Tool for assembling deep silicon detector element

Abstract

The utility model relates to a tool for assembling a deep silicon detector element, which comprises a first die for assembling a detector unit and a second die for assembling a plurality of detector units, the first die comprises a first upper die and a first lower die, the first lower die comprises a first positioning block, and the second die comprises a second positioning block. The first upper die comprises a second positioning block which is matched with the first positioning block for positioning, and a second convex block which is connected with the second positioning block and is smaller than the small silicon wafer in length and / or width. According to the utility model, the non-sticking part is used for positioning, the positioning table of the small silicon wafer is used for fixing and limiting, and the length and width of the first convex block and the second convex block are set, so that glue overflows but does not pollute a tool during combination; the three first positioning rods are inserted into the first positioning blocks, so that the first positioning blocks are matched with the second positioning blocks, meanwhile, the arrangement of the three positioning blocks replaces a track shaft for positioning, and flexible positioning is facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of deep silicon detector, especially to the field of deep silicon detector element assembly technology, specifically refers to a kind of deep silicon detector element assembly's tooling. BACKGROUND

[0002] Deep silicon detector element is pasted and assembled by multiple detector units, and the detector unit includes small silicon wafers, tungsten sheets, large silicon wafers, tungsten sheets and small silicon wafers sequentially bonded, the small silicon wafers include a body and a positioning platform connected to the body, the two small silicon wafers are mirror image arranged about the large silicon wafer, the length and width of the bonding part of the large silicon wafer and the small silicon wafer are adapted to the small silicon wafer, and the other part of the large silicon wafer needs to install an ASIC dummy sheet. When bonding the two detector units, the tungsten sheet is placed on the upper end of the small silicon wafer of the two detector units, and then the tungsten sheet is pasted to the two small silicon wafers on the two detector units. The glue used in the detector element is epoxy glue.

[0003] The traditional tooling surrounds the whole workpiece to perform positioning function, usually a groove with the size of the workpiece is made as a limit, however, epoxy glue is used for photocuring during the assembly of the deep silicon detector unit, and the excess glue will be squeezed out to pollute the tooling during the limit extrusion.

[0004] At the same time, the traditional tooling uses track shaft positioning, which causes inflexible positioning. UTILITY MODEL CONTENTS

[0005] The utility model provides a kind of tooling for deep silicon detector element assembly in view of the deficiency of prior art, when positioning, non-pasting part is positioned, and the positioning platform of small silicon wafer is fixed and limited. The length and width of the first protruding block and the second protruding block are set, and the glue will overflow during combination, but will not pollute the tooling.

[0006] The utility model is realized by the following technical scheme, a kind of tooling for deep silicon detector element assembly, including the first mold of being assembled into detector unit, and the second mold of assembling multiple detector units, the first mold includes first upper die and first lower die, and the first lower die includes first positioning block, and the first positioning block is connected with first protruding block, and the length and / or width of first protruding block is less than small silicon wafer, and the first upper die includes the second positioning block of being positioned with first positioning block cooperation, and the second positioning block is connected with second protruding block, and the length and / or width of second protruding block is less than small silicon wafer.

[0007] The utility model discloses a first mould is used to realize the assembly bonding of large silicon wafer and small silicon wafer to form a detector unit, and a second mould is used to realize the assembly bonding between the detector units to form a detector element.

[0008] When the overflowed glue is always located at the long side, the width of the first protruding block and the second protruding block is less than the width of the small silicon wafer when the first protruding block and the second protruding block are processed, and at this time, the overflowed glue does not contact the tooling, so the tooling is not polluted.

[0009] When the overflowed glue is always located at the width, the length of the first protruding block and the second protruding block is less than the length of the small silicon wafer when the first protruding block and the second protruding block are processed, and at this time, the overflowed glue does not contact the tooling, so the tooling is not polluted.

[0010] When the overflowed glue is located at both the long side and the width, the length of the first protruding block and the second protruding block is less than the length of the small silicon wafer, and the width of the first protruding block and the second protruding block is less than the width of the small silicon wafer when the first protruding block and the second protruding block are processed, and at this time, the overflowed glue does not contact the tooling, so the tooling is not polluted.

[0011] Meanwhile, since the first protruding block is connected with the first positioning block through an edge, the distance between the glue coating area and the edge of the small silicon wafer is large at this position due to the influence of the glue coating process, and therefore, the overflowed glue does not exist at this position.

