Wafer printing equipment

Abstract

The utility model provides wafer printing equipment. The wafer printing equipment comprises a wafer printing platform and a wafer tray. The wafer printing platform comprises a supporting platform and a vacuum supporting structure. The supporting platform is provided with a platform opening located in the middle and a platform supporting area located on the periphery of the platform opening. The vacuum supporting structure is provided with a supporting top surface for supporting a wafer and a plurality of vacuum adsorption holes penetrating through the supporting top surface, and the plurality of vacuum adsorption holes are used for adsorbing the wafer supported on the supporting top surface; the wafer tray is provided with a tray opening located in the middle and an annular bearing part which is located in the platform opening and can be used for bearing the peripheral area of the wafer, and the tray can be placed on the wafer printing platform; a tray opening of the tray is opposite to the platform opening, at least part of the vacuum supporting structure is located in the platform opening and the tray opening, and when the vacuum supporting structure is in a supporting state, the supporting top face is higher than the surface, used for supporting the wafer, in the annular supporting part or flush with the surface, used for supporting the wafer, in the annular supporting part.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and in particular to a wafer printing device. BACKGROUND

[0002] Wafer printing is mainly applied to wafer solder paste printing and organic adhesive coating. Wafer printing devices are divided into full-automatic feeding devices and semi-automatic feeding devices. The full-automatic feeding device needs to invest in a multi-axis mechanical arm, and the equipment investment cost is high, which is suitable for mass production. The semi-automatic feeding device is adopted by most enterprises with small production scale because of low equipment investment. The semi-automatic feeding device usually adopts a combination of a support platform and a wafer tray. In the related art, the tray is generally designed to include a support area in the middle and a peripheral area at the periphery. The whole wafer is supported in the tray, which makes the tray easy to deform and affects the printing effect. SUMMARY

[0003] Embodiments of the present application provide a wafer printing device, which comprises:

[0004] The wafer printing platform comprises a support platform and a vacuum support structure, the support platform has a platform opening in the middle and a platform support area at the periphery of the platform opening; the vacuum support structure has a support top surface for supporting a wafer, and a plurality of vacuum suction holes penetrating through the support top surface, the plurality of vacuum suction holes are used to suction and support the wafer on the support top surface;

[0005] The wafer tray has a tray opening in the middle and an annular supporting part in the platform opening and capable of supporting the peripheral area of the wafer;

[0006] The wafer tray can be placed on the wafer printing platform; the tray opening of the wafer tray is opposite to the platform opening, at least part of the vacuum support structure is located in the platform opening and the tray opening, the vacuum support structure has a supporting state, when the vacuum support structure is in the supporting state, the support top surface is higher than or flush with the surface of the annular supporting part for supporting the wafer.

[0007] In some embodiments, the vacuum support structure can be arranged to be liftable.

[0008] In some embodiments, the wafer printing platform comprises a lifting driving device for driving the vacuum support structure to lift;

[0009] The vacuum support structure further comprises a retracted state, when the vacuum support structure is in the retracted state, the support top surface is lower than the surface in the annular supporting portion for supporting the wafer; the lifting driving device can drive the vacuum support structure to be in the supporting state and the retracted state.

[0010] In some embodiments, the wafer printing platform further comprises a height adjusting structure arranged in the platform supporting area, which is used to adjust the height of the support top surface in cooperation with the lifting driving device.

[0011] In some embodiments, the height adjusting structure is arranged in the platform supporting area in a lifting manner; or,

[0012] The height adjusting structure is a pad with different thicknesses.

[0013] In some embodiments, for the height adjusting structure arranged in a lifting manner, the height adjusting structure comprises an adjusting bolt arranged in the platform supporting area.

[0014] In some embodiments, the vacuum support structure comprises a first supporting portion arranged in the platform opening and a second supporting portion arranged below the platform opening and supporting the first supporting portion, the second supporting portion has a vacuum passage, and a plurality of vacuum suction holes are arranged in the first supporting portion and communicate with the vacuum passage in the second supporting portion; wherein the second supporting portion has a vacuum external interface.

[0015] The first supporting portion is arranged in the second supporting portion, and the bottom of the height adjusting structure is arranged on the surface of the second supporting portion towards the first supporting portion.

[0016] In some embodiments, the height adjusting structure comprises a plurality of adjusting structures arranged in a spaced manner.

