Connecting structure of aluminum-based double-sided copper-clad bus duct

Abstract

The utility model discloses a connecting structure of an aluminum-based double-sided copper-clad bus duct, and relates to the technical field of busbars. The copper-aluminum eutectic conducting bar comprises a copper-aluminum eutectic conducting bar body, the copper-aluminum eutectic conducting bar body comprises an aluminum alloy base body layer A, the two opposite side faces of the aluminum alloy base body layer A are covered with copper connecting layers A, and the copper-aluminum eutectic layer A is arranged between the aluminum alloy base body layer A and the copper connecting layers A. The copper-aluminum eutectic conducting bar further comprises a connector which comprises a plurality of copper-aluminum eutectic connecting pieces. The copper-aluminum eutectic conducting bar is clamped by the connector and tightly abuts against the copper-aluminum eutectic connecting piece. The beneficial effects of the utility model lie in that the copper-aluminum eutectic technology is adopted, the advantages of low density and low cost of aluminum and high conductivity and high mechanical strength of copper are combined, the conductive performance, cost and lightweight requirements are effectively balanced, the copper-aluminum eutectic conducting bar and the copper-aluminum eutectic connector are adopted, the heat dissipation is increased, the connection temperature is reduced under the same current-carrying condition, and the service life is prolonged. Damage of high temperature to materials is avoided, and production efficiency and economical efficiency are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to busbar technology field especially relates to a kind of connecting structure of aluminium base double-sided copper clad bus duct. BACKGROUND

[0002] In the electric power and electronic industry, the conductive bar as the key component of transmission electric energy, its performance directly affects the efficiency and reliability of the whole system, traditional conductive bar mostly uses copper bar or aluminium bar, but these materials have limitations in certain application scenarios, for example, copper conductive bar although excellent electrically conductive performance, but cost is higher and density is big, not conducive to lightweight design;And aluminium conductive bar although cost is low and density is small, but electrically conductive performance and mechanical strength are relatively low.

[0003] In order to overcome these limitations, people began to try to use composite materials to make conductive bar, among which aluminium base double-sided copper clad conductive bar is a kind of representative product, which combines the advantages of aluminium and copper, has low density and cost, and has good electrically conductive performance and mechanical strength, however, the existing copper-aluminium composite material is basically copper and aluminium directly solid-solid composite, and the direct connection between aluminium and copper often has the problem of poor interface bonding, in practical application, due to the large difference in physical and chemical properties between copper and aluminium, direct bonding will produce potential difference due to different materials, thus easily causing problems of electrochemical corrosion and increased contact resistance, which seriously affects the performance and service life of the conductive bar.

[0004] In order to solve the connection problem between aluminium and copper, people have proposed various methods, such as electroplating, brazing, crimping, etc., but these methods have some defects, such as high cost and easy peeling of electroplating layer, high brazing temperature easy to damage material, large crimping resistance, etc., so it is necessary to develop a conductive bar and the corresponding connecting structure to meet the production needs.

[0005] Therefore, the applicant proposes a connecting structure of aluminium base double-sided copper clad bus duct to solve the above technical problems. CONTENT OF UTILITY MODEL

[0006] The utility model provides a connecting structure of aluminium base double-sided copper clad bus duct to solve the above technical problems in view of the deficiencies in the prior art.

[0007] The utility model solves the above technical problems by the following technical solutions:

[0008] The utility model relates to a kind of connection structure of aluminum-based double-sided copper clad bus duct, including copper-aluminum eutectic conductive row, the copper-aluminum eutectic conductive row includes aluminum alloy matrix layer A, opposite two sides of the aluminum alloy matrix layer A are covered with copper connection layer A, copper-aluminum eutectic layer A between the aluminum alloy matrix layer A and the copper connection layer A, still include connector, the connector includes several copper-aluminum eutectic connecting pieces, the copper-aluminum eutectic conductive row is clamped by the connector and is in close abutment with the copper-aluminum eutectic connecting piece.

