Electronic equipment

Abstract

The utility model provides electronic equipment, and relates to the technical field of electronic equipment, the electronic equipment comprises a shell and a temperature sensing part, the shell is provided with a through hole, the temperature sensing part is fixed in the shell, and under the condition that the temperature of the shell is greater than a preset temperature, at least part of the temperature sensing part deforms along the thickness direction of the electronic equipment. And the through hole moves along the direction far away from the shell, so that the shell is raised along the thickness direction of the electronic equipment.

Description

TECHNICAL FIELD

[0001] The present application relates to, but is not limited to, the technical field of electronic equipment, and in particular to an electronic equipment. BACKGROUND

[0002] The heat-generating element in the electronic equipment consumes huge power consumption in the working process, and a large amount of waste heat is generated at the same time. The waste heat exchanges with the outside air to achieve the effect of cooling. However, in the related technology, when the heat-generating element generates a large amount of waste heat in the working process, the exchange channel of the electronic equipment and the outside air is small, which leads to slow cooling. CONTENT OF THE UTILITY MODEL

[0003] In order to solve the above problems, the present application provides an electronic equipment.

[0004] The present application provides an electronic equipment, which comprises a shell and a temperature sensing piece, wherein the shell is provided with a through hole, the temperature sensing piece is fixed inside the shell, and at least part of the temperature sensing piece deforms along the thickness direction of the electronic equipment and moves away from the shell along the through hole in the case that the temperature of the shell is greater than a preset temperature, so that the shell rises along the thickness direction of the electronic equipment.

[0005] In an implementation mode provided by the present application, in the case that the temperature of the shell is less than the preset temperature, the part of the temperature sensing piece moving outside the shell through the through hole deforms along the thickness direction of the electronic equipment and moves towards the shell along the through hole, so that the shell descends along the thickness direction of the electronic equipment.

[0006] In an implementation mode provided by the present application, in the case that the temperature of the shell is less than the preset temperature, the part of the temperature sensing piece moving outside the shell through the through hole deforms along the thickness direction of the electronic equipment and moves towards the shell along the through hole to the inside of the shell or to a first position, and the temperature sensing piece satisfies the coplanar condition with the outer surface of the shell in the case of the first position.

[0007] In an implementation mode provided by the present application, the electronic equipment further comprises a foot pad, and the foot pad is fixedly attached to the temperature sensing piece.

[0008] In an implementation mode provided by the present application, the foot pad extends along a first direction, the temperature sensing piece is a plurality of temperature sensing pieces, the plurality of temperature sensing pieces are arranged along the first direction, there is a gap between adjacent two temperature sensing pieces, and the plurality of temperature sensing pieces are fixedly attached to the foot pad, wherein the first direction is the length direction of the electronic equipment or the length direction.

[0009] In an implementation provided by the present application, the foot pad extends along a second direction, the temperature sensing member includes two temperature sensing members, the two temperature sensing members are arranged along a first direction, and the two temperature sensing members are fixedly attached to the foot pad, one of the temperature sensing members is provided with a first recess and a first protrusion along the first direction, the first recess and the first protrusion are arranged along the second direction, the other temperature sensing member is provided with a second recess and a second protrusion along the first direction, the second recess and the second protrusion are arranged along the second direction, the first protrusion extends into the second recess along the first direction, and the second protrusion extends into the first recess along the first direction, wherein the first direction is a width direction of the electronic device, and the second direction is a length direction of the electronic device.

[0010] In an implementation provided by the present application, the temperature sensing member includes a fixed portion, a deformed portion, and a lifting portion, the transition portion is located between the fixed portion and the deformed portion, the fixed portion is used for being fixed to the shell, in a case where the temperature of the shell is greater than a preset temperature, the deformed portion is deformed in a direction away from the shell and towards the through hole, the lifting portion moves along the direction away from the shell through the through hole, and the shell is lifted along the thickness direction of the electronic device.

[0011] In an implementation provided by the present application, the temperature sensing member is provided with a first hot melting hole, the shell is provided with a first hot melting column, the first hot melting column extends into the first hot melting hole, and the temperature sensing member is fixed inside the shell.

[0012] In an implementation provided by the present application, the axis direction of the through hole is parallel to the thickness direction of the electronic device, and at least part of the temperature sensing member guided by the through hole is deformed along the thickness direction of the electronic device.

[0013] In an implementation provided by the present application, the electronic device further includes a heat conduction element and a heat generating element arranged inside the shell, one end of the heat conduction element is in contact with the heat generating element, and the other end of the heat conduction element is in contact with the temperature sensing member. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 The electronic device provided by the embodiments of the present application includes a structure schematic diagram of a heat dissipation fan, a heat generating element, a heat conduction element, a shell, a temperature sensing member, and the like;

[0015] Figure 2 The electronic device provided by the embodiments of the present application includes a structure schematic diagram of a heat generating element, a heat conduction element, a shell, a temperature sensing member, and the like;

[0016] Figure 3 In the electronic device provided by the embodiments of the present application, in a case where the temperature of the shell is greater than a preset temperature, at least part of the temperature sensing member moves along a direction close to the shell through the through hole, and the shell is lifted along the thickness direction of the electronic device.

[0017] Figure 4 Provided for the embodiments of this application Figure 3 Enlarged view of point D in the middle;

[0018] Figure 5 Provided for the embodiments of this application Figure 3 The left view in the middle;

[0019] Figure 6 In the electronic device provided in this application embodiment, when the housing temperature is lower than a preset temperature, the part of the temperature sensing element that moves to the outside of the housing through the through hole deforms along the thickness direction of the electronic device, and moves to the inside of the housing or to a first position along the direction close to the housing through the through hole, so that the housing descends along the thickness direction of the electronic device.

[0020] Figure 7 Provided for the embodiments of this application Figure 6 Enlarged view of point E in the middle;

[0021] Figure 8 Provided for the embodiments of this application Figure 6 The left view in the middle;

[0022] Figure 9 Provided for the embodiments of this application Figure 6 An explosion diagram;

[0023] Figure 10 Provided for the embodiments of this application Figure 6 A schematic diagram of the shell structure;

[0024] Figure 11 Provided for the embodiments of this application Figure 6 Schematic diagram of the temperature sensing element;

[0025] Figure 12 The diagram shows a structure in which the foot pads and temperature sensors of an electronic device provided in this application are attached and fixed together. When the temperature of the housing is greater than a preset temperature, at least a portion of the temperature sensor deforms along the thickness direction of the electronic device and drives the foot pads to move away from the housing through the through hole, thereby raising the housing along the thickness direction of the electronic device.

