Power device packaging structure, battery protection board, battery and terminal equipment

Abstract

The utility model discloses a power device packaging structure, a battery protection board, a battery and terminal equipment, and belongs to the field of power device packaging. The power device packaging structure comprises a first MOS tube, a metal connecting layer and a second MOS tube, the metal connecting layer is provided with a first surface and a second surface which are opposite in the thickness direction of the metal connecting layer, the first MOS tube is arranged on the first surface, the second MOS tube is arranged on the second surface, and the first MOS tube and the second MOS tube are opposite in position in the thickness direction of the metal connecting layer.

Description

TECHNICAL FIELD

[0001] The application belongs to the field of power device packaging, and particularly relates to a power device packaging structure, a battery protection plate, a battery and a terminal device. BACKGROUND

[0002] With the development of science and technology, terminal devices are applied more and more widely. For example, terminal devices such as mobile phones and notebooks have become indispensable articles in people's daily life. Usually, a battery is installed in a terminal device, and the terminal device is provided with electric energy by the battery, so that the terminal device can operate normally. The battery usually has a battery protection plate, and a power device is arranged on the battery protection plate. The power device is packaged on the battery protection plate, so that the battery protection plate can realize a specific function. For example, a MOS tube is packaged on the battery protection plate. However, in the related art, after the power device is packaged on the battery protection plate, the on-resistance between the power devices is large, so that the on-resistance of the battery protection plate is increased. CONTENT OF THE INVENTION

[0003] The purpose of the embodiments of the application is to provide a power device packaging structure, a battery protection plate, a battery and a terminal device, and at least solve the problem that the on-resistance between the power devices is large, so that the on-resistance of the battery protection plate is increased.

[0004] In a first aspect, the embodiments of the application provide a power device packaging structure, which comprises: a first MOS tube, a metal connection layer and a second MOS tube.

[0005] The metal connection layer has opposite first and second surfaces in the thickness direction of the metal connection layer, the first MOS tube is arranged on the first surface, the second MOS tube is arranged on the second surface, and the first MOS tube and the second MOS tube are opposite in position in the thickness direction of the metal connection layer.

[0006] Optionally, the first MOS tube has a first drain, the second MOS tube has a second drain, the first drain is arranged on the first surface, the second drain is arranged on the second surface, and the first drain and the second drain are opposite in position in the thickness direction of the metal connection layer.

[0007] Optionally, the first drain is welded to the first surface, and the second drain is welded to the second surface.

[0008] Optionally, the first MOS tube is provided with a first source and a first gate on the surface away from the first surface, and the second MOS tube is provided with a second source and a second gate on the surface away from the second surface.

[0009] Optionally, the first source electrode is connected with a first output pad, the first gate electrode is connected with a second output pad, the second source electrode is connected with a third output pad, and the second gate electrode is connected with a fourth output pad.

[0010] Optionally, the number of the first output pads is multiple, and the multiple first output pads are distributed at intervals.

[0011] Optionally, the first MOS transistor and the second MOS transistor each include one of an N-type MOS transistor and a P-type MOS transistor.

[0012] In a second aspect, an embodiment of the present application provides a battery protection plate, which includes a battery protection plate body and the power device package structure in any one of the above-mentioned first aspect.

[0013] The first MOS transistor, the metal connection layer, and the second MOS transistor are all arranged in the battery protection plate body.

[0014] In a third aspect, an embodiment of the present application provides a battery, which includes the battery protection plate in the above-mentioned second aspect.

[0015] In a fourth aspect, an embodiment of the present application provides a terminal device, which includes the battery in the above-mentioned third aspect.

