Die bonding mechanism

Abstract

The utility model discloses a die bonding mechanism. The die bonding mechanism comprises a glue disc assembly, a scraper assembly and a dispensing assembly. The glue disc assembly comprises a rotating shaft and a glue disc, the periphery of the rotating shaft is sleeved with the glue disc, and the glue disc is provided with an annular glue groove; the scraper assembly comprises a first scraper and a second scraper, the first scraper and the second scraper are arranged at an interval and move relative to the glue disc, an interval is formed between the first scraper and the inner wall of the annular glue groove, and the second scraper is in contact with the inner wall of the annular glue groove; and the dispensing assembly is at least arranged above the annular glue groove between the first scraper and the second scraper. By adopting the die bonding mechanism provided by the utility model, the loss of the die bonding glue can be reduced, so that the utilization rate of the die bonding glue is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to LED manufacturing technical field, especially a fixed crystal mechanism. BACKGROUND

[0002] In the LED packaging process, the fixed crystal bonding of LED light emitting chip and support is a very important link. The fixed crystal bonding is to load the fixed crystal glue in the fixed crystal glue disc, the glue dispensing head dips the fixed crystal glue in the groove of the fixed crystal glue disc, and then transfers to the support. The LED light emitting chip is placed on the fixed crystal glue, and the LED light emitting chip and the support are fixedly connected by the viscosity of the fixed crystal glue.

[0003] The existing fixed crystal glue disc only has one scraper, and the scraper and the inner wall of the groove have a gap. The scraper pushes the fixed crystal glue in the groove flat, and at the same time, the thickness of the fixed crystal glue in the groove is controlled by means of the gap left below. However, due to the viscosity of the fixed crystal glue, part of the fixed crystal glue will adhere to the inner wall of the groove and remain in the glue disc. If the fixed crystal glue remaining in the glue disc is not cleaned in time, it will slowly react over time, causing the viscosity of the fixed crystal glue in the glue disc to increase. During the process of dipping and transferring the fixed crystal glue by the glue dispensing head, abnormal phenomena such as glue throwing are likely to occur. By increasing the frequency of cleaning the glue disc, the frequency of the occurrence of the glue throwing phenomenon can be reduced, but more labor costs are required, and the loss and waste of fixed crystal glue caused by cleaning also increase significantly. SUMMARY

[0004] The technical problem to be solved by the utility model is to provide a fixed crystal mechanism that can reduce the loss of fixed crystal glue and improve the utilization rate of fixed crystal glue.

[0005] In order to solve the above technical problems, the utility model provides a fixed crystal mechanism, which comprises a glue disc assembly, a scraper assembly and a glue dispensing assembly.

[0006] The glue disc assembly comprises a rotating shaft and a glue disc, the glue disc is sleeved on the periphery of the rotating shaft, and the glue disc is provided with an annular glue groove. The scraper assembly comprises a first scraper and a second scraper, the first scraper and the second scraper are arranged at intervals and move relative to the glue disc, the first scraper has a gap with the inner wall of the annular glue groove, and the second scraper is in contact with the inner wall of the annular glue groove. The glue dispensing assembly is arranged above the annular glue groove between the first scraper and the second scraper.

[0007] As an improvement of the above scheme, the first scraper and the second scraper are connected with the rotating shaft through a connecting piece. The first scraper and the second scraper rotate along a first direction with the rotating shaft, and the glue disc is fixed.

[0008] As an improvement of the above-mentioned scheme, the second scraper comprises a scraper body and glue scraping plates arranged on both sides and the bottom of the scraper body, and the side of the glue scraping plate away from the scraper body is in contact with the inner wall of the annular glue groove.

[0009] As an improvement of the above-mentioned scheme, the glue scraping plate extends from the scraper body to the first direction.

[0010] As an improvement of the above-mentioned scheme, the glue scraping plate has an included angle with the inner wall of the annular glue groove, and the size of the included angle is 5°-25°.

[0011] As an improvement of the above-mentioned scheme, the scraper body of the second scraper is provided with a through hole, and the through hole is arranged at the center of the scraper body.

[0012] As an improvement of the above-mentioned scheme, the length of the top of the through hole is greater than the length of the bottom of the through hole.

[0013] As an improvement of the above-mentioned scheme, the second scraper further comprises a movable piece, and the movable piece can move up and down to adjust the size of the through hole.

[0014] As an improvement of the above-mentioned scheme, the second scraper can move up and down to make the second scraper away from or in contact with the inner wall of the annular glue groove.

