Chuck structure and semiconductor device

Abstract

The utility model relates to a chuck structure and semiconductor equipment, the chuck structure comprises a first chuck and a second chuck, the first chuck comprises a hollow annular cavity, and the first chuck is used for rotating a wafer; the second chuck is arranged in the annular cavity, the second chuck ascends and descends relative to the first chuck to bear the wafer and place the borne wafer on the first chuck, and the edge of the wafer is in lap joint with the first chuck. The chuck structure is composed of the rotatable first chuck and the liftable second chuck, the second chuck lifts up and down to bear and transfer the wafer, the first chuck rotates to assist in pre-alignment of the wafer, and the chuck structure is not provided with a bonded annular ring, so that the situation that the wafer alignment is affected by particles generated by residual colloid which falls off from the annular ring is avoided; and meanwhile, the edge of the wafer is overlapped on the first chuck, so that the contact area between the wafer and the first chuck is reduced, the friction damage of the first chuck is reduced, and the service life of the chuck structure is prolonged.

Description

TECHNICAL FIELD

[0001] The present application relates to a chuck structure and a semiconductor device. BACKGROUND

[0002] At present, a chuck is usually used to assist in pre-alignment of a wafer. The chuck rotates to rub the wafer to adsorb the wafer by friction. If there are impurities such as particles on the contact surface of the chuck and the wafer, the friction of the chuck and the wafer will be affected, or the structure of the chuck is worn, which can cause the position of the wafer to deviate, affect the alignment result of the wafer, and even cause the wafer to fall off the chuck and be damaged. CONTENT OF THE UTILITY MODEL

[0003] The following is a summary of the subject matter of the detailed description of the present disclosure. This summary is not intended to limit the scope of protection of the claims.

[0004] In a first aspect, the present application provides a chuck structure, comprising:

[0005] a first chuck comprising a hollow annular cavity, the first chuck being used to rotate a wafer;

[0006] a second chuck arranged in the annular cavity, the second chuck being raised and lowered relative to the first chuck to carry the wafer and place the carried wafer on the first chuck, the edge of the wafer being overlapped on the first chuck.

[0007] Optionally, the first chuck comprises:

[0008] an annular body;

[0009] a first driving mechanism drivingly connected with the annular body and used to drive the annular body to rotate.

[0010] Optionally, the first chuck further comprises:

[0011] at least one support member arranged on the annular body in a circumferential direction of the annular body and spaced apart from each other, the at least one support member being used to support the wafer.

[0012] Optionally, in a radial direction of the annular body, the support member comprises a support portion arranged in a direction away from the annular cavity and a protruding portion protruding upward relative to the support portion.

[0013] Optionally, one side of the protruding portion and the support portion is provided with an inclined surface inclined toward the annular cavity.

[0014] Optionally, the support member is a transparent structure.

[0015] Optionally, a ceramic gasket is arranged on the support portion.

[0016] Optionally, the annular body protrudes upward in a radial direction of the annular body away from the side of the annular body close to the annular cavity, and the edge of the wafer is overlapped on the side of the annular body close to the annular cavity.

[0017] Optionally, the second chuck comprises:

[0018] a bearing part;

[0019] a second driving mechanism, and the bearing part is drivingly connected to the second driving mechanism, and the second driving mechanism is configured to drive the bearing part to move up and down.

[0020] In a second aspect, the present application provides a semiconductor device, which comprises the chuck structure as described in the first aspect, and the semiconductor device comprises:

[0021] a vacuum chamber, and the chuck structure is arranged in the vacuum chamber;

[0022] a detection mechanism, which is arranged in the vacuum chamber and is arranged close to the first chuck of the chuck structure, and the detection mechanism is configured to detect a notch position of a wafer arranged on the first chuck.