[0017] The plurality of adjusting structures are uniformly arranged in the periphery of the platform opening.

[0018] In some embodiments, the opening portion in the tray opening and located in the annular supporting portion has the same shape and size as the platform opening; and / or,

[0019] The wafer printing platform has a supporting leg arranged below the supporting platform, and when the wafer printing platform comprises a lifting driving device, the lifting driving device is arranged below the supporting platform and inside the supporting leg.

[0020] In some embodiments, the wafer printing device further comprises a wafer top block, the wafer top block has a height greater than the height of the wafer tray, the wafer top block has a cross-sectional dimension in the height direction smaller than the size of the tray opening, when the wafer tray is removed from the support platform, the annular supporting portion of the wafer tray can be sleeved outside the wafer top block, and the wafer on the wafer tray can be lifted by the wafer top block.

[0021] The main technical effects achieved by the embodiments of the present application are as follows:

[0022] The wafer printing device provided by the embodiments of the present application has the following advantages: the wafer printing platform is provided with a platform opening in the middle, and the vacuum support structure with a supporting top surface is arranged in the platform opening, so that the wafer tray is arranged on the wafer printing platform, and when the vacuum support structure is in a supporting state, the supporting top surface of the vacuum support structure is higher than or flush with the surface of the annular supporting portion for supporting the wafer, the middle part of the wafer supported by the wafer tray can be supported by the vacuum support structure, the supporting force of the wafer tray is reduced, and the situation that the wafer is not uniformly printed due to the deformation of the wafer tray is avoided, thereby improving the wafer printing quality. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 is a cross-sectional view of a wafer printing device provided by an example embodiment of the present application;

[0024] Figure 2 is a cross-sectional view of a wafer printing platform provided by an example embodiment of the present application;

[0025] Figure 3 is a cross-sectional view of a wafer tray provided by an example embodiment of the present application;

[0026] Figure 4 is a top view of a wafer tray provided by an example embodiment of the present application;

[0027] Figure 5 is a combined schematic view of a wafer printing device provided by an example embodiment of the present application;

[0028] Figure 6 is a top view of a wafer top block provided by an example embodiment of the present application;

[0029] Figure 7 and Figure 8 is a process schematic view of removing a wafer from a wafer tray by using a wafer top provided by an example embodiment of the present application. DETAILED DESCRIPTION

[0030] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0031] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0032] The following is in conjunction with the appendix Figures 1 to 8 The following describes some embodiments of this application in detail. Unless otherwise specified, the embodiments and features described below can be combined with each other.

[0033] Reference Figure 1 and combine when necessary Figures 2 to 8 As shown in the figure, this application embodiment provides a wafer printing apparatus 100. The wafer printing apparatus 100 includes a wafer printing platform 10 and a wafer tray 20.

[0034] The wafer printing platform 10 includes a support platform 11 and a vacuum support structure 12. The support platform 11 has a platform opening 1101 in the center and a platform support region S1 located around the platform opening 1101; the platform support region S1 can be used to support the wafer tray 20. At least a portion of the vacuum support structure 12 is disposed in the platform opening 1101. The vacuum support structure 12 has a support top surface 1211 for supporting the wafer 200, and a plurality of vacuum suction holes 1201 penetrating the support top surface 1211, the plurality of vacuum suction holes 1201 being used to suction the wafer 200 supported on the support top surface 1211.

[0035] The wafer tray 20 has a tray opening 201 in the middle and an annular support portion 21 located within the platform opening 1101. The annular support portion 21 has a surface located within the platform opening 1101 for supporting the wafer 200, namely the wafer support surface 210.

[0036] The wafer tray 20 can be placed on the wafer printing platform 10, wherein the tray opening 201 of the wafer tray 20 is opposite to the platform opening 1101. At least part of the vacuum support structure 12 is located in the platform opening 1101 and the tray opening 201, and the vacuum support structure 12 has a support state, wherein the support top surface 1211 is higher than or flush with the wafer supporting surface 210 in the annular supporting part 21 when the vacuum support structure 12 is in the support state.

