Substrate and electronic device

Abstract

The utility model provides a substrate and an electronic device, and the substrate comprises a substrate part which is used for connecting a radio frequency chip; the first connecting part is arranged on the substrate part, the first connecting part is used for being electrically connected with a power supply pin of the radio frequency chip, and the first connecting part is used for being connected with a first pin of the capacitor part; and the plurality of second connecting parts are arranged on the substrate part, the plurality of second connecting parts and the first connecting part are arranged at intervals, the plurality of second connecting parts are arranged around the first connecting part, and one of the second connecting parts is used for connecting a second pin of the capacitor part. According to the substrate and the electronic device provided by the invention, signal interference on the radio frequency chip can be reduced by adjusting the connection position of the second pin of the capacitor while the first pin of the capacitor is kept close to the power supply pin of the radio frequency chip; the working effect of the radio frequency chip can be improved, and the working effect of the electronic device can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic device production, and in particular to a substrate and an electronic device. BACKGROUND

[0002] The radio frequency chip can be applied to various electronic devices. The power supply end of the radio frequency chip can realize signal decoupling through the connection of the patch capacitor. However, the patch capacitor is subject to interference from wireless signals generated by other components in the electronic device and electrical signals in the signal lines, which can interfere with the operation of the radio frequency chip and affect the operation of the electronic device. SUMMARY

[0003] In view of the above, it is necessary to provide a substrate and an electronic device to solve the above-mentioned defects.

[0004] In a first aspect, an embodiment of the present application provides a substrate, comprising: a base member, the base member being configured to connect a radio frequency chip; a first connecting portion, the first connecting portion being disposed on the base member, the first connecting portion being configured to electrically connect with a power supply pin of the radio frequency chip, and the first connecting portion being configured to connect a first pin of a capacitor; and a plurality of second connecting portions, each of the plurality of second connecting portions being disposed on the base member, each of the plurality of second connecting portions being spaced apart from the first connecting portion, the plurality of second connecting portions being disposed around the first connecting portion, and one of the plurality of second connecting portions being configured to connect a second pin of the capacitor.

[0005] Optionally, the plurality of second connecting portions are spaced apart in a circumferential direction, and connecting lines of the plurality of second connecting portions form a semicircular arc or a quarter circular arc.

[0006] Optionally, the plurality of second connecting portions are connected to each other to form a continuous second connecting member, and the second connecting member has a shape of a semicircular ring or a quarter circular ring.

[0007] Optionally, a distance between the first connecting portion and the radio frequency chip is less than or equal to a distance between any of the second connecting portions and the radio frequency chip.

[0008] Optionally, an isolation member is formed on the substrate, and the isolation member extends between the first connecting portion and the radio frequency chip, between each of the second connecting portions and the first connecting portion, and between each of the second connecting portions and the radio frequency chip.

[0009] In a second aspect, the embodiments of the present application provide an electronic device, comprising a radio frequency chip, a capacitor and a substrate, the substrate comprising: a base member, the base member being connected to the radio frequency chip; a first connecting part, the first connecting part being arranged on the base member, the first connecting part being used for electrically connecting to a power supply pin of the radio frequency chip, the first connecting part being connected to a first pin of the capacitor; and a plurality of second connecting parts, each of the plurality of second connecting parts being arranged on the base member, each of the plurality of second connecting parts being arranged apart from the first connecting part, the plurality of second connecting parts being arranged around the first connecting part, and one of the plurality of second connecting parts being connected to a second pin of the capacitor.

[0010] Optionally, the plurality of second connecting parts are arranged apart in a circumferential direction, and lines of the plurality of second connecting parts form a semicircular arc or a quarter circular arc.

[0011] Optionally, the plurality of second connecting parts are connected to each other to form a continuous second connecting member, and the second connecting member has a semicircular ring shape or a quarter circular ring shape.

[0012] Optionally, a distance between the first connecting part and the radio frequency chip is less than or equal to a distance between any of the second connecting parts and the radio frequency chip.