[0009] Preferably, the thickness of the copper connection layer A is 5% to 35% of the thickness of the copper-aluminum eutectic conductive row.

[0010] Preferably, the thickness of the copper-aluminum eutectic conductive row is 1mm to 5mm.

[0011] Preferably, the thickness of the copper connection layer A is 0.1mm to 0.5mm.

[0012] Preferably, the copper-aluminum eutectic conductive row further includes a P1 row, and the thickness of the P1 row is 0.5mm to 2.5mm.

[0013] Preferably, the copper-aluminum eutectic connecting piece includes an aluminum alloy matrix layer B, and a copper connection layer B is coated on the connecting surface of the aluminum alloy matrix layer B corresponding to the copper-aluminum eutectic conductive row, and a copper-aluminum eutectic layer B is between the aluminum alloy matrix layer B and the copper connection layer B.

[0014] Preferably, the thickness ratio of the aluminum alloy matrix layer B to the copper connection layer B is 8 to 10.

[0015] Preferably, the thickness of the copper-aluminum eutectic connecting piece is 1mm to 5mm.

[0016] Preferably, the thickness of the copper connection layer B is 0.1mm to 0.5mm.

[0017] Preferably, a tin connection layer A is electroplated on the outer end of the copper connection layer A, and a tin connection layer B is electroplated on the outer end of the copper connection layer B.

[0018] Preferably, a silver connection layer A is electroplated on the outer end of the copper connection layer A, and a silver connection layer B is electroplated on the outer end of the copper connection layer B.

[0019] The utility model has the advantages that:

[0020] 1. Optimizing material performance: by adopting copper-aluminum eutectic technology, the advantages of low density and low cost of aluminum and high conductivity and high mechanical strength of copper are combined, effectively balancing the conductivity performance, cost and lightweight demand, providing a more efficient and economical conductive row solution for the power and electronic industries;

[0021] 2. Strengthen the interface bonding: use copper aluminum eutectic technology, adopt solid-liquid composite, make copper and aluminum reach metallurgical bonding, form stable eutectic layer between aluminum alloy matrix and copper connecting layer, significantly enhance the interface bonding force between aluminum and copper, solve the problem of weak interface bonding in traditional connection mode, effectively reduce the contact resistance, improve the conductivity efficiency and stability of the conductive row;

[0022] 3. Improve corrosion resistance: the copper aluminum eutectic layer not only enhances the interface bonding, but also has certain corrosion resistance, which can effectively resist the erosion of external environment, prolong the service life of the conductive row and reduce the maintenance cost;

[0023] 4. Simplify the connection process: compared with the traditional connection methods such as electroplating and brazing, the design of copper copper aluminum eutectic conductive row and copper aluminum eutectic connector increases the heat dissipation, reduces the connection temperature under the same current carrying condition, avoids the damage of high temperature to the material, at the same time, reduces the high cost process such as electroplating, improves the production efficiency and economy;

[0024] 5. Flexible adaptation to various application scenarios: by adjusting the thickness ratio of the aluminum alloy matrix and the copper connecting layer, and the thickness design of the overall conductive row, the connection structure can flexibly adapt to the needs of different application scenarios. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the following will describe the drawings needed to be used in the embodiment or the prior art description. Obviously, the technical scheme described in the description combined with the drawings is only some embodiments of the present application. For those skilled in the art, other embodiments and drawings can be obtained without creative labor on the basis of the embodiments shown in the drawings.

[0026] Figure 1 is the connection state of the present application. The structure of the schematic diagram.

[0027] Figure 2 is the connection state of the present application. The structure of the schematic diagram.

[0028] Figure 3 is the connection state of the present application. The structure of the schematic diagram.

[0029] Figure 4 is the copper aluminum eutectic conductive row level structure of the present application. The schematic diagram.

[0030] Figure 5 is the copper aluminum eutectic conductive row level structure of the present application. The schematic diagram.