[0023] The chuck structure and the semiconductor device described above are composed of the rotatable first chuck and the liftable second chuck, the wafer is carried and transferred by the second chuck moving up and down, the pre-alignment of the wafer is assisted by the rotation of the first chuck, the chuck structure does not have the annular ring, which avoids the influence of the particles generated by the residual glue of the annular ring falling off on the wafer alignment, and the edge of the wafer is overlapped on the first chuck, which reduces the contact area of the wafer and the first chuck, is conducive to reducing the friction damage of the first chuck, and improves the service life of the chuck structure. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 A structural schematic view of the chuck structure shown in an exemplary embodiment.

[0025] Figure 2 A front view of the chuck structure shown in an exemplary embodiment.

[0026] Figure 3 A front view of the wafer carried by the second chuck shown in an exemplary embodiment.

[0027] Figure 4 A structural schematic view of the first chuck shown in an exemplary embodiment.

[0028] Figure 5 A structural schematic view of the second chuck shown in an exemplary embodiment.

[0029] Figure 6 A structural schematic view of the support shown in an exemplary embodiment.

[0030] Figure 7 A schematic view of a wafer placed on a support according to an exemplary embodiment.

[0031] Figure 8 A cross-sectional view of the annular body along a radial direction of the annular body according to an exemplary embodiment.

[0032] Figure 9 A schematic view of a structure of a semiconductor device according to an exemplary embodiment.

[0033] BRIEF DESCRIPTION OF DRAWINGS

[0034] 10, first chuck; 11, annular cavity; 12, annular body; 13, first driving mechanism; 14, support; 141, support portion; 142, protruding portion; 143, inclined surface; 144, vertical surface; 15, ceramic gasket; 20, second chuck; 21, bearing portion; 22, second driving mechanism; 30, wafer; 40, vacuum chamber; 50, detecting mechanism. DETAILED DESCRIPTION

[0035] In order to make the above objectives, features and advantages of the present application more clear and comprehensible, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, a lot of specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be implemented in many different ways other than those described herein, and one of ordinary skill in the art can make similar improvements without departing from the spirit of the present application, and therefore the present application is not limited to the specific embodiments disclosed below.

[0036] In the description of the present application, it should be understood that if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0037] In the relevant design, the chuck is fitted with an annular ring, and the chuck and the annular ring are bonded together with an adhesive. If the annular ring detaches from the chuck, the residual adhesive will generate particles that affect the chuck's friction and adhesion of the wafer, causing wafer misalignment, affecting wafer alignment, and potentially even causing the wafer to fall off the chuck and break. Chuck damage during use will also cause wafer misalignment, affecting wafer alignment, and potentially causing the wafer to fall off the chuck and break. Therefore, the chuck has a short lifespan; it must be replaced regardless of whether the annular ring detaches from the chuck or the chuck breaks during use.

[0038] See Figure 1 , Figure 2 , Figure 3 , Figure 1 A schematic diagram of the chuck structure according to one embodiment of this application is shown. Figure 2 A front view of a chuck structure according to an embodiment of this application is shown. Figure 3 The diagram shows a front view of a second chuck carrying a wafer according to an embodiment of this application. The chuck structure provided in this embodiment includes a first chuck 10 and a second chuck 20. The first chuck 10 includes a hollow annular cavity 11 and is used to rotate a wafer 30. The second chuck 20 is disposed in the annular cavity 11 and moves up and down relative to the first chuck 10 to carry the wafer 30 and place the carried wafer 30 on the first chuck 10. The edge of the wafer 30 overlaps the first chuck 10.

[0039] The chuck structure of this embodiment consists of a rotatable first chuck 10 and a liftable second chuck 20. The second chuck 20 lifts and moves the wafer 30, while the first chuck 10 rotates to assist in the pre-alignment of the wafer 30. The chuck structure does not have an adhesive ring, which avoids the residual adhesive from the ring falling off and causing particles that affect wafer alignment. At the same time, the edge of the wafer 30 overlaps with the first chuck 10, reducing the contact area between the wafer 30 and the first chuck 10, which helps to reduce frictional damage to the first chuck 10 and improve the service life of the chuck structure.

[0040] In some embodiments, refer to Figure 4 As shown, the first chuck 10 includes an annular body 12 and a first drive mechanism 13. The first drive mechanism 13 and the annular body 12 are connected in a drive connection and are used to drive the annular body 12 to rotate.