[0016] In the embodiment of the present application, since the first MOS transistor is arranged on the first surface of the metal connection layer, the second MOS transistor is arranged on the second surface of the metal connection layer, and the first MOS transistor and the second MOS transistor are opposite in the thickness direction of the metal connection layer, when the first MOS transistor and the second MOS transistor need to be turned on, the current flowing through the first MOS transistor only needs to flow through the metal connection layer in the thickness direction of the metal connection layer, and then can flow into the second MOS transistor, that is, the conduction resistance between the first MOS transistor and the second MOS transistor is the conduction resistance in the thickness direction of the metal connection layer, so that the conduction resistance between the first MOS transistor and the second MOS transistor is small. That is, in the embodiment of the present application, by arranging the first MOS transistor on the first surface of the metal connection layer, arranging the second MOS transistor on the second surface of the metal connection layer, and arranging the first MOS transistor and the second MOS transistor opposite in the thickness direction of the metal connection layer, which is equivalent to that the first MOS transistor and the second MOS transistor are symmetrical about the metal connection layer, and the conduction resistance between the first MOS transistor and the second MOS transistor is the conduction resistance in the thickness direction of the metal connection layer, so that the conduction resistance between the first MOS transistor and the second MOS transistor is small, thereby when the power device package structure is applied to the battery protection plate, the conduction resistance of the battery protection plate is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 Fig. 1 is a schematic diagram of a power device packaging structure according to an embodiment of the present application;

[0018] Figure 2 Fig. 2 is a schematic diagram of a first MOS transistor with a first source and a first drain according to an embodiment of the present application;

[0019] Figure 3 Fig. 3 is a schematic diagram of a second MOS transistor with a second source and a second drain according to an embodiment of the present application;

[0020] Figure 4 Fig. 4 is a schematic diagram of a first MOS transistor with a first output pad and a second output pad according to an embodiment of the present application;

[0021] Figure 5 Fig. 5 is a schematic diagram of a second MOS transistor with a third output pad and a fourth output pad according to an embodiment of the present application;

[0022] Figure 6 Fig. 6 is a schematic diagram of a first MOS transistor and a second MOS transistor in a power device packaging structure according to an embodiment of the present application.

[0023] Reference signs:

[0024] 10: first MOS transistor; 11: connection region; 12: gate connection layer; 13: doped region; 14: oxide layer; 15: polysilicon layer; 16: epitaxial layer; 17: substrate; 101: first source; 102: first gate; 103: first output pad; 104: second output pad; 20: metal connection layer; 201: first surface; 202: second surface; 30: second MOS transistor; 301: second source; 302: second gate; 303: third output pad; 304: fourth output pad. DETAILED DESCRIPTION

[0025] The terms "first", "second" in the specification and claims of the present application can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / ", generally means that the front and rear associated objects are in an "or" relationship.

[0026] In the description of the present application, it needs to be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0027] In the description of the present application, it needs to be understood that the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, or internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0028] Referring to Figure 1 , a schematic diagram of a power device packaging structure provided by an embodiment of the present application is shown; referring to Figure 2 , a schematic diagram of a first MOS tube provided with a first source and a first drain is shown; referring to Figure 3 , a schematic diagram of a second MOS tube provided with a second source and a second drain is shown; referring to Figure 4 , a schematic diagram of a first MOS tube provided with a first output pad and a second output pad is shown; referring to Figure 5 , a schematic diagram of a second MOS tube provided with a third output pad and a fourth output pad is shown; referring to Figure 6 , a schematic diagram of a first MOS tube and a second MOS tube in a power device packaging structure provided by an embodiment of the present application is shown. As Figures 1 to 6 shown, the power device packaging structure includes a first MOS tube 10, a metal connection layer 20, and a second MOS tube 30.

[0029] The metal connection layer 20 has opposite first and second surfaces 201 and 202 in the thickness direction of the metal connection layer 20, the first MOS tube 10 is disposed on the first surface 201, the second MOS tube 30 is disposed on the second surface 202, and the first MOS tube 10 and the second MOS tube 30 are located opposite to each other in the thickness direction of the metal connection layer 20.

