Through type lower image wafer cutting device

Abstract

The utility model relates to a penetrating type lower image wafer cutting device which comprises a platform base, a left side stand column and a right side stand column are installed on the left side and the right side of the platform base respectively, a cross beam is installed on the top between the left side stand column and the right side stand column, and a wafer cutting carrying table is installed on the platform base below the cross beam. The utility model provides the lower image mechanism capable of obtaining the outline of the lower surface of the wafer, and meanwhile, the light source and the dodging plate are arranged on the frame table, so that light can be supplemented to the image on the frame table.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing related technical field especially, it relates to a kind of through lower image wafer cutting device. BACKGROUND

[0002] One of wafer processing procedures is to cut its boundary, in the processing, wafer needs to be placed according to the following requirements, that is, the upper surface of wafer is polymer surface, lower surface is glass surface, the glass surface of lower surface cannot be seen on the polymer surface of upper surface, before cutting wafer, the profile data of cutting wafer needs to be obtained. Since the center of polymer packaging surface and the center of glass surface are different in the packaging process of wafer, in order to ensure that the next process has good stripping effect, the center of polymer packaging surface and the center of wafer glass surface need to be accurately found, therefore, the center of wafer glass surface needs to be obtained, according to the center of glass surface and the center of polymer surface, a difference between the two can be given, which can compensate for the interpolation in cutting process, so as to ensure the accuracy of cutting and facilitate the separation of next process. Therefore, a mechanism is needed to obtain the profile of the lower surface of wafer, and at the same time, a lifting mechanism is needed to provide wafer transfer in the process of placing wafer on wafer cutting platform.

[0003] In view of the above defects, the present design person actively researches and innovates to create a through lower image wafer cutting device, so that it has more industrial use value. CONTENT OF THE UTILITY MODEL

[0004] To solve any one of the above technical problems, the purpose of the utility model is to provide a through lower image wafer cutting device.

[0005] To achieve the above purpose, the utility model adopts the following technical solutions:

[0006] The through lower image wafer cutting device comprises a platform base, left and right side columns are respectively installed on the left and right sides of the platform base, a cross beam is installed on the top between the left and right side columns, a wafer cutting platform is installed on the platform base below the cross beam;

[0007] A Y-direction motion platform is installed on the platform base, the Y-direction motion platform drives the X-direction motion platform above to move in front and back direction, the X-direction motion platform drives the wafer cutting platform above to move in left and right direction, a through lower image is installed between the left and right side columns, and the through lower image penetrates the inner side of wafer cutting platform along left and right direction;

[0008] The wafer cutting platform comprises a platform frame, which is a hollow rectangular frame structure, a base is mounted on the top outer side of the platform frame, an outer platform and a transfer platform are sequentially mounted on the base from the outside to the inside, a lead screw motor is mounted on the base directly below the transfer platform, and the driving end of the top of the lead screw motor drives the transfer platform above to move in the vertical direction.

[0009] As a further improvement of the utility model, a plurality of outer suction cups are uniformly distributed on the outer platform, and a plurality of inner suction cups are uniformly distributed on the transfer platform.

[0010] As a further improvement of the utility model, a dust collection disc is arranged on the outer side of the outer platform, and a cylinder is mounted on the base through a cylinder support block to drive the dust collection disc above to move in the vertical direction.

[0011] As a further improvement of the utility model, a light source is mounted on the inner bottom of the platform frame, and a light homogenizing plate is mounted on the platform frame directly above the light source.

[0012] As a further improvement of the utility model, a protective plate is mounted on the outer platform.

[0013] As a further improvement of the utility model, the lead screw motor is mounted on the base through a motor fixing plate, and the lead screw motor drives the top lead screw and the sliding block to be connected with the transfer platform above.

[0014] As a further improvement of the utility model, the through-type lower image mechanism comprises an image support rod, the left side of the image support rod is mounted on the left side column through a left side support plate, the right side of the image support rod is mounted on the right side column through a right side support plate, a camera lens assembly, a light source and an adjusting frame are sequentially mounted on the image support rod from left to right, the camera lens assembly is coaxial with the right side light source, and the adjusting frame is obliquely mounted on the image support rod through an adjusting frame support block.

[0015] As a further improvement of the utility model, the camera lens assembly is mounted on the image support rod through a plurality of pressing blocks.

[0016] By the above scheme, the utility model has at least the following advantages:

[0017] The utility model provides a lower image mechanism capable of acquiring the profile of the lower surface of a wafer, and a light source and a light homogenizing plate are arranged on the frame table to supplement light for the image above.

[0018] The utility model provides a lifting mechanism for supplying wafer transfer, and each mechanism is matched together to complete the transfer after wafer polymer surface cutting processing, thereby ensuring normal production of the next process.

[0019] The above description is only a summary of the technical scheme of the present application, in order to more clearly understand the technical means of the present application, and can be implemented according to the content of the specification, the following will be described in detail with the preferred embodiment of the present application and the accompanying drawings as follows. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments, it should be understood that the following drawings only show some embodiments of the present application, therefore should not be regarded as a limitation on the scope, for those skilled in the art, without creative labor, other related drawings can also be obtained according to these drawings.

