;

[0044] 3, ground terminal group; 31, first ground terminal; 32, second ground terminal;

[0045] 4, laminated block; 5, protective sheet mother plate; 51, through hole; 52, protective sheet;

[0046] 10, first groove; 20, second groove; 30, ground terminal avoiding groove. DETAILED DESCRIPTION

[0047] The specific embodiments of the present application will be further described in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present application, but not to limit the scope of the present application.

[0048] In the description of the present application, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0049] In the present application, unless otherwise explicitly specified and limited, the "upper" or "lower" of the first feature to the second feature can include the direct contact of the first and second features, or it can include the contact of the first and second features through another feature between them. Moreover, the "upper", "upper" and "upper" of the first feature to the second feature include the vertical and oblique above of the first feature to the second feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The "below", "below" and "below" of the first feature to the second feature include the vertical and oblique below of the first feature to the second feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0050] In the description of the present application, the terms "upper", "lower", "right", and other orientation or position relationship are based on the orientation or position relationship shown in the drawings, only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used to distinguish in the description, and have no special meaning.

[0051] Reference Figures 6-10As shown, the embodiment provides a multilayer ceramic capacitor, having a first direction X, a second direction Y and a third direction Z perpendicular to each other, the multilayer ceramic capacitor comprising a ceramic body 1, a through terminal group 2 and a ground terminal group 3. The ceramic body 1 has a first end face 11 and a second end face 12 oppositely arranged along the first direction X, a first side face 13 and a second side face 14 oppositely arranged along the second direction Y. The through terminal group 2 comprises a first through terminal 21 and a second through terminal 22 oppositely arranged at both ends of the ceramic body 1 along the first direction X. The first side face 13 is provided with a first recess 10 at the middle part along the first direction X, and the second side face 14 is provided with a second recess 20 at the middle part along the first direction X, both the first recess 10 and the second recess 20 extending along the third direction Z; the ground terminal group 3 comprises a first ground terminal 31 and a second ground terminal 32, the first ground terminal 31 being arranged in the first recess 10, and the second ground terminal 32 being arranged in the second recess 20. A plurality of through internal electrodes 17 and a plurality of ground internal electrodes 18 are arranged in the ceramic body 1, the through internal electrodes 17 and the ground internal electrodes 18 being alternately arranged along the third direction Z, the through internal electrodes 17 extending to the first end face 11 at one end along the first direction X and connecting with the first through terminal 21, and extending to the second end face 12 at the other end and connecting with the second through terminal 22, the ground internal electrodes 18 extending to the bottom of the first recess 10 at one end along the second direction Y and connecting with the first ground terminal 31, and extending to the bottom of the second recess 20 at the other end and connecting with the second ground terminal 32.

[0052] The multilayer ceramic capacitor provided by the embodiment is characterized in that: the through inner electrode 17 is connected with the first through terminal 21 and the second through terminal 22, and the ground inner electrode 18 is connected with the first ground terminal 31 and the second ground terminal 32. The first through terminal 21 and the second through terminal 22 are capable of conducting current, and can be used for transmitting useful signals. The first ground terminal 31 and the second ground terminal 32 are grounded when the multilayer ceramic capacitor is welded to a circuit board, and can bypass high-frequency noise in the useful signals transmitted between the first through terminal 21 and the second through terminal 22 to the ground. In the multilayer ceramic capacitor, the first recess 10 and the second recess 20 are arranged on the ceramic body 1, the ground inner electrode 18 is exposed on the bottom of the first recess 10 and the bottom of the second recess 20, the first ground terminal 31 is arranged in the first recess 10, and the second ground terminal 32 is arranged in the second recess 20. In this way, the ground inner electrode 18 is connected with the first ground terminal 31 and the second ground terminal 32 for conduction, and the narrow lead-out part arranged on the ground inner electrode 18 is not needed, and the problem of lead-out part deviation is avoided, thereby improving the reliability of the multilayer ceramic capacitor.

[0053] In the embodiment, the materials of the through inner electrode 17 and the ground inner electrode 18 are both nickel. The ground inner electrode 18 is in the shape of a rectangular sheet, and the through inner electrode 17 is approximately in the shape of a rectangular sheet.

