Dissociation mechanism for recycling copper powder of waste circuit board

Abstract

The utility model discloses a dissociation mechanism for copper powder recovery of waste circuit boards, which belongs to the technical field of copper powder recovery of waste circuit boards and comprises a dissociation box and a feed inlet arranged at the top of the dissociation box. A driving motor for controlling the rotating rollers to rotate is arranged on the outer side of the dissociation box, a polishing abrasive belt is arranged between the two sets of rotating rollers, and the top of the polishing abrasive belt is horizontal. According to the circuit board polishing device, the polishing abrasive belt capable of horizontally moving is arranged below the feeding port, the blocking mechanism is arranged above the polishing abrasive belt, and the gap is reserved between the bottom of the blocking mechanism and the polishing abrasive belt, so that the polishing thickness of a circuit board can be ensured by adjusting the gap; and after the circuit board is polished to be smaller than the thickness of the gap, the circuit board can pass below the blocking mechanism, the dissociation process of the copper powder is simpler, and meanwhile the dissociation effect of the copper powder and the circuit board is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a dissociation mechanism, particularly to a dissociation mechanism for waste circuit board copper powder recovery belongs to waste circuit board copper powder recovery technical field. BACKGROUND

[0002] With the electronic product's replacement speed more and more fast, the generation of waste circuit board is also increasing, and efficient recycling and utilization of it has become an important issue, and the copper powder is recovered from the waste circuit board, which not only can reduce the dependence on primary copper ore resources, but also can reduce the pollution of waste circuit board to the environment.

[0003] In the prior art, such as the utility model with the application number 202021345694.X, a waste circuit board superfine copper powder recovery device is disclosed, in order to solve the problem of poor control of polishing thickness caused by the small polishing surface of the roller type circuit board copper powder polishing, the motor drives the driving roller and further drives the two driven rollers through the second belt, wherein the pressing device presses the belt between the driven rollers to be close to the first belt, until the gap between the first belt and the second belt is sufficient to polish the circuit board, the transition roller directly acts on the second belt, and the transition roller and the belt are in rolling contact, and simultaneously play the role of pressing the second belt; the outer side of the second belt is provided with a grinding layer, which contacts the surface of the circuit board and plays the role of polishing the copper powder, since the grinding surface is the second belt with larger contact area, the polishing thickness of the copper powder on the surface of the circuit board can be controlled, and the polishing degree is easy to control, and the polishing surface of the circuit board is more uniform.

[0004] There are still some deficiencies in the similar application as mentioned above:

[0005] Since the thickness of the circuit board is not the same, in the control of the polishing thickness of the circuit board, not only the conveying belt speed needs to be regulated, but also the height of the second belt needs to be continuously adjusted, in addition, the wear of the grinding layer in the polishing process also affects the polishing, the dissociation process is relatively complicated, and the dissociation effect of the copper powder and the circuit board is affected.

[0006] Therefore, a dissociation mechanism for waste circuit board copper powder recovery is designed to optimize the above problems. UTILITY MODEL CONTENTS

[0007] The main purpose of the utility model is to provide a dissociation mechanism for waste circuit board copper powder recovery, so as to solve the problems in the background art.

[0008] The purpose of the utility model can be achieved by adopting the following technical scheme:

[0009] The utility model provides a kind of dissociation mechanism for waste circuit board copper powder recovery, including dissociation box and the feed inlet being opened in the top of dissociation box, the top in dissociation box and below the feed inlet are both rotationally installed with rotating roller, the outside of dissociation box is equipped with the drive motor of controlling rotating roller rotation, and the polishing abrasive belt is equipped between two rotating rollers, and the top of polishing abrasive belt is horizontal, and the end of dissociation box top is close to the feed inlet is equipped with barrier mechanism, and the gap is left between the bottom of barrier mechanism and the top of polishing abrasive belt, and copper powder collection mechanism is equipped in the below of the conveying direction of polishing abrasive belt in the inside of dissociation box.