[0030] In the embodiment of the present application, since the first MOS tube 10 is arranged on the first surface 201 of the metal connection layer 20, the second MOS tube 30 is arranged on the second surface 202 of the metal connection layer 20, and the first MOS tube 10 and the second MOS tube 30 are opposite to each other in the thickness direction of the metal connection layer 20, when the first MOS tube 10 and the second MOS tube 30 need to be turned on, the current flowing through the first MOS tube 10 only needs to flow through the metal connection layer 20 in the thickness direction of the metal connection layer 20, and then flow into the second MOS tube 30, that is, the conduction resistance between the first MOS tube 10 and the second MOS tube 30 is the conduction resistance in the thickness direction of the metal connection layer 20, so that the conduction resistance between the first MOS tube 10 and the second MOS tube 30 is small. That is, in the embodiment of the present application, by arranging the first MOS tube 10 on the first surface 201 of the metal connection layer 20, arranging the second MOS tube 30 on the second surface 202 of the metal connection layer 20, and arranging the first MOS tube 10 and the second MOS tube 30 opposite to each other in the thickness direction of the metal connection layer 20, which is equivalent to that the first MOS tube 10 and the second MOS tube 30 are symmetrical about the metal connection layer 20, and the conduction resistance between the first MOS tube 10 and the second MOS tube 30 is the resistance in the thickness direction of the metal connection layer 20, so that the conduction resistance between the first MOS tube 10 and the second MOS tube 30 is small, thereby facilitating reducing the conduction resistance of the battery protection plate when the power device packaging structure is applied to the battery protection plate.

[0031] In the related art, the power device packaging structure includes a first MOS tube 10, a second MOS tube 30 and a circuit board, the circuit board has a first surface 201, the first MOS tube 10 and the second MOS tube 30 are arranged on the first surface 201, that is, the first MOS tube 10 and the second MOS tube 30 are packaged on the first surface 201 of the circuit board, and the first MOS tube 10 and the second MOS tube 30 are distributed with a spacing. When the first MOS tube 10 and the second MOS tube 30 need to be turned on, the current flowing through the first MOS tube 10 flows into the circuit board, and then flows into the second MOS tube 30. However, the spacing between the first MOS tube 10 and the second MOS tube 30 causes the conduction resistance between the first MOS tube 10 and the second MOS tube 30 to be large. In the embodiment of the present application, the first MOS tube 10 and the second MOS tube 30 are arranged on the first surface 201 and the second surface 202 of the metal connection layer 20 respectively, which is equivalent to that the first MOS tube 10 and the second MOS tube 30 are symmetrical about the metal connection layer 20, and the first MOS tube 10 and the second MOS tube 30 are arranged in a back-to-back manner, thereby greatly reducing the conduction resistance between the first MOS tube 10 and the second MOS tube 30, and reducing the conduction resistance of the power device packaging structure.

[0032] It should be noted that in the embodiments of the present application, the material of the metal connecting layer 20 can be set according to actual needs, for example, the metal connecting layer 20 is a silver layer, and for another example, the metal connecting layer 20 is a copper layer. In this regard, the embodiments of the present application are not limited here.

[0033] In addition, in the embodiments of the present application, the thickness of the metal connecting layer 20 can be set according to actual needs, for example, the thickness of the metal connecting layer 20 is 1 millimeter, and for another example, the thickness of the metal connecting layer 20 is 2 millimeters. In this regard, the embodiments of the present application are not limited here.

[0034] In addition, in the embodiments of the present application, the first MOS tube 10 and the second MOS tube 30 can each include one of an N-type MOS tube and a P-type MOS tube. That is, the first MOS tube 10 can be an N-type MOS tube or a P-type MOS tube, and the second MOS tube 30 can also be an N-type MOS tube or a P-type MOS tube, so that when the power packaging device is applied to the battery protection board, the type of the required power device can be selected according to actual needs, so that the selection range of the power device is increased, and then a suitable power device can be selected to ensure that the battery protection board can effectively protect the battery.

[0035] In addition, in the embodiments of the present application, the first MOS tube 10 and the second MOS tube 30 can each include a connection region 11, a gate connecting layer 12, a doped region 13, an oxide layer 14, a polysilicon layer 15, an epitaxial layer 16, and a substrate 17. The doped region 13 can be an N-type doped region 13, and of course, it can also be a P-type doped region 13.

[0036] In addition, in some embodiments, the first MOS tube 10 can have a first drain, and the second MOS tube 30 can have a second drain, the first drain is disposed on the first surface 201, the second drain is disposed on the second surface 202, and the first drain and the second drain are located opposite to each other in the thickness direction of the metal connecting layer 20.

[0037] Through such a setting, once the current flows into the first MOS tube 10, the current can flow through the metal connecting layer 20, and then flow into the drain of the second MOS tube 30, so that the first MOS tube 10 and the second MOS tube 30 are conductive, thereby ensuring that the battery protection board can realize a specific function when the device packaging structure is applied to the battery protection board.