[0054] Optionally, referring to FIG. 1, Figures 6-10 As shown in FIG. 1, the two ends of the through inner electrode 17 along the second direction Y are both located inside the ceramic body 1, and the two ends of the ground inner electrode 18 along the first direction X are both located inside the ceramic body 1. That is to say, the ground inner electrode 18 is not exposed on other surfaces of the ceramic body 1 except for the bottom of the first recess 10 and the bottom of the second recess 20, and the through inner electrode 17 is not exposed on other surfaces of the ceramic body 1 except for the first end face 11 and the second end face 12. The through terminal group 2 covers the exposed ends of the through inner electrode 17 on the first end face 11 and the second end face 12, and the ground terminal group 3 covers the exposed ends of the ground inner electrode 18 on the bottom of the first recess 10 and the bottom of the second recess 20, that is, the through terminal group 2 and the ground terminal group 3 can prevent moisture from penetrating into the exposed ends of the through inner electrode 17 and the ground inner electrode 18 on the surfaces of the ceramic body 1, thereby improving the reliability of the multilayer ceramic capacitor.

[0055] Optionally, referring to FIG. 1, Figure 9As shown, both ends of the through inner electrode 17 along the second direction Y are provided with a ground terminal avoiding groove 30, so that the through inner electrode 17 is spaced apart from the first ground terminal 31 and the second ground terminal 32, avoiding the through inner electrode 17 contacting the first ground terminal 31 and the second ground terminal 32 to cause short circuit.

[0056] Optionally, referring to Figures 6-10 As shown, the ceramic body 1 further has a third side face 15 and a fourth side face 16 oppositely arranged along a third direction Z, the first through terminal 21 covers the first end face 11 and extends to the first side face 13, the second side face 14, the third side face 15 and the fourth side face 16, and the second through terminal 22 covers the second end face 12 and extends to the first side face 13, the second side face 14, the third side face 15 and the fourth side face 16. The first through terminal 21 and the second through terminal 22 are spaced apart.

[0057] Optionally, referring to Figures 6-10 As shown, the first ground terminal 31 and the first through terminal 21, the first ground terminal 31 and the second through terminal 22, the second ground terminal 32 and the first through terminal 21, and the second ground terminal 32 and the second through terminal 22 are spaced apart, so as to realize insulation between the first ground terminal 31 and the first through terminal 21, the first ground terminal 31 and the second through terminal 22, the second ground terminal 32 and the first through terminal 21, and the second ground terminal 32 and the second through terminal 22.

[0058] Optionally, the first groove 10 and the second groove 20 respectively extend to the third side face 15 and the fourth side face 16 along the third direction Z, so that when the copper metal paste is applied at the positions of the first groove 10 and the second groove 20, the air in the first groove 10 and the second groove 20 can be discharged through the ends of the third side face 15 and the fourth side face 16 of the first groove 10 and the second groove 20, preventing bubbles from being formed in the first ground terminal 31 and the second ground terminal 32, thereby improving the reliability of the multilayer ceramic capacitor.

[0059] Optionally, the thickness of the through inner electrode 17 is 0.5 μm-1 μm, and the thickness of the ground inner electrode 18 is 0.5 μm-1 μm. When the thickness is too small, the continuity of the through inner electrode 17 and the ground inner electrode 18 is poor, which is not conducive to improving the capacitance; when the thickness is too large, it is not conducive to reducing the thickness of the multilayer ceramic capacitor.

[0060] Optionally, the distance between the ground inner electrode 18 and the first end surface 11 is 50-200 μm, and the distance between the ground inner electrode 18 and the second end surface 12 is 50-200 μm. If the distance is too small, moisture can easily enter the inside of the ceramic body 11, causing the reliability of the multilayer ceramic capacitor to decrease; if the distance is too large, it is not conducive to increasing the capacitance of the multilayer ceramic capacitor.

[0061] Optionally, referring to FIG. 1, Figure 7 As shown in FIG. 1, the length of the ceramic body 1 along the first direction X is L, and the width of the groove is W, and W / L is 0.1-0.2. If W / L is too small, the portion of the ground inner electrode 18 exposed to the bottom of the first groove 10 and the second groove 20 is too small, and the contact resistance between the ground inner electrode 18 and the first ground terminal 31 and between the ground inner electrode 18 and the second ground terminal 32 increases; if W / L is too large, the area of the ground terminal avoiding groove 30 needs to be increased accordingly to prevent short circuit between the through inner electrode 17 and the first ground terminal 31 and between the through inner electrode 17 and the second ground terminal 32, thereby significantly reducing the area of the through inner electrode 17, which is not conducive to increasing the capacitance.