[0010] Preferably: the top of feed inlet is obliquely provided with a feed guide plate, and side baffles are arranged on both sides of the feed guide plate.

[0011] Preferably: the barrier mechanism includes a U-shaped plate, a sliding groove, a partition plate, and a screw rod, the U-shaped plate is fixed on the top of the dissociation box along the width direction of the dissociation box, the sliding groove is formed in the bottom of the U-shaped plate along the length direction, the partition plate is vertically slidably installed in the sliding groove, the length of the partition plate is the same as the width of the inside of the dissociation box, and the partition plate is perpendicular to the top of the polishing abrasive belt, the screw rod is rotatably installed on the top of the partition plate, and the top of the screw rod extends above the U-shaped plate.

[0012] Preferably: the top of the screw rod is provided with an adjusting disc, and anti-slip patterns are arranged on the outside of the adjusting disc.

[0013] Preferably: the copper powder collection mechanism includes a collection cavity, a filter bag, a negative pressure fan, an air suction pipe, the air suction pipe, and a vibration assembly, the collection cavity is formed in the inside of the dissociation box, the filter bag is installed at one end of the inside of the collection cavity, the negative pressure fan is installed at the other end of the inside of the collection cavity, the output end of the negative pressure fan is in communication with the outside of the dissociation box, the air suction pipe is installed at the end of the collection cavity close to the filter bag, the air suction pipe is provided with a gas collecting hood at the top end, the gas collecting hood is located below the end of the polishing abrasive belt, and the vibration assembly is arranged on the top of the gas collecting hood to shake off the debris on the surface of the circuit board.

[0014] Preferably: the vibration assembly includes a supporting plate, a filter plate, and a spring, the supporting plate is horizontally fixed in the inside of the dissociation box, the filter plate is obliquely arranged above the supporting plate, the spring is arranged between the bottom of the filter plate and the supporting plate, and the gas collecting hood is fixed on the top of the supporting plate.

[0015] Preferably: the supporting plate is uniformly and vertically slidably provided with a slide rod, the slide rod passes through the inside of the spring and is fixedly connected with the filter plate.

[0016] Compared with the prior art, the utility model has the beneficial effects that:

[0017] 1. The utility model discloses a movable polishing abrasive belt is provided to the below of feed inlet, and is provided with the barrier mechanism above the polishing abrasive belt, and the gap is left between the bottom of barrier mechanism and polishing abrasive belt, can guarantee the polishing thickness of circuit board through the adjustment of gap, can pass from the below of barrier mechanism after the polishing of circuit board is less than the thickness of gap, and the dissociation process of copper powder is simpler, improves the dissociation effect of copper powder and circuit board simultaneously.

[0018] 2. The utility model discloses a copper powder collection mechanism that is composed of a collecting cavity, a filter bag, a negative pressure fan, an air extraction pipe and a gas collecting hood arranged in the dissociation box. The copper powder after polishing can be quickly collected by negative pressure suction, effectively avoiding dust pollution, and the collection of copper powder is more convenient. In addition, the vibration assembly composed of a supporting plate, a filter plate, a slide rod and a spring can shake off the debris on the surface of the circuit board after it falls, improving the collection effect of copper powder. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is the front view of the utility model;

[0020] Figure 2 It is the front view of the utility model;

[0021] Figure 3 It is the barrier mechanism diagram of the utility model;

[0022] Figure 4 It is the copper powder collection mechanism diagram of the utility model.

[0023] In the drawing: 1, dissociation box;

[0024] 2, feed inlet; 201, feed guide plate;

[0025] 3, rotating roller; 301, polishing abrasive belt;

[0026] 4, barrier mechanism; 401, L-shaped plate; 402, chute; 403, partition; 404, screw rod; 405, adjusting disc;

[0027] 5, copper powder collection mechanism; 501, collecting cavity; 502, filter bag; 503, negative pressure fan; 504, air extraction pipe; 505, gas collecting hood; 506, supporting plate; 507, filter plate; 508, spring; 509, slide rod. DETAILED DESCRIPTION

[0028] To make the purpose, technical scheme and advantage of the utility model embodiment clearer, the technical scheme in the utility model embodiment will be described clearly and completely in combination with the drawings. Obviously, the described embodiment is a part of the embodiment of the utility model, not all the embodiment.

