Multilayer circuit board with thermoelectric separation substrate

Abstract

The utility model discloses a multilayer circuit board with a thermoelectric separation substrate, and relates to the technical field of multilayer circuit boards, the multilayer circuit board comprises a heat dissipation base, a connecting seat and a plurality of circuit boards, the connecting seat is fixedly connected to the upper surface of the heat dissipation base, the inner wall of the top end of the connecting seat is provided with a plurality of strip-shaped openings, and the strip-shaped openings are communicated with the heat dissipation base. And the multiple circuit boards are inserted into the inner walls of the top ends, located at the strip-shaped openings, of the connecting bases correspondingly, a cavity is formed in the inner wall of the bottom end of the heat dissipation base, and a controller is arranged on the inner wall, located at the cavity, of the heat dissipation base. When the piston moves towards the controller, the second cover plate is opened under the influence of air pressure, air can enter the inner wall of the cavity through the air inlet, the first cover plate is arranged on the side wall of the piston in a pressing mode, and air on the side, corresponding to the controller, of the piston can extend to the inner wall of the air collecting groove and flow out through the pressurizing exhaust hole. And blowing heat dissipation processing can be accurately carried out on gaps of a plurality of circuit boards.

Description

Technical Field

[0001] This utility model relates to the field of multilayer circuit board technology, and specifically to a multilayer circuit board with a thermoelectric separation substrate. Background Technology

[0002] Multilayer circuit boards are circuit boards made of multiple layers of conductive and insulating materials. They are widely used in electronic devices. Compared with single-layer and double-layer circuit boards, multilayer circuit boards have higher integration and better signal integrity, and can meet the needs of complex circuit designs.

[0003] A search revealed Chinese patent publication number CN221829146U, which specifically describes a multilayer circuit board with a thermoelectric separation substrate, including a thermoelectric separation module mechanism, a heat dissipation mechanism fixedly installed inside the thermoelectric separation module mechanism, an electronic component mechanism fixedly installed below the heat dissipation mechanism, and a thermoelectric separation substrate mechanism fixedly installed below the electronic component mechanism.

[0004] In existing technologies, the small gaps between multilayer circuit boards result in poor air circulation, leading to heat buildup on the board surface after prolonged use. Adding a cooling fan not only occupies significant space but also makes it difficult to precisely channel the heat trapped in the gaps, resulting in poor heat dissipation. Therefore, this application designs a multilayer circuit board with a thermoelectric separation substrate. Utility Model Content

[0005] In view of the problems existing in the current multilayer circuit boards, this utility model is proposed.

[0006] Therefore, the purpose of this utility model is to provide a multilayer circuit board with a thermoelectric separation substrate, which solves the problem that the small gap between the circuit boards leads to poor gas flow, heat accumulation on the surface of the circuit board after long-term use, and the addition of a cooling fan not only occupies a lot of space, but also makes it difficult to accurately guide the heat trapped in the gaps, resulting in poor heat dissipation.

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] A multilayer circuit board with a thermoelectric separation substrate includes a heat dissipation base, a connecting base, and multiple circuit boards. The connecting base is fixedly connected to the upper surface of the heat dissipation base. The inner wall of the top of the connecting base has multiple strip-shaped openings. The multiple circuit boards are respectively inserted into the inner wall of the top of the connecting base at the strip-shaped openings. The inner wall of the bottom of the heat dissipation base has a cavity. A controller is provided on the inner wall of the cavity of the heat dissipation base. First electromagnets are provided on both sides of the controller. Second electromagnets are provided on the inner walls of both ends of the cavity of the heat dissipation base. Two pistons are slidably provided on the inner wall of the cavity of the heat dissipation base. Magnetic rings are provided on both sides of the pistons. A first cover plate is hinged to the side of the piston relative to the controller. An air collection groove is provided on the inner wall of the heat dissipation base above the cavity. Multiple pressurized exhaust holes are provided at the connection between the heat dissipation base and the connecting base.

[0009] Preferably, the connecting seat has multiple rubber strips on the inner wall of the strip-shaped opening, and the pressurized exhaust hole is configured as a conical hole.

[0010] Preferably, the heat dissipation base has air inlets on the top inner walls of both sides of the cavity, and a second cover plate is hinged to the inner wall of the air inlet of the heat dissipation base.

[0011] Preferably, the inner wall of the piston is provided with a venting groove.

[0012] Preferably, the inner wall of the connecting seat is fixedly connected to a plurality of fixing rods, and sleeves are movably sleeved on the walls of the plurality of fixing rods. A pressure block is fixedly connected to the end of the sleeve opposite to the fixing rod. The pressure block is pressed tightly onto the side wall of the circuit board. A spring is fixedly connected to the inner wall of the sleeve, and the end of the spring opposite to the sleeve is fixedly connected to the end of the fixing rod.