[0015] As an improvement of the above-mentioned scheme, the glue dispensing assembly comprises a glue dispensing head and a glue dispensing arm, the glue dispensing head is arranged vertically and connected with the glue dispensing arm, and the glue dispensing head is arranged above the annular glue groove between the first scraper and the second scraper.

[0016] The solidifying mechanism comprises two scrapers, the first scraper is used for pushing the solidifying glue flat, the second scraper is in contact with the inner wall of the glue disc, so that the solidifying glue remaining in the inner wall of the glue disc is scraped off and pushed flat under the action of the first scraper, the solidifying glue added into the glue disc each time will not be adhered to the inner wall of the glue disc for a long time, and can be fully used. By adopting the solidifying mechanism, the online time of the solidifying glue is prolonged, the frequency of cleaning the glue disc is reduced, and the loss rate of the solidifying glue is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a sectional structure schematic view of the existing solidifying mechanism;

[0018] Figure 2 is a top view structure schematic view of the existing solidifying mechanism;

[0019] Figure 3 is a sectional structure schematic view of the solidifying mechanism provided by an embodiment of the present application;

[0020] Figure 4is a top view structural schematic diagram of the die bonding mechanism provided by an embodiment of the utility model;

[0021] Figure 5 is a top view structural schematic diagram of the die bonding mechanism provided by another embodiment of the utility model. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical scheme and advantages of the utility model more clear, the utility model will be described in further detail below in combination with the drawings. Only by this declaration, the up, down, left, right, front, back, inside and outside orientation words appearing or about to appear in the utility model in the text are based on the drawings of the utility model, and they are not the specific limitation of the utility model.

[0023] As shown in Figure 1 and Figure 2 , the existing die bonding mechanism comprises a rubber tray 1', a rotating shaft 2', a scraper 3' and a glue head 4', wherein the scraper 2' leaves a gap with the inner wall of the groove of the rubber tray 1', the scraper 2' pushes the die bonding glue in the groove flat, and simultaneously controls the thickness of the die bonding glue in the groove by means of the gap left below. However, since the die bonding glue has a certain viscosity, part of the die bonding glue will be adhered to the inner wall of the groove and remain in the rubber tray 1', causing the viscosity of the die bonding glue in the rubber tray 1' to increase, and in the process of dipping and transferring the die bonding glue by the glue head 4', abnormal phenomena such as glue throwing are prone to occur, the frequency of cleaning the rubber tray 1' needs to be increased, but the corresponding production cost is significantly increased.

[0024] As shown in Figures 3-5 , the utility model embodiment provides a kind of die bonding mechanism, including rubber tray component 1, scraper component 2 and glue dispensing component 3. Among them, rubber tray component 1 is used to carry die bonding glue, scraper component 2 is used to push flat the die bonding glue in rubber tray component 1, to guarantee the consistency of glue amount that glue dispensing component takes each time, glue dispensing component 3 is used to dip the die bonding glue after pushing flat and transfer to the support to be die bonded. Through the joint action of rubber tray component 1, scraper component 2 and glue dispensing component 3, the die bonding in LED packaging is completed.

[0025] Specifically, the glue disc assembly 1 comprises a rotating shaft 11 and a glue disc 12, the glue disc 12 is sleeved on the periphery of the rotating shaft 11, and the glue disc 12 is provided with an annular glue groove 121 for carrying die-bonding glue. The scraper assembly 2 comprises a first scraper 21 and a second scraper 22, the first scraper 21 and the second scraper 22 are arranged at intervals and move oppositely with the glue disc 12, so as to ensure the fluidity of the die-bonding glue in the glue disc 12, the first scraper 21 has a spacing with the inner wall of the annular glue groove 121, and the second scraper 22 is in contact with the inner wall of the annular glue groove 121, the first scraper 21 is used for pushing the die-bonding glue flat, the second scraper 22 is in contact with the inner wall of the annular glue groove 121, so that the die-bonding glue remaining on the inner wall of the annular glue groove 121 is scraped off and pushed flat under the action of the first scraper 21, and the die-bonding glue added into the glue disc 12 each time will not be adhered to the inner wall of the glue disc 12 for a long time and can be fully used. The glue dispensing assembly 3 is arranged at least above the annular glue groove 121 between the first scraper 21 and the second scraper 22.