[0026] Figure 13 Provided for the embodiments of this application Figure 12 Enlarged view of point F in the middle;

[0027] Figure 14 Provided for the embodiments of this application Figure 12 The left view in the middle;

[0028] Figure 15In the electronic device provided by the embodiment of the present application, the foot pad is fixedly attached to the temperature sensing member, and in the case that the temperature of the shell is less than the preset temperature, the part of the temperature sensing member that drives the foot pad to move through the through hole in the direction away from the shell deforms along the thickness direction of the electronic device, and drives the foot pad to move through the through hole in the direction close to the shell to the inside of the shell or to the first position, so that the structure schematic diagram of the shell descending along the thickness direction of the electronic device;

[0029] Figure 16 In the electronic device provided by the embodiment of the present application, Figure 15 the enlarged schematic diagram at G in the electronic device;

[0030] Figure 17 In the electronic device provided by the embodiment of the present application, Figure 15 the left view in the electronic device;

[0031] Figure 18 In the electronic device provided by the embodiment of the present application, Figure 15 the exploded schematic diagram of the electronic device;

[0032] Figure 19 In the electronic device provided by the embodiment of the present application, Figure 17 the schematic diagram of the shell structure of the electronic device;

[0033] Figure 20 In the electronic device provided by the embodiment of the present application, Figure 17 the schematic diagram of the structure of the foot pad of the electronic device;

[0034] Figure 21 In the electronic device provided by the embodiment of the present application, Figure 17 the schematic diagram of the structure of the temperature sensing member of the electronic device.

[0035] Explanation of reference signs:

[0036] 1-electronic device; 11-shell; 111-first hot melt column; 112-through hole; 12-temperature sensing member; 121-fixed part; 122-bent part; 123-lifting part; 124-first hot melt hole; 125-second hot melt hole; 13-foot pad; 131-second hot melt column; 14-heating element; 15-heat conducting element; 16-heat dissipation fan; A-thickness direction; B-length direction; C-width direction. DETAILED DESCRIPTION

[0037] It should be noted that the embodiments in the present application and the technical features in the embodiments can be combined with each other without conflict, and the detailed description in the specific implementation should be understood as the explanation and description of the purpose of the present application, and should not be regarded as improper limitation of the present application.

[0038] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the specific technical solutions will be further described below in conjunction with the accompanying drawings in some embodiments. The following embodiments are used to explain the present application, but not to limit the scope of the present application.

[0039] In some embodiments, the terms "first", "second", "third", etc. are used only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second", etc. can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, the meaning of "a plurality of" is more than one or more.

[0040] In addition, in some embodiments, the orientation terms such as "upper", "lower", "left", "right", etc. are defined with respect to the orientation of the components shown in the drawings, and it should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and can be changed accordingly according to the change of the orientation of the components placed in the drawings.

[0041] In some embodiments, unless otherwise explicitly specified and limited, the term "connection" should be understood broadly, for example, "connection" can be fixed connection, or detachable connection, or integral; can be directly connected, or indirectly connected through intermediate medium.

[0042] In some embodiments, the terms "comprising", "containing" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or includes elements inherent to such process, method, article or device. Without more limitations, the element defined by the statement "including a…" does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0043] In some embodiments, the words "exemplary" or "for example" are used to mean serving as an example, instance, or illustration. In some embodiments, any embodiment or design described as "exemplary" or "for example" should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of the words "exemplary" or "for example" is intended to present concepts in a concrete manner.

[0044] Reference is made to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 10The electronic device 1 provided by the embodiment of the present application comprises a shell 11 and a temperature sensing part 12, wherein the shell 11 is provided with a through hole 112, the temperature sensing part 12 is fixed inside the shell 11, and at least part of the temperature sensing part 12 is deformed along the thickness direction A of the electronic device 1 and moves away from the shell 11 through the through hole 112 to make the shell 11 rise along the thickness direction A of the electronic device 1 when the temperature of the shell 11 is greater than a preset temperature.

[0045] In some embodiments, the electronic device 1 can be a notebook computer; the electronic device 1 can be a computer host; the electronic device 1 can be a television; the electronic device 1 can also be a game console, etc.; the embodiment of the present application does not limit this. That is, the type of the electronic device 1 can be determined by the person skilled in the art according to the actual situation, and the above-mentioned cases are only exemplary descriptions of which types of electronic devices 1 can be in the present application, but are not limited to the cases described in the above embodiments. For reference Figure 1 In one implementation provided by the embodiment of the present application, the electronic device 1 is a notebook computer.

[0046] In some embodiments, the electronic device 1 further comprises a heat generating element 14, wherein the heat generating element 14 is arranged inside the shell 11. The heat generating element 14 can be a central processing unit (CPU), which is the operation and control core of the electronic device 1 and is the final execution unit of information processing and program running. The heat generating element 14 can also be a graphics processing unit (GPU) and the like. The GPU is also called a display core or a display chip. The GPU is a kind of coprocessor for processing image and graphics operation work. Of course, the heat generating element 14 can also include other types of devices, and the embodiment of the present application does not limit this. That is, the type of the heat generating element 14 can be determined by the person skilled in the art according to the actual situation, and the above-mentioned cases are only exemplary descriptions of which types of heat generating elements 14 can be in the present application, but are not limited to the cases described in the above embodiments.

[0047] In some embodiments, the electronic device 1 comprises a shell 11, which here refers to a shell 11 that covers the heat-generating element 14 of the electronic device 1. The outer contour of the shell 11 can be a regular shape, for example, a cube, for example, a cuboid, and the like. Of course, the outer contour of the shell 11 can also be an irregular shape, for which the embodiments of the present application do not make any limitation. That is, the outer contour of the shell 11 can be adjusted by those skilled in the art according to actual conditions. The above is only an exemplary description of which shapes the outer contour of the shell 11 in the present application can be, but is not limited to the cases described in the above embodiments. In an implementation provided by the embodiments of the present application, the outer contour of the shell 11 is a cuboid. On this basis, the shell 11 can be made of a metal material, or can be made of a plastic material, and the like, for which the embodiments of the present application do not make any limitation. That is, the material of the shell 11 can be adjusted by those skilled in the art according to actual conditions. The above is only an exemplary description of which materials the shell 11 in the present application can be made of, but is not limited to the cases described in the above embodiments.