[0013] Preferably, the inner wall of the sleeve is provided with a guide groove, and a guide block is fixedly connected to the wall of the fixed rod. The guide block is slidably disposed on the inner wall of the sleeve located in the guide groove.

[0014] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0015] 1. In this utility model, when the piston moves toward the controller, the second cover plate is opened by the air pressure. The gas can enter the inner wall of the cavity through the air inlet, while the first cover plate is pressed and set on the side wall of the piston. This allows the air on the side of the piston corresponding to the controller to extend to the inner wall of the air collection groove and flow out through the pressurized exhaust hole. This can accurately blow and dissipate heat at the gaps between multiple circuit boards.

[0016] 2. In this utility model, when the piston slides away from the controller, the second cover plate closes due to air pressure, and the first cover plate opens, allowing the gas inside the cavity to pass through the piston and extend to the gap with the controller, which facilitates subsequent heat dissipation.

[0017] 3. In this utility model, the spring can push the sleeve to slide along the wall of the fixed rod, so that the pressure block is pressed tightly on the side wall of the circuit board, which can improve the stability of the circuit board insertion. The guide block slides along the inner wall of the guide groove, which can improve the stability of the sleeve movement. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0019] Figure 1 This is a three-dimensional structural view of the present invention;

[0020] Figure 2 This is a cross-sectional view of the structure of this utility model;

[0021] Figure 3 For the present utility model Figure 1 Enlarged schematic diagram of part A;

[0022] Figure 4 For the present utility model Figure 1 Enlarged schematic diagram of part B;

[0023] Figure 5 For the present utility model Figure 3 A three-dimensional diagram of the piston structure.

[0024] Explanation of reference numerals in the attached figures:

[0025] 1. Heat dissipation base; 2. Connector; 3. Circuit board; 4. Rubber strip; 5. Controller; 6. First electromagnet; 7. Second electromagnet; 8. Piston; 9. Magnetic ring; 10. First cover plate; 11. Second cover plate; 12. Fixing rod; 13. Sleeve; 14. Pressure block; 15. Spring; 16. Guide block. Detailed Implementation

[0026] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0027] This utility model discloses a multilayer circuit board with a thermoelectric separation substrate.

[0028] This utility model provides, for example Figure 1-5 The multilayer circuit board with a thermoelectric separation substrate shown includes a heat dissipation base 1, a connecting seat 2, and multiple circuit boards 3. The connecting seat 2 is fixedly connected to the upper surface of the heat dissipation base 1. Multiple strip-shaped openings are provided on the inner wall of the top of the connecting seat 2. Multiple circuit boards 3 are respectively inserted into the inner wall of the top of the strip-shaped openings of the connecting seat 2. A cavity is provided on the inner wall of the bottom end of the heat dissipation base 1. A controller 5 is provided on the inner wall of the heat dissipation base 1 in the cavity. First electromagnets 6 are provided on both sides of the controller 5. Second electromagnets 7 are provided on the inner walls of both ends of the heat dissipation base 1 in the cavity. Two pistons 8 are slidably provided on the inner wall of the heat dissipation base 1 in the cavity. Magnetic rings 9 are provided on both sides of the pistons 8. A first cover plate 10 is hinged to one side of the pistons 8 relative to the controller 5. A gas collection groove is provided on the inner wall of the heat dissipation base 1 above the cavity. Multiple pressurized exhaust holes are provided at the connection between the heat dissipation base 1 and the connecting seat 2.

[0029] The connecting seat 2 is provided with multiple rubber strips 4 on the inner wall of the strip-shaped opening, the pressurization exhaust hole is set as a conical hole, the heat dissipation base 1 is provided with air inlets on the top inner walls on both sides of the cavity, the heat dissipation base 1 is hinged to the inner wall of the air inlet and a second cover plate 11 is provided, and the inner wall of the piston 8 is provided with ventilation slots.