[0013] Optionally, an isolation member is formed on the substrate, and the isolation member extends between the first connecting part and the radio frequency chip, between each of the second connecting parts and the first connecting part, and between each of the second connecting parts and the radio frequency chip.

[0014] By using the substrate and the electronic device provided in the present application, when the capacitor is installed, the worker can keep the first pin of the capacitor close to the power supply pin of the radio frequency chip without changing the position of the first pin of the capacitor, and reduce the signal interference on the capacitor by adjusting the connection position of the second pin of the capacitor, thereby reducing the signal interference on the radio frequency chip. The working effect of the radio frequency chip and the working effect of the electronic device can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 FIG. 1 is a structural schematic diagram of a substrate in an embodiment of the present application.

[0016] Figure 2 FIG. 2 is a schematic diagram of an electronic device in an embodiment of the present application.

[0017] Figure 3 FIG. 3 is a first partial schematic diagram of an electronic device in an embodiment of the present application.

[0018] Figure 4 FIG. 4 is a second partial schematic diagram of an electronic device in an embodiment of the present application.

[0019] Figure 5 FIG. 5 is a third partial schematic diagram of an electronic device in an embodiment of the present application.

[0020] Figure 6 FIG. 4 is a fourth partial schematic view of an electronic device according to an embodiment of the present application.

[0021] Main element symbol explanation:

[0022] 100, electronic device; 101, substrate; 102, radio frequency chip; 103, capacitor; 10, base member; 20, first connecting portion; 30, second connecting portion; 31, second connecting member; 40, isolation member. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application.

[0024] The plurality of in the present application refers to two or more. In addition, it should be understood that in the description of the present application, the words "first", "second", etc. are used only for the purpose of distinguishing the description, and cannot be understood as indicating or implying relative importance, nor can it be understood as indicating or implying order.

[0025] In the description of the embodiments of the present application, the words "exemplary" or "for example" are used to mean serving as an example, instance, or illustration. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or having more advantages than other embodiments or design solutions. Rather, the words "exemplary" or "for example" are used in the sense of presenting a related concept in a specific manner.

[0026] Please refer to Figure 1 and Figure 2 , Figure 1 and Figure 2 FIG. 1 shows an electronic device 100 provided by an embodiment of the present application.

[0027] In an embodiment, the electronic device 100 can include a substrate 101, a radio frequency chip 102, and a capacitor 103. The radio frequency chip 102 and the capacitor 103 can be fixedly installed on the substrate 101. The capacitor 103 can include a first pin and a second pin. The first pin can be electrically connected to a power supply pin of the radio frequency chip 102, and the second pin can be grounded. The circuit in which the radio frequency chip 102 is located can be decoupled through the capacitor 103.

[0028] It can be understood that the capacitor 103 can be a multilayer ceramic capacitor (MLCC). The first pin and the second pin of the capacitor 103 can be fixed on the substrate 101 by welding, and the pad connected with the first pin can be electrically connected to the power supply pin of the radio frequency chip 102 by a connecting wire or an engraved circuit, so as to realize the electrical connection between the first pin and the power supply pin of the radio frequency chip 102.

[0029] It can be understood that the electronic device 100 can further include a plurality of signal lines, a plurality of connection terminals and other electronic components, and the embodiments of the present application do not limit the same.

[0030] Please refer to Figure 3 In some embodiments, the substrate 101 can include a base 10, a first connection part 20 and a second connection part 30. The base 10 can be a hard plate made of insulating material. The first connection part 20 and the second connection part 30 are located on the same surface of the base 10. The first connection part 20 and the second connection part 30 can both be made of metal conductive material and are fixedly connected with the substrate 101. The first connection part 20 is arranged apart from the radio frequency chip 102 and is electrically connected with the power supply pin of the radio frequency chip 102. The first pin of the capacitor 103 can be fixedly connected and electrically connected with the first connection part 20. The number of the second connection part 30 can be multiple, and the multiple second connection parts 30 can be arranged apart from the radio frequency chip 102 and the first connection part 20. The multiple second connection parts 30 are arranged in a circumferential direction around the first connection part 20. The multiple second connection parts 30 can all be electrically connected with the second pin of the capacitor 103 and grounded, and the second pin of the capacitor 103 is fixedly connected and electrically connected with one of the multiple second connection parts 30.