[0037] The wafer printing device 100 described above, by setting the wafer printing platform 10 to have a platform opening 1101 in the middle, and setting the vacuum support structure 12 with a support top surface in the platform opening 1101, the wafer tray 20 is arranged on the wafer printing platform 10, and when the vacuum support structure is in the support state, the support top surface 1211 of the vacuum support structure 12 is higher than or flush with the surface for supporting the wafer 200 in the annular supporting part 21, the middle part of the wafer 200 supported by the wafer tray 20 can be supported by the vacuum support structure 12, reducing the support force of the wafer tray 20, which is beneficial to avoid the situation of uneven wafer printing caused by the deformation of the wafer tray 20, and improve the wafer printing quality.

[0038] In combination with Figure 3 and Figure 4 In some embodiments, the annular supporting part 21 can be a stepped part of the tray opening 201. The wafer supporting surface 210 is a corresponding stepped surface. The wafer tray 20 can further include a supporting part 22 located at the periphery of the annular supporting part 21. The tray opening 201 includes a first opening part 2012 located in the annular supporting part 21 and on the side away from the wafer supporting surface 210, and a second opening part 2011 located in the supporting part 22 and on the side toward the wafer supporting surface 210. The first opening part 2012 and the second opening part 2011 correspondingly communicate. The side wall of the first opening part 2012 in the thickness direction of the wafer tray 20 falls within the orthogonal projection of the second opening part 2011 in the thickness direction of the wafer tray 20.

[0039] In some embodiments, the vacuum support structure 12 can be arranged to be lifted, so as to be suitable for wafers of different thicknesses, so that the upper surface of the wafer of different thicknesses can be higher than or flush with the top surface of the side of the wafer tray away from the supporting platform 11, so as to facilitate the printing or coating operation such as solder paste printing and organic glue coating.

[0040] As shown in Figure 1 In some embodiments, the wafer printing platform 10 further includes a lifting driving device 13 for driving the vacuum support structure 12 to lift.

[0041] The lifting driving device 13 can drive the vacuum support structure 12 to be in a supporting state. Figure 5 As shown in the example, when the vacuum support structure 12 is in the supporting state, the supporting top surface 1211 of the vacuum support structure 12 can be flush with the wafer supporting surface 210 of the annular supporting portion 21. In this state, the supporting top surface 1211 and the annular supporting portion 21 jointly support the wafer 200. In other embodiments, the supporting top surface 1211 can also be higher than the wafer supporting surface 210 of the annular supporting portion 21, and accordingly, the wafer is entirely supported by the supporting top surface 1211. In this state, it is more conducive to avoid the situation that the wafer printing is uneven due to the deformation of the wafer tray 20, and further improve the wafer printing quality.

[0042] In some embodiments, the vacuum support structure 12 further comprises a retracted state. When the vacuum support structure 12 is in the retracted state, the supporting top surface 1211 is lower than the surface of the annular supporting portion 21 for supporting the wafer 200, that is, the supporting top surface 1211 is lower than the wafer supporting surface 210. In this way, the annular supporting portion 21 and the wafer 200 supported on the annular supporting portion 21 can be easily removed from the supporting platform 11.

[0043] The lifting driving device 13 can drive the vacuum support structure 12 to be in the retracted state. When the lifting driving device 13 is in the retracted state, the supporting top surface 1211 is lower than the wafer supporting surface 210 of the annular supporting portion 21.

[0044] In some embodiments, the wafer printing platform 10 further comprises a height adjusting structure 14 arranged on the platform supporting area S1, which is used to accurately adjust the height of the supporting top surface 1211 in cooperation with the lifting driving device 13.

[0045] In some embodiments, the height adjusting structure 14 can be arranged on the platform supporting area S1 in a lifting manner, which is convenient for the wafer of more thickness sizes.

[0046] In some embodiments, for the height adjusting structure 14 arranged in a lifting manner, the height adjusting structure 14 arranged in a lifting manner can be a bolt. The corresponding area on the supporting platform 11 is provided with a through hole 1102 for arranging the bolt, and the height of the supporting top surface 1211 can be accurately adjusted by rotating the bolt.

[0047] It should be noted that, in order to avoid unnecessary influence on the wafer tray 20, the top end of the bolt cannot be higher than the top surface of the supporting platform 11.

[0048] In other embodiments, the height adjusting structure can be a gasket with different thicknesses, so as to arrange the gasket with different thicknesses between the supporting platform 11 and the vacuum support structure 12 according to the needs.

[0049] In some embodiments, the lifting driving device 13 comprises a plurality of adjusting supports arranged at intervals.

[0050] In some embodiments, the plurality of adjusting supports are arranged uniformly around the platform opening 1101.