[0030] In use, multiple circuit boards 3 are respectively inserted into the inner wall of the top of the connector 2. Simultaneously, the wiring board of the circuit board 3 contacts the rubber strip 4 to prevent leakage. This ensures the multi-layer circuit board 3 is stably mounted on the inner wall of the top of the connector 2. The controller 5 can drive the first electromagnet 6 and the second electromagnet 7 to be energized and magnetized. When the piston 8 approaches the first electromagnet 6 and the second electromagnet 7 respectively, the magnetic ring 9 has the same magnetic pole on the corresponding side of the first electromagnet 6 and the second electromagnet 7, allowing the first electromagnet 6 and the second electromagnet 7 to push the approaching piston 8 and the magnetic ring 9 to slide along the inner wall of the cavity. When piston 8 moves toward controller 5, the second cover plate 11 opens due to air pressure, allowing gas to enter the inner wall of the cavity through the air inlet. Meanwhile, the first cover plate 10 is pressed against the side wall of piston 8, allowing air on the side of piston 8 opposite controller 5 to extend to the inner wall of the air collection groove and flow out through the pressurized exhaust port. This allows for precise blowing and heat dissipation at the gaps between multiple circuit boards 3. When piston 8 slides away from controller 5, the second cover plate 11 closes due to air pressure, and the first cover plate 10 opens, allowing gas inside the cavity to penetrate piston 8 and extend to the gap between it and controller 5, facilitating subsequent heat dissipation.

[0031] To improve the stability of the circuit board 3 connection, such as Figure 1-5As shown, multiple fixing rods 12 are fixedly connected to the inner wall of the connecting seat 2. Sleeves 13 are movably sleeved on the rod walls of the multiple fixing rods 12. A pressure block 14 is fixedly connected to the end of the sleeve 13 away from the fixing rod 12. The pressure block 14 is pressed tightly onto the side wall of the circuit board 3. A spring 15 is fixedly connected to the inner wall of the sleeve 13. The end of the spring 15 away from the sleeve 13 is fixedly connected to the end of the fixing rod 12. A guide groove is opened on the inner wall of the sleeve 13. A guide block 16 is fixedly connected to the rod wall of the fixing rod 12. The guide block 16 is slidably disposed on the inner wall of the sleeve 13 located in the guide groove.

[0032] Spring 15 can push sleeve 13 to slide along the wall of fixed rod 12, so that pressure block 14 is pressed and set on the side wall of circuit board 3, which can improve the stability of circuit board 3 insertion. Meanwhile, guide block 12 slides along the inner wall of guide groove, which can improve the stability of sleeve 13 movement.

[0033] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A multilayer circuit board with a thermoelectric separation substrate, comprising a heat sink base (1), a connector (2), and multiple circuit boards (3), characterized in that, The connecting seat (2) is fixedly connected to the upper surface of the heat dissipation base (1). The inner wall of the top of the connecting seat (2) is provided with multiple strip-shaped openings. Multiple circuit boards (3) are respectively inserted into the inner wall of the top of the connecting seat (2) located at the strip-shaped openings. The inner wall of the bottom of the heat dissipation base (1) is provided with a cavity. The inner wall of the heat dissipation base (1) located at the cavity is provided with a controller (5). The controller (5) is provided with a first electromagnet (6) on both sides. The inner walls of the two ends of the heat dissipation base (1) located at the cavity are provided with a second electromagnet (7). The inner wall of the heat dissipation base (1) located at the cavity is provided with two pistons (8). The pistons (8) are provided with magnetic rings (9) on both sides. The pistons (8) are hinged to one side of the controller (5) with a first cover plate (10). The inner wall of the heat dissipation base (1) located above the cavity is provided with an air collection groove. Multiple pressurized exhaust holes are provided at the connection between the heat dissipation base (1) and the connecting seat (2).

2. The multilayer circuit board with a thermoelectric separation substrate according to claim 1, characterized in that, The connecting seat (2) has multiple rubber strips (4) on the inner wall of the strip-shaped opening, and the pressurized exhaust hole is set as a conical hole.

3. The multilayer circuit board with a thermoelectric separation substrate according to claim 1, characterized in that, The heat dissipation base (1) has air inlets on the inner walls of the top of the cavity on both sides, and a second cover plate (11) is hinged to the inner wall of the air inlet of the heat dissipation base (1).

4. The multilayer circuit board with a thermoelectric separation substrate according to claim 1, characterized in that, The piston (8) has ventilation slots on its inner wall.

5. The multilayer circuit board with a thermoelectric separation substrate according to claim 1, characterized in that, The inner wall of the connecting seat (2) is fixedly connected to a plurality of fixing rods (12), and sleeves (13) are movably sleeved on the rod walls of the plurality of fixing rods (12). A pressure block (14) is fixedly connected to one end of the sleeve (13) away from the fixing rod (12). The pressure block (14) is pressed and set on the side wall of the circuit board (3). A spring (15) is fixedly connected to the inner wall of the sleeve (13), and one end of the spring (15) away from the sleeve (13) is fixedly connected to the end of the fixing rod (12).

6. The multilayer circuit board with a thermoelectric separation substrate according to claim 5, characterized in that, The inner wall of the sleeve (13) is provided with a guide groove, and a guide block (16) is fixedly connected to the rod wall of the fixed rod (12). The guide block (16) is slidably disposed on the inner wall of the sleeve (13) located in the guide groove.

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