Pressure cleaning brush

Abstract

The utility model discloses a pressure cleaning brush. The pressure cleaning brush comprises a base, a pressing device, a mounting seat, a connecting rod and a driving device, the mounting seat is mounted on the base in a sliding manner, and the pressing device on the base can drive the mounting seat to do lifting motion; one end of the connecting rod penetrates through the mounting seat and is rotationally connected with the mounting seat, and the other end of the connecting rod is connected with a brush head; a first rotating ring is arranged on the connecting rod in the mounting seat in a sleeving manner; the driving device is installed on the base, and the output end of the driving device drives the first rotating ring to drive the connecting rod and the brush head to rotate together. In this way, the pressing device does not make direct contact with the connecting rod to cause abrasion, and the service life of the connecting rod is prolonged. And the situation that particles are generated due to mutual abrasion between the pressing device and the connecting rod and fall on the surface of the to-be-cleaned wafer is avoided, it is guaranteed that the surface of the to-be-cleaned wafer is cleaned thoroughly, the cleanliness is high, and adverse effects on the subsequent cleaning process are avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to cleaning technical field especially, relate to a pressure cleaning brush. BACKGROUND

[0002] Pressure cleaning brush is a common conventional means in wafer cleaning operation, has obvious effect under the operation environment of assisting to remove glue, removes the big particle of wafer surface, carries out cleaning operation to the wafer surface by spray head, two fluid spray heads, cooperation pressure brush.

[0003] In prior art, the brush head is generally connected with the connecting rod to rotate together, and the connecting rod is also connected with the downward pressing device to drive the connecting rod to move up and down. However, when the connecting rod rotates, the contact surface of the connecting rod and the downward pressing device is worn due to the contact between the connecting rod and the downward pressing device, which not only reduces the durability of the downward pressing structure and the connecting rod and shortens the service life, but also causes the particles generated in the wear process to fall on the wafer surface, resulting in unclean wafer cleaning and affecting the cleanliness of the wafer, which adversely affects the subsequent cleaning process. SUMMARY

[0004] Therefore, the utility model provides a pressure cleaning brush, which is used to solve the problem that the downward pressing device of the pressure cleaning brush in the prior art contacts with the connecting rod, causing the connecting rod to wear with the downward pressing device when rotating, shortening the service life, and the particles generated in the wear process falling on the wafer surface, resulting in unclean wafer cleaning.

[0005] The technical scheme of the utility model is a pressure cleaning brush, which comprises a base, a downward pressing device, a mounting seat, a connecting rod, a brush head, a driving device and a first rotating ring.

[0006] The mounting seat is slidably installed on the base, and the downward pressing device can drive the mounting seat to move up and down on the base.

[0007] One end of the connecting rod penetrates through the mounting seat and is rotatably connected with the mounting seat, and the other end of the connecting rod is connected with the brush head.

[0008] A first rotating ring is sleeved on the connecting rod in the mounting seat.

[0009] The driving device is installed on the base, and the output end of the driving device drives the first rotating ring to drive the connecting rod and the brush head to rotate together.

[0010] Further, the connecting rod of the downward pressing device corresponding to the mounting seat is matched with an avoiding groove, and the depth of the avoiding groove is greater than the lifting stroke of the downward pressing device.

[0011] Further, the connecting rod of the mounting base is matched with a limiting ring, and the limiting ring can extend into the avoiding slot and form a gap with the avoiding slot.

[0012] Further, the base is provided with a driving device on the side away from the pressing device.

[0013] The middle part of the mounting base is provided with a rotating space, and a first rotating ring is matched in the rotating space, and a transmission belt is sleeved between the first rotating ring and the output end of the driving device.

[0014] Further, the connecting rod of the mounting base is matched with a limiting ring, and the limiting ring can extend into the avoiding slot and form a gap with the avoiding slot.

[0015] Further, the connecting rod of the mounting base is matched with a limiting ring, and the limiting ring can extend into the avoiding slot and form a gap with the avoiding slot.