[0048] In some embodiments, the shell 11 is provided with a through hole 112, which here refers to a hole that connects the inside of the shell 11 and the outside of the shell 11. In addition, the inner contour of the through hole 112 can be a regular shape, for example, a cylinder, for example, a triangle, and the like. Of course, the inner contour of the through hole 112 can also be an irregular shape, for which the embodiments of the present application do not make any limitation. That is, the inner contour of the through hole 112 can be adjusted by those skilled in the art according to actual conditions. The above is only an exemplary description of which shapes the inner contour of the through hole in the present application can be, but is not limited to the cases described in the above embodiments. In an implementation provided by the embodiments of the present application, the inner contour of the through hole 112 is a long strip shape.

[0049] In some embodiments, the temperature sensing element 12 refers to a component that can deform with the change of temperature. Here, the temperature sensing element 12 can be a memory metal, a rubber product, a polyethylene product, and the like, for which the embodiments of the present application do not make any limitation. That is, the temperature sensing element 12 can be adjusted by those skilled in the art according to actual conditions. The above is only an exemplary description of which types the temperature sensing element 12 in the present application can be, but is not limited to the cases described in the above embodiments. In an implementation provided by the embodiments of the present application, the temperature sensing element 12 is a memory metal, which is a special metal material that can plastically deform within a certain temperature range and then restore the original shape within another temperature range. The memory metal can be a TiNi-based shape memory alloy, a copper-based shape memory alloy, an iron-based shape memory alloy, and the like.

[0050] In some embodiments, the temperature sensing element 12 is fixed inside the shell 11. Here, the temperature sensing element 12 can be fixed inside the shell 11 in a non-detachable manner, for example, the temperature sensing element 12 can be glued to be fixed inside the shell 11; for another example, the temperature sensing element 12 can be heat-staked to be fixed inside the shell 11; and so on. Of course, the temperature sensing element 12 can be fixed inside the shell 11 in a detachable manner, for example, the temperature sensing element 12 can be clamped to be fixed inside the shell 11; for another example, the temperature sensing element 12 can be screwed to be fixed inside the shell 11; and so on. In this regard, the temperature sensing element 12 can be fixed inside the shell 11 in any manner, which is not limited in the embodiments of the present application. That is, the temperature sensing element 12 can be fixed inside the shell 11 in any manner, which is not limited in the embodiments of the present application. In one implementation provided by the embodiments of the present application, and with reference to Figure 9 , Figure 10 and Figure 11 , the temperature sensing element 12 can be heat-staked to be fixed inside the shell 11. In this way, the reliability of the temperature sensing element 12 fixed inside the shell 11 can be improved, and the risk of the temperature sensing element 12 shaking inside the shell 11 can be reduced.

[0051] In some embodiments, at least part of the temperature sensing element 12 deforms along the thickness direction A of the electronic device 1 when the temperature of the shell 11 is greater than the preset temperature. Here, the at least part includes all or part of the temperature sensing element 12. For example, the at least part of the temperature sensing element 12 can be other part than the part fixed to the shell 11. For another example, the at least part of the temperature sensing element 12 can be the part opposite to the through hole 112 along the thickness direction A of the electronic device 1. In this regard, the at least part of the temperature sensing element 12 can be any part, which is not limited in the embodiments of the present application. That is, the at least part of the temperature sensing element 12 can be any part, which is not limited in the embodiments of the present application. In one implementation provided by the embodiments of the present application, and with reference to

[0052] In some embodiments, at least part of the temperature sensing member 12 deforms along the thickness direction A of the electronic device 1 when the temperature of the shell 11 is greater than a preset temperature, where the preset temperature can be the lowest temperature at which the temperature sensing member 12 begins to deform, the preset temperature can be a temperature at which the temperature sensing member 12 deforms well, and the like. The preset temperature of the temperature sensing member 12 in the present application can be of any type, but is not limited to the cases described in the above embodiments. In an example, the temperature sensing member 12 is a memory metal, and different materials of the memory metal correspond to different preset temperatures. The preset temperature can be 60 degrees Celsius, the preset temperature can be 70 degrees Celsius, the preset temperature can be 80 degrees Celsius, the preset temperature can be 90 degrees Celsius, and the like.

[0053] In some embodiments, at least part of the temperature sensing member 12 deforms along the thickness direction A of the electronic device 1 when the temperature of the shell 11 is greater than a preset temperature, where the temperature of the shell 11 can be the overall temperature of the shell 11, the temperature of the shell 11 can be the temperature of a certain heating element 14 inside the shell 11, and the like. The temperature of the shell 11 in the present application can be of any type, but is not limited to the cases described in the above embodiments. For example, when the temperature of the shell 11 is the temperature of a certain heating element 14 inside the shell 11, in order to quickly conduct the temperature of the heating element 14 to the temperature sensing member 12, the electronic device 1 can further include a heat conducting element 15, one end of the heat conducting element 15 is in contact with the heating element 14, and the other end is in contact with the temperature sensing member 12. The heat conducting element 15 can be a heat pipe, the heat conducting element 15 can be a heat conducting fin, the heat conducting element 15 can be a heat plate, and the like. The specific type of the heat conducting element 15 is not limited in the present application. The type of the heat conducting element 15 in the present application can be of any type, but is not limited to the cases described in the above embodiments.

[0054] In some embodiments, at least part of the temperature sensing member 12 deforms along the thickness direction A of the electronic device 1 when the temperature of the shell 11 is greater than the preset temperature. Here, one third of the temperature sensing member 12 can deform along the thickness direction A of the electronic device 1; one half of the temperature sensing member 12 can deform along the thickness direction A of the electronic device 1; one fifth of the temperature sensing member 12 can deform along the thickness direction A of the electronic device 1, and the like. The present embodiments are not limited in this regard; that is, those skilled in the art can set the deformation amplitude according to the actual situation. The above cases are only exemplary to illustrate the forms in which the temperature sensing member 12 in the present application can be applied, but are not limited to the cases described in the above embodiments.

