Heat dissipation assembly and electronic device

Abstract

The embodiment of the application provides a heat dissipation assembly and electronic equipment, and relates to the technical field of electronic equipment. The heat dissipation assembly comprises: a substrate, which is arranged on one side of a heat dissipation object of the electronic equipment; a fan module, which is arranged on one side of the substrate and has an air outlet; and a fin group, which comprises a plurality of spaced fins arranged on the substrate, and an air outlet channel is formed between two adjacent fins. The air outlet channel is located on one side of the air outlet and extends towards a heat dissipation port of the electronic equipment. The heat dissipation assembly provided by the embodiment of the application can timely discharge the airflow inside the electronic equipment to improve the heat dissipation efficiency of the electronic device inside the electronic equipment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment, and in particular to a heat dissipation assembly and an electronic equipment. BACKGROUND

[0002] With the gradual improvement of the device performance of electronic equipment (such as a notebook computer), the power consumption of electronic devices inside the electronic equipment gradually increases, resulting in a continuous increase in heat generation.

[0003] The related art sets an internal blowing fan inside the electronic equipment, the internal blowing fan drives airflow to flow inside the electronic equipment, and then flows out to the outside of the electronic equipment, so as to achieve heat dissipation of the electronic devices inside the electronic equipment.

[0004] However, the airflow inside the electronic equipment is difficult to be discharged in time, resulting in a low heat dissipation efficiency of the electronic devices. UTILITY MODEL CONTENT

[0005] Embodiments of the present application provide a heat dissipation assembly and an electronic equipment, so as to achieve the effect of discharging the airflow inside the electronic equipment in time, thereby improving the heat dissipation efficiency of the electronic devices inside the electronic equipment.

[0006] In a first aspect, embodiments of the present application provide a heat dissipation assembly, comprising:

[0007] a substrate, the substrate being configured to be arranged on one side of a heat dissipation target of an electronic equipment;

[0008] a fan module, the fan module being arranged on one side of the substrate, and the fan module having an air outlet;

[0009] a fin group, the fin group comprising a plurality of fins arranged at intervals, the fins being arranged on the substrate, and an air outlet channel being formed between two adjacent fins, the air outlet channel being located on one side of the air outlet, and the air outlet channel being configured to extend towards a heat dissipation port of the electronic equipment.

[0010] In a possible implementation, the fins are air deflectors.

[0011] In a possible implementation, the air deflectors are arc-shaped plates or flat plates.

[0012] In a possible implementation, the fin group further comprises two baffles arranged on the substrate.

[0013] The fins are air deflectors, each air deflector is arranged between two baffles, and the air deflectors are arranged in an array, at least two air deflectors located on the same straight line form a first air deflector unit, and an air outlet channel is formed between two adjacent first air deflector units.

[0014] In a possible implementation, the plurality of fins comprise:

[0015] a plurality of first fins, the first fins being flat plates, a first air outlet channel being formed between two adjacent flat plates, the first air outlet channel being located at one side of the air outlet, and the first air outlet channel extending towards the heat dissipation port of the electronic device;

[0016] a plurality of second fins, the second fins being arc-shaped plates, a second air outlet channel being formed between two adjacent arc-shaped plates, the second air outlet channel being located at a side of the first air outlet channel away from the air outlet, and the second air outlet channel extending towards the heat dissipation port of the electronic device;

[0017] a plurality of third fins, the third fins being air guide columns, the air guide columns being arranged in an array, at least two air guide columns located on the same straight line forming a second air guide unit, a third air outlet channel being formed between two adjacent second air guide units, the third air outlet channel being located at a side of the second air outlet channel away from the first air outlet channel, and the third air outlet channel extending towards the heat dissipation port of the electronic device.

[0018] In a possible implementation, the fins are integrally formed with the base plate, or the fins are welded on the base plate.

[0019] In a possible implementation, a heat pipe is further included, and the heat pipe is arranged on the base plate, and a part of the fins is arranged on the heat pipe.

[0020] In a possible implementation, the number of fan modules is two or more, and the number of fin groups is two or more.

[0021] The fan modules are arranged at the side of the base plate.