[0016] Further, the base is provided with a first fixing column corresponding to the mounting base, and the top of the first fixing column is connected with the pressing device.

[0017] The first fixing column is matched with a sliding rail corresponding to the mounting base, and the mounting base can slide on the sliding rail.

[0018] Further, the base is provided with a second fixing column corresponding to the mounting base, and the top of the second fixing column is provided with a pressure sensor corresponding to the mounting base.

[0019] When the output end of the pressing device drives the mounting base to move up and down, the mounting base can abut against the pressure sensor.

[0020] Further, the top of the second fixing column is further provided with a buffer, and the mounting base is matched with a groove corresponding to the buffer.

[0021] Further, the pressure cleaning brush further comprises a lifting device, the output end of the lifting device is connected with a lifting arm, the lifting arm is connected with the base, and the lifting device can drive the base to move up and down through the lifting arm.

[0022] Compared with the prior art, the utility model has at least the following beneficial effects:

[0023] The utility model discloses a lower pressure device drives the connecting rod to rotate in the mounting seat through the first rotary ring to realize the rotation of brush head and the purpose of cleaning the wafer surface to be cleaned, so that the lower pressure device will not directly contact with the connecting rod to cause abrasion, prolongs the service life of the connecting rod, and the lower pressure device and the connecting rod will not cause the situation that the particles are produced due to mutual abrasion and fall on the wafer surface to be cleaned, guarantees the wafer surface to be cleaned clean, and the cleanliness of the cleaned wafer is high, and will not cause the adverse effect on the subsequent cleaning process. BRIEF DESCRIPTION OF DRAWINGS

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the utility model belongs; the terms used in the specification of the application are only for the purpose of describing the specific embodiments and are not intended to limit the utility model; the terms "include" and "have" and any variation thereof in the specification and claims of the utility model and the above drawing description are intended to cover the non-exclusive inclusion; the terms "first", "second" and the like in the specification and claims of the utility model or the above drawing are used to distinguish different objects and are not used to describe a specific sequence.

[0025] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the drawings needed to be used in the embodiments or prior art description will be briefly introduced as follows; obviously, the drawings in the following description are only some embodiments of the utility model, and those skilled in the art can obtain other drawings according to these drawings without paying creative labor.

[0026] Figure 1 It is the sectional view of the pressure cleaning brush of the utility model;

[0027] Figure 2 It is Figure 1 It is the enlarged schematic view of reference sign A in the drawing;

[0028] Figure 3 It is the internal structure schematic view of the pressure cleaning brush of the utility model;

[0029] Figure 4 It is Figure 3 It is the enlarged schematic view of reference sign B in the drawing;

[0030] Figure 5 It is Figure 3 It is the enlarged schematic view of reference sign C in the drawing.

[0031] Reference signs:

[0032] 10, base; 101, first fixed column; 102, sliding rail; 103, second fixed column; 11, pressing device; 111, avoiding groove; 112, transmission arm; 12, mounting seat; 121, rotating space; 122, groove; 13, connecting rod; 14, brush head; 15, driving device; 16, first rotating ring; 17, transmission belt; 18, limiting ring; 19, first protective cover; 20, bearing; 21, protective sleeve; 22, pressure sensor; 23, buffer; 24, lifting device; 241, lifting arm; 25, second rotating ring; 26, second protective cover; 27, base plate. DETAILED DESCRIPTION

[0033] In order to make the technical problems, technical schemes and beneficial effects of the utility model clearer, the utility model is further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the utility model and are not used to limit the utility model. Therefore, one feature mentioned in the specification is used to explain one feature of one embodiment of the utility model, and it is not implied that each embodiment of the utility model must have the explained feature. In addition, it should be noted that the specification describes many features. Although certain features can be combined together to show possible system designs, these features can also be used in other combinations that are not explicitly described. Therefore, unless otherwise stated, the explained combinations are not intended to be limiting.

[0034] The principle and structure of the utility model are described in detail below in combination with the drawings and examples.