[0055] In some embodiments, at least part of the temperature sensing member 12 deforms along the thickness direction A of the electronic device 1 when the temperature of the shell 11 is greater than the preset temperature, and moves away from the shell 11 along the thickness direction A of the electronic device 1 through the through hole 112, so as to raise the shell 11 along the thickness direction A of the electronic device 1. Here, the axial direction of the through hole 112 can be parallel to the thickness direction A of the electronic device 1, and the through hole 112 can guide the deformation of at least part of the temperature sensing member 12 along the thickness direction A of the electronic device 1. At this time, the through hole 112 can play a guiding role and provide guidance for the deformation of at least part of the temperature sensing member 12 along the thickness direction A of the electronic device 1. Of course, the axial direction of the through hole 112 can also form an angle with the thickness direction A of the electronic device 1, and the like. The present embodiments are not limited in this regard; that is, those skilled in the art can set the relationship between the axial direction of the through hole 112 and the thickness direction A of the electronic device 1 according to the actual situation. The above cases are only exemplary to illustrate the relationship between the axial direction of the through hole 112 in the present application and the thickness direction A of the electronic device 1, but are not limited to the cases described in the above embodiments. In one implementation provided by the present embodiments, the axial direction of the through hole 112 is parallel to the thickness direction A of the electronic device 1.

[0056] In some embodiments, when the temperature of the shell 11 is greater than the preset temperature, at least part of the temperature sensing element 12 is deformed along the thickness direction A of the electronic device 1, and moves away from the shell 11 through the through hole 112, so that the shell 11 is raised along the thickness direction A of the electronic device 1. In some embodiments, when the temperature of the shell 11 is less than the preset temperature, at least part of the temperature sensing element 12 can be deformed along the thickness direction A of the electronic device 1, and move towards the shell 11 through the through hole 112, move to a first position that satisfies the coplanar surface with the outer surface of the shell 11 or move to the inside of the shell 11, so that the shell 11 is lowered along the thickness direction A of the electronic device 1, which is beneficial to the design of thin and light electronic device 1; in some embodiments, when the temperature of the shell 11 is less than the preset temperature, at least part of the temperature sensing element 12 can remain in the state that the temperature of the shell 11 is greater than the preset temperature, so that the time of deforming at least part of the temperature sensing element 12 along the thickness direction A of the electronic device 1 and moving along the direction of the shell 11 through the through hole 112 to raise the shell 11 along the thickness direction A of the electronic device 1 can be saved next time.

[0057] Compared with the related art, when the heat generating element 14 of the electronic device 1 generates a large amount of waste heat in the working process, the exchange channel of the electronic device 1 and the outside air is small, which leads to slow cooling. In the embodiment of the present application, a through hole 112 is formed on the shell 11, and a temperature sensing piece 12 is fixed inside the shell 11. At this time, the temperature inside the shell 11 can be sensed by the temperature sensing piece 12. In other words, the temperature inside the shell 11 can be reflected by whether the temperature sensing piece 12 is deformed. When the temperature of the shell 11 is greater than the preset temperature, at least part of the temperature sensing piece 12 can be deformed along the thickness direction A of the electronic device 1, and move away from the shell 11 through the through hole 112, so that the shell 11 rises along the thickness direction A of the electronic device 1. In other words, as a large amount of waste heat is generated inside the shell 11, the shell 11 rises along the thickness direction A of the electronic device 1, so that the exchange channel of the electronic device 1 and the outside air is increased, the heat dissipation efficiency is improved, and the electronic device 1 can achieve higher efficiency. At the same time, the service life of the electronic device 1 is prolonged. On this basis, when the temperature of the shell 11 is greater than the preset temperature, at least part of the temperature sensing piece 12 can be deformed along the thickness direction A of the electronic device 1, and move away from the shell 11 through the through hole 112, so that the shell 11 rises along the thickness direction A of the electronic device 1. In other words, at least part of the temperature sensing piece 12 can be deformed according to the change of the temperature of the shell 11, and then automatically adjust the height of the shell 11 along the thickness direction A of the electronic device 1. The user does not need to pay attention to the temperature inside the shell 11 and whether the exchange channel of the electronic device 1 and the outside air is adapted to the current temperature inside the shell 11, and does not need manual intervention. The technical effect is simple, efficient, portable and time-saving.

[0058] In some embodiments, the electronic device 1 can also include a heat dissipation fan 16 that blows the waste heat inside the shell 11 into the air and sucks cold air from the outside of the shell 11 to exchange the air inside and outside the shell 11. In the embodiment of the present application, a through hole 112 is formed on the shell 11, and a temperature sensing piece 12 is fixed inside the shell 11. When the temperature of the shell 11 is greater than the preset temperature, at least part of the temperature sensing piece 12 is deformed along the thickness direction A of the electronic device 1, and can move away from the shell 11 through the through hole 112, so that the shell 11 rises along the thickness direction A of the electronic device 1. In this way, the outflow channel of the heat dissipation fan 16 for blowing the waste heat inside the shell 11 into the air and the inflow channel of the heat dissipation fan 16 for sucking cold air from the outside of the shell 11 can be increased, the flow of the heat dissipation fan 16 is increased, the heat dissipation efficiency is improved, and the service life of the electronic device 1 is prolonged.

[0059] In an embodiment provided in the embodiments of the present application, in the electronic device 1, the power consumption of the CPU can be 55W, the power consumption of the GPU can be 115W, the height of the shell 11 along the thickness direction A of the electronic device 1 can be 4.5mm, the temperature of the CPU can be 91℃, and the temperature of the GPU can be 85℃. At this time, the temperatures of the CPU and the GPU are relatively high, causing the temperature of the shell 11 to be greater than the preset temperature. At least part of the temperature sensing member 12 located inside the shell 11 deforms along the thickness direction A of the electronic device 1 and moves away from the shell 11 through the through hole 112, so that the height of the shell 11 along the thickness direction A of the electronic device 1 increases. At this time, the height of the shell 11 along the thickness direction A of the electronic device 1 is 5.5mm, so that the air exchange channel of the electronic device 1 with the outside air increases, and the heat dissipation efficiency of the CPU and the GPU is improved. The temperature of the CPU can be reduced to 87℃, and the temperature of the GPU can be reduced to 82℃. At this time, the temperatures of the CPU and the GPU are still relatively high, causing the temperature of the shell 11 to be greater than the preset temperature. At least part of the temperature sensing member 11 located inside the shell 11 deforms along the thickness direction A of the electronic device 1 and moves away from the shell 11 through the through hole 112, so that the height of the shell 11 along the thickness direction A of the electronic device 1 continues to increase. At this time, the height of the shell along the thickness direction A of the electronic device 1 is 6.5mm, so that the air exchange channel of the electronic device 1 with the outside air increases, and the heat dissipation efficiency of the CPU and the GPU is improved. The temperature of the CPU can be reduced to 85℃, and the temperature of the GPU can be reduced to 80℃.