[0022] The fins of each fin group are located at one side of the air outlet of each fan module.

[0023] In a possible implementation, the base plate includes:

[0024] a mounting portion, the mounting portion being arranged at one side of the heat dissipation object, and the fins being arranged on the mounting portion;

[0025] an extension portion, the extension portion being connected with the mounting portion, the extension portion being located at one side of the heat dissipation object, and the mounting portion and the extension portion jointly forming a receiving port for receiving the fan module.

[0026] In a second aspect, the embodiments of the present application provide an electronic device, including a device body and a heat dissipation assembly provided in the first aspect.

[0027] The heat dissipation assembly and the electronic device provided by the embodiments of the present application have the following advantages. The heat dissipation assembly is provided with a substrate arranged on one side of a heat dissipation component of the electronic device, so that the substrate can directly absorb heat emitted by the heat dissipation component. The heat dissipation assembly is provided with a fin group, the fin group includes a plurality of fins arranged at intervals, and the fins are arranged on the substrate. The fin group can increase the area of the substrate in contact with air flow in a limited space, thereby increasing the heat dissipation area of the substrate. The heat dissipation assembly is provided with a fan module, the fan module is arranged on one side of the substrate, and the fan module can drive air flow to flow on the surface of the substrate to absorb heat on the substrate and the fins. Adjacent two fins form an air outlet channel. The air outlet channel is arranged on one side of an air outlet of the fan module, and the air outlet channel extends towards a heat dissipation port of the electronic device. The air flow after absorbing heat can be directly discharged from the inside of the electronic device to the outside of the electronic device through the heat dissipation port, and cannot stay or circulate in the electronic device, thereby improving the heat dissipation efficiency of the heat dissipation component. BRIEF DESCRIPTION OF DRAWINGS

[0028] The accompanying drawings, which are incorporated herein and form a part of the specification, illustrate the embodiments of the present application and, together with the description, serve to explain the principles of the present application.

[0029] Figure 1 A structural schematic diagram of an electronic device provided by the embodiments of the present application is shown in the figure.

[0030] Figure 2 A structural schematic diagram of an electronic device provided by the embodiments of the present application is shown in the figure. Figure 1 A structural schematic diagram of an electronic device provided by the embodiments of the present application is shown in the figure. Figure 1 ; A structural schematic diagram of an electronic device provided by the embodiments of the present application is shown in the figure.

[0031] Figure 3 A structural schematic diagram of an electronic device provided by the embodiments of the present application is shown in the figure. Figure 1 A structural schematic diagram of an electronic device provided by the embodiments of the present application is shown in the figure. Figure 2 ; A structural schematic diagram of an electronic device provided by the embodiments of the present application is shown in the figure.

[0032] Figure 4 A structural schematic diagram of an electronic device provided by the embodiments of the present application is shown in the figure. Figure 1 A structural schematic diagram of an electronic device provided by the embodiments of the present application is shown in the figure. Figure 3 ; A structural schematic diagram of an electronic device provided by the embodiments of the present application is shown in the figure.

[0033] Figure 5 A structural schematic diagram of an electronic device provided by the embodiments of the present application is shown in the figure. Figure 1 A structural schematic diagram of an electronic device provided by the embodiments of the present application is shown in the figure. Figure 4 .

[0034] Explanation of reference signs:

[0035] 10-heat dissipation assembly; 20-heat dissipation port; 30-device body;

[0036] 100-substrate; 110-mounting portion; 120-expanding portion; 130-receiving port;

[0037] 200-fan module; 210-air outlet;

[0038] 300 - fin group; 310 - fin; 311 - first fin; 312 - second fin; 313 - third fin; 320 - first air guide unit; 330 - second air guide unit; 340 - baffle;

[0039] 400 - air outlet passage; 410 - first air outlet passage; 420 - second air outlet passage; 430 - third air outlet passage;

[0040] 500 - heat pipe.

[0041] For the purpose of understanding the scheme of the embodiments of the present application, the spline curves and arrows used in the reference signs of the drawings are described as follows: the components indicated by the spline curves without arrows can be solid components, i.e. components with solid structures; the components indicated by the spline curves with arrows can be virtual components, i.e. components without solid structures; in some cases, the components indicated by the spline curves with arrows can also be assembly bodies with solid structures or virtual structures.