[0051] In some embodiments, the vacuum support structure 12 comprises a first support part 121 arranged in the platform opening 1101 and a second support part 122 arranged below the platform opening 1101 and supporting the first support part 121, the second support part 122 having a vacuum passage 1202 therein, and a plurality of vacuum adsorption holes 1201 are arranged in the first support part 121 and communicate with the vacuum passage 1202 in the second support part 122; wherein the second support part 122 has a vacuum external interface 1203 which can be used to connect a vacuum pipeline for vacuumizing to adsorb wafers.

[0052] The orthographic projection of the first support part 121 on the second support part 122 falls within the second support part 122.

[0053] When the height adjusting structure 14 is a liftable structure, the height adjusting structure 14 can be arranged in the through hole 1102 of the platform support area S1 of the support platform 11, and the bottom is abutted on the surface of the side of the second support part 122 facing the first support part 121, so as to accurately control the height of the support plane 1211.

[0054] In other embodiments, when the height adjusting structure is a pad with different thicknesses, a pad with the required thickness can be arranged between the support platform 11 and the surface of the side of the second support part 122 facing the first support part 121 according to the requirement.

[0055] In some embodiments, the shape and size of the first opening part 2012 in the tray opening 201 inside the annular supporting part 21 and the platform opening 1101 are the same, so as to align the wafer tray opening 201 with the platform opening 1101 of the wafer printing platform 10.

[0056] Wherein, the shape of the first opening part 2012 in the tray opening 201 and the platform opening 1101 is the shape of the cross section perpendicular to the thickness direction of each of them respectively. The size of the first opening part 2012 in the tray opening 201 and the platform opening 1101 is the size of the cross section perpendicular to the thickness direction of each of them respectively.

[0057] The first opening portion 2012 can have a circular shape in a cross section perpendicular to a thickness direction of the wafer tray 20. The platform opening 1101 can have a circular shape in a cross section perpendicular to a thickness direction of the support platform 11. The diameter of the cross section perpendicular to the respective thickness directions of the first opening portion 2012 and the platform opening 1101 is D2. The D2 is smaller than the diameter D1 of the second opening portion 2011 in the direction.

[0058] In some embodiments, the wafer printing platform 10 has a support leg 16 supported below the support platform 11. When the wafer printing platform 10 includes a lifting driving device 13, the lifting driving device 13 can be located below the support platform 10 and inside the support leg 16.

[0059] The driving device 13 can be arranged below the second support portion 122 of the vacuum support structure 12 to support the second support portion 122 and the first support portion 121 thereon from the bottom.

[0060] The driving device 13 can be a pneumatic driving device or other driving devices such as a driving motor.

[0061] It should be noted that the wafer printing apparatus is configured to include the wafer printing platform 10 having the vacuum support structure 12 and the wafer tray 20 having the tray opening in the middle. This configuration is also beneficial for reducing the size of the wafer tray outside the tray opening and improving the convenience of personnel operation.

[0062] In combination with Figure 7 and Figure 8 In some embodiments, the wafer printing apparatus 100 further includes a wafer top block 30. The height H2 of the wafer top block 30 is greater than the height H1 of the wafer tray 20. The size of the cross section of the wafer top block 30 perpendicular to the height direction is smaller than the minimum size of the cross section of the tray opening 201 perpendicular to the thickness direction of the wafer tray 20, so that the tray opening can be fitted outside the wafer top block 30.

[0063] The wafer top block 30 can have a circular, rectangular, elliptical, or other regular or irregular shape in a cross section perpendicular to the height direction.

[0064] In some embodiments, the wafer top block 30 can have a shape in a cross section perpendicular to the height direction that is adapted to the shape of the tray opening 201 to better support the wafer 200. The shape of the tray opening 201 can be the shape of the cross section of the tray opening 201 perpendicular to the thickness direction of the tray.

[0065] For example, when the tray opening 201 and the wafer top block 30 are both circular, as shown in Figure 8As shown, the diameter D3 of the cross section of the wafer top block 30 perpendicular to the height direction is smaller than the diameter D2 of the first opening portion 2012 in the tray opening 201.

[0066] Of course, in some other embodiments, the shape of the cross section of the wafer top block perpendicular to the height direction can also not match the shape of the tray opening, as long as the overall outer periphery contour of the wafer top block is smaller than the tray opening, so that the tray opening can be fitted outside the wafer top block.