[0012] In the scheme, the first protruding block connected with the first positioning block and having a length and / or a width less than that of the small silicon wafer refers to two cases, one is the first protruding block connected with the first positioning block and having a length and a width both less than that of the small silicon wafer, and the other is the first protruding block connected with the first positioning block and having a length or a width less than that of the small silicon wafer.

[0013] Preferably, the first lower mould is further provided with a tooling groove for inserting the small silicon wafer positioning table, and the first upper mould is further provided with a tooling groove for inserting the small silicon wafer positioning table.

[0014] The cooperation of the tooling groove and the positioning table facilitates the positioning of the small silicon wafer.

[0015] Preferably, the first lower mould is provided with a first recess corresponding to the first protruding block and for placing the large silicon wafer, and the groove bottom of the first recess is provided with the tooling groove.

[0016] The first recess is arranged to facilitate positioning of the large silicon wafer.

[0017] Preferably, the distance between the first protrusion and the second protrusion is adapted to the thickness of a detector unit after the first positioning block and the second positioning block are positioned.

[0018] The first protrusion and the second protrusion are limited in thickness, so that only the glue is pressed during pressing, avoiding large pressing force that damages the large silicon wafer and the small silicon wafer.

[0019] Preferably, the second positioning block is provided with three first positioning rods inserted into the first positioning block, and the first recess is inserted into a triangle formed by the three first positioning rods.

[0020] The three first positioning rods are inserted into the first positioning block to position the first positioning block and the second positioning block, and the three first positioning rods are used instead of a track shaft to facilitate flexible positioning.

[0021] Preferably, the second mold comprises a second upper mold and a second lower mold, the second lower mold is provided with a third recess for placing a side of the detector unit provided with a small silicon wafer, the length and width of the third recess are adapted to the small silicon wafer, the second upper mold is provided with a fourth recess corresponding to the third recess, and the second upper mold is provided with a second positioning rod inserted into the second lower mold.

[0022] When the ASIC dummy is needed to be installed on the large silicon wafer, the second upper mold is turned upside down, the bottom surface of the second upper mold faces upward, the fourth recess faces upward, the side of the detector unit provided with the small silicon wafer is placed into the fourth recess, the bottom surface of the second lower mold is contacted with the bottom surface of the second upper mold to close the mold, the fourth recess is matched with the bottom surface of the second lower mold to clamp the detector unit, the ASIC dummy is conveniently installed on the large silicon wafer, the third recess and the fourth recess position the side of the detector unit provided with the small silicon wafer, and the two detector units are conveniently bonded and assembled.

[0023] The utility model discloses a beneficial effect is: in the positioning, use non -adhesive part to carry out the positioning, with the positioning table of small silicon wafer fixed limit, the setting of first lug and second lug's length and width, when combining, the glue will overflow but will not pollute frock, through the cooperation of frock groove in positioning table, the positioning of small silicon wafer is convenient to realize, through the restriction between first lug and second lug thickness, thereby in extruding, only to the glue extrusion, avoid extrusion degree big morning big silicon wafer and small silicon wafer's damage, through three first positioning rod insert into first positioning block, thereby realize first positioning block and second positioning block's cooperation, and three first positioning rod's setting, replaced with track axle positioning, thereby convenient flexible positioning. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is first lower mould plan view;

[0025] Figure 2 It is first upper mould elevational view;

[0026] Figure 3 It is first mould closing diagram;

[0027] Figure 4 It is second lower mould plan view;

[0028] Figure 5 It is second upper mould elevational view;

[0029] Figure 6 It is second mould closing diagram;

[0030] Figure 7 It is probe unit front view;

[0031] Figure 8 It is probe unit plan view;

[0032] Figure 9 It is probe unit elevational view;

[0033] Figure 10 It is second upper mould and second lower mould's schematic diagram when fixing probe unit;

[0034] Figure 11 It is small silicon wafer and big silicon wafer's glue coating area schematic diagram;

[0035] Shown in the figure:

[0036] 1, first upper mould, 2, first lower mould, 3, first recess, 4, frock groove, 5, first lug, 6, second lug, 7, first positioning hole, 8, first positioning rod, 9, second positioning rod, 10, second lower mould, 11, third recess, 12, second upper mould, 13, fourth recess, 14, small silicon wafer, 15, big silicon wafer, 16, positioning table, 17, second positioning hole. DETAILED DESCRIPTION

[0037] In order to clearly illustrate the technical features of the present application, the present application will be described in detail below with specific embodiments.