[0041] The first drive mechanism 13 can be a drive motor, the output shaft of which is connected to the annular body 12. The drive motor is configured to generate driving force through its output shaft to drive the annular body 12 to rotate around its center. The drive motor driving the annular body 12 to rotate can precisely control the rotation speed of the annular body 12 and ensure positioning and stopping.

[0042] Referring to Figure 5 As shown in the figure, the second chuck 20 comprises a bearing part 21 and a second driving mechanism 22, the second driving mechanism 22 and the bearing part 21 are drivingly connected, for driving the bearing part 21 to ascend and descend.

[0043] The second driving mechanism 22 can be a cylinder. For example, the second driving mechanism 22 comprises a vertical cylinder arranged at the bottom of the bearing part 21, the vertical cylinder and the bearing part 21 are drivingly connected to control the bearing part 21 to ascend or descend, the vertical cylinder is installed below the bearing part 21, the vertical cylinder can quickly and accurately ascend or descend the bearing part 21 to the target position, and keep the wafer 30 on the bearing part 21 stable during the ascending or descending process.

[0044] Further, the second driving mechanism 22 can also comprise a horizontal cylinder drivingly connected with the bearing part 21, the horizontal cylinder and the bearing part 21 are drivingly connected to control the bearing part 21 to move horizontally, so as to place the wafer 30 on the bearing part 21 on the first chuck 10 in alignment, avoiding the placement position of the wafer 30 deviating from the first chuck 10, which may cause the wafer 30 to fall off or even breakage.

[0045] The chuck structure of the embodiment is applied, referring to Figures 1-5 As shown in the figure, the second chuck 20 is arranged in the annular cavity 11, the initial position of the bearing part 21 is lower than the annular body 12, the second driving mechanism 22 drives the bearing part 21 to ascend to be higher than the annular body 12, so as to make the bearing part 21 carry the wafer 30 from the conveying mechanism; then, the second driving mechanism 22 drives the bearing part 21 to descend downward to the direction of the first chuck 10, when the height of the bearing part 21 and the annular body 12 is flush, the edge of the wafer 30 is overlapped on the annular body 12, the second driving mechanism 22 continues to drive the bearing part 21 to descend, so as to make the wafer 30 be carried by the first chuck 10; then, the first driving mechanism 13 drives the annular body 12 to rotate, the position of the notch of the wafer 30 is detected by the detection mechanism 50 (refer to Figure 9 ), the detection mechanism 50 detects in the direction perpendicular to the wafer 30 (the direction of the dashed line shown in Figure 9 ), after detecting the position of the notch of the wafer 30, the first driving mechanism 13 is controlled to stop driving the annular body 12 to rotate, the wafer 30 stops rotating, the position of the notch of the wafer 30 is arranged corresponding to the position of the detection mechanism 50, the pre-alignment of the wafer 30 is completed; after the pre-alignment of the wafer 30 is completed, the second driving mechanism 22 drives the bearing part 21 to ascend to be flush with the height of the annular body 12, the bearing part 21 carries the wafer 30, the second driving mechanism 22 continues to drive the bearing part 21 to ascend, the bearing part 21 is separated from the annular body 12, and the pre-aligned wafer 30 is transferred by the conveying mechanism.

[0046] For example, the conveying mechanism can be a mechanical arm.

[0047] In some embodiments, as shown in Figures 1-4 The first chuck 10 further comprises at least one support 14 arranged on the annular body 12 in a circumferential direction of the annular body 12, and the at least one support 14 is configured to support the wafer 30.

[0048] The top surface of the annular body 12 is planar, and the annular body 12 is provided with a plurality of supports 14 arranged equidistantly in the circumferential direction of the annular body 12. For example, the annular body 12 can be provided with four, five, six or more supports 14 equidistantly.