[0031] Figure 6 is the copper aluminum eutectic connecting piece level structure of the present application. The schematic diagram.

[0032] Figure 7 is a hierarchical structure sectional view of the copper-aluminum eutectic connecting sheet of the utility model.

[0033] Figure 8 is a hierarchical structure schematic diagram of the copper-aluminum eutectic connecting sheet of the utility model.

[0034] Figure 9 is a connection schematic diagram of the utility model.

[0035] Figure 10 is a bus duct schematic diagram of the utility model.

[0036] In the figure: 1, copper-aluminum eutectic conductive row, 11, P1 row, 101, aluminum alloy base layer A, 102, copper connecting layer A, 103, copper-aluminum eutectic layer A, 104, tin connecting layer A, 2, connector, 21, copper-aluminum eutectic connecting sheet, 211, aluminum alloy base layer B, 212, copper connecting layer B, 213, copper-aluminum eutectic layer B, 214, tin connecting layer B. DETAILED DESCRIPTION

[0037] The technical solutions of various embodiments of the utility model will be described clearly and completely in combination with the drawings below, obviously, the described embodiments are only a part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments described in the utility model, all other embodiments obtained by the person skilled in the art without creative labor are within the scope of protection of the utility model. Embodiment 1:

[0038] As Figures 1 to 4 , Figures 6 to 7 , Figures 9 to 10As shown, the utility model discloses a kind of connecting structure of aluminum-based double-sided copper clad bus duct, including copper-aluminum eutectic conductive row 1, copper-aluminum eutectic conductive row 1 includes aluminum alloy matrix layer A101, opposite two sides of aluminum alloy matrix layer A101 are covered with copper connection layer A102, copper-aluminum eutectic layer A103 between aluminum alloy matrix layer A101 and copper connection layer A102, the thickness of copper-aluminum eutectic conductive row 1 is 3mm, the thickness of copper connection layer A102 is 0.3mm, copper-aluminum eutectic conductive row 1 also includes P1 row 11, the thickness of P1 row 11 is 1.5mm, further include connector 2, the connector 2 includes several copper-aluminum eutectic connecting pieces 21, copper-aluminum eutectic conductive row 1 is clamped by the connector 2 and is closely abutted with copper-aluminum eutectic connecting piece 21, copper-aluminum eutectic connecting piece 21 includes aluminum alloy matrix layer B211, the connecting surface of copper-aluminum eutectic conductive row 1 on aluminum alloy matrix layer B211 is covered with copper connection layer B212, copper-aluminum eutectic layer B213 between aluminum alloy matrix layer B211 and copper connection layer B212, the thickness of copper-aluminum eutectic connecting piece 21 is 3mm, the thickness of copper connection layer B212 is 0.3mm, the thickness of copper-aluminum eutectic layer B213 is several microns to several tens of microns.

[0039] Compared with traditional connection mode such as electroplating, brazing, the design of copper-aluminum eutectic conductive row and copper-aluminum eutectic connector increases heat dissipation, reduces connection temperature under the same current-carrying condition, avoids damage to materials caused by high temperature, and also reduces high-cost processes such as electroplating, thereby improving production efficiency and economy.

[0040] As shown in the drawings, Figure 5 , Figure 8 As shown in another embodiment, the outer side end of the copper connection layer A102 is electroplated with a tin connection layer A104, and the outer side of the copper connection layer B212 is electroplated with a tin connection layer B214. After tin plating, surface oxidation is prevented, the corrosion resistance of the connection part is improved, and the overall durability of the conductive row is also enhanced. This design effectively resists the erosion of the external environment and prolongs the service life of the conductive row.

[0041] In another embodiment, the outer side end of the copper connection layer A102 is electroplated with a silver connection layer A, and the outer side of the copper connection layer B212 is electroplated with a silver connection layer B. After silver plating, the electrical conductivity can be improved.