[0038] Referring to the drawings Figures 1-11 The utility model discloses a tool for deep silicon detector element assembly, including the first mould of the assembly into the detector unit, and the second mould of the assembly multiple detector units.

[0039] Deep silicon detector element is by multiple detector unit pasting assembly, and the detector unit includes the small silicon wafer 14 of sequential bonding, tungsten sheet, large silicon wafer 15, tungsten sheet, small silicon wafer 14, and the small silicon wafer 14 includes the body and the positioning platform 16 connected on the body, and two small silicon wafers 14 are about the mirror image of large silicon wafer 15, and the length and width of the bonding part of large silicon wafer 15 and small silicon wafer 14 are adapted to small silicon wafer 14, and another part of large silicon wafer 15 needs to install ASIC false piece, and when two detector units are bonded, the tungsten sheet is placed on the upper end of two small silicon wafers 14 of two detector units, and then the tungsten sheet is pasted with two small silicon wafers 14 on two detector units, and the glue used in the detector element is all epoxy glue.

[0040] The first mould includes the first upper die 1 and the first lower die 2, and the first lower die 2 includes the first positioning block, and the first protruding block 5 connected with the first positioning block and less than the small silicon wafer 14 in length and width, and the first upper die 1 includes the second positioning block matched with the first positioning block, and the second protruding block 6 connected with the second positioning block and less than the small silicon wafer 14 in length and width.

[0041] The first lower die 2 is further provided with the tool groove 4 for the positioning platform 16 of small silicon wafer 14 to be inserted, and the first upper die 1 is further provided with the tool groove 4 for the positioning platform 16 of small silicon wafer 14 to be inserted.

[0042] The first lower die 2 is provided with the first recess 3 corresponding to the first protruding block 5 and for the large silicon wafer 15 to be placed, and the groove bottom of the first recess 3 is provided with the tool groove 4.

[0043] After the first positioning block and the second positioning block are matched and positioned, the distance between the first protruding block 5 and the second protruding block 6 is adapted to the thickness of one detector unit.

[0044] The second positioning block is provided with three first positioning rods 8 inserted into the first positioning block, the first recess 3 is inserted into the triangle formed by the three first positioning rods 8, and the first positioning hole 7 for the first positioning rod 8 to be inserted is formed in the first positioning block.

[0045] The second mold comprises a second upper mold 12 and a second lower mold 10, a third groove 11 is formed on the top surface of the second lower mold 10 for placing the small silicon wafer 14 on one side of the detector unit, the length and width of the third groove 11 are adapted to the small silicon wafer 14, a fourth groove 13 corresponding to the third groove 11 is formed on the bottom surface of the second upper mold 12, the second lower mold 10 is provided with a second positioning hole 17 matched with the second positioning rod, and the second positioning rod 9 is provided with two second positioning rods which are symmetrically arranged.

[0046] The maximum thickness of the detector unit is adapted to the thickness of the fourth groove, and the maximum thickness of the detector unit and the thickness of the tungsten sheet are adapted to the thickness of the third groove.

[0047] When the first mold is used, the first upper mold 1 and the first lower mold 2 are placed on the desktop with the bottom surface of the first upper mold 1 upward, then the small silicon wafer 14 is positioned according to the cooperation of the positioning table 16 and the tool groove 4, and the small silicon wafer 14 is glued, then the tungsten sheet is placed, then the bottom surface of the large silicon wafer 15 is glued, then the large silicon wafer 15 is positioned according to the cooperation of the first groove 3 and the part of the large silicon wafer 15 far away from the glue, so that the large silicon wafer 15 is positioned on the first lower mold 2, and the tungsten sheet on the first lower mold 2 is bonded with the large silicon wafer 15, then the top surface of the large silicon wafer 15 is glued, the first upper mold 1 is turned over, the small silicon wafer 14 on the first upper mold 1 is held by hand, then the first upper mold 1 and the first lower mold 2 are clamped by the first positioning rod 8 and the first positioning hole 7, so that the detector unit is assembled, at this time, the excess glue will overflow due to extrusion, then the overflowed glue is wiped off with a scraper and a paper towel to avoid polluting the tool and causing difficulty in disassembling the tool.