[0042] The specific embodiments of the present application have been shown by the above drawings, and will be described in more detail hereinafter. The drawings and the written description are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application for the person skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0043] For the purpose of making the objects, technical schemes and advantages of the embodiments of the present application more clear, the technical schemes of the embodiments of the present application will be described clearly and completely by referring to the drawings of the embodiments of the present application.

[0044] It should be noted that, in this document, the terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. In the description of the embodiments of the present application, it should be understood that the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship (if any) shown in the drawings, and are only used to facilitate the description of the embodiments of the present application and simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the elements defined by the statement "include" do not exclude the presence of other identical elements in the process, method, article or device including the element. If there is no conflict, the embodiments of the present application and various features in the embodiments can be combined with each other, and all within the scope of protection of the present application.

[0045] The embodiments of the present application provide an electronic device, Figure 1 is a structural schematic diagram of an electronic device.

[0046] Please refer to Figure 1 The electronic device includes a device body 30 and a heat dissipation assembly 10 connected with the device body 30.

[0047] In the present embodiment, by connecting the heat dissipation assembly 10 with the device body 30, the heat dissipation assembly 10 can absorb the heat emitted by the device body 30 and discharge the absorbed heat outside the device body 30, so as to achieve heat dissipation of the device body 30, thereby prolonging the service life of the device body 30 and maintaining the performance of the device body 30.

[0048] In some embodiments, the device body 30 includes a shell (not shown in the figure), and a heat dissipation component (not shown in the figure) arranged in the shell, and the heat dissipation assembly 10 is connected in the shell and located on one side of the heat dissipation component.

[0049] In the embodiment, the shell physically protects the to-be-cooled component, and prevents external sundries from entering the shell and affecting normal operation of the to-be-cooled component. By arranging the heat dissipation assembly 10 on one side of the to-be-cooled component, the heat dissipation assembly 10 can dissipate heat from the to-be-cooled component, thereby prolonging the service life of the to-be-cooled component and maintaining the equipment performance of the to-be-cooled component.

[0050] In some other embodiments, the to-be-cooled component includes at least one of a graphics processing unit (GPU), a central processing unit (CPU), and an integrated circuit (IC).

[0051] As the equipment performance of electronic equipment gradually improves, the power consumption of the graphics processing unit, the central processing unit, and the integrated circuit inside the electronic equipment gradually increases, resulting in increasing heat generation. Accumulation of heat can cause the performance of these devices to decrease. Therefore, by arranging the heat dissipation assembly 10, the heat dissipation assembly 10 can keep these devices within an optimal working temperature range, thereby ensuring efficient operation of these devices.

[0052] It can be understood that, Figure 1 Only some components included in the electronic equipment are schematically shown, and the actual shape, actual size, actual position, and actual structure of these components are not limited by Figure 1 The electronic equipment can also include more or fewer components than Figure 1

[0053] It should be noted that the specific type of the electronic equipment is not limited in the present application, and can be selected according to specific needs. For example, the electronic equipment is a notebook computer, a desktop computer, a tablet computer, a wearable device, a household appliance, an office equipment, a game entertainment device, a health care device, an industrial device, or a network device.

[0054] The related art arranges an internal blowing fan inside the electronic equipment, the internal blowing fan drives air flow to flow inside the electronic equipment, and then flows out to the outside of the electronic equipment, thereby dissipating heat from electronic devices inside the electronic equipment.

[0055] However, the air flow inside the electronic equipment is difficult to be discharged in time, resulting in low heat dissipation efficiency of the electronic devices, and further resulting in high temperature of the electronic devices and the shell of the electronic equipment.

[0056] To solve the above technical problems, the present application provides a heat dissipation assembly 10, which is described below with reference to Figure 1 ​The heat dissipation assembly 10 comprises a substrate 100, the substrate 100 is arranged on one side of a heat dissipation object of an electronic device; a fan module 200, the fan module 200 is arranged on one side of the substrate 100, and the fan module 200 has an air outlet 210; and a fin group 300, the fin group 300 comprises a plurality of fins 310 arranged at intervals, the fins 310 are arranged on the substrate 100, and an air outlet channel 400 is formed between adjacent two fins 310, the air outlet channel 400 is located on one side of the air outlet 210, and the air outlet channel 400 extends towards a heat dissipation port 20 of the electronic device.

