Ceramic dielectric resonator structure
By designing grooves and protrusions in the ceramic dielectric resonator and fixing it with adhesive, the problem of uneven adhesive application on the contact surface is solved, thermal conductivity and shock resistance are improved, and the stability and reliability of the resonator are ensured.
Patent Information
- Application Number
- CN202423279860.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2034-12-30
AI Technical Summary
In the fabrication of ceramic dielectric resonators, traditional fixed structures can easily lead to uneven adhesive thickness on the contact surface, resulting in poor thermal conductivity and shock resistance, which is especially noticeable when pressure and temperature are not properly controlled.
Design a ceramic dielectric resonator structure, wherein the bottom of the resonator has a groove for easy embedding of a support pad, the top of the support pad has an annular array of protrusions, and the groove has a concave hole. Combined with adhesive fixation, a uniform colloid distribution and rigid support are formed.
This achieves uniform distribution of the colloid and robust bonding, improves shock resistance and thermal conductivity, reduces dependence on temperature and pressure control, and ensures stable installation and operation of the resonator.
Smart Images
Figure CN223599005U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to medium resonator technical field, concretely is a ceramic medium resonator structure. BACKGROUND
[0002] As a new microwave element, medium resonator, especially in hybrid microwave integrated circuit, helps to realize miniaturization and high frequency of microwave circuit and system, and is widely used in microwave circuit. The ceramic medium resonator can keep frequency stable in wide temperature range, and has very low thermal expansion coefficient, so that the frequency of the ceramic medium resonator changes very little when the temperature changes, and has very high temperature stability. This makes it have very high application value in occasions requiring high-precision frequency signals. At the same time, the ceramic medium resonator can be mass-produced, so the cost is relatively low, which is conducive to wide application in the electronic field.
[0003] In production and processing, the ceramic medium resonator is mainly composed of a cylindrical ceramic resonator and a supporting pad below. In the traditional processing process, glue is brushed on the two contact surfaces, and then the clamp is heated and a certain pressure is applied to the upper and lower parts, so that the glue between the contact surfaces is solidified, and the resonator and the supporting pad are fixed. However, the main problem is that when the pressure applied during processing is too large and the heating temperature curve is not suitable, the thickness of the glue brushed on the contact surface is uneven, resulting in poor heat conductivity and shock resistance. In order to reduce such situations, the utility model provides an improved fixing structure of ceramic medium resonator and supporting pad to improve the above problems. UTILITY MODEL CONTENT
[0004] The utility model aims at providing a ceramic medium resonator structure which can reduce the problems of excessive pressure and unstable temperature of the resonator and the supporting pad contact surface during processing, and the poor heat conductivity and shock resistance caused by uneven thickness of the resonator and the contact surface, so as to solve the problems proposed in the above background technology.
[0005] To achieve the above purpose, the utility model provides the following technical scheme:
[0006] A ceramic medium resonator structure includes a resonator body and a supporting pad. The bottom of the resonator body is provided with a groove for embedding the supporting pad. The top of the supporting pad is embedded in the inside of the groove, and the connection between the resonator body and the supporting pad is provided with adhesive.
[0007] Preferably, the top of the supporting pad is provided with three groups of protrusions in an annular array. The inner top of the groove is provided with recesses matched with the protrusions. The protrusions are located in the recesses.
[0008] Preferably, the depth of the groove is 2mm±0.2mm, and the height of the convex is set to 0.1mm-0.2mm.
[0009] Preferably, the diameter of the support pad is set to 12mm±0.2mm, and the length of the support pad is set to 6.4mm±0.2mm.
[0010] Preferably, the resonant body is composed of ceramic, and the dielectric constant (ER) of the resonant body is 40±1, and the material of the support pad is composed of PEI.
[0011] Preferably, the resonant body and the support pad are both set to a cylindrical shape.
[0012] Preferably, the resonant body is provided with a first through hole in the middle, and the support pad is provided with a second through hole in the middle and communicated with the first through hole.