[0021] Figure 1 is a structure diagram of a through type lower image wafer cutting device of the present application;

[0022] Figure 2 is Figure 1 a structure diagram of a wafer cutting platform in the present application;

[0023] Figure 3 is Figure 2 a structure diagram of the internal structure of the present application;

[0024] Figure 4 is Figure 1 a structure diagram of a through type lower image in the present application.

[0025] In the drawings, the meanings of various reference signs are as follows.

[0026] Left side column 1, cross beam 2, wafer cutting platform 3, through type lower image 4, right side column 5, X direction movement platform 6, Y direction movement platform 7, platform base 8;

[0027] Platform frame 301, outer side suction cup 302, transfer platform 303, inner side suction cup 304, outer side platform 305, dust collection disc 306, air cylinder 307, base 308, air cylinder support block 309, light source 310, homogenizing plate 311, protection plate 312, sliding block 313, screw motor 314, motor fixed plate 315;

[0028] Left side support plate 401, image support rod 402, camera lens assembly 403, pressing block 404, light source 405, adjusting frame 406, adjusting frame support block 407, right side support plate 408. DETAILED DESCRIPTION

[0029] The specific implementation of the present application will be further described in detail in combination with the drawings and examples. The following examples are used to illustrate the present application, but not to limit the scope of the present application.

[0030] In order to make the person skilled in the art better understand the technical scheme of the present application, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0031] As shown in the drawings, Figures 1-4 A through-type lower image wafer cutting device comprises a platform base 8, a left side column 1 and a right side column 5 are respectively installed on the left and right sides of the platform base 8, a cross beam 2 is installed on the top between the left side column 1 and the right side column 5, and a wafer cutting platform 3 is installed on the platform base 8 below the cross beam 2.

[0032] A Y-direction motion platform 7 is installed on the platform base 8, the Y-direction motion platform 7 drives an X-direction motion platform 6 above to move in the front-rear direction, the X-direction motion platform 6 drives the wafer cutting platform 3 above to move in the left-right direction, and a through-type lower image 4 is installed between the left side column 1 and the right side column 5, the through-type lower image 4 penetrates the inner side of the wafer cutting platform 3 along the left-right direction.

[0033] The wafer cutting platform 3 comprises a platform frame 301 which is a hollow rectangular frame structure, a base 308 is installed on the top outer side of the platform frame 301, an outer side platform 305 and a transfer platform 303 are sequentially installed on the base 308 from the outside to the inside, a lead screw motor 314 is installed on the base 308 directly below the transfer platform 303, and the driving end of the top of the lead screw motor 314 drives the transfer platform 303 above to move in the vertical direction. The lead screw motor 314 is installed on the base 308 through a motor fixing plate 315, and the lead screw motor 314 drives the top lead screw and the sliding block 313 to be connected with the transfer platform 303 above.

[0034] A plurality of outer side suction cups 302 are uniformly distributed on the outer side platform 305, and a plurality of inner side suction cups 304 are uniformly distributed on the transfer platform 303.

[0035] A dust collecting disc 306 is arranged on the outer side of the outer side platform 305, a cylinder 307 is installed on the base 308 through a cylinder support block 309, and the cylinder 307 drives the dust collecting disc 306 above to move in the vertical direction. A protective plate 312 is installed on the outer side platform 305.

[0036] The through lower image 4 comprises an image support rod 402, the left side of the image support rod 402 is installed on the left side stand column 1 through a left side support plate 401, the right side of the image support rod 402 is installed on the right side stand column 5 through a right side support plate 408, a camera lens assembly 403, a light source 405 and an adjusting frame 406 are sequentially installed on the image support rod 402 from left to right, the camera lens assembly 403 is coaxial with the right side light source 405, and the adjusting frame 406 is installed on the image support rod 402 by an adjusting frame support block 407. The camera lens assembly 403 is installed on the image support rod 402 by a plurality of pressing blocks 404.

[0037] A light source 310 is installed on the inner side bottom of the platform frame 301, and a light homogenizing plate 311 is installed on the platform frame 301 directly above the light source 310.

[0038] The working process of the utility model is briefly described as follows:

[0039] The X-direction motion platform 6 and the Y-direction motion platform 7 drive the wafer cutting platform 3 to move in a circular arc interpolation motion through interpolation circular arc motion, the camera lens assembly 403 on the through lower image 4 obtains the profile data of the bottom wafer glass, and the profile data of the polymer on the upper wafer is compared and analyzed, so that the difference data is fitted to cut the wafer, when the profile data is obtained by using the through lower image 4, the dust collecting disc 306 installed above the cylinder 307 is opened, during processing, the dust collecting disc 306 installed above the cylinder 307 is closed, and the particles obtained after processing are sucked away after processing, so that the cleanliness of the processed wafer is ensured, after processing, the lead screw motor 314 drives the transfer platform 303 to rise, the mechanical hand takes away the wafer, and the cutting and transfer of the wafer are completed.