[0031] In the embodiments of the present application, the fixed connection and the fixed installation are not limited in specific manners. For example, the fixed manner can include, but is not limited to, welding, integral molding and the like.

[0032] In the embodiments of the present application, the material of the first connection part 20 and the second connection part 30 is not limited in specific manners. For example, the material of the first connection part 20 and the second connection part 30 can be, but is not limited to, copper alloy. For example, the first connection part 20 and the second connection part 30 can be copper pads.

[0033] It can be understood that the radio frequency chip 102 can be fixedly connected with the pad fixedly connected on the base 10, so as to realize the fixed connection with the base 10 and the electrical connection with the signal line or the engraved circuit in the electronic device 100.

[0034] It can be understood that, in order to realize the decoupling effect on the circuit where the radio frequency chip 102 is located, the first pin of the capacitor 103 should be arranged close to the power supply pin of the radio frequency chip 102. In the embodiment of the present application, the first connecting part 20 is located on the side where the power supply pin of the radio frequency chip 102 is located, and the distance between the first connecting part 20 and the radio frequency chip 102 is less than or equal to the distance between any second connecting part 30 and the radio frequency chip 102, so as to shorten the distance between the first pin connected to the first connecting part 20 and the power supply pin of the radio frequency chip 102.

[0035] It can be understood that, when the staff assembles the electronic device 100, the first pin of the capacitor 103 can be fixed to the first connecting part 20 first, and then the second pin of the capacitor 103 can be connected to different second connecting parts 30 by rotating the capacitor 103, and the staff can detect how much signal interference the capacitor 103 receives when the second pin is located in different second connecting parts 30 by using the detection equipment (not shown) commonly used in the related field. In this way, the staff can select the second connecting part 30 that can make the capacitor 103 receive less signal interference according to the detection result, and fix the second pin in the second connecting part 30, so as to realize the installation of the capacitor 103 on the substrate 101.

[0036] In this way, the signal interference received by the capacitor 103 can be reduced by adjusting the connection position of the second pin of the capacitor 103 without changing the position of the first pin of the capacitor 103, so as to reduce the signal interference received by the radio frequency chip 102. The working effect of the radio frequency chip 102 can be improved, and the working effect of the electronic device 100 can be improved.

[0037] In the embodiment of the present application, the length direction and the width direction of the base member 10 can be defined as the first direction and the second direction respectively. For example, the first direction can be the X direction and the opposite direction thereof as shown in the drawing, and the second direction can be the Y direction and the opposite direction thereof as shown in the drawing. Figure 2 Figure 2 It can be understood that, in order to realize the decoupling effect on the circuit where the radio frequency chip 102 is located, the first pin of the capacitor 103 should be arranged close to the power supply pin of the radio frequency chip 102. In the embodiment of the present application, the first connecting part 20 is located on the side where the power supply pin of the radio frequency chip 102 is located, and the distance between the first connecting part 20 and the radio frequency chip 102 is less than or equal to the distance between any second connecting part 30 and the radio frequency chip 102, so as to shorten the distance between the first pin connected to the first connecting part 20 and the power supply pin of the radio frequency chip 102.

[0038] Please refer to Figure 4 In some embodiments, the plurality of second connecting parts 30 are arranged at intervals.