[0049] In this way, the second chuck 20 lowers to place the wafer 30 on the first chuck 10, and the edge of the wafer 30 is overlapped on the support 14, and the contact area between the wafer 30 and the support 14 is smaller, which can further reduce the friction damage of the first chuck 10 and improve the service life of the chuck structure.

[0050] The support 14 is fixedly connected with the annular body 12, so that the structure of the support 14 and the annular body 12 is more stable, and separation of the support 14 and the annular body 12 during rotation of the first chuck 10 can be avoided.

[0051] In some examples, the support 14 and the annular body 12 can be integrally formed when the annular body 12 is made.

[0052] In other examples, the support 14 can be detachably connected with the annular body 12 through a connecting member, so that the damaged support 14 can be replaced flexibly during the friction process, without the need to replace the entire first chuck 10, thereby improving the service life of the first chuck 10 and saving costs.

[0053] In some embodiments, as shown in Figure 1 , Figure 4 , Figure 6 , Figure 7 In the radial direction of the annular body 12, the support 14 comprises a support portion 141 arranged away from the annular cavity 11 and a protruding portion 142 protruding upward relative to the support portion 141.

[0054] The protruding portion 142 is configured to block the wafer 30. If the wafer 30 deviates to one side during the process of transferring the wafer 30 from the second chuck 20 to the first chuck 10, the protruding portion 142 blocks the wafer 30, and the wafer 30 is moved in the direction of the center of the annular body 12 under the resistance of the protruding portion 142. In this way, the wafer 30 is placed on the annular body 12, and the deviation amount between the center of the wafer 30 and the center of the annular body 12 is smaller, which is conducive to the detection mechanism 50 to detect the difficulty of the notch of the wafer 30 more quickly and shorten the pre-alignment time.

[0055] In some embodiments, referring to Figure 1 , Figure 4 , Figure 6 , Figure 7 , the side where the protruding part 142 and the supporting part 141 are connected is provided with an inclined surface 143 inclined to the direction of the annular cavity 11.

[0056] In this way, during the process of transferring the wafer 30 from the second chuck 20 to the first chuck 10, if the position of the wafer 30 deviates relative to the annular body 12, the edge of the wafer 30 abuts against the inclined surface 143 of the protruding part 142, and the wafer 30 slides along the inclined direction of the inclined surface 143 to the supporting part 141, so that the edge of the wafer 30 is overlapped on the supporting part 141, the supporting part 141 bears the wafer 30, and the inclined surface 143 provides a movement route for the wafer 30 to be accurately placed on the supporting part 141, so that the wafer 30 can be smoothly placed on the supporting part 141, avoiding a large positional deviation of the wafer 30 during the process of transferring the wafer 30 from the second chuck 20 to the first chuck 10, and avoiding that the notch of the wafer 30 cannot be detected by the detection mechanism 50 due to the placement position error of the wafer 30 on the first chuck 10, which is beneficial to shorten the pre-alignment time and improve the pre-alignment efficiency.

[0057] Referring to Figure 1 , Figure 4 , Figure 6 , Figure 7 , the protruding part 142 further includes a vertical surface 144 extending away from the supporting part 141 perpendicularly to the supporting part 141, and the inclined surface 143 is connected to the supporting part 141 through the vertical surface 144. In this way, when the wafer 30 is placed on the first chuck 10, the edge of the wafer 30 abuts against the vertical surface 144.

[0058] In some embodiments, referring to Figure 1 , Figure 7 , four supporting parts 14 are provided on the annular body 12 at equal intervals, and the two supporting parts 14 are oppositely arranged, and the distance between the vertical surfaces 144 of the two oppositely arranged supporting parts 14 is set according to the specification of the wafer 30, and the distance between the vertical surfaces 144 of the two oppositely arranged supporting parts 14 is equal to or slightly larger than the diameter of the wafer 30. In this way, when the wafer 30 is transferred from the second chuck 20 to the first chuck 10, the edge of the wafer 30 touches the inclined surface 143 and smoothly slides along the inclined surface 143, the edge of the wafer 30 is overlapped on the supporting part 141, and the edge of the wafer 30 abuts against the vertical surface 144.