[0038] In addition, in some embodiments, the first drain can be welded to the first surface 201, and the second drain can be welded to the second surface 202. Through such an arrangement, the first MOS tube 10 can be firmly connected to the first surface 201 of the metal connecting layer 20, avoiding the problem that the first MOS tube 10 is prone to falling off from the first surface 201 of the metal connecting layer 20, and the first MOS tube 10 and the metal connecting layer 20 can conduct electricity. Similarly, the second MOS tube 30 can be firmly connected to the second surface 202 of the metal connecting layer 20, avoiding the problem that the second MOS tube 30 is prone to falling off from the second surface 202 of the metal connecting layer 20, and the second MOS tube 30 and the metal connecting layer 20 can conduct electricity, thereby ensuring that the first MOS tube 10 and the second MOS tube 30 can conduct electricity.

[0039] It should be noted that the first surface 201 of the metal connecting layer 20 can be provided with a pad, and the first drain is welded to the pad of the first surface 201, so that the first MOS tube 10 is fixed to the first surface 201 of the metal connecting layer 20. Of course, the first surface 201 of the metal connecting layer 20 can also not be provided with a pad, and the first drain of the first MOS tube 10 can be directly welded to the first surface 201 of the metal connecting layer 20. For this, the embodiments of the present application are not limited here. In addition, the second surface 202 of the metal connecting layer 20 can be provided with a pad, and the second drain is welded to the pad of the second surface 202, so that the second MOS tube 30 is fixed to the second surface 202 of the metal connecting layer 20. Of course, the second surface 202 of the metal connecting layer 20 can also not be provided with a pad, and the second drain of the second MOS tube 30 can be directly welded to the second surface 202 of the metal connecting layer 20. For this, the embodiments of the present application are not limited here.

[0040] In addition, in some embodiments, the first source 101 and the first gate 102 can be arranged on the surface of the first MOS tube 10 away from the first surface 201, and the second source 301 and the second gate 302 can be arranged on the surface of the second MOS tube 30 away from the second surface 202. Through such an arrangement, when the power device packaging structure is applied in the battery protection plate, i.e., the power device packaging structure is embedded in the battery protection plate, the first source 101 and the first gate 102 arranged on the first surface 201 of the first MOS tube 10 can facilitate the connection of the connection layer in the battery protection plate with the first source 101 and the first gate 102 of the first MOS tube 10; similarly, the second source 301 and the second gate 302 arranged on the second surface 202 of the second MOS tube 30 can facilitate the connection of the connection layer in the battery protection plate with the second source 301 and the second gate 302 of the second MOS tube 30, so that after the connection layer in the battery protection plate connects the first source 101, the first gate 102, the second source 301 and the second gate 302, the first MOS tube 10 and the second MOS tube 30 can be electrically connected, and the battery protection plate can achieve a specific function. That is, by arranging the first source 101 and the first gate 102 on the surface of the first MOS tube 10 away from the first surface 201, and arranging the second source 301 and the second gate 302 on the surface of the second MOS tube 30 away from the second surface 202, when the power device is applied to the battery protection plate, the first MOS tube 10 can be connected with the connection layer in the battery protection plate, and the second MOS tube 30 can also be connected with the connection layer in the battery protection plate.

[0041] In addition, in some embodiments, the first source 101 can be connected with a first output pad 103, the first gate 102 can be connected with a second output pad 104, the second source 301 can be connected with a third output pad 303, and the second gate 302 can be connected with a fourth output pad 304.

[0042] By such arrangement, when the power package device is applied to the battery protection plate, the first output pad 103 and the second output pad 104 can be welded to the connecting layer in the battery protection plate, so as to realize the connection between the connecting layer in the battery protection plate and the first source 101 and the first gate 102 of the first MOS tube 10; similarly, the third output pad 303 and the fourth output pad 304 can also be welded to the connecting layer in the battery protection plate, so as to realize the connection between the connecting layer in the battery protection plate and the second source 301 and the second gate 302 of the second MOS tube 30. That is, by arranging the first output pad 103, the second output pad 104, the third output pad 303 and the fourth output pad 304, when the power package device is applied to the battery protection plate, the first MOS tube 10 can be conveniently connected to the connecting layer in the battery protection plate, and the second MOS tube 30 can also be conveniently connected to the connecting layer in the battery protection plate.