[0039] In the embodiment of the present application, when the plurality of second connecting parts 30 are not arranged at intervals, the shape of the lines of the plurality of second connecting parts 30 is not specifically limited. For example, as shown in the drawing, Figure 3 ​As shown in FIG. 6, when the two sides of the first connecting portion 20 in the first direction are not provided with electronic components and solder pads, the plurality of second connecting portions 30 can be arranged on the two sides of the first connecting portion 20 in the first direction and on the side away from the radio frequency chip 102 in the second direction, and the connecting lines of the plurality of second connecting portions 30 can be semicircular arcs. For example, as shown in FIG. 7, when one side of the first connecting portion 20 in the first direction is not provided with electronic components or solder pads, the plurality of second connecting portions 30 can be arranged on the side of the first connecting portion 20 in the first direction which is not provided with electronic components and solder pads, and on the side away from the radio frequency chip 102 in the second direction, so that the second connecting member 31 can be a quarter of a circular ring, and the first connecting portion 20 is arranged at the center of the circular ring. Figure 4 As shown in FIG. 7, when one side of the first connecting portion 20 in the first direction is not provided with electronic components or solder pads, the plurality of second connecting portions 30 can be arranged on the side of the first connecting portion 20 in the first direction which is not provided with electronic components and solder pads, and on the side away from the radio frequency chip 102 in the second direction, so that the second connecting member 31 can be a quarter of a circular ring, and the first connecting portion 20 is arranged at the center of the circular ring.

[0040] Please refer to FIGS. 6 and 7 Figure 5 and Figure 6 In some embodiments, among the plurality of second connecting portions 30, two adjacent second connecting portions 30 are fixedly connected to each other and cover each other. The plurality of second connecting portions 30 cooperatively form a continuous second connecting member 31.

[0041] In the embodiments of the present application, the shape of the second connecting member 31 formed by the plurality of second connecting portions 30 is not specifically limited. For example, as shown in FIG. 6, when the two sides of the first connecting portion 20 in the first direction are not provided with electronic components and solder pads, the plurality of second connecting portions 30 can be arranged on the two sides of the first connecting portion 20 in the first direction and on the side away from the radio frequency chip 102 in the second direction, so that the second connecting member 31 can be a semicircular ring, and the first connecting portion 20 is arranged at the center of the circular ring. For example, as shown in FIG. 7, when one side of the first connecting portion 20 in the first direction is not provided with electronic components or solder pads, the plurality of second connecting portions 30 can be arranged on the side of the first connecting portion 20 in the first direction which is not provided with electronic components and solder pads, and on the side away from the radio frequency chip 102 in the second direction, so that the second connecting member 31 can be a quarter of a circular ring, and the first connecting portion 20 is arranged at the center of the circular ring. Figure 5 Figure 6 As shown in FIG. 7, when one side of the first connecting portion 20 in the first direction is not provided with electronic components or solder pads, the plurality of second connecting portions 30 can be arranged on the side of the first connecting portion 20 in the first direction which is not provided with electronic components and solder pads, and on the side away from the radio frequency chip 102 in the second direction, so that the second connecting member 31 can be a quarter of a circular ring, and the first connecting portion 20 is arranged at the center of the circular ring.

[0042] In some embodiments, on the side of the substrate 10 provided with the first connecting portion 20 and the second connecting portion 30, the area of the substrate 10 which is not covered by the first connecting portion 20, the second connecting portion 30 and other solder pads and engraved circuits forms an isolation member 40. The isolation member 40 can extend between the first connecting portion 20 and the radio frequency chip 102, between the first connecting portion 20 and each second connecting portion 30, and between the radio frequency chip 102 and each second connecting portion 30, so as to achieve the spaced arrangement of the first connecting portion 20, the second connecting portion 30 and the radio frequency chip 102.

[0043] ​It can be understood that the isolation piece 40 is made of insulating material, and the isolation piece 40 can form a solder mask on the circuit board.

[0044] In the embodiments of the present application, the shape of the first connecting portion 20 is not specifically limited. For example, the first connecting portion 20 can be circular. For another example, the first connecting portion 20 can be rectangular, and the first connecting portion 20 can extend along the first direction or the second direction, or can extend along a direction that forms an acute angle with the first direction and the second direction. In this way, when installing the capacitor 103, the worker can move the capacitor 103 while rotating the capacitor 103, so that the first pin of the capacitor 103 moves on the first connecting portion 20, so as to install the capacitor 103 to a position where the capacitor 103 is less interfered by signals.