[0062] Optionally, the first through terminal 21, the second through terminal 22, the first ground terminal 31, and the second ground terminal 32 each include a copper layer, a nickel layer, and a tin layer. The copper layer is attached to the ceramic body 1, the nickel layer is disposed on the side of the copper layer away from the ceramic body 1, and the tin layer is disposed on the side of the nickel layer away from the copper layer.

[0063] Optionally, the number of the through inner electrode 17 and the ground inner electrode 18 is 100-500, so as to increase the capacitance of the multilayer ceramic capacitor.

[0064] The embodiment also provides a multilayer ceramic capacitor preparation method, which is used for preparing the multilayer ceramic capacitor described above, and includes the following steps:

[0065] In step S1, a ceramic film is prepared. Specifically, ceramic powder, a binder, and an organic solvent are mixed to form ceramic slurry, and the ceramic slurry is cast into a ceramic film. The material of the ceramic powder can be barium titanate, calcium zirconate, etc. The thickness of the ceramic film can be, for example, 1-5 μm.

[0066] In step S2, a laminated body block 4 is prepared, and a protective sheet 52 is prepared.

[0067] The preparation of the laminated body block 4 includes:

[0068] In step M1, a nickel metal slurry is applied to the ceramic film according to the printing pattern of the through inner electrode film and is dried to form a through inner electrode film. Figure 11The printing pattern of the through inner electrode thin film is printed on the ceramic thin film, and the printing pattern of the grounding inner electrode thin film is printed on the ceramic thin film. Figure 12 The printing pattern of the through inner electrode thin film is printed on the ceramic thin film, and the printing pattern of the grounding inner electrode thin film is printed on the ceramic thin film.

[0069] In step M2, the ceramic thin film with the through inner electrode thin film and the ceramic thin film with the grounding inner electrode thin film are alternately stacked, and the stacked ceramic thin films are covered on the upper and lower sides of the stacked structure to obtain a laminated body mother plate.

[0070] In step M3, referring to Figure 13 The laminated body mother plate is compressed along the third direction Z, and then the laminated body mother plate is sequentially cut along the Y direction into a plurality of elongated laminated body blocks 4. The cutting surface formed in step M3 is a first cutting surface, and the first cutting surface corresponds to the first side surface 13 and the second side surface 14 of the ceramic body 1. The through inner electrode 17 and the grounding inner electrode 18 are exposed on the first cutting surface. Since the through inner electrode 17 is provided with the grounding terminal avoiding groove 30, the through inner electrode 17 does not expose at the position corresponding to the grounding terminal avoiding groove 30 on the first cutting surface.

[0071] The preparation of the protection sheet 52 includes: laminating and compressing a plurality of ceramic thin films obtained in step S1 to obtain a protection sheet mother plate 5, and punching and cutting the protection sheet mother plate 5 to form the protection sheet 52. Referring to Figure 14 , a plurality of rectangular through holes 51 are punched on the protection sheet mother plate 5 along the first direction X at a fixed step distance, and then the protection sheet mother plate 5 is cut but not cut off at the position between the through holes 51, i.e. Figure 14 The two cutting lines L2 and the part surrounded by every two adjacent through holes 51 are the protection sheet 52. The protection sheet 52 is rectangular, and the thickness of the protection sheet 52 along the third direction Z is equal to the thickness of the laminated body block 4 along the third direction Z. The punching step distance corresponds to the length of the ceramic body 1. The distribution position of the through hole 51 on the protection sheet mother plate 5 along the first direction X corresponds to the distribution position of the grounding terminal avoiding groove 30 on the laminated body block 4 along the first direction X one by one. The length of the through hole 51 along the first direction X is less than the length of the grounding terminal avoiding groove 30 along the first direction X. In this embodiment, by controlling the cutting depth, the cutting position is in the broken state, and the protection sheet 52 is still connected to the protection sheet mother plate 5, so as to facilitate the overall operation of the plurality of protection sheets 52.