[0060] With reference to Figure 6 , Figure 7 and Figure 8 , the embodiments of the present application provide an electronic device 1. When the temperature of the shell 11 is less than the preset temperature, the part of the temperature sensing member 12 that moves outside the shell 11 through the through hole 112 deforms along the thickness direction A of the electronic device 1 and moves towards the shell 11 through the through hole 112, so that the height of the shell 11 along the thickness direction A of the electronic device 1 decreases.

[0061] In some embodiments, when the temperature of the shell 11 is less than the preset temperature, the part of the temperature sensing piece 12 moving outside the shell 11 through the through hole 112 is deformed along the thickness direction A of the electronic device 1, and moves along the direction close to the shell 11 through the through hole 112 to move inside the shell 11, so as to facilitate the thin design of the electronic device 1, and also reduce the wear of the temperature sensing piece 12; of course, it can also move to the first position which satisfies the coplanar condition with the outer surface of the shell 11, so as to facilitate the thin design of the electronic device 1; of course, it can also move to the outside of the shell 11 through the through hole 112 along the direction close to the shell 11, so that at least part of the temperature is deformed along the thickness direction A of the electronic device 1, and moves along the direction of the shell 11 through the through hole 112 to make the shell 11 rise along the thickness direction A of the electronic device 1.

[0062] The electronic device 1 provided by the embodiments of the present application can facilitate the thin design of the electronic device 1, because when the temperature of the shell 11 is less than the preset temperature, the part of the temperature sensing piece 12 moving outside the shell 11 through the through hole 112 is deformed along the thickness direction A of the electronic device 1, and moves along the direction close to the shell 11 through the through hole 112 to make the shell 11 descend along the thickness direction A of the electronic device 1.

[0063] Referring to Figure 6 , Figure 7 and Figure 8 , the embodiments of the present application provide an electronic device 1, when the temperature of the shell 11 is less than the preset temperature, the part of the temperature sensing piece 12 moving outside the shell 11 through the through hole 112 is deformed along the thickness direction A of the electronic device 1, and moves along the direction close to the shell 11 through the through hole 112 to move inside the shell 11 or to the first position, and the temperature sensing piece 12 satisfies the coplanar condition with the outer surface of the shell 11 in the first position.

[0064] In some embodiments, when the temperature of the shell 11 is less than the preset temperature, the part of the temperature sensing member 12 moving to the outside of the shell 11 through the through hole 112 deforms along the thickness direction A of the electronic device 1, and can move to the inside of the shell 11 through the through hole 112 in the direction close to the shell 11, at this time, the state of the temperature sensing member 12 can be the same as that of the temperature sensing member 12 fixed inside the shell 11 without deformation; of course, the state of the temperature sensing member 12 can also be different from that of the temperature sensing member 12 fixed inside the shell 11 without deformation, and the present application embodiments are not limited to this. That is, whether the state of the temperature sensing member 12 is the same as that of the temperature sensing member 12 fixed inside the shell 11 without deformation can be determined by the person skilled in the art according to the actual situation, and the above-mentioned case is only an exemplary description of which relationship the state of the temperature sensing member 12 in the present application can have with the state of the temperature sensing member 12 fixed inside the shell 11 without deformation, but is not limited to the case described in the above-mentioned embodiments.

[0065] In some embodiments, when the temperature of the shell 11 is less than the preset temperature, the part of the temperature sensing member 12 moving to the outside of the shell 11 through the through hole 112 deforms along the thickness direction A of the electronic device 1, and moves to the first position through the through hole 112 in the direction close to the shell 11, and the temperature sensing member 12 satisfies the coplanar condition with the outer surface of the shell 11 in the first position, here, the coplanar condition means that the temperature sensing member 12 satisfies the error allowable value with the outer surface of the shell 11 in the first position, which can be referred to as that the temperature sensing member 12 and the outer surface of the shell 11 are in the same plane. In an embodiment, the error allowable value can be 0.1 millimeter; can be 0.5 millimeter, etc., and the present application embodiments are not limited to the specific size of the error allowable value. Specifically, when the error allowable value is 0.1 millimeter, the temperature sensing member 12 is 0.1 millimeter higher than the outer surface of the shell 11 along the thickness direction A of the electronic device 1 in the first position, or the temperature sensing member 12 is 0.1 millimeter lower than the outer surface of the shell 11 along the thickness direction A of the electronic device 1 in the first position.

[0066] The electronic device 1 provided by the present application embodiments can be beneficial to the design of thin and light electronic device 1, because when the temperature of the shell 11 is less than the preset temperature, the part of the temperature sensing member 12 moving to the outside of the shell 11 through the through hole 112 deforms along the thickness direction A of the electronic device 1, and moves to the inside of the shell 11 through the through hole 112 in the direction close to the shell 11 or moves to the first position, and the temperature sensing member 12 satisfies the coplanar condition with the outer surface of the shell 11 in the first position.

[0067] Reference Figure 11 , Figure 12 , Figure 13 , Figure 14 andFigure 19 The electronic device 1 according to the embodiments of the present application further comprises a foot pad 13, and the foot pad 13 is fixedly connected with the temperature sensing element 12.

[0068] In some embodiments, the electronic device 1 further comprises a foot pad 13, and the foot pad 13 refers to a pad for contacting the electronic device 1 with a to-be-placed position. The foot pad 13 can be made of elastic material, so as to provide partial buffering effect. Of course, the foot pad 13 can also be made of non-elastic material, and the like. The embodiments of the present application do not make any limitation in this regard. That is, the type of the foot pad 13 can be set and adjusted by the person skilled in the art according to the actual situation. The above-mentioned cases are only exemplary to illustrate that the foot pad 13 in the present application can be applied in which forms, but are not limited to the cases described in the above-mentioned embodiments. In an example, the foot pad 13 is made of rubber material. On this basis, the foot pad 13 can be further provided with an anti-skid structure, so as to provide partial anti-skid effect. In an example, an anti-skid groove can be formed on the foot pad 13. In another example, an anti-skid support can be arranged on the foot pad 13. The embodiments of the present application do not make any limitation in this regard. That is, the type of the anti-skid structure can be set and adjusted by the person skilled in the art according to the actual situation. The above-mentioned cases are only exemplary to illustrate that the anti-skid structure in the present application can be applied in which forms, but are not limited to the cases described in the above-mentioned embodiments.