[0040] The utility model provides a kind of through lower image wafer cutting device, which comprises a mechanism capable of obtaining the profile of the lower surface of the wafer, and also comprises a lifting mechanism capable of supplying the wafer transfer, each mechanism cooperates to complete the cutting and processing of the wafer polymer surface and the wafer transfer, ensuring the normal production of the next process.

[0041] In this document, the X-axis direction is the left-right direction in Figure 1 , the Y-axis direction is the front-rear direction in Figure 1 , and the Z-axis direction is the vertical direction in Figure 1 .

[0042] The utility model can obtain the profile of the lower surface of the wafer through the lower image mechanism, and also has a light source and a light homogenizing plate on the frame platform to supplement the light of the image above. The lifting mechanism supplies the wafer transfer, and each mechanism cooperates to complete the transfer after cutting and processing of the wafer polymer surface, ensuring the normal production of the next process.

[0043] In the description of the utility model, need understanding is, the orientation or position relation that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "internal", "external" and the like indicate is based on the orientation or position relation shown in the drawing, only for the convenience of describing the utility model and simplifying the description, and is not indicating or implying that the device or element indicated must have a particular orientation, is constructed and operated with a particular orientation, therefore can not be understood as limiting the utility model. In addition, the terms "first", "second" and the like are only for the purpose of description, and can not be understood as indicating or implying relative importance or implying the number of the technical features indicated. Therefore, the features limited by "first", "second" and the like can be explicitly or implicitly include one or more features. In the description of the utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0044] In the description of the utility model, it should be explained that, unless otherwise expressly provided and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, can be fixedly connected, can be detachably connected, or integrally connected, can be mechanically connected, can be electrically connected, can be directly connected, can be indirectly connected through intermediate medium, can be the communication inside two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood through specific circumstances.

[0045] The above is only the preferred embodiment of the utility model, and is not used to limit the utility model, it should be pointed out that, for ordinary skilled in the art, on the premise of not departing from the technical principles of the utility model, can also make several improvements and variations, these improvements and variations also should be regarded as the protection scope of the utility model.

Claims

1. A through-type lower imaging wafer dicing apparatus, comprising a platform base (8), a left column (1) and a right column (5) respectively installed on the left and right sides of the platform base (8), a crossbeam (2) installed at the top between the left column (1) and the right column (5), and a wafer dicing stage (3) installed on the platform base (8) below the crossbeam (2); characterized in that: A Y-axis motion platform (7) is installed on the platform base (8). The Y-axis motion platform (7) drives the X-axis motion platform (6) above to move in the front-back direction. The X-axis motion platform (6) drives the wafer dicing stage (3) above to move in the left-right direction. A through-type lower image (4) is installed between the left column (1) and the right column (5). The through-type lower image (4) passes through the inner side of the wafer dicing stage (3) in the left-right direction. The wafer dicing stage (3) includes a stage frame (301), which is a hollow rectangular frame structure. A base (308) is installed on the top outer side of the stage frame (301). An outer stage (305) and a middle transfer stage (303) are installed on the base (308) from the outside to the inside. A lead screw motor (314) is installed on the base (308) directly below the middle transfer stage (303). The drive end at the top of the lead screw motor (314) drives the upper middle transfer stage (303) to move in the vertical direction.

2. The through-type lower imaging wafer dicing apparatus as described in claim 1, characterized in that, Several outer suction cups (302) are evenly distributed on the outer platform (305), and several inner suction cups (304) are evenly distributed on the middle transfer platform (303).

3. The through-type lower imaging wafer dicing apparatus as described in claim 1, characterized in that, A dust collection tray (306) is provided on the outer side of the outer platform (305). The dust collection tray (306) is driven to move vertically by a cylinder (307) mounted on the base (308) via a cylinder support block (309).

4. The through-type lower imaging wafer dicing apparatus as described in claim 1, characterized in that, A light source (310) is installed on the bottom inner side of the stage frame (301), and a light-diffusing plate (311) is installed on the stage frame (301) directly above the light source (310).

5. The through-type lower imaging wafer dicing apparatus as described in claim 1, characterized in that, A protective plate (312) is installed on the outer platform (305).

6. The through-type lower imaging wafer dicing apparatus as described in claim 1, characterized in that, The lead screw motor (314) is mounted on the base (308) via a motor mounting plate (315). The lead screw motor (314) drives the lead screw at the top and the slider (313) to connect with the intermediate transfer platform (303) above.

7. The through-type lower imaging wafer dicing apparatus as described in claim 1, characterized in that, The through-type lower image (4) includes an image support rod (402). The left side of the image support rod (402) is mounted on the left column (1) via a left support plate (401), and the right side of the image support rod (402) is mounted on the right column (5) via a right support plate (408). A camera lens assembly (403), a second light source (405), and an adjustment frame (406) are installed on the image support rod (402) from left to right. The camera lens assembly (403) is coaxial with the second light source (405) on the right side. The adjustment frame (406) is installed obliquely on the image support rod (402) via an adjustment frame support block (407).

8. The through-type lower imaging wafer dicing apparatus as described in claim 7, characterized in that, The camera lens assembly (403) is mounted on the image support rod (402) by a plurality of pressure blocks (404).

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