[0035] In order to ensure that the pressing device 11 does not contact the connecting rod 13 when the pressure cleaning brush starts, the pressing device 11 does not wear the connecting rod 13, prolongs the service life of the connecting rod 13, and the pressing device 11 and the connecting rod 13 will not produce particles on the surface of the wafer to be cleaned due to wear, so as to ensure that the surface of the wafer to be cleaned is clean, the cleanliness of the cleaned wafer is high, and the subsequent cleaning process is not adversely affected.

[0036] Therefore, in one embodiment, referring to the accompanying drawings Figures 1-2 In order to solve the above problems, the utility model provides a pressure cleaning brush, which comprises a base 10, a pressing device 11, a mounting seat 12, a connecting rod 13, a brush head 14, a driving device 15 and a first rotating ring 16.

[0037] The mounting seat 12 is slidably installed on the base 10, and the pressing device 11 is installed on the base 10 and can drive the mounting seat 12 to move up and down.

[0038] One end of the connecting rod 13 penetrates the mounting base 12 and is rotationally connected with the mounting base 12, and the other end of the connecting rod 13 is connected with the brush head 14;

[0039] A first rotating ring 16 is sleeved on the connecting rod 13 in the mounting base 12;

[0040] The driving device 15 is installed on the base 10, and an output end of the driving device 15 drives the first rotating ring 16 to drive the connecting rod 13 and the brush head 14 to rotate together.

[0041] In the embodiment, the pressing device 11 is preferably a pressure cylinder, the driving device 15 is preferably a driving motor, and the pressure cleaning brush further comprises a control unit (not shown, the same below) which is electrically connected with the pressing device 11 and the driving device 15.

[0042] In this way, the pressing device 11 drives the connecting rod 13 and the brush head 14 to move up and down through the mounting base 12, so that the pressing device 11 and the connecting rod 13 are arranged separately to achieve the purpose that the pressing device 11 does not directly contact the connecting rod 13, then the driving device 15 drives the connecting rod 13 to rotate in the mounting base 12 through the first rotating ring 16 to achieve the purpose that the brush head 14 rotates to clean the surface of the wafer to be cleaned, so that the pressing device 11 does not directly contact the connecting rod 13 to cause abrasion, prolonging the service life of the connecting rod 13; and the pressing device 11 and the connecting rod 13 will not generate particles due to mutual abrasion and fall on the surface of the wafer to be cleaned, ensuring that the surface of the wafer to be cleaned is clean, the cleanliness of the cleaned wafer is high, and the subsequent cleaning process is not adversely affected.

[0043] It should be noted that the base 10 in the embodiment is composed of a base plate 27 and a first protective cover 19, and the first protective cover 19 can be matched and covered on the base plate 27. The base plate 27 is provided with a through hole (not shown, the same below) corresponding to the connecting rod 13, and when the output end of the pressing device 11 drives the connecting rod 13 to move up and down through the mounting base 12, the connecting rod 13 will move up and down in the through hole. The connecting rod 13 cannot rotate alone, that is, the connecting rod 13 cannot rotate relative to the first rotating ring 16, but can only be driven to rotate together with the first rotating ring 16.

[0044] In order to ensure that the pressing device 11 and the driving device 15 are not disturbed by external factors, with reference to the accompanying drawings, Figures 1-2 The first protective cover 19 is installed on the side away from the pressing device 11, and the output end of the driving device 15 is fixedly connected with a second rotating ring 25;

[0045] A rotation space 121 is provided in the middle of the mounting base 12, a first rotating ring 16 is fitted in the rotation space 121, and a transmission belt 17 is sleeved between the outer edge of the first rotating ring 16 and the outer edge of the second rotating ring 25.

[0046] It should be noted that in this embodiment, the first rotating ring 16 and the second rotating ring 25 are preferably pulley wheels, and the transmission belt 17 is preferably a conveyor belt. And the lifting stroke of the pressing device 11 is preferably 5% of the bandwidth of the transmission belt 17. Because the offset of the transmission belt 17 does not exceed 5% of the bandwidth of the transmission belt 17, the driving device 15 and the transmission belt 17 can still continue to run smoothly.