[0043] It should be noted that the shape of the first output pad 103, the shape of the second output pad 104, the shape of the third output pad 303 and the shape of the fourth output pad 304 can be set according to actual needs. For example, the shape of the first output pad 103 and the shape of the third output pad 303 are oval, and the shape of the second output pad 104 and the shape of the fourth output pad 304 are circular; for another example, the shape of the first output pad 103 and the shape of the third output pad 303 are rectangular, and the shape of the second output pad 104 and the shape of the fourth output pad 304 are triangular. In this regard, the embodiments of the present application are not limited here.

[0044] In addition, in the embodiments of the present application, the first output pad 103 can cover the first source 101, that is, the projection of the first output pad 103 on the first surface 201 covers the projection of the first source 101 on the first surface 201. Of course, the projection of the first output pad 103 on the first surface 201 can also coincide with the projection of the first source 101 on the first surface 201, and the projection of the first output pad 103 on the first surface 201 can also be located inside the projection of the first source 101 on the first surface 201. In this regard, the embodiments of the present application are not limited here. The relationship between the projection of the second output pad 104 on the first surface 201 and the projection of the first gate 102 on the first surface 201, the relationship between the projection of the third output pad 303 on the second surface 202 and the projection of the second source 301 on the second surface 202, and the relationship between the projection of the fourth output pad 304 on the second surface 202 and the projection of the second gate 302 on the second surface 202 can all refer to the relationship between the projection of the first output pad 103 on the first surface 201 and the projection of the first source 101 on the first surface 201, and will not be repeated here.

[0045] In addition, in some embodiments, the number of the first output pads 103 is multiple, the multiple first output pads 103 are distributed at intervals, the number of the third output pads 303 is multiple, and the multiple third output pads 303 are distributed at intervals.

[0046] Through such a setting, when the power packaging device is applied to the battery protection plate, once the connecting layer in the battery protection plate is welded with the first output pads 103, the multiple first output pads 103 distributed at intervals can effectively avoid mutual interference between the first output pads 103, thereby avoiding the problem of mutual interference when the current is input or output in the first MOS tube 10. Similarly, the multiple third output pads 303 distributed at intervals can effectively avoid mutual interference between the third output pads 303, thereby avoiding the problem of mutual interference when the current is input or output in the second MOS tube 30.

[0047] It should be noted that the number of the first output pads 103 can be set according to actual needs, for example, the number of the first output pads 103 is 2, and for another example, the number of the first output pads 103 is 3. In this regard, the embodiments of the present application are not limited here. In addition, the number of the third output pads 303 can be set according to actual needs, for example, the number of the third output pads 303 is 2, and for another example, the number of the third output pads 303 is 3. In this regard, the embodiments of the present application are not limited here. Among them, the number of the first source electrodes 101 is equal to the number of the first output pads 103, and the number of the second source electrodes 301 is equal to the number of the third output pads 303.

[0048] In addition, in the embodiments of the present application, the multiple first output pads 103 can be distributed at intervals and parallel to each other, and similarly, the multiple third output pads 303 can be distributed at intervals and parallel to each other.

[0049] In addition, in the embodiments of the present application, when the number of the first output pads 103 is 3, the three first output pads 103 can be arranged in sequence and parallel to each other, and the second output pad 104 can be located between two first output pads 103; when the number of the third output pads 303 is 3, the three third output pads 303 can be arranged in sequence and parallel to each other, and the fourth output pad 304 can be located between two third output pads 303.