[0057] The heat dissipation assembly 10 provided in the embodiment of the present application is arranged on one side of the heat dissipation object of the electronic device, so that the substrate 100 can directly absorb the heat emitted by the heat dissipation object. It should be noted that the specific material of the substrate 100 is not limited, and the substrate 100 is a metal plate for example.

[0058] The fin group 300 comprises a plurality of fins 310 arranged at intervals, the fins 310 are arranged on the substrate 100, so that the area of the substrate 100 in contact with the airflow can be increased in a limited space, thereby increasing the heat dissipation area of the substrate 100 and improving the heat dissipation efficiency of the heat dissipation object. In addition, the fins 310 arranged at intervals not only ensure that each fin 310 can fully contact the airflow, but also avoid the mutual influence of heat between the fins 310, so that each fin 310 can play a better heat dissipation effect.

[0059] The fan module 200 is arranged on one side of the substrate 100, and the fan module 200 can drive the airflow to flow on the surface of the substrate 100, so that the airflow can absorb the heat on the substrate 100 and the fins 310.

[0060] The air outlet channel 400 is formed between adjacent two fins 310, the air outlet channel 400 is arranged on one side of the air outlet 210 of the fan module 200, and the air outlet channel 400 extends towards the heat dissipation port 20 of the electronic device, so that the airflow after absorbing heat can be directly discharged from the inside of the electronic device to the outside of the electronic device through the heat dissipation port 20, without staying or circulating in the electronic device, thereby improving the heat dissipation efficiency of the heat dissipation object, and further making the heat dissipation object and the shell of the electronic device operate in an environment with a suitable temperature.

[0061] The preferred technical scheme of the heat dissipation assembly 10 provided in the embodiment of the present application will be described below with reference to the drawings, Figure 2 The structure of the heat dissipation assembly 10 is shown in Figure 1 Fig. 1, Figure 1 The structure of the heat dissipation assembly 10 is shown in Figure 3 Fig. 2, Figure 1 The structure of the heat dissipation assembly 10 is shown in Figure 2 Fig. 3, Figure 4 The structure of the heat dissipation assembly 10 is shown in Figure 1Structure diagram of heat dissipation assembly 10 Figure 3 , Figure 5 For Figure 1 Structure diagram of heat dissipation assembly 10 Figure 4 .

[0062] In some embodiments, referring to Figures 1 to 2 The fins 310 are air deflectors.

[0063] By designing the fins 310 as air deflectors, the fins 310 not only have the effect of increasing the heat dissipation area, but also can effectively guide the airflow. Specifically, an air outlet channel 400 is formed between two adjacent air deflectors, the air outlet channel 400 is located on one side of the air outlet 210, and the air outlet channel 400 extends towards the heat dissipation port 20 of the electronic device, then the air deflector can guide the airflow from the air outlet 210 to the heat dissipation port 20 directly, to ensure that the airflow after absorbing heat can be quickly dissipated to the outside of the electronic device.

[0064] In some specific embodiments, referring to Figure 1 The air deflector is a flat plate. The flat plate structure is simple, easy to manufacture and install, and can significantly reduce production costs.

[0065] In some other specific embodiments, referring to Figure 2 The air deflector is an arc-shaped plate.

[0066] Compared with the flat plate, under the premise that the distance between the air outlet 210 and the heat dissipation port 20 is certain, the length of the arc-shaped plate is longer, which can increase the contact area between the substrate 100 and the airflow, thereby improving the heat dissipation efficiency of the to-be-cooled component.

[0067] In some other embodiments, referring to Figure 3 The fin group 300 further includes two baffles 340, the baffles 340 are arranged on the substrate 100; the fins 310 are air deflectors, each air deflector is arranged between two baffles 340, each air deflector is arranged in an array, at least two air deflectors located on the same straight line form a first air deflector unit 320, and an air outlet channel 400 is formed between two adjacent first air deflector units 320.