[0047] In this way, when the connecting rod 13 needs to rotate to drive the brush head 14 to clean the surface of the wafer to be cleaned, the control unit will start the driving device 15, and then the driving device 15 drives the first rotating ring 16 to rotate through the transmission belt 17, and the first rotating ring 16 then drives the connecting rod 13 and the brush head 14 to rotate to clean the wafer to be cleaned.

[0048] Among them, to ensure that the connecting rod 13 rotates more smoothly on the mounting base 12 and prevent wear at the place where the connecting rod 13 is rotationally connected to the mounting base 12, refer to the appendix Figure 2 At the top and bottom of the mounting base 12 corresponding to the connecting rod 13, bearings 20 are provided, and the bearings 20 are in interference connection with the connecting rod 13.

[0049] It should be noted that the shape of the mounting base 12 in this embodiment is a "C"-shaped plate.

[0050] In this way, when the connecting rod 13 rotates, it will rotate within the bearings 20 at the top and bottom of the mounting base 12. And ensuring that the bearings 20 have proper lubrication, are correctly installed, and are cleaned and replaced in a timely manner can reduce the wear condition at the place where the connecting rod 13 is rotationally connected to the mounting base 12, reduce the occurrence of particles generated by mutual wear between the connecting rod 13 and the bearings 20, ensure that the surface of the wafer to be cleaned is cleaned, and the cleanliness of the cleaned wafer is high, without causing adverse effects on subsequent cleaning processes.

[0051] Among them, to further ensure the connecting rod 13 located at the top of the mounting base 12 and extend its service life, refer to the appendix Figure 2 On the outer surface of the connecting rod 13 corresponding to the bearing 20 at the top of the mounting base 12, a protective sleeve 21 is further provided, and the protective sleeve 21 is in interference connection with the bearing 20 at the top of the mounting base 12.

[0052] In this way, when the connecting rod 13 rotates relative to the bearing 20, the connecting rod 13 will drive the protective sleeve 21 to rotate relative to the bearing 20 together.

[0053] In order to ensure that the pressing device 11 does not contact the connecting rod 13, with reference to the accompanying drawings Figure 2 The pressing device 11 is provided with a circular avoiding groove 111 corresponding to the connecting rod 13 extending out of the mounting base 12, and the depth of the avoiding groove 111 is greater than the lifting stroke of the pressing device 11.

[0054] It should be noted that the output end of the pressing device 11 is also provided with a transmission arm 112 connected to the top of the mounting base 12, and the avoiding groove 111 is provided at the top of the connecting rod 13 extending out of the mounting base 12.

[0055] In this way, when the pressing device 11 drives the mounting base 12 to move up and down through the transmission arm 112, the top of the connecting rod 13 will match the avoiding groove 111, but because the depth of the avoiding groove 111 is greater than the lifting stroke of the pressing device 11, and the diameter of the avoiding groove 111 is greater than the diameter of the top of the connecting rod 13, the top of the connecting rod 13 will not contact the avoiding groove 111.

[0056] In order to ensure that the connecting rod 13 does not deviate from the mounting base 12 and can stably rotate on the mounting base 12, with reference to the accompanying drawings Figure 2 The connecting rod 13 extending out of the mounting base 12 is also provided with a limiting ring 18, and the limiting ring 18 can match the avoiding groove 111 and form a gap therebetween.

[0057] It should be noted that the diameter of the connecting rod 13 extending out of the top of the mounting base 12 and the diameter of the limiting ring 18 are both less than the diameter of the avoiding groove 111, so as to ensure that the limiting ring 18 does not contact the avoiding groove 111; and the limiting ring 18 is located above the protective sleeve 21 and contacts the protective sleeve 21, the top of the connecting rod 13 still extends out of the limiting ring 18, and the connecting rod 13 will drive the limiting ring 18 to rotate together.

[0058] In order to ensure that the mounting base 12 can slide more smoothly during the lifting movement, with reference to the accompanying drawings Figures 3-4 The base plate 27 is provided with a first fixed column 101 corresponding to one side of the mounting base 12, and the top of the first fixed column 101 is connected to the pressing device 11.