[0013] Compared with the prior art, the utility model has the beneficial effects that:
[0014] 1. After brushing glue, the uneven thickness of the contact surface glue does not appear, the embedded structure of the support pad and the resonant body makes the glue distribution more uniform, and the contact area is larger;
[0015] 2. There is rigid support between the support pad and the resonant body, so that the connection is more stable;
[0016] 3. In the processing process, the control of the heating temperature curve does not need to be considered;
[0017] 4. When heating and curing in the clamp, the problem of pressure control does not need to be considered too much;
[0018] 5. The existence of the convex increases the friction between the support pad and the resonant body, prevents displacement or loosening in the long-term use process, which helps to ensure that the resonant body can maintain a stable installation position and working state, and improves the overall reliability. BRIEF DESCRIPTION OF DRAWINGS
[0019] Figure 1 It is a side view of the utility model three-dimensional structure schematic diagram;
[0020] Figure 2 It is a resonant body and support pad structure schematic diagram of the utility model;
[0021] Figure 3 It is a resonant body bottom structure schematic diagram;
[0022] Figure 4 It is a utility model cut structure schematic diagram.
[0023] In the figure: 1, resonant body; 2, support pad; 3, groove; 4, protrusion; 5, recess; 6, first through hole; 7, second through hole. DETAILED DESCRIPTION
[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0025] Please refer to Figures 1-4 The present application provides a technical solution:
[0026] The ceramic dielectric resonator structure comprises a resonant body 1 and a support pad 2, and the bottom of the resonant body 1 is provided with a groove 3 for embedding the support pad 2, the top of the support pad 2 is embedded in the inside of the groove 3, and the connection between the resonant body 1 and the support pad 2 is provided with adhesive.
[0027] Further, the top of the support pad 2 is provided with three groups of protrusions 4 in a ring array, the inner top of the groove 3 is provided with recesses 5 matched with the protrusions 4, the protrusions 4 are located in the recesses 5, and the design of the protrusions 4 can significantly increase the contact area between the support pad 2 and the resonant body 1, so that the pressure distribution is more uniform, effectively preventing the resonant body 1 from being damaged or deformed due to excessive single-point pressure. At the same time, the three protrusions 4 will form a rigid support with the contact surface of the resonant body 1, so that the resonant body can be better buffered and supported when facing external vibration or impact. The existence of the protrusions 4 increases the friction between the support pad 2 and the resonant body 1, thereby improving the anti-vibration ability.
[0028] Specifically, the depth of the groove 3 is 2mm±0.2mm, and the size of the groove 3 is determined according to the size of the support pad 2, leaving a gap of 0.1mm for the support pad to be embedded. By embedding the support pad 2 into the resonant body 1, the glue brushing area at the connection between the support pad 2 and the resonant body 1 changes from the original planar coverage to covering the front and side surfaces of the contact part of the support pad 2 and the resonant body 1, making the glue coverage more uniform, and increasing the contact area to make the connection more stable. The height of the protrusion 4 is set to 0.1mm-0.2mm, which covers the glue during gluing. The design of the protrusion 4 can significantly increase the contact area between the support pad 2 and the resonant body 1, making the pressure distribution more uniform, effectively preventing damage or deformation of the resonant body 1 caused by excessive single-point pressure. At the same time, the three protrusions 4 form a rigid support with the contact surface of the resonant body 1, so that the resonant body can be better buffered and supported when it is subjected to external vibration or impact. The presence of the protrusion 4 increases the friction between the support pad 2 and the resonant body 1, thereby improving its anti-vibration ability and ensuring the stable operation of the resonator.
[0029] Notably, the coverage area of the glue brushing area changes from the original planar coverage to covering the front and side surfaces of the contact part of the support pad, making the glue coverage more uniform, and increasing the contact area to make the connection more stable. At the same time, it avoids the problem of uneven glue brushing caused by unsuitable temperature curve during curing, but such structure still needs to be controlled in terms of pressure control, otherwise the above problems may still occur.
[0030] Specifically, the diameter of the support pad 2 is set to 12mm±0.2mm, the length of the support pad 2 is set to 6.4mm±0.2mm, and the height of the support pad 2 embedded in the resonant body 1 is 2mm±0.2mm.