[0068] In this embodiment, by arranging the fins 310 as air deflectors, the contact area between the substrate 100 and the airflow can be increased, thereby improving the heat dissipation efficiency of the to-be-cooled component. Specifically, compared with the plate-shaped fin, the air deflector provides a larger surface area in the same occupied space, and this increased surface area directly translates into more heat exchange opportunities, thereby improving the heat dissipation efficiency.

[0069] And, by arranging the arrays of wind guide columns and making at least two wind guide columns on the same straight line form a first wind guide unit 320, so that an air outlet channel 400 is formed between two adjacent first wind guide units 320, the air outlet channel 400 can effectively guide the air flow absorbing heat to flow along the preset path, which is conducive to the rapid discharge of heat.

[0070] It should be noted that by arranging two baffles 340 on each wind guide column, the baffles 340 are arranged on the base plate 100, so as to ensure that the air flow directly flows from the air outlet 210 to the heat dissipation port 20 through the air outlet channel 400, and will not flow out from both sides of the air outlet channel 400, so as to avoid the accumulation of air flow in the interior of the electronic device.

[0071] In other embodiments, please refer to Figure 4 , the plurality of fins 310 includes:

[0072] A plurality of first fins 311, the first fins 311 are flat plates, and a first air outlet channel 410 is formed between two adjacent flat plates, the first air outlet channel 410 is located on one side of the air outlet 210, and the first air outlet channel 410 is used to extend towards the heat dissipation port 20 of the electronic device.

[0073] A plurality of second fins 312, the second fins 312 are arc-shaped plates, and a second air outlet channel 420 is formed between two adjacent arc-shaped plates, the second air outlet channel 420 is located on a side of the first air outlet channel 410 away from the air outlet 210, and the second air outlet channel 420 is used to extend towards the heat dissipation port 20 of the electronic device.

[0074] A plurality of third fins 313, the third fins 313 are wind guide columns, and the arrays of wind guide columns are arranged, at least two wind guide columns on the same straight line form a second wind guide unit 330, a third air outlet channel 430 is formed between two adjacent second wind guide units 330, the third air outlet channel 430 is located on a side of the second air outlet channel 420 away from the first air outlet channel 410, and the third air outlet channel 430 is used to extend towards the heat dissipation port 20 of the electronic device.

[0075] In this embodiment, by arranging a plurality of first fins 311 on the base plate 100, the first fins 311 are flat plates, and a first air outlet channel 410 is formed between two adjacent flat plates, which is arranged on one side of the air outlet 210, so that the resistance of the first air outlet channel 410 is smaller, which is conducive to maximizing the air flow from the air outlet 210.

[0076] By arranging a plurality of second fins 312 on the substrate 100, a second air outlet channel 420 is formed between two adjacent arc-shaped plates, the second air outlet channel 420 is located on the side of the first air outlet channel 410 away from the air outlet 210, and the second air outlet channel 420 can receive airflow from the first air outlet channel 410. By arranging the second fin 312 as an arc-shaped plate, the curved structure of the arc-shaped plate can extend the flow path of the airflow on the surface of the second fin 312, increase the contact time and area of the airflow with the second fin 312, thereby increasing the contact area of the substrate 100 with the airflow, and further improving the heat dissipation efficiency of the heat dissipation component.

[0077] By arranging a plurality of third fins 313 on the substrate 100, the third fins 313 are air guide columns, each air guide column is arranged in an array, and at least two air guide columns located on the same straight line form a second air guide unit 330, so that a third air outlet channel 430 is formed between two adjacent second air guide units 330, the third air outlet channel 430 is located on the side of the second air outlet channel 420 away from the first air outlet channel 410, and the third air outlet channel 430 can receive airflow from the second air outlet channel 420. Moreover, the third fin 313 is an air guide column, and the array arrangement of the air guide column can disperse the airflow direction, reduce the turbulence or local high pressure caused by the concentration of airflow, thereby reducing the flow resistance in the rear section. The gaps between the air guide columns form a multi-channel air outlet structure, promote the uniform distribution of airflow at the end, prevent local overheating caused by heat accumulation in the area close to the heat dissipation port 20, and further improve the heat dissipation efficiency of the heat dissipation port 20.