[0026] In an embodiment, the first scraper 21 and the second scraper 22 are connected with the rotating shaft 11 through a connecting piece 23. It can be understood that the first scraper 21 and the second scraper 22 move oppositely with the glue disc 12, which can rotate, and the first scraper 21 and the second scraper 22 are fixed, or the first scraper 21 and the second scraper 22 rotate and the glue disc 12 is fixed. Specifically, in an embodiment, as shown in Figure 3 and Figure 4 the first scraper 21 and the second scraper 22 are connected with the rotating shaft 11 through the connecting piece 23, and under the driving of the motor and the rotating shaft, the first scraper 21 and the second scraper 22 rotate in the first direction, and the glue disc 12 is fixed. In another embodiment, as shown in Figure 3 and Figure 5 the glue disc 12 is connected with the rotating shaft 11 through a bearing, the first scraper 21 and the second scraper 22 are connected with the rotating shaft 11 through the connecting piece 23, and under the driving of the motor and the bearing, the glue disc 12 rotates in the second direction, and the first scraper 21 and the second scraper 22 are fixed.

[0027] In a preferred embodiment, the second scraper 22 comprises a scraper body 221 and glue scraping plates 222 arranged on both sides and the bottom of the scraper body 221, one side of the glue scraping plate 222 away from the scraper body 221 is in contact with the inner wall of the annular glue groove 121, and is used for scraping off the die-bonding glue remaining on the inner wall of the annular glue groove 121. More preferably, the glue scraping plate 222 can be selected from a plastic elastic sheet, which can be fully attached to the inner wall of the annular glue groove 121 and will not generate too much heat due to friction.

[0028] In a preferred embodiment, the glue scraping plate 222 extends from the scraper body 221 to a first direction. Correspondingly, if the glue disc 12 rotates in a second direction, the first scraper 21 and the second scraper 22 are fixed, and the glue scraping plate 222 extends from the scraper body 221 to the second direction in a reverse direction. The glue scraping plate 222 is arranged to ensure the glue scraping effect and prevent the die bonding adhesive from accumulating on the surface of the scraper.

[0029] More preferably, the glue scraping plate 222 has an included angle θ with the inner wall of the annular glue groove 121, and the size of the included angle θ is 5°-25°, for example, 8°, 10°, 15°, 20°, or 22°, but is not limited thereto, and the glue scraping efficiency can be further improved. Alternatively, the side surface of the glue scraping plate 222 can be a flat surface or an arc surface protruding towards the inner wall of the annular glue groove 121, and the arrangement of the arc surface can improve the effect of gathering the die bonding adhesive on the two side walls to the middle. When the side surface of the glue scraping plate 222 is a flat surface, the included angle θ is the included angle between the side surface and the tangent of the annular glue groove 121, and when the side surface of the glue scraping plate 222 is an arc surface, the included angle θ is the included angle between the line of the side surface and the tangent of the annular glue groove 121.

[0030] The scraper body 221 of the second scraper 22 is provided with a through hole 223, and the through hole 223 is arranged at the center of the scraper body 221. The arrangement of the through hole 223 can provide a flow channel for the die bonding adhesive scraped by the glue scraping plate 222, and the die bonding adhesive scraped by the glue scraping plate 222 flows in a reverse direction of the first direction or a second direction, and is pushed flat by the first scraper 21 and continues to be used for dispensing glue. The through hole 223 is arranged at the center of the scraper body 221, so that the die bonding adhesive scraped from the two side walls can be distributed in the middle of the annular glue groove 121, which is more conducive to subsequent flattening and improves the thickness uniformity of the glue layer.

[0031] In a preferred embodiment, the top length of the through hole 223 is greater than the bottom length of the through hole 223, and more preferably, the shape of the through hole 223 can be funnel-shaped, thereby achieving the effect of scraping the die bonding adhesive from the edge and concentrating it in the middle of the annular glue groove 121.

[0032] In a preferred embodiment, the second scraper 22 further includes a movable piece 224, and the movable piece 224 can move up and down to adjust the size of the through hole 223.

[0033] It can be understood that the second scraper 22 can be arranged in the annular glue groove 121 and in contact with the inner wall of the annular glue groove 121. In another embodiment, the second scraper 22 can also move up and down, so that the second scraper 22 is intermittently inserted into the annular glue groove 121 and in contact with the inner wall of the annular glue groove 121. For example, the second scraper can be inserted into the annular glue groove 121 and in contact with the inner wall of the annular glue groove 121 every 1h.