[0067] The wafer top block 30 can be used to take out the wafer 200 on the wafer tray 20. When the wafer 200 on the wafer tray 20 is taken out using the wafer top block 30, the wafer top block 30 can be placed on the platform 300. When the wafer tray 20 is taken off the support platform 11, the annular supporting portion of the wafer tray 20 can be fitted outside the wafer top block 30, and the wafer 200 on the wafer tray 20 can be lifted by the wafer top block 30, so that the wafer 200 can be taken off the wafer top block 30 by a robot or other structure.

[0068] Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. It is intended that the specification and examples be considered as exemplary only, with the true scope and spirit of the application being indicated by the following claims.

[0069] It is to be understood that the application is not limited to the precise construction here described and as shown in the drawings, and that various modifications and changes can be made by those skilled in the art without departing from the scope of the application. The scope of the application is to be limited only by the appended claims.

Claims

1. A wafer printing apparatus characterized by comprising: The application relates to a wafer printing platform, which comprises a support platform and a vacuum support structure, wherein the support platform has a platform opening in the middle and a platform support area in the periphery of the platform opening; the vacuum support structure has a support top surface for supporting a wafer and a plurality of vacuum suction holes penetrating through the support top surface, and the plurality of vacuum suction holes are used for suction supporting the wafer supported on the support top surface; a wafer tray has a tray opening in the middle and an annular supporting part in the platform opening and capable of supporting the peripheral area of the wafer; wherein the wafer tray can be placed on the wafer printing platform; the tray opening of the wafer tray is opposite to the platform opening, at least part of the vacuum support structure is located in the platform opening and the tray opening, the vacuum support structure has a supporting state, and when the vacuum support structure is in the supporting state, the support top surface is higher than or flush with the surface of the annular supporting part for supporting the wafer. The vacuum support structure is arranged to be liftable. The wafer printing platform comprises a lifting driving device for driving the vacuum support structure to lift. The vacuum support structure further comprises a retracted state, and when the vacuum support structure is in the retracted state, the support top surface is lower than the surface of the annular supporting part for supporting the wafer; the lifting driving device can drive the vacuum support structure to be in the supporting state and the retracted state. The wafer printing platform further comprises a height adjusting structure arranged on the platform support area, which is used for adjusting the height of the support top surface in cooperation with the lifting driving device.

2. The wafer printing apparatus of claim 1, wherein, The height adjusting structure is arranged to be liftable on the platform support area; or 3. The wafer printing apparatus of claim 2, wherein, The height adjusting structure is a gasket with different thicknesses. For the height adjusting structure arranged to be liftable, the height adjusting structure comprises an adjusting bolt penetrating through the platform support area.

4. The wafer printing apparatus of claim 3, wherein, The vacuum support structure comprises a first support part arranged in the platform opening and a second support part arranged below the platform opening and supporting the first support part, the second support part has a vacuum channel, the plurality of vacuum suction holes are arranged in the first support part and communicate with the vacuum channel in the second support part; wherein the second support part has a vacuum external interface; 5. The wafer printing apparatus of claim 4, wherein, The first support part is projected on the second support part, and the bottom of the height adjusting structure is arranged on the surface of the second support part towards the first support part. The height adjusting structure comprises a plurality of adjusting structures arranged at intervals.

6. The wafer printing apparatus of claim 5, wherein, The plurality of adjusting structures are uniformly arranged in the periphery of the platform opening.

7. The wafer printing apparatus of claim 4, wherein, The opening part in the tray opening in the annular supporting part is the same in shape and size with the platform opening; and / or The wafer printing platform has a support leg supported below the support platform, and when the wafer printing platform comprises a lifting driving device, the lifting driving device is located below the support platform and inside the support leg.

8. The wafer printing apparatus of claim 4, wherein, ​ ​ 9. The wafer printing apparatus according to any one of claims 1 to 8, wherein, ​ ​ 10. The wafer printing apparatus of claim 1, wherein, The wafer printing device further comprises a wafer top block, the wafer top block has a height greater than that of the wafer tray, a size of a cross section of the wafer top block in a height direction is less than that of the tray opening, and when the wafer tray is taken off from the support platform, the annular supporting part of the wafer tray can be sleeved outside the wafer top block, and the wafer on the wafer tray can be lifted by the wafer top block.

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