[0078] In some embodiments, the fin 310 is integrally formed with the substrate 100, or the fin 310 is welded on the substrate 100.

[0079] By integrally forming or welding the fin 310 with the substrate 100, the thermal conduction interface can be greatly reduced, thereby reducing the thermal resistance and further improving the heat conduction efficiency. Moreover, the integrally formed or welded connection mode significantly improves the bonding strength between the fin 310 and the substrate 100.

[0080] In other embodiments, please refer to Figure 5 , the heat dissipation assembly 10 further comprises a heat pipe 500, the heat pipe 500 is arranged on the substrate 100, and a part of the fin 310 is arranged on the heat pipe 500.

[0081] The heat pipe 500 utilizes the phase change principle of working fluid to quickly transfer a large amount of heat with a very small temperature gradient. By arranging the heat pipe 500, the heat conduction efficiency of the substrate 100 can be significantly improved.

[0082] By arranging a part of the fin 310 on the heat pipe 500, the contact area of the airflow with the heat pipe 500 can be equivalent to increasing, thereby improving the heat exchange efficiency of the heat pipe 500.

[0083] It should be noted that part of the fin 310 of the embodiment is arranged on the heat pipe 500, and the other part of the fin 310 can be arranged in the air, and the other part can be directly connected to the substrate 100, so that the fin 310 can be arranged on the substrate 100 directly or indirectly.

[0084] It should be further noted that the heat pipe 500 is a structure design manner known in the art, which will not be described here.

[0085] In other embodiments, please refer to Figures 1 to 5 , the number of fan modules 200 is more than two, and the number of fin groups 300 is more than two; the fan modules 200 are arranged corresponding to the side of the substrate 100; the fins 310 of each fin group 300 are located corresponding to one side of the air outlet 210 of each fan module 200.

[0086] By arranging two or more fan modules 200, the fan modules 200 are arranged corresponding to the side of the substrate 100, and two fan modules 200 can generate more air flow on the side of the substrate 100 and blow to the substrate 100, which can improve the heat dissipation efficiency of the heat dissipation component.

[0087] By arranging two or more fin groups 300, the fins 310 of each fin group 300 are located corresponding to one side of the air outlet 210 of each fan module 200, which can ensure that the air flow blown by each fan module 200 is directly guided to the heat dissipation port 20 through the fin 310, avoiding the accumulation of hot air flow in the electronic equipment.

[0088] In some embodiments, please refer to Figures 1 to 5 , the substrate 100 comprises: a mounting portion 110, the mounting portion 110 is arranged on one side of the heat dissipation component, and the fin 310 is arranged on the mounting portion 110; an extension portion 120 connected with the mounting portion 110, the extension portion 120 is located on one side of the heat dissipation component, and the extension portion 120 and the mounting portion 110 jointly form a containing port 130 for containing the fan module 200.

[0089] By arranging the mounting portion 110, the mounting portion 110 is located on one side of the heat dissipation component, and the mounting portion 110 is used to directly obtain the heat of the heat dissipation component, which ensures the effective conduction of heat. And the fin 310 is arranged on the mounting portion 110, which increases the contact area of the mounting portion 110 with the air flow and improves the heat dissipation efficiency.

[0090] By setting the extension part 120, the extension part 120 is connected with the mounting part 110, so that the extension part 120 increases the total coverage area of the substrate 100. By setting the extension part 120 on one side of the heat dissipation object, the heat dissipation surface of the substrate 100 is increased, so that the substrate 100 can obtain more heat of the heat dissipation object, thereby improving the heat dissipation effect of the whole heat dissipation assembly 10.

[0091] By making the extension part 120 and the mounting part 110 jointly form the accommodating port 130, the fan module 200 can be accommodated in the accommodating port 130, which can improve the space utilization inside the electronic equipment without affecting the heat dissipation effect of the heat dissipation assembly 10.

[0092] In some other embodiments, the substrate 100 is a uniform temperature plate.