[0069] In some embodiments, the electronic device 1 further comprises a foot pad 13. Here, the foot pad 13 can extend along the length direction B of the electronic device 1, can extend along the width direction C of the electronic device 1, can extend along both the length direction B and the width direction C of the electronic device 1, and the like. The embodiments of the present application do not make any limitation in this regard. That is, the extending direction of the foot pad 13 can be set and adjusted by the person skilled in the art according to the actual situation. The above-mentioned cases are only exemplary to illustrate that the extending direction of the foot pad 13 in the present application can be which directions, but are not limited to the cases described in the above-mentioned embodiments. In a realizable manner provided by the embodiments of the present application, the foot pad 13 extends along the length direction B of the electronic device 1.

[0070] In some embodiments, the electronic device 1 further comprises a foot pad 13 fixedly attached to the temperature sensing element 12. Here, the foot pad 13 and the temperature sensing element 12 can be fixedly attached in a non-detachable manner, for example, the foot pad 13 is glued to the temperature sensing element 12, for example, the foot pad 13 is heat-welded to the temperature sensing element 12, etc. Of course, the foot pad 13 and the temperature sensing element 12 can also be fixedly attached in a detachable manner, for example, the foot pad 13 is clamped to the temperature sensing element 12, for example, the foot pad 13 is screwed to the temperature sensing element 12, etc. The skilled in the art can set and adjust the fixing type of the foot pad 31 and the temperature sensing element 12 according to the actual situation. The above-mentioned cases are only exemplary to illustrate that the foot pad 13 and the temperature sensing element 12 in the present application can be applied in which fixing type, but are not limited to the cases described in the above embodiments. In one implementation provided by the embodiments of the present application, and with reference to Figure 18 , Figure 19 , Figure 20 and Figure 21 , the foot pad 13 is heat-welded to the temperature sensing element 12 in a non-detachable manner and with an increased material, which can improve the reliability of the foot pad 13 fixed to the temperature sensing element 12 and enhance the strength of the electronic device 1. In one example, a second heat-welding column 131 can be provided on the foot pad 13, a second heat-welding hole 125 can be provided on the temperature sensing element 12, and the second heat-welding column 131 extends into the second heat-welding hole 125 to fix the foot pad 13 to the temperature sensing element 12. In another example, a second heat-welding hole 125 can be provided on the foot pad 13, a second heat-welding column 131 can be provided on the temperature sensing element 12, and the second heat-welding column 131 extends into the second heat-welding hole 125 to fix the foot pad 13 to the temperature sensing element 12, etc.

[0071] In some embodiments, the electronic device 1 further comprises a foot pad 13 fixedly attached to the temperature sensing element 12. Here, it means that there can be no gap between the foot pad 13 and the temperature sensing element 12. In this way, space can be saved, and at the same time, foreign matter can be prevented from entering between the foot pad 13 and the temperature sensing element 12. On this basis, the time for the at least part of the temperature sensing element 12 to deform along the thickness direction A of the electronic device 1 and drive the foot pad 13 to move away from the housing 11 through the through hole 112 to raise the housing 11 along the thickness direction A of the electronic device 1 can be saved when the temperature of the housing 11 is greater than the preset temperature.

[0072] The electronic device 1 provided by the embodiment of the present application further comprises a foot pad 13, the foot pad 13 is fixedly attached to the temperature sensing member 12. In this way, when the temperature of the shell 11 is greater than the preset temperature, at least part of the temperature sensing member 12 deforms along the thickness direction A of the electronic device 1, and drives the foot pad 13 to move through the through hole 112 in a direction away from the shell 11, so that the shell 11 rises along the thickness direction A of the electronic device 1. In this way, the opportunity of direct contact between the temperature sensing member 12 and external objects can be reduced, the wear degree of the temperature sensing member 12 is reduced, and the service life of the temperature sensing member 12 is prolonged.

[0073] With reference to Figure 15 , Figure 16 and Figure 17 In one implementation provided by the embodiment of the present application, when the temperature of the shell 11 is less than the preset temperature, the part of the temperature sensing member 12 that drives the foot pad 13 to move through the through hole 112 in a direction close to the shell 11 deforms along the thickness direction A of the electronic device 1, and drives the foot pad 13 to move through the through hole 112 in a direction close to the shell 11, so that the shell 11 descends along the thickness direction A of the electronic device 1. In this way, it is conducive to the design of thin and light electronic device 1. In addition, the part of the temperature sensing member 12 that drives the foot pad 13 to move through the through hole 112 in a direction away from the shell 11 deforms along the thickness direction A of the electronic device 1, and drives the foot pad 13 to move through the through hole 112 in a direction close to the shell 11 to the inside of the shell 11. In this way, the probability of wear of the foot pad 13 can be reduced, and it is conducive to the design of thin and light electronic device 1. In addition, the part of the temperature sensing member 12 that drives the foot pad 13 to move through the through hole 112 in a direction close to the shell 11 to the first position, the foot pad 13 satisfies the coplanar condition with the outer surface of the shell 11 when it is in the first position. In this way, it is conducive to the design of thin and light electronic device 1.

[0074] In some embodiments, when the temperature of the shell 11 is less than the preset temperature, the part of the temperature sensing member 12 that drives the foot pad 13 to move through the through hole 112 in the direction close to the shell 11 deforms along the thickness direction A of the electronic device 1, and drives the foot pad 13 to move through the through hole 112 in the direction close to the shell 11 to the first position. When the foot pad 13 is in the first position, the foot pad 13 and the outer surface of the shell 11 satisfy the coplanar condition. Here, the coplanar condition means that the temperature sensing member 12 and the outer surface of the shell 11 satisfy an error allowable value when the temperature sensing member 12 is in the first position. That is, the foot pad 13 and the outer surface of the shell 11 are in the same plane. In some embodiments, the error allowable value can be 0.1 mm; it can be 0.5 mm, etc. The specific size of the error allowable value is not limited in the embodiments of the present application. Specifically, when the error allowable value is 0.1 mm, the foot pad 13 is 0.1 mm higher than the outer surface of the shell 11 along the thickness direction A of the electronic device 1 when the foot pad 13 is in the first position, or the foot pad 13 is 0.1 mm lower than the outer surface of the shell 11 along the thickness direction A of the electronic device 1 when the foot pad 13 is in the first position.

[0075] The embodiments of the present application provide an electronic device 1, the foot pad 13 extends along a first direction, the temperature sensing member 12 is a plurality of, the plurality of temperature sensing members 12 are arranged along the first direction, and there is a gap between the adjacent two temperature sensing members 12. The plurality of temperature sensing members 12 are fixedly attached to the foot pad 13, wherein the first direction is the length direction B or the width direction C of the electronic device 1.