[0072] In step S3, the protection sheet 52 is bonded with the laminated body block 4. Specifically, referring to Figure 15One side of the protective sheet mother plate 5 is aligned with the first cut surface of the laminated block 4, aligning each through hole 51 with each grounding terminal clearance groove 30, and aligning the two cutting lines L2 with the two sides of the laminated block 4 in the third direction Z. In this configuration, the protective sheet 52 is joined to the laminated block 4. The protective sheet 52 and the laminated block 4 can be joined by pressing them together under heating conditions. Since the connection between the protective sheet 52 and the protective sheet mother plate 5 is in a state of near breakage after the cutting process in step S2, the protective sheet 52 can be easily detached from the protective sheet mother plate 5 and attached to the laminated block 4 during pressing. The remaining portion of the protective sheet mother plate 5, excluding the protective sheet 52, is recycled as scrap. (See reference...) Figure 16 After the protective sheet 52 is joined to the laminated block 4, the protective sheet 52 covers the through inner electrode 17 and the grounding inner electrode 18 exposed on the first cut surface. This is especially true because each through hole 51 is aligned with each grounding terminal clearance groove 30, and the length of the through hole 51 along the first direction X is less than the length of the grounding terminal clearance groove 30 along the first direction X. Therefore, the protective sheet 52 completely covers the through inner electrode 17 exposed on the first cut surface, and the through hole 51 between every two adjacent protective sheets 52 along the first direction X becomes the first groove 10 and the second groove 20. The thickness of the protective sheet 52 along the second direction Y is 50μm to 200μm. If this thickness is too small, the moisture-proof effect of the protective sheet deteriorates, easily reducing the reliability of the multilayer ceramic capacitor; if the thickness is too large, it is not conducive to improving the capacitance of the multilayer ceramic capacitor.

[0073] Step S4, as follows Figure 17 As shown, the four laminated blocks covered with protective sheet 52 are sequentially cut into multiple green ceramic sheets along the X direction. (See reference...) Figure 18 The green ceramic sheet is roughly rectangular in shape, with a first groove 10 and a second groove 20 on its two opposing surfaces along the second direction Y. The cut surface formed in step S4 is the second cut surface. The through inner electrode 17 is exposed on the second cut surface.

[0074] Step S5, the green ceramic sheet is degreased and sintered to obtain the ceramic body 1. Specifically, first, the degreasing is performed, which is to heat the green ceramic sheet to 250-350 DEG C and keep for 0.5-3 hours in air to remove the binder contained in the green ceramic sheet, or heat the green ceramic sheet to 350-600 DEG C and keep for 2-6 hours in nitrogen to remove the binder contained in the green ceramic sheet. Then the sintering is performed, which is to heat the green ceramic sheet to 1100-1300 DEG C and keep for 0.5-3 hours in a reducing atmosphere formed by the mixed gas of humidified nitrogen and hydrogen (the volume of hydrogen is 0.1-3% of the volume of nitrogen) to sinter the green ceramic sheet into a uniform and dense whole to obtain the ceramic body 1. Since the green ceramic sheet has the first groove 10 and the second groove 20 on both sides, the first groove 10 and the second groove 20 provide more channels for the removal of the binder when the green ceramic sheet is degreased, and the efficiency of the degreasing can be improved.

[0075] Step S6, the through terminal group 2 and the ground terminal group 3 are prepared on the ceramic body 1 to obtain the multilayer ceramic capacitor. Step S61, copper metal paste is applied on the positions of the first groove 10 and the second groove 20 of the ceramic body 1 corresponding to the two ends where the second cut surface is located, and the copper metal paste is sintered to form the copper layer of the first through terminal 21, the copper layer of the second through terminal 22, the copper layer of the first ground terminal 31 and the copper layer of the second ground terminal 32, respectively. Step S62, the nickel layer of the first through terminal 21 and the tin layer of the first through terminal 21 are formed on the copper layer of the first through terminal 21 in sequence by electroplating, the nickel layer of the second through terminal 22 and the tin layer of the second through terminal 22 are formed on the copper layer of the second through terminal 22 in sequence, the nickel layer of the first ground terminal 31 and the tin layer of the first ground terminal 31 are formed on the copper layer of the first ground terminal 31 in sequence, and the nickel layer of the second ground terminal 32 and the tin layer of the second ground terminal 32 are formed on the copper layer of the second ground terminal 32 in sequence to obtain the multilayer ceramic capacitor.

[0076] The above only describes the preferred embodiments of the present application, and it should be noted that those skilled in the art can make some improvements and replacements without departing from the technical principles of the present application, and these improvements and replacements should also be considered as the protection scope of the present application.