[0093] In the present embodiment, by setting the substrate 100 as a uniform temperature plate, when the airflow flows on the surface of the fin 310 and the uniform temperature plate, the heat on the uniform temperature plate can be quickly taken away, thereby improving the two-phase heat exchange efficiency inside the uniform temperature plate, and further improving the heat dissipation effect of the uniform temperature plate.

[0094] It should be noted that the uniform temperature plate is a structure design manner known in the art, which will not be described here.

[0095] It should be understood that the embodiments of the present application are not limited to the precise structure described above and shown in the drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the present application is only limited by the appended claims.

Claims

1. A heat dissipating assembly, characterized by, The application relates to a heat dissipation device for electronic equipment. The heat dissipation device comprises a substrate (100) arranged on one side of a heat dissipation part of the electronic equipment; a fan module (200) arranged on one side of the substrate (100), wherein the fan module (200) has an air outlet (210); and a fin group (300) comprising a plurality of fins (310) arranged at intervals, wherein the fins (310) are arranged on the substrate (100), two adjacent fins (310) form an air outlet channel (400), the air outlet channel (400) is located on one side of the air outlet (210), and the air outlet channel (400) extends towards a heat dissipation port (20) of the electronic equipment. The fin (310) is a wind guide plate. The wind guide plate is an arc-shaped plate or a flat plate.

2. The heat dissipation assembly of claim 1, wherein, The fin group (300) further comprises two baffle plates (340) arranged on the substrate (100).

3. The heat dissipation assembly of claim 2, wherein, The fin (310) is a wind guide column, each wind guide column is arranged in an array, at least two wind guide columns located on the same straight line form a first wind guide unit (320), and two adjacent first wind guide units (320) form the air outlet channel (400).

4. The heat dissipation assembly of claim 1, wherein, The plurality of fins (310) comprises: a plurality of first fins (311) which are flat plates, two adjacent flat plates form a first air outlet channel (410), the first air outlet channel (410) is located on one side of the air outlet (210), and the first air outlet channel (410) extends towards the heat dissipation port (20) of the electronic equipment; 5. The heat dissipation assembly of claim 1, wherein, a plurality of second fins (312) which are arc-shaped plates, two adjacent arc-shaped plates form a second air outlet channel (420), the second air outlet channel (420) is located on one side of the first air outlet channel (410) away from the air outlet (210), and the second air outlet channel (420) extends towards the heat dissipation port (20) of the electronic equipment; a plurality of third fins (313) which are wind guide columns, each wind guide column is arranged in an array, at least two wind guide columns located on the same straight line form a second wind guide unit (330), two adjacent second wind guide units (330) form a third air outlet channel (430), the third air outlet channel (430) is located on one side of the second air outlet channel (420) away from the first air outlet channel (410), and the third air outlet channel (430) extends towards the heat dissipation port (20) of the electronic equipment. The fin (310) is integrally formed with the substrate (100), or the fin (310) is welded on the substrate (100). The heat dissipation device further comprises a heat pipe (500) arranged on the substrate (100), and a part of the fin (310) is arranged on the heat pipe (500).

6. The heat dissipation assembly of claim 1, wherein, ​ 7. The heat dissipating assembly according to any one of claims 1-6, wherein, ​ 8. The heat dissipating assembly according to any one of claims 1-6, wherein, The number of the fan modules (200) is two or more, and the number of the fin groups (300) is two or more; The fan modules (200) are arranged correspondingly on the side of the substrate (100); The fins (310) of each fin group (300) are arranged correspondingly on one side of the air outlet (210) of each fan module (200).

9. The heat dissipating assembly according to any one of claims 1-6, wherein, The substrate (100) comprises: A mounting portion (110) arranged on one side of the heat-dissipating component, and the fins (310) are arranged on the mounting portion (110); An extension portion (120) connected with the mounting portion (110), and arranged on one side of the heat-dissipating component, wherein the extension portion (120) and the mounting portion (110) jointly form a receiving opening (130) for receiving the fan module (200).

10. An electronic device, comprising: The heat-dissipating assembly (10) according to any one of claims 1-9 is connected with a device body (30).

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