[0034] In an embodiment, the glue dispensing assembly 3 comprises a glue dispensing head and a glue dispensing arm, the glue dispensing head is arranged vertically and connected with the glue dispensing arm, and the glue dispensing head is arranged above the annular glue groove 121 between the first scraper 21 and the second scraper 22, so as to uniformly dip the die-bonding glue for die bonding. Specifically, if the first scraper 21 and the second scraper 22 rotate in the first direction, the glue dispensing head is arranged behind the first scraper in the rotation direction; if the glue disc rotates in the second direction, the glue dispensing head is arranged in front of the first scraper.

[0035] Specifically, the working steps of the die-bonding mechanism are as follows:

[0036] The die-bonding glue is added in the annular glue groove 121 of the glue disc 12, the height of the first scraper 21 is adjusted to adjust the thickness of the die-bonding glue in the annular glue groove 121 according to the requirement of the glue dispensing amount, the position of the movable piece 224 of the second scraper 22 is adjusted to adjust the size of the through hole 223 according to the viscosity, the adding amount and other requirements of the die-bonding glue, the first scraper rotates in the first direction to push the die-bonding glue in the annular glue groove 121 flat, and the second scraper 22 is lowered every 1h during the process or the second scraper 22 is always in contact with the annular glue groove 121, the second scraper rotates in the first direction to scrape the die-bonding glue remaining on the inner wall of the annular glue groove 121, and the glue dispensing head dips the die-bonding glue in the annular glue groove 121 which has been pushed flat between the first scraper 1 and the second scraper 2 and transfers the die-bonding glue to the LED support.

[0037] The die-bonding mechanism provided by the embodiment of the present application can prolong the online time of the die-bonding glue, and the die-bonding glue can be continuously operated from the conventional 12h or 24h, and only needs to be cleaned when the machine is stopped, so that the frequency of cleaning the glue disc and the labor cost are greatly reduced. Correspondingly, after the frequency of cleaning the glue disc is reduced, the loss rate of the die-bonding glue is reduced from 80% to 5%, and the production cost is greatly reduced.

[0038] The above describes the preferred embodiments of the present application, and it should be pointed out that, for ordinary skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, and these improvements and refinements are also considered to be within the protection scope of the present application.

Claims

1. A die bonding mechanism, characterized by comprising: The glue disc assembly, the scraper assembly and the glue dispensing assembly are provided. The glue disc assembly comprises a rotating shaft and a glue disc, the glue disc is sleeved on the periphery of the rotating shaft, and the glue disc is provided with an annular glue groove.

2. The die bonding mechanism according to claim 1, wherein The scraper assembly comprises a first scraper and a second scraper, the first scraper and the second scraper are arranged at intervals and move oppositely relative to the glue disc, the first scraper has an interval with the inner wall of the annular glue groove, and the second scraper is in contact with the inner wall of the annular glue groove.

3. The die bonding mechanism according to claim 2, wherein The glue dispensing assembly is arranged above the annular glue groove between the first scraper and the second scraper.

4. The die bonding mechanism according to claim 3, wherein The first scraper and the second scraper are connected with the rotating shaft through a connecting piece.

5. The die bonding mechanism according to claim 4, wherein The first scraper and the second scraper rotate along a first direction with the rotating shaft, and the glue disc is fixed.

6. The die bonding mechanism according to claim 3, wherein The second scraper comprises a scraper body and glue scraping plates arranged on both sides and the bottom of the scraper body.

7. The die bonding mechanism according to claim 6, wherein The glue scraping plates are in contact with the inner wall of the annular glue groove.

8. The die bonding mechanism according to claim 6, wherein The glue scraping plates extend from the scraper body to the first direction.

9. The die bonding mechanism according to claim 1, wherein The glue scraping plates have an included angle with the inner wall of the annular glue groove, and the size of the included angle is 5°-25°.

10. The die bonding mechanism according to claim 1, wherein The scraper body of the second scraper is provided with a through hole arranged at the center of the scraper body. The top length of the through hole is greater than the bottom length of the through hole. The second scraper further comprises a movable piece which can move up and down to adjust the size of the through hole. The second scraper can move up and down to make the second scraper away from or in contact with the inner wall of the annular glue groove. The glue dispensing assembly comprises a glue dispensing head and a glue dispensing arm, the glue dispensing head is arranged vertically and connected with the glue dispensing arm, and the glue dispensing head is arranged above the annular glue groove between the first scraper and the second scraper.

Images