Claims

1. A multilayer ceramic capacitor having a first direction (X), a second direction (Y), and a third direction (Z) that are perpendicular to each other, characterized in that, It includes a ceramic body (1), a through terminal group (2), and a grounding terminal group (3); The ceramic body (1) has a first end face (11) and a second end face (12) disposed opposite to each other along a first direction (X), and a first side face (13) and a second side face (14) disposed opposite to each other along a second direction (Y); The through terminal group (2) includes a first through terminal (21) and a second through terminal (22), the first through terminal (21) and the second through terminal (22) are disposed opposite to each other at both ends of the ceramic body (1) along the first direction (X); the first side surface (13) is provided with a first groove (10) at the middle part along the first direction (X), and the second side surface (14) is provided with a second groove (20) at the middle part along the first direction (X), the first groove (10) and the second groove (20) both extend along the third direction (Z); the ground terminal group (3) includes a first ground terminal (31) and a second ground terminal (32), the first ground terminal (31) is disposed in the first groove (10), and the second ground terminal (32) is disposed in the second groove (20); The ceramic body (1) is provided with a plurality of through internal electrodes (17) and a plurality of ground internal electrodes (18). The through internal electrodes (17) and the ground internal electrodes (18) are alternately arranged along the third direction (Z). One end of the through internal electrode (17) along the first direction (X) extends to the first end face (11) and is connected to the first through terminal (21). The second end extends to the second end face (12) and is connected to the second through terminal (22). One end of the ground internal electrode (18) along the second direction (Y) extends to the bottom of the first groove (10) and is connected to the first ground terminal (31). The second end extends to the bottom of the second groove (20) and is connected to the second ground terminal (32).

2. The multilayer ceramic capacitor according to claim 1, characterized in that, Both ends of the through inner electrode (17) along the second direction (Y) are located inside the ceramic body (1), and both ends of the ground inner electrode (18) along the first direction (X) are located inside the ceramic body (1).

3. The multilayer ceramic capacitor according to claim 2, characterized in that, The through inner electrode (17) is provided with grounding terminal clearance grooves (30) at both ends along the second direction (Y), so that the through inner electrode (17) and the first grounding terminal (31) and the through inner electrode (17) and the second grounding terminal (32) are spaced apart.

4. The multilayer ceramic capacitor according to claim 1, characterized in that, The ceramic body (1) also has a third side surface (15) and a fourth side surface (16) disposed opposite to each other along the third direction (Z), the first through terminal (21) covers the first end face (11) and extends to the first side surface (13), the second side surface (14), the third side surface (15) and the fourth side surface (16), the second through terminal (22) covers the second end face (12) and extends to the first side surface (13), the second side surface (14), the third side surface (15) and the fourth side surface (16), and the first through terminal (21) and the second through terminal (22) are spaced apart.

5. The multilayer ceramic capacitor according to claim 4, characterized in that, The first grounding terminal (31) is spaced apart from the first through terminal (21), from the first grounding terminal (31) to the second through terminal (22), from the second grounding terminal (32) to the first through terminal (21), and from the second grounding terminal (32) to the second through terminal (22).

6. The multilayer ceramic capacitor according to any one of claims 1-5, characterized in that, The thickness of the through inner electrode (17) is 0.5 μm to 1 μm, and the thickness of the ground inner electrode (18) is 0.5 μm to 1 μm.

7. The multilayer ceramic capacitor according to any one of claims 1-5, characterized in that, The distance between the grounding inner electrode (18) and the first end face (11) is 50μm to 200μm, and the distance between the grounding inner electrode (18) and the second end face (12) is 50μm to 200μm.

8. The multilayer ceramic capacitor according to any one of claims 1-5, characterized in that, The ceramic body (1) has a length of L along the first direction (X), and the groove has a width of W, with W / L being 0.1 to 0.

2.

9. The multilayer ceramic capacitor according to any one of claims 1-5, characterized in that, The first through terminal (21), the second through terminal (22), the first ground terminal (31) and the second ground terminal (32) all include a copper layer, a nickel layer and a tin layer.

10. The multilayer ceramic capacitor according to any one of claims 1-5, characterized in that, The number of the through inner electrode (17) and the ground inner electrode (18) is 100 to 500.

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