[0045] Similarly, in the embodiments of the present application, the shape of the second connecting portion 30 when the plurality of second connecting portions 30 are arranged at intervals is not specifically limited. For example, the second connecting portion 30 can be circular. For another example, the second connecting portion 30 can be rectangular, and the second connecting portion 30 can extend along the first direction or the second direction, or can extend along a direction that forms an acute angle with the first direction and the second direction.

[0046] In some embodiments, the number of the substrate 101 in the electronic device 100 can be multiple, and the plurality of substrates 101 can be arranged in a stacked manner, and adjacent substrates 101 are arranged at intervals. The first connecting portion 20, the second connecting portion 30, the radio frequency chip 102 and the capacitor 103 can be arranged on each substrate 101.

[0047] Through the substrate 101 and the electronic device 100 provided by the embodiments of the present application, when installing the capacitor 103, the worker can adjust the connection position of the second pin of the capacitor 103 without changing the position of the first pin of the capacitor 103, so as to reduce the signal interference received by the capacitor 103, and further reduce the signal interference received by the radio frequency chip 102. The working effect of the radio frequency chip 102 can be improved, and the working effect of the electronic device 100 can be improved.

[0048] It is apparent for those skilled in the art that the present application is not limited to the details of the above-described exemplary embodiments, but can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the above-described embodiments of the present application should be considered in all aspects as exemplary and not restrictive, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended to include all changes falling within the meaning and range of equivalents of the claims.

Claims

1. A substrate, characterized by, The application relates to a substrate for connecting a radio frequency chip, comprising: a substrate for connecting a radio frequency chip; a first connecting part arranged on the substrate and used for electrically connecting a power supply pin of the radio frequency chip, the first connecting part being used for connecting a first pin of a capacitor; a plurality of second connecting parts, each of which is arranged on the substrate and is spaced apart from the first connecting part, the plurality of second connecting parts being arranged around the first connecting part, and one of the second connecting parts being used for connecting a second pin of the capacitor.

2. The substrate of claim 1, wherein, The plurality of second connecting parts are arranged in a circumferential direction, and the connecting lines of the plurality of second connecting parts form a semicircular arc or a quarter circular arc.

3. The substrate of claim 1, wherein, The plurality of second connecting parts are connected to each other to form a continuous second connecting part, and the second connecting part is in a semicircular ring shape or a quarter circular ring shape.

4. The substrate of claim 1, wherein, The distance between the first connecting part and the radio frequency chip is less than or equal to the distance between any of the second connecting parts and the radio frequency chip.

5. The substrate of claim 1, wherein, An isolation part is arranged on the substrate, and the isolation part extends to the space between the first connecting part and the radio frequency chip, the space between each of the second connecting parts and the first connecting part, and the space between each of the second connecting parts and the radio frequency chip.

6. An electronic device, comprising: The application relates to a substrate for connecting a radio frequency chip, comprising: a substrate for connecting a radio frequency chip; a first connecting part arranged on the substrate and used for electrically connecting a power supply pin of the radio frequency chip, the first connecting part being used for connecting a first pin of a capacitor; a plurality of second connecting parts, each of which is arranged on the substrate and is spaced apart from the first connecting part, the plurality of second connecting parts being arranged around the first connecting part, and one of the second connecting parts being used for connecting a second pin of the capacitor. 7.The electronic device of claim 6, wherein, The plurality of second connecting parts are arranged in a circumferential direction, and the connecting lines of the plurality of second connecting parts form a semicircular arc or a quarter circular arc. 8.The electronic device of claim 6, wherein, The plurality of second connecting parts are connected to each other to form a continuous second connecting part, and the second connecting part is in a semicircular ring shape or a quarter circular ring shape. 9.The electronic device of claim 6, wherein, The distance between the first connecting part and the radio frequency chip is less than or equal to the distance between any of the second connecting parts and the radio frequency chip. 10.The electronic device of claim 6, wherein, An isolation part is arranged on the substrate, and the isolation part extends to the space between the first connecting part and the radio frequency chip, the space between each of the second connecting parts and the first connecting part, and the space between each of the second connecting parts and the radio frequency chip.

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