[0042] In the above embodiment, the connector 2 includes a plurality of insulating mounting plates arranged between the two end covers, and the copper-aluminum eutectic connecting pieces 21 are arranged on the insulating mounting plates.

[0043] The copper-aluminum eutectic refers to a low-melting-point eutectic alloy formed between copper and aluminum under certain temperature and pressure. This eutectic alloy has good wettability and fluidity, can fill the small gaps between copper and aluminum, and form a firm connection. At the same time, the copper-aluminum eutectic layer also has good electrical conductivity and corrosion resistance, which can improve the overall performance of the connector.

[0044] The insulating mounting plate includes one single-sided groove insulating mounting plate and four double-sided groove insulating mounting plates. The number of single-sided groove insulating mounting plates and double-sided groove insulating mounting plates is set according to actual needs and is matched with the bus duct. The single-sided groove insulating mounting plate is arranged adjacent to the end cover, and the double-sided groove insulating mounting plate is arranged between the single-sided groove insulating mounting plate and another end cover. One copper-aluminum eutectic connecting piece 21 is arranged on the single-sided groove insulating mounting plate, and two copper-aluminum eutectic connecting pieces 21 are symmetrically arranged on the double-sided groove insulating mounting plate.

[0045] A connecting cavity for clamping the copper-aluminum eutectic conductive row 1 is formed between adjacent insulating mounting plates, and a connecting cavity for clamping the P1 row 11 is formed between the end cover and the adjacent double-sided groove insulating mounting plate.

[0046] The end cover is provided with a protrusion in the middle of the side facing the insulating mounting plate, and a gap is formed between the protrusion and the adjacent single-sided groove insulating mounting plate, which is matched with the auxiliary side plate of the bus duct. The end cover is provided with a mounting cavity on the side away from the insulating mounting plate, and a gasket is arranged in the mounting cavity. The design of the protrusion and the mounting cavity on the end cover enhances the structural strength of the device and facilitates installation and fixation.

[0047] The insulating sleeve penetrates the end cover, the insulating mounting plate, and the copper-aluminum eutectic connecting piece 21. After the bus duct torque bolt passes through the insulating sleeve, the nut is tightened at the end to clamp the copper-aluminum eutectic conductive row 1, ensuring the stability and safety of the connection.

[0048] The copper-aluminum eutectic conductive rows 1 in the bus duct are arranged in a stack, and an insulating layer is arranged thereon to prevent mutual communication and short circuit. The insulating layer can be a single-layer polyester film. The smooth surface of the polyester film can prevent the film from being damaged due to mutual extrusion and friction when the copper-aluminum eutectic conductive rows 1 are stacked. Although the single-layer polyester film is very thin, it still affects heat dissipation. The use of copper-aluminum eutectic conductive rows 1 can improve heat dissipation. The higher the row width, the better the heat dissipation. The base layer of the copper-aluminum eutectic conductive row 1 is an aluminum alloy base layer A101. Compared with copper rows, the copper-aluminum eutectic conductive row 1 has better heat dissipation under the same weight or cost.

[0049] The copper-aluminum eutectic conductive row 1 and the copper-aluminum eutectic connecting piece 21 are copper-aluminum eutectic composite materials, and the production process of the copper-aluminum eutectic composite material is provided, relates to copper plate surface pretreatment, copper plate preheating, solid-liquid composite casting and rolling, composite slab homogenization annealing, cold rolling, secondary annealing and slitting and cutting, and the process comprises the following steps:

[0050] Step A: copper plate surface pretreatment: the copper plate is first subjected to high-pressure washing to quickly remove solid impurities on the surface of the copper plate, then subjected to low-pressure washing for degreasing treatment to remove grease on the surface of the copper plate, and then subjected to polishing by a steel brush device to polish off the oxide layer on the surface of the copper plate, and finally the copper plate is dried for standby;