[0059] In some embodiments, referring to Figure 1 , Figure 4 , Figure 6 , Figure 7As shown, in order to increase the friction between the support part 141 and the wafer 30, the side of the support part 141 carrying the wafer 30 can be polished into a rough frosted surface, or the side of the support part 141 carrying the wafer 30 can be provided with a concave-convex surface, so as to avoid the wafer 30 from slipping off the support part 141 when the first chuck 10 rotates.

[0060] In some embodiments, referring to Figure 1 、 Figure 4 、 Figure 6 、 Figure 7 As shown, the support part 141 is provided with a ceramic pad 15. The ceramic pad 15 can increase the friction between the wafer 30 and the support part 141, and the wafer 30 is less likely to slip on the ceramic pad 15, thus avoiding displacement of the wafer 30 during rotation of the first chuck 10.

[0061] Meanwhile, the ceramic pad 15 is provided on the support part 141, and the ceramic pad 15 is raised relative to the support part 141, which can further reduce the contact area between the wafer 30 and the support part 141, thus avoiding friction damage to the support part 14.

[0062] In order to further increase the friction and avoid displacement of the wafer 30 during rotation of the first chuck 10, the surface of the ceramic pad 15 can be provided with a frosted surface or a concave-convex surface.

[0063] In some embodiments, not shown in the drawings of the present embodiment, the support part 141 can be provided with an inwardly recessed groove, and the ceramic pad 15 is arranged in the groove, thus avoiding displacement of the ceramic pad 15 and avoiding the ceramic pad 15 from falling off. The top surface of the ceramic pad 15 is slightly higher than the top surface of the support part 141, and the top surface of the wafer 30 does not contact the top surface of the support part 141, thus avoiding friction damage to the support part 141 by the wafer 30, and the support part 141 does not need to be replaced.

[0064] In some embodiments, the support part 14 is a transparent structure. For example, the support part 14 can be made of transparent quartz glass, so that when the wafer 30 is arranged on the support part 14, the support part 14 does not block the edge of the wafer 30, and the detection mechanism 5 can clearly detect the notch position of the wafer 30 through the support part 14, thus ensuring smooth execution of the pre-alignment process and ensuring accuracy and reliability of the pre-alignment process.

[0065] In some embodiments, referring to Figure 8As shown, the support 14 can not be arranged on the annular body 12, and the annular body 12 protrudes upward in the radial direction of the annular body 12 away from the annular cavity 11, and the edge of the wafer 30 is overlapped on the side of the annular body 12 close to the annular cavity 11. That is, the annular body 12 has a structure of low inside and high outside, and in the process of transferring the wafer 30 to the first chuck 10 by the second chuck 20, the protruding part of the outside of the annular body 12 limits the wafer 30, which is used to guide the wafer 30 to move to the inside of the annular body 12 until the wafer 30 is overlapped on the inside of the annular body 12.

[0066] The chuck structure of the embodiment of the present application improves the structure, and realizes the pre-alignment of the wafer 30 by combining the first chuck 10 and the second chuck 20. The wafer 30 is lifted and transferred to the first chuck 10 by the second chuck 20, and the pre-alignment of the wafer 30 is realized by rotating the first chuck 10, which reduces the contact area of the wafer 30 in the rotating process and the first chuck 10, can reduce the damage of the rotating friction to the first chuck 10, is conducive to improving the service life of the chuck structure, and does not need to be frequently replaced; neither the first chuck 10 nor the second chuck 20 uses colloid connection, which avoids the problem that the particles generated by the colloid affect the pre-alignment of the wafer 30 from the root.

[0067] In combination with Figure 9 As shown, Figure 9 A structure schematic diagram of a semiconductor device in an embodiment of the present application is shown, and in some embodiments, a semiconductor device is provided, which includes the chuck structure of the above-mentioned embodiments. The semiconductor device includes a vacuum chamber 40 and a detection mechanism 50, and the chuck structure of the above-mentioned embodiments is arranged in the vacuum chamber 40. The detection mechanism 50 is arranged in the vacuum chamber 40 and is arranged close to the first chuck 10 of the chuck structure. The detection mechanism 50 is used to detect the notch position of the wafer 30 located on the first chuck 10.