[0050] In the embodiment of the present application, since the first MOS tube 10 is arranged on the first surface 201 of the metal connection layer 20, the second MOS tube 30 is arranged on the second surface 202 of the metal connection layer 20, and the first MOS tube 10 and the second MOS tube 30 are opposite in the thickness direction of the metal connection layer 20, when the first MOS tube 10 and the second MOS tube 30 need to be turned on, the current flowing through the first MOS tube 10 only needs to flow through the metal connection layer 20 in the thickness direction of the metal connection layer 20, and then flow into the second MOS tube 30, that is, the conduction resistance between the first MOS tube 10 and the second MOS tube 30 is the conduction resistance in the thickness direction of the metal connection layer 20, so that the conduction resistance between the first MOS tube 10 and the second MOS tube 30 is small. That is, in the embodiment of the present application, by arranging the first MOS tube 10 on the first surface 201 of the metal connection layer 20, arranging the second MOS tube 30 on the second surface 202 of the metal connection layer 20, and arranging the first MOS tube 10 and the second MOS tube 30 opposite in the thickness direction of the metal connection layer 20, it is equivalent to that the first MOS tube 10 and the second MOS tube 30 are symmetrical about the metal connection layer 20, and the conduction resistance between the first MOS tube 10 and the second MOS tube 30 is the resistance in the thickness direction of the metal connection layer 20, so that the conduction resistance between the first MOS tube 10 and the second MOS tube 30 is small, thereby facilitating reducing the conduction resistance of the battery protection plate when the power device packaging structure is applied to the battery protection plate.

[0051] The embodiment of the present application provides a battery protection plate, which comprises a battery protection plate body and the power device packaging structure in any one of the above-mentioned embodiments.

[0052] The embodiment of the present application provides a battery, which comprises the battery protection plate in any one of the above-mentioned embodiments.

[0053] The embodiment of the present application provides a terminal device, which comprises the battery in any one of the above-mentioned embodiments.

[0054] It should be noted that, in the embodiment of the present application, the terminal device includes but is not limited to a controller, a smart device, a terminal product, and the like. The smart device is, for example, a smart phone, a smart television, a smart speaker, a smart robot, a VR device, an AR device, an XR device, and the like. The terminal product includes a personal computer, a tablet computer, and the like.

[0055] In the description of the application, reference has been made to descriptive terms such as "one embodiment", "some embodiments", "an embodiment", "example", "specific example" or "some examples" etc. Such terminology means that a particular feature, structure, material or characteristic being described is included in at least one embodiment or example of the application. The illustrative appearances of such terminology in various places in the specification does not necessarily refer to the same embodiment or example. Moreover, it is appreciated that the specific features, structures, materials or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0056] Although embodiments of the present application have been shown and described, it would be appreciated by those skilled in the art that changes, modifications, alternatives and variations to these embodiments could be made without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. A power device package structure, characterized by, The power device packaging structure comprises a first MOS tube, a metal connecting layer, and a second MOS tube. The metal connecting layer has opposite first and second surfaces in the thickness direction of the metal connecting layer, the first MOS tube is disposed on the first surface, the second MOS tube is disposed on the second surface, and the first MOS tube and the second MOS tube are located opposite to each other in the thickness direction of the metal connecting layer.

2. The power device package structure of claim 1, wherein, The first MOS tube has a first drain, and the second MOS tube has a second drain, the first drain is disposed on the first surface, the second drain is disposed on the second surface, and the first drain and the second drain are located opposite to each other in the thickness direction of the metal connecting layer.

3. The power device package structure of claim 2, wherein, The first drain is welded to the first surface, and the second drain is welded to the second surface.

4. The power device package structure of claim 2, wherein, The first MOS tube is provided with a first source and a first gate on the surface away from the first surface, and the second MOS tube is provided with a second source and a second gate on the surface away from the second surface.

5. The power device package structure of claim 4, wherein, The first source is connected with a first output pad, the first gate is connected with a second output pad, the second source is connected with a third output pad, and the second gate is connected with a fourth output pad.

6. The power device package structure of claim 5, wherein, The number of the first output pads is multiple, and the multiple first output pads are distributed at intervals, the number of the third output pads is multiple, and the multiple third output pads are distributed at intervals.

7. The power device package structure of claim 1, wherein, The first MOS tube and the second MOS tube each comprise one of an N-type MOS tube and a P-type MOS tube.

8. A battery protection plate, characterized in that, The battery protection plate comprises a battery protection plate body and the power device packaging structure of any one of claims 1-7. The first MOS tube, the metal connecting layer, and the second MOS tube are all disposed in the battery protection plate body.

9. A battery, characterized by The battery comprises the battery protection plate of claim 8.

10. A terminal device, comprising: The terminal device comprises the battery of claim 9.

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