[0051] Step B: copper plate preheating: the pretreated copper plate is fixedly sent to a feeding device, and heated to 150 DEG C ~ 220 DEG C in an oxygen-free environment;

[0052] Step C: solid-liquid composite casting and rolling: the aluminum ingot is heated to 660 DEG C ~ 710 DEG C to obtain molten aluminum liquid, then inert gas is introduced near the roller to fill the casting and rolling environment to form an oxygen-free environment, and the outer surface temperature of the roller is heated to 85 DEG C ~ 95 DEG C, cooling liquid is introduced into the roller, the casting and rolling device is started, the molten aluminum liquid and the treated copper plate are contacted in the oxygen-free environment, solid-liquid composite oxygen-free continuous casting and rolling are realized, and a copper-aluminum composite slab is obtained;

[0053] Step D: composite slab homogenization annealing: the obtained copper-aluminum composite slab is placed in an annealing furnace for homogenization annealing;

[0054] Step E: cold rolling: the composite slab after annealing is subjected to secondary rolling, the rolling equipment is adjusted, the required plate thickness and plate width are obtained, and the plate thickness after the final secondary rolling is 0.2 mm ~ 16 mm, wherein the thickness of the copper plate is 5% ~ 35% of the thickness of the whole composite plate, and the plate width is 600 mm ~ 1200 mm;

[0055] Step F: secondary annealing: the copper-aluminum composite plate after cold rolling is subjected to secondary annealing;

[0056] Step G: slitting and cutting.

[0057] In step A, the washing liquid is an alkaline degreasing liquid at 50 DEG C ~ 70 DEG C.

[0058] In step A, the oxide layer on the surface of the copper plate is polished off by the steel brush device, and at the same time, the surface roughness is improved, the copper-aluminum composite area is increased, and the adhesion of the composite material is enhanced.

[0059] In step B, the copper plate is preheated to increase the atomic thermal activation energy, so that the atoms can obtain sufficient energy in a short time at high temperature to migrate and form a thicker eutectic layer, thereby effectively improving the bonding strength of the copper-aluminum composite interface.

[0060] In step C, the inert gas is nitrogen, and the introduction of nitrogen can avoid the formation of an oxide layer on the copper plate and aluminum liquid during the compounding process due to direct exposure to air, which makes it difficult to form an ideal eutectic layer and adversely affects the peel strength of the material.

[0061] In step C, the cooling liquid is introduced into the roller to increase the cooling speed of the casting and rolling, forming smaller grains, thereby increasing the material strength. The rolling speed of the roller is 600-1300 mm / min, the temperature of the cooling liquid is 20-30℃, and the cooling rate is 300-1000℃ / s.

[0062] In step C, the compounding rate after solid-liquid compounding casting and rolling is 100%.

[0063] In step D, the heating temperature of the homogenization annealing process is 430-510℃, and the annealing time is 4-5h. The homogenization annealing process can reduce the segregation of the copper-aluminum alloy on both sides, remove residual stress, and improve the alloy performance.

[0064] In step F, the heating temperature of the secondary annealing process is 300-350℃, and the cooling temperature in the annealing furnace is below 80℃. The secondary annealing process can refine the grains, adjust the structure, and eliminate structural defects. Since there is a certain internal stress during rolling, it can reduce the strength of the composite material. The annealing process can reduce residual stress, stabilize size, reduce deformation and crack tendency, and ensure that the product has good comprehensive mechanical properties and good metallurgical bonding.

[0065] The copper-aluminum eutectic composite material has an unaffected skin effect for current transmission, and the current-carrying capacity is about 85% of that of a pure copper conductor. Compared with a copper bar, the consumption of copper material is reduced, and the production cost is saved.

[0066] The copper-aluminum eutectic composite material produced by the process has high shear strength and peel strength, can achieve metallurgical bonding between the composite metals, form a eutectic layer, and meet the bonding strength of the material. Compared with existing composite material production methods, the preparation method of the process is simpler, more economical and efficient.