[0059] The first fixed column 101 is provided with a sliding rail 102 corresponding to the mounting base 12, and the mounting base 12 can slide on the sliding rail 102.

[0060] When the brush head 14 cleans the wafer to be cleaned, the pressure of the brush head 14 relative to the surface of the wafer to be cleaned needs to be determined first, because the pressure is too large, the brush head 14 will damage the wafer to be cleaned, and if the pressure is too small, the wafer to be cleaned will not be cleaned, therefore, the pressure during the lifting of the pressing device 11 needs to be monitored in real time, with reference to the accompanying drawingsFigure 3 and 5 The substrate 27 is provided with a second fixing column 103 corresponding to the other side of the mounting base 12, and the top of the second fixing column 103 is provided with a pressure sensor 22 corresponding to the mounting base 12.

[0061] When the output end of the pressing device 11 drives the mounting base 12 to move up and down, the mounting base 12 can abut against the pressure sensor 22.

[0062] It should be noted that the pressure sensor 22 is also electrically connected with the control unit to upload the pressure detected by itself in real time to the control unit, and the pressures corresponding to different lifting strokes are all different.

[0063] In order to prevent the mounting base 12 from damaging the pressure sensor 22 during lifting, referring to the attached Figure 5 The top of the second fixing column 103 is also provided with a buffer 23, and the mounting base 12 is provided with a groove 122 corresponding to the buffer 23.

[0064] In this way, when the bottom wall of the groove 122 abuts against the buffer 23, the pressure sensor 22 also abuts against the corresponding mounting base 12, so as to reduce the impact force during the descending process of the mounting base 12 and prevent the pressure sensor 22 from being damaged.

[0065] In order to prevent the mounting base 12 from damaging the pressure sensor 22 during lifting, referring to the attached Figure 1 The pressure cleaning brush also comprises a lifting device 24, the output end of the lifting device 24 is connected with a lifting arm 241, the lifting arm 241 is connected with the substrate 27, and the lifting device 24 can drive the base 10 to move up and down through the lifting arm 241.

[0066] It should be noted that the lifting device 24 in the embodiment is preferably a lifting cylinder, and the lifting device 24 is electrically connected with the control unit. The lifting device 24 is arranged on the equipment on which the pressure cleaning brush is arranged.

[0067] The pressing device 11 drives the connecting rod 13 and the brush head 14 to move up and down through the mounting base 12, which is called fine adjustment, that is, the lifting stroke of the pressing device 11 does not exceed 5% of the bandwidth of the transmission belt 17; while the lifting device 24 drives the base 10 to move up and down through the lifting arm 241, and the base 10 drives the connecting rod 13 and the brush head 1 to move up and down, which is called coarse adjustment, that is, the lifting stroke of the lifting device 24 is greater than the lifting stroke of the pressing device 11.

[0068] The lifting device 24 is also provided with a second protective cover 26 to prevent the lifting device 24 from being interfered by the outside world and affecting the normal operation of the lifting device 24.

[0069] The use process of the pressure cleaning brush is as follows:

[0070] Firstly, the control unit starts the lifting device 24 to perform coarse adjustment, so that the lifting device 24 drives the base 10 to perform lifting movement through the lifting arm 241 to reach above the wafer to be cleaned, and the lifting device 24 is closed.

[0071] Then the control unit starts the pressing device 11 to perform fine adjustment, so that the pressing device 11 drives the connecting rod 13 and the brush head 14 to descend together through the mounting seat 12, at this time the mounting seat 12 slides downward along the slide rail 102, the pressure sensor 22 determines the pressure of the brush head 14 relative to the surface of the wafer to be cleaned, so as to prevent the wafer to be cleaned from being damaged by the brush head 14 due to too large pressure, and the wafer to be cleaned is not cleaned due to too small pressure.