[0048] When the second mold is used, when the ASIC false piece needs to be installed on the large silicon wafer, the second upper mold is turned over and placed below the second lower mold, then the detector unit with the small silicon wafer 14 is placed into the fourth groove 12, the second upper mold is moved to the lower end of the second lower mold, then the second positioning rod is inserted into the second positioning hole from the lower end, at this time, the bottom surface of the second lower mold is matched with the fourth groove to fix the detector unit, that is, the second lower mold is used reversely to clamp one detector unit, then the ASIC false piece is installed on the part of the large silicon wafer 15 outside the second mold, the second mold is used reversely to clamp one detector unit, so that the ASIC false piece is conveniently installed on the large silicon wafer.

[0049] When the detector element is assembled, the two detector units are respectively placed into the third recess 11 and the fourth recess 13, at this time, the detector units are provided with the small silicon wafer 14 on the side of the third recess 11 and the fourth recess 13, so as to realize the positioning of the two detector units, in the third recess 11, the small silicon wafer 14 connected with the tungsten sheet on the detector unit is coated with glue, and the tungsten sheet is pasted, in the fourth recess 13, the small silicon wafer 14 connected with the tungsten sheet on the detector unit is coated with glue, after the second upper die 12 and the second lower die 10 are closed, the bonding of the two detector units is realized.

[0050] In particular, according to the attached Figure 10 At the positioning table 16, the distance between the glue coating area and the edge of the small silicon wafer 14 is large, so there is no glue overflow at this position, and correspondingly, there is no glue overflow at the connection between the first protrusion and the first positioning block and at the connection between the second protrusion and the second positioning block.

[0051] Of course, the above description is not limited to the above examples, and the technical features not described in the utility model can be realized by or using the prior art, which will not be described here; the above embodiments and drawings are only used to illustrate the technical scheme of the utility model and are not a limitation on the utility model, the utility model is described in detail with reference to the preferred embodiments, and those skilled in the art should understand that the changes, modifications, additions or replacements made by those skilled in the art within the essential scope of the utility model do not deviate from the purpose of the utility model, and should also belong to the protection scope of the claims of the utility model.

Claims

1. A tooling for assembling deep silicon detector elements, characterized in that: The first mold includes a first mold for assembling detector units and a second mold for assembling multiple detector units. The first mold includes a first upper mold (1) and a first lower mold (2). The first lower mold (2) includes a first positioning block and a first bump (5) connected to the first positioning block and having a length and / or width smaller than the small silicon wafer (14). The first upper mold (1) includes a second positioning block that cooperates with the first positioning block for positioning and a second bump (6) connected to the second positioning block and having a length and / or width smaller than the small silicon wafer (14).

2. The tooling for assembling deep silicon detector elements according to claim 1, characterized in that: The first lower mold (2) is also provided with a tooling slot (4) for inserting the positioning stage (16) of the small silicon wafer (14), and the first upper mold (1) is also provided with a tooling slot (4) for inserting the positioning stage (16) of the small silicon wafer (14).

3. The tooling for assembling deep silicon detector elements according to claim 2, characterized in that: The first lower mold (2) has a first groove (3) that corresponds to the first protrusion (5) and is used for the large silicon wafer (15) to be placed. The tooling groove (4) is provided at the bottom of the first groove (3).

4. The tooling for assembling deep silicon detector elements according to claim 3, characterized in that: After the first positioning block and the second positioning block are positioned together, the distance between the first protrusion (5) and the second protrusion (6) is adapted to the thickness of a detector unit.

5. The tooling for assembling deep silicon detector elements according to claim 3, characterized in that: The second positioning block is provided with three first positioning rods (8) inserted into the first positioning block, and the first groove (3) is inserted into the triangle formed by the three first positioning rods (8).

6. The tooling for assembling deep silicon detector elements according to claim 1, characterized in that: The second mold includes a second upper mold (12) and a second lower mold (10). The second lower mold (10) has a third groove (11) for the detector unit to be placed on the side with the small silicon wafer (14). The length and width of the third groove (11) are adapted to the small silicon wafer (14). The second upper mold (12) has a fourth groove (13) corresponding to the third groove (11). The second upper mold (12) has a second positioning rod that is inserted into the second lower mold (10).

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