[0067] In this embodiment, in order to obtain a copper-aluminum eutectic conductive bar 1 and a copper-aluminum eutectic connecting piece 21 that meet the requirements, the relevant parameters in the copper-aluminum eutectic composite material production process can be adjusted appropriately, so that the treated composite material meets the requirements.

[0068] It is apparent for a person skilled in the art that the present application is not limited to the details of the above-described exemplary embodiments, but that it can be implemented in other concrete forms without departing from the spirit or the essential characteristics of the present application. Therefore, the embodiments should be considered as exemplary and non-limiting, whatever the point of view. The scope of the present application is defined by the appended claims, and not by the above description, which is therefore intended to be merely illustrative and not restrictive. No figure reference in the claims should be considered as limiting the claim concerned.

[0069] Furthermore, it should be understood that, although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the present specification is described in this way only for the sake of clarity, and a person skilled in the art should consider the present specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by a person skilled in the art.

Claims

1. A connection structure for an aluminum-based double-sided copper-clad busbar trunking, characterized in that: The device includes a copper-aluminum eutectic conductive bus (1), which includes an aluminum alloy substrate layer A (101), copper connecting layers A (102) on opposite sides of the aluminum alloy substrate layer A (101), and a copper-aluminum eutectic layer A (103) between the aluminum alloy substrate layer A (101) and the copper connecting layer A (102). The device also includes a connector (2), which includes a plurality of copper-aluminum eutectic connecting pieces (21). The copper-aluminum eutectic conductive bus (1) is clamped by the connector (2) and closely abuts against the copper-aluminum eutectic connecting pieces (21).

2. The connection structure of an aluminum-based double-sided copper-clad busbar trunking according to claim 1, characterized in that: The thickness of the copper interconnect layer A (102) is 5% to 35% of the thickness of the copper-aluminum eutectic conductive bus (1).

3. The connection structure of an aluminum-based double-sided copper-clad busbar trunking according to claim 2, characterized in that: The thickness of the copper-aluminum eutectic conductive bus (1) is 1mm to 5mm.

4. The connection structure of an aluminum-based double-sided copper-clad busbar trunking according to claim 3, characterized in that: The thickness of the copper interconnect layer A (102) is 0.1mm~0.5mm.

5. The connection structure of an aluminum-based double-sided copper-clad busbar trunking according to claim 1, characterized in that: The copper-aluminum eutectic connector (21) includes an aluminum alloy substrate layer B (211), and a copper connector layer B (212) is covered on the aluminum alloy substrate layer B (211) corresponding to the connector surface of the copper-aluminum eutectic busbar (1). Between the aluminum alloy substrate layer B (211) and the copper connector layer B (212) is a copper-aluminum eutectic layer B (213).

6. The connection structure of an aluminum-based double-sided copper-clad busbar trunking according to claim 5, characterized in that: The thickness ratio of the aluminum alloy substrate layer B (211) to the copper connecting layer B (212) is 8 to 10.

7. The connection structure of an aluminum-based double-sided copper-clad busbar trunking according to claim 6, characterized in that: The thickness of the copper-aluminum eutectic connecting piece (21) is 1mm to 5mm.

8. The connection structure of an aluminum-based double-sided copper-clad busbar trunking according to claim 7, characterized in that: The thickness of the copper interconnect layer B(212) is 0.1mm~0.5mm.

9. The connection structure of an aluminum-based double-sided copper-clad busbar trunking according to claim 5, characterized in that: The outer end of the copper connection layer A (102) is electroplated with a tin connection layer A (104), and the outer side of the copper connection layer B (212) is electroplated with a tin connection layer B (214).

10. The connection structure of an aluminum-based double-sided copper-clad busbar trunking according to claim 5, characterized in that: The outer end of the copper connecting layer A (102) is electroplated with a silver connecting layer A, and the outer side of the copper connecting layer B (212) is electroplated with a silver connecting layer B.

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