[0031] Specifically, the resonant body 1 is composed of ceramic, and the dielectric constant (ER) of the resonant body 1 is 40±1, which has a high polarization degree, meaning that the charges in the material can be more effectively polarized under the action of an electric field, thereby responding to changes in the electric field. The material of the support pad 2 is composed of PEI, which is a high-performance thermoplastic with good mechanical properties and thermal stability. Its main function is to support the resonant body 1 and ensure its stable position in the resonant body 1.
[0032] Specifically, the resonant body 1 and the support pad 2 are both set to cylindrical shape.
[0033] Specifically, the resonant body 1 has a first through hole 6 in the middle, and the support pad 2 has a second through hole 7 in the middle that communicates with the first through hole 6.
[0034] Working principle: a groove 3 is opened at the lower end of the resonant body 1 according to the size of the support pad 2, the size of the groove 3 is determined according to the size of the support pad 2, and a gap of 0.1mm is left for the support pad to be embedded, the support pad 2 is embedded in the resonant body 1, the brush glue area of the connection between the support pad 2 and the resonant body 1 covers an area from the original plane, which changes to cover the front and side of the contact part of the support pad 2 and the resonant body 1, so that the coverage of the glue is more uniform, and the contact area is increased to make the connection more stable, and the problem of uneven brush glue caused by unsuitable temperature curve during curing is avoided.
[0035] Three protrusions 4 are uniformly distributed at the connection between the support pad 2 and the resonant body 1, the height of the protrusion 4 is kept at 0.1mm-0.2mm, and the protrusion 4 is covered during gluing, the design of the protrusion 4 can significantly increase the contact area between the support pad 2 and the resonant body 1, so that the pressure distribution is more uniform, effectively preventing the resonant body 1 from being damaged or deformed due to excessive single-point pressure, and the three protrusions 4 will form a rigid support with the contact surface of the resonant body 1, so that the resonant body can get better buffering and support when facing external vibration or impact, the existence of the protrusion 4 increases the friction between the support pad 2 and the resonant body 1, thereby improving its anti-vibration ability, ensuring the stable work of the resonator, through such adjustment, when the clamp is heated and pressure is applied for bonding, the problem of poor heat conductivity and shock resistance caused by uneven brush glue due to unsuitable temperature curve and excessive applied pressure can be solved.
[0036] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, the scope of the utility model is defined by the appended claims and its equivalents.
Claims
1. A ceramic dielectric resonator structure comprising a resonator body (1) and a support pad (2), characterized in that: The bottom of the resonant body (1) is provided with a groove (3) for embedding the support pad (2), the top of the support pad (2) is embedded in the groove (3), and the connection between the resonant body (1) and the support pad (2) is provided with adhesive.
2. A ceramic dielectric resonator structure as claimed in claim 1, characterized in that: The top of the support pad (2) is provided with three groups of protrusions (4) in an annular array, the inner top of the groove (3) is provided with concave holes (5) matched with the protrusions (4), and the protrusions (4) are located in the concave holes (5).
3. A ceramic dielectric resonator structure as claimed in claim 2, wherein: The depth of the groove (3) is 2mm±0.2mm, and the height of the protrusion (4) is 0.1mm-0.2mm.
4. The ceramic dielectric resonator structure of claim 1, wherein: The diameter of the support pad (2) is 12mm±0.2mm, and the length of the support pad (2) is 6.4mm±0.2mm.
5. The ceramic dielectric resonator structure of claim 1, wherein: The resonant body (1) is made of ceramic, the dielectric constant (ER) of the resonant body (1) is 40±1, and the material of the support pad (2) is PEI.
6. The ceramic dielectric resonator structure of claim 1, wherein: The resonant body (1) and the support pad (2) are both provided in a cylindrical shape.
7. The ceramic dielectric resonator structure of claim 1, wherein: The resonant body (1) is provided with a first through hole (6) in the middle, and the support pad (2) is provided with a second through hole (7) communicated with the first through hole (6).