[0068] The notch of the wafer 30 is a gap formed in the wafer 30 in the process of cutting and slicing, and the notch of the wafer 30 is used for positioning, arranging or transferring, transporting and the like of the wafer 30.

[0069] The detection mechanism 50 can be a line scan camera, an infrared camera or a CCD camera, etc. The detection mechanism 50 is used to detect the notch of the wafer 30, so that the first chuck 10 stops positioning, the notch of the wafer 30 faces a preset direction, the second chuck 20 rises to carry the wafer 30, the transfer mechanism clamps the wafer 30 on the second chuck 20, and keeps the notch of the wafer 30 facing the preset direction to transfer.

[0070] The semiconductor device of the embodiment of the present application is used for wafer 30 pre-alignment, the chuck structure used by the semiconductor device does not have a ring that is bonded by glue, which avoids the ring falling off and generating particles that affect the wafer 30 pre-alignment process, at the same time, the structure of the first chuck 10 and the second chuck 20 does not have a part that is bonded by glue, the chuck structure is stable, which avoids the problem of the ring falling off and the need to replace the chuck structure, the contact area between the first chuck 10 and the wafer 30 is small, the first chuck 10 suffers less friction damage when rotating the wafer 30, which reduces the frequency of replacing the first chuck 10 due to damage, is conducive to improving the service life of the chuck structure, and improving the work efficiency of the semiconductor device.

[0071] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, but as long as the combinations of the technical features do not exist contradictions, they should be considered as the scope of the present disclosure.

[0072] The above-described embodiments only express several implementation manners of the present application, the description is more specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A chuck structure, characterized by, The chuck structure comprises: a first chuck (10) comprising a hollow annular cavity (11), the first chuck (10) being used to rotate a wafer (30); a second chuck (20) arranged in the annular cavity (11), the second chuck (20) being lifted up and down relative to the first chuck (10) to carry the wafer (30) and place the carried wafer (30) on the first chuck (10), the edge of the wafer (30) being overlapped on the first chuck (10).

2. The chuck structure of claim 1, wherein The first chuck (10) comprises: an annular body (12); a first driving mechanism (13) drivingly connected with the annular body (12) and used to drive the annular body (12) to rotate.

3. The chuck structure of claim 2, wherein The first chuck (10) further comprises: at least one support (14) arranged on the annular body (12) along the circumferential direction of the annular body (12) and used to support the wafer (30).

4. The chuck structure according to claim 3, characterized by In the radial direction of the annular body (12), the support (14) comprises a support portion (141) arranged away from the annular cavity (11) and a protruding portion (142) protruding upward relative to the support portion (141).

5. The chuck structure according to claim 4, characterized by The side where the protruding portion (142) and the support portion (141) are connected is provided with an inclined surface (143) inclined toward the annular cavity (11).

6. The chuck structure of claim 4 wherein, The support (14) is a transparent structure.

7. The chuck structure of claim 4 wherein, The support portion (141) is provided with a ceramic gasket (15).

8. The chuck structure of claim 2, wherein In the radial direction of the annular body (12), the side of the annular body (12) away from the annular cavity (11) protrudes upward, and the edge of the wafer (30) is overlapped on the side of the annular body (12) close to the annular cavity (11).

9. The chuck structure of claim 1, wherein The second chuck (20) comprises: a carrying portion (21); a second driving mechanism (22) drivingly connected with the carrying portion (21) and used to drive the carrying portion (21) to lift up and down.

10. A semiconductor device, characterized by comprising: The semiconductor device comprises: a vacuum chamber (40), the chuck structure being arranged in the vacuum chamber (40); a detection mechanism (50) arranged in the vacuum chamber (40), the detection mechanism (50) being arranged close to the first chuck (10) of the chuck structure, and the detection mechanism (50) being used to detect the notch position of the wafer (30) located on the first chuck (10).

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