[0076] In an embodiment of the present application, the temperature sensing member 12 can extend along the length direction B of the electronic device 1. The temperature sensing member 12 can be two, the two temperature sensing members 12 can be arranged along the first direction, there can be a gap between the two temperature sensing members 12, and the two temperature sensing members 12 can be fixedly attached to the two ends of the foot pad 13, respectively.

[0077] In some embodiments, the temperature sensing member 12 can also be three, the three temperature sensing members 12 can be arranged along the first direction, there can be a gap between the three temperature sensing members 12, and the three temperature sensing members 12 can be fixedly attached to the two ends of the foot pad 13, respectively. It should be noted that the number of temperature sensing members 12 is not limited in the embodiments of the present application. That is, the number of temperature sensing members 12 can be adjusted according to the actual situation by those skilled in the art. The above-mentioned cases are only exemplary to illustrate that the temperature sensing member 12 in the present application can be applied in which form, but it is not limited to the cases described in the above embodiments.

[0078] The electronic device 1 provided by the embodiment of the present application, since the foot pad 13 extends along the first direction, by arranging a plurality of temperature sensing pieces 12 arranged along the first direction, there is a gap between two adjacent temperature sensing pieces 12, and the plurality of temperature sensing pieces 12 are fixedly attached to the foot pad 13, in this way, the stability of the part of the foot pad 13 driven by the temperature sensing piece 12 to move along the direction close to the shell 11 through the through hole 112 along the thickness direction A of the electronic device 1 can be improved when the temperature of the shell 11 is less than the preset temperature.

[0079] With reference to Figure 18 , Figure 19 , Figure 20 and Figure 21 , the embodiment of the present application provides an electronic device 1, the foot pad 13 extends along the second direction, the temperature sensing piece 12 is two, the two temperature sensing pieces 12 are arranged along the first direction and the two temperature sensing pieces 12 are fixedly attached to the foot pad 13, one of the temperature sensing pieces 12 is provided with a first groove and a first protrusion along the first direction, the first groove and the first protrusion are arranged along the second direction, the other temperature sensing piece 12 is provided with a second groove and a second protrusion along the first direction, the second groove and the second protrusion are arranged along the second direction, the first protrusion extends into the second groove along the first direction, and the second protrusion extends into the first groove along the first direction; wherein the first direction is the width direction C of the electronic device 1, and the second direction is the length direction B of the electronic device 1.

[0080] In some embodiments, one of the temperature sensing pieces 12 is provided with six first grooves and seven first protrusions along the first direction, the six first grooves and the seven first protrusions are arranged along the second direction, and a first groove is arranged between every two adjacent first protrusions, similarly, the other temperature sensing piece 12 is provided with six second grooves and seven second protrusions along the first direction, the six second grooves and the seven second protrusions are arranged along the second direction, and a second groove is arranged between every two adjacent second protrusions, each first protrusion extends into the corresponding second groove along the first direction, and each second protrusion extends into the corresponding first groove along the first direction, here, it needs to be pointed out that the number of the first grooves and the first protrusions or the second grooves and the second protrusions provided on the temperature sensing piece 12 is not limited. That is, those skilled in the art can adjust the number of the first grooves, the first protrusions, the second grooves and the second protrusions according to the actual situation, and the above-mentioned situation is only an exemplary description of which number of the first grooves, the first protrusions, the second grooves and the second protrusions can be applied in the present application, but it is not limited to the situation described in the above-mentioned embodiments.

[0081] The electronic device 1 provided by the embodiment of the present application has the following advantages. One of the temperature sensing members 12 is provided with a first recess and a first protrusion along a first direction, the first recess and the first protrusion are arranged along a second direction, another temperature sensing member 12 is provided with a second recess and a second protrusion along the first direction, the second recess and the second protrusion are arranged along the second direction, the first protrusion extends into the second recess along the first direction, and the second protrusion extends into the first recess along the first direction. In this way, the first protrusion limits the second recess along the first direction, and the second protrusion limits the first recess along the first direction. In this way, the shaking range of the foot pad 13 along the first direction can be reduced. On this basis, the first protrusion and the second protrusion are limited along the second direction. In this way, the shaking range of the foot pad 13 along the second direction can be reduced.

[0082] With reference to Figure 9 、 Figure 10 and Figure 11 or Figure 18 、 Figure 19 、 Figure 20 and Figure 21 , the embodiment of the present application provides an electronic device 1, and the temperature sensing member 12 includes a fixed part 121, a deformation part, and a lifting part 123. The transition part is located between the fixed part 121 and the deformation part. The fixed part 121 is used to be fixed with the shell 11. In the case that the temperature of the shell 11 is greater than a preset temperature, the deformation part is bent and deformed towards the through hole 112 and away from the shell 11. The lifting part 123 moves along the direction away from the shell 11 through the through hole 112, so that the shell 11 is raised along the thickness direction A of the electronic device 1.

[0083] In some embodiments, the temperature sensing member 12 includes a fixed part 121. Here, in the case that the temperature of the shell 11 is greater than a preset temperature, the fixed part 121 can be deformed along the thickness direction A of the electronic device 1, the fixed part 121 can not be deformed along the thickness direction A of the electronic device 1, and the like. The embodiment of the present application does not limit this. That is, those skilled in the art can set and adjust whether the fixed part 121 is deformed along the thickness direction A of the electronic device 1 according to the actual situation. The above-mentioned cases are only exemplary to illustrate that the fixed part 121 of the temperature sensing member 12 in the present application can be applied in which forms, but is not limited to the cases described in the above-mentioned embodiments.

[0084] In some embodiments, the temperature sensing piece 12 includes a lifting portion 123. Here, the lifting portion 123 can be deformed along the thickness direction A of the electronic device 1 when the temperature of the shell 11 is greater than the preset temperature, or the lifting portion 123 can not be deformed along the thickness direction A of the electronic device 1, and the like. The present application does not limit the lifting portion 123 of the temperature sensing piece 12 in the present application. That is, those skilled in the art can set and adjust whether the lifting portion 123 is deformed along the thickness direction A of the electronic device 1 according to the actual situation. The above-mentioned cases are only exemplary to illustrate which forms the lifting portion 123 of the temperature sensing piece 12 in the present application can be applied, but are not limited to the cases described in the above embodiments. In an implementation provided by the present application, the temperature sensing piece 12 is designed as a whole, and the fixing portion 121, the deformation portion, and the lifting portion 123 can all be deformed along the thickness direction A of the electronic device 1.