[0072] When the control unit determines the appropriate pressure, the control unit closes the pressing device 11 to maintain the current determined pressure, and then starts the driving device 15 to drive the first rotating ring 16 to rotate through the transmission belt 17, and the first rotating ring 16 drives the connecting rod 13 and the brush head 14 to rotate to clean the wafer to be cleaned. After cleaning, the control unit closes the driving device 15, and starts the lifting device 24 again to move the brush head 14 away from the cleaned wafer, and then the cleaned wafer is replaced by the next wafer to be cleaned to form a cycle.

[0073] Obviously, the above-described embodiments are only some embodiments of the present application, but not all the embodiments. The preferred embodiments of the present application are shown in the drawings, but do not limit the patent scope of the present application. The present application can be realized in many different forms, and conversely, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments, or equivalently replace some technical features. Any equivalent structure made by using the content of the present application specification and drawings, directly or indirectly applied to other related technical fields, is also within the patent protection scope of the present application.

Claims

1. A pressure washing brush characterized by, Include: Base (10), down device (11), mounting seat (12), connecting rod (13), brush head (14), drive device (15) and first rotating ring (16); The mounting seat (12) is slidably mounted on the base (10), and the down device (11) can drive the mounting seat (12) to move up and down on the base (10); One end of the connecting rod (13) penetrates through the mounting seat (12) and is rotatably connected with the mounting seat (12), and the other end of the connecting rod (13) is connected with the brush head (14); The first rotating ring (16) is sleeved on the connecting rod (13) in the mounting seat (12); The drive device (15) is installed on the base (10), and the output end of the drive device (15) drives the first rotating ring (16) to drive the connecting rod (13) and the brush head (14) to rotate together.

2. The pressure washing brush of claim 1, wherein, The down device (11) is matched with a avoiding slot (111) corresponding to the connecting rod (13) extending out of the mounting seat (12), and the depth of the avoiding slot (111) is greater than the lifting stroke of the down device (11).

3. The pressure washing brush of claim 2, wherein, The connecting rod (13) extending out of the mounting seat (12) is also matched with a limiting ring (18), and the limiting ring (18) can match into the avoiding slot (111) and form a gap with the avoiding slot (111).

4. The pressure washing brush of claim 1, wherein, The base (10) is installed with a drive device (15) on the side away from the down device (11); The middle part of the mounting seat (12) is provided with a rotating space (121), and the first rotating ring (16) is matched in the rotating space (121), and the transmission belt (17) is sleeved between the first rotating ring (16) and the output end of the drive device (15).

5. The pressure washing brush of claim 1, wherein, The top and bottom of the mounting seat (12) are provided with bearings (20) corresponding to the connecting rod (13), and the bearings (20) are all connected with the connecting rod (13) in interference.

6. The pressure washing brush of claim 5, wherein, The connecting rod (13) corresponding to the bearing (20) at the top of the mounting seat (12) is also matched with a protective sleeve (21), and the protective sleeve (21) is connected with the bearing (20) at the top of the mounting seat (12) in interference.

7. The pressure washing brush of claim 1, wherein, The base (10) is provided with a first fixed column (101) corresponding to one side of the mounting seat (12), and the top of the first fixed column (101) is connected with the down device (11); The first fixed column (101) is matched with a slide rail (102) corresponding to the mounting seat (12), and the mounting seat (12) can slide on the slide rail (102).

8. The pressure washing brush of claim 1, wherein, The base (10) is provided with a second fixed column (103) corresponding to the other side of the mounting seat (12), and the top of the second fixed column (103) is provided with a pressure sensor (22) corresponding to the mounting seat (12); When the output end of the down device (11) drives the mounting seat (12) to move up and down, the mounting seat (12) can abut with the pressure sensor (22).

9. The pressure washing brush of claim 8, wherein, The top of the second fixed column (103) is further provided with a buffer (23), and the mounting seat (12) is correspondingly provided with a groove (122) matched with the buffer (23).

10. The pressure washing brush of claim 1, wherein, The pressure cleaning brush further comprises a lifting device (24), an output end of the lifting device (24) is connected with a lifting arm (241), the lifting arm (241) is connected with the base (10), and the lifting device (24) can drive the base (10) to make lifting movement through the lifting arm (241).

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