[0085] In some embodiments, the fixing portion 121 is used to be fixed with the shell 11. Here, the fixing manner of the fixing portion 121 fixed to the shell 11 can be non-detachable fixing, such as that the fixing portion 121 is glued and fixed inside the shell 11, or that the fixing portion 121 is heat-fused and fixed inside the shell 11, and the like. Of course, the fixing manner of the fixing portion 121 fixed to the shell 11 can also be detachable connection, such as that the fixing portion 121 is clamped and fixed inside the shell 11, or that the fixing portion 121 is threadedly connected and fixed inside the shell 11, and the like. The present application does not limit the fixing manner of the fixing portion 121 fixed to the shell 11. That is, those skilled in the art can set and adjust the fixing manner of the fixing portion 121 fixed to the shell 11 according to the actual situation. The above-mentioned cases are only exemplary to illustrate which forms the fixing portion 121 of the temperature sensing piece 12 in the present application can be fixed to the shell 11 to be applied, but are not limited to the cases described in the above embodiments. In an implementation provided by the present application, the fixing portion 121 is heat-fused and fixed inside the shell 11 in a non-detachable manner and with an increased material. In this way, the reliability of the fixing portion 121 fixed inside the shell 11 can be improved, and the strength of the entire electronic device 1 can be improved. In an example, referring to Figure 9 、 Figure 10 and Figure 11 , a first heat-fusion hole 124 is arranged on the temperature sensing piece 12, a first heat-fusion column 111 is arranged on the shell 11, the first heat-fusion column 111 extends into the first heat-fusion hole 124, so that the temperature sensing piece 12 is fixed inside the shell 11. In another example, a first heat-fusion hole 124 can be arranged on the shell 11, a first heat-fusion column 111 is arranged on the temperature sensing piece 12, the first heat-fusion column 111 extends into the first heat-fusion hole 124, so that the temperature sensing piece 12 is fixed inside the shell 11, and the like. The present application does not limit the fixing manner of the fixing portion 121 fixed to the shell 11.

[0086] In some embodiments, the temperature sensing element 12 is fixedly attached to the foot pad 13, and the fixed portion 121 of the temperature sensing element 12 can be fixedly attached to the foot pad 13; the bent portion 122 of the temperature sensing element 12 can be fixedly attached to the foot pad 13; and the lifting portion 123 of the temperature sensing element 12 can be fixedly attached to the foot pad 13. However, when the temperature of the shell 11 is greater than the preset temperature, the deformed portion is bent and deformed towards the through hole 112 and away from the shell 11, and the lifting portion 123 moves away from the shell 11 through the through hole 112, so that the shell 11 is raised along the thickness direction A of the electronic device 1. At this time, the distance between the lifting portion 123 and the foot pad 13 is small, and it is difficult to be fixedly attached. Therefore, in one implementation provided in the embodiments of the present application, the lifting portion 123 of the temperature sensing element 12 is fixedly attached to the foot pad 13.

[0087] The above is only a preferred embodiment of the present application, and is not intended to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. An electronic device, comprising: The application relates to an electronic device, which comprises the following parts: a shell with a through hole; a temperature sensing part fixed inside the shell; when the temperature of the shell is higher than a preset temperature, at least part of the temperature sensing part is deformed along the thickness direction of the electronic device, and moves away from the shell through the through hole, so that the shell is lifted along the thickness direction of the electronic device.

2. The electronic device of claim 1, wherein, when the temperature of the shell is lower than the preset temperature, the part of the temperature sensing part moving outside the shell through the through hole is deformed along the thickness direction of the electronic device, and moves towards the shell through the through hole, so that the shell is lowered along the thickness direction of the electronic device.

3. The electronic device of claim 2, wherein, when the temperature of the shell is lower than the preset temperature, the part of the temperature sensing part moving outside the shell through the through hole is deformed along the thickness direction of the electronic device, and moves towards the shell through the through hole to the inside of the shell or to a first position, and the temperature sensing part satisfies the coplanar condition with the outer surface of the shell in the first position.

4. The electronic device of claim 1, wherein, The electronic device further comprises a foot pad fixedly attached to the temperature sensing part.

5. The electronic device of claim 4, wherein, The foot pad extends along a first direction, and the temperature sensing part is multiple, and the multiple temperature sensing parts are arranged along the first direction, and there is a gap between two adjacent temperature sensing parts, and the multiple temperature sensing parts are fixedly attached to the foot pad. The first direction is the length direction of the electronic device or the width direction of the electronic device.

6. The electronic device of claim 4, wherein, The foot pad extends along a second direction, and the temperature sensing part is two, and the two temperature sensing parts are arranged along the first direction and are fixedly attached to the foot pad, one of the temperature sensing parts is provided with a first recess and a first protrusion along the first direction, the first recess and the first protrusion are arranged along the second direction, the other temperature sensing part is provided with a second recess and a second protrusion along the first direction, the second recess and the second protrusion are arranged along the second direction, the first protrusion extends into the second recess along the first direction, and the second protrusion extends into the first recess along the first direction. The first direction is the width direction of the electronic device, and the second direction is the length direction of the electronic device.

7. The electronic device of any of claims 1-6, wherein, The temperature sensing part comprises a fixed part, a deformed part and a lifting part, the deformed part is located between the fixed part and the deformed part, the fixed part is used for being fixed to the shell, when the temperature of the shell is higher than the preset temperature, the deformed part is bent and deformed towards the through hole and away from the shell, and the lifting part moves away from the shell through the through hole, so that the shell is lifted along the thickness direction of the electronic device.

8. The electronic device of any of claims 1-6, wherein, The temperature sensing part is provided with a first hot melting hole, and the shell is provided with a first hot melting column, the first hot melting column extends into the first hot melting hole, so that the temperature sensing part is fixed inside the shell.

9. The electronic device of claim 1, wherein, An axial direction of the through hole is parallel to a thickness direction of the electronic device, and at least a portion of the temperature sensing element guided by the through hole is deformed along the thickness direction of the electronic device.

10. The electronic device of claim 1, wherein, The electronic device further comprises a heat-conducting element and a heat-generating element arranged inside the shell, one end of the heat-conducting element is in contact with the heat-generating element, and the other end of the heat-conducting element is in contact with the temperature sensing element.

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