[0029] Therefore, the following detailed description of the embodiments of the present application is not intended to limit the scope of the claimed application, but merely to describe some embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0030] It should be noted that the embodiments and features and technical solutions in the embodiments of the present application can be combined with each other without conflict.

[0031] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0032] In the description of the present application, it should be noted that the terms "upper", "lower" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product is used, or the orientation or positional relationship commonly understood by those skilled in the art. Such terms are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second" and the like are only used for differentiation and cannot be understood as indicating or implying relative importance.

[0033] Embodiment 1

[0034] As shown in Figure 1 , Figure 2 , Figure 3 and Figure 4 , the present embodiment proposes a dissociation mechanism for recovering copper powder from waste circuit boards, which comprises a dissociation box 1 and a feed inlet 2 opened at the top of the dissociation box 1. The dissociation box 1 is rotatably installed at both ends of the top inside and below the feed inlet 2. A drive motor is provided on the outside of the dissociation box 1 to control the rotation of the rotating roller 3. A polishing belt 301 is provided between the two groups of rotating rollers 3. The top of the polishing belt 301 is horizontal. One end of the dissociation box 1 near the feed inlet 2 is provided with a blocking mechanism 4. A gap is left between the bottom end of the blocking mechanism 4 and the top of the polishing belt 301. A copper powder collecting mechanism 5 is provided inside the dissociation box 1 below the conveying direction of the polishing belt 301.

[0035] Before use, according to the thickness of the circuit board and the degree of polishing, the height of the blocking mechanism 4 is controlled, and the vertical height between the blocking mechanism 4 and the polishing belt 301 is the thickness of the circuit board after polishing and conveying. When in use, the processed circuit board is horizontally placed from the feeding port 2 to the top of the polishing belt 301, the front surface of the circuit board is attached to the polishing belt 301, and the polishing belt 301 is conveyed in the direction of the blocking mechanism 4. Due to the blocking effect of the blocking mechanism 4, the polishing belt 301 will always polish the surface of the circuit board before the thickness of the circuit board is greater than the set distance between the blocking mechanism 4 and the polishing belt 301, and the copper powder will be separated from the circuit board. Until the thickness of the circuit board is less than the set distance between the blocking mechanism 4 and the polishing belt 301, the circuit board is conveyed towards the inside of the separation box 1 along with the rotation of the polishing belt 301 and falls down. In the process of polishing the circuit board, the copper powder collecting mechanism 5 is used to continuously collect the copper powder.

[0036] Embodiment 2

[0037] The scheme in embodiment 1 will be further introduced in combination with a specific working mode, which will be described in detail below:

[0038] As shown in Figure 1 , as a preferred embodiment, on the basis of the above-mentioned mode, further, the top of the feeding port 2 is inclinedly provided with a feeding guide plate 201, and both sides of the feeding guide plate 201 are provided with side baffles.

[0039] By using the feeding guide plate 201, the feeding of the circuit board can be facilitated, and it is ensured that the circuit board can be horizontally attached to the top of the polishing belt 301.

[0040] As shown in Figure 3 , as a preferred embodiment, on the basis of the above-mentioned mode, further, the blocking mechanism 4 comprises an L-shaped plate 401, a sliding groove 402, a partition plate 403 and a screw rod 404. The L-shaped plate 401 is fixed on the top of the separation box 1 along the width direction of the separation box 1. The bottom of the L-shaped plate 401 is provided with the sliding groove 402 along the length direction. The partition plate 403 is vertically and slidably installed in the sliding groove 402. The length of the partition plate 403 is the same as the internal width of the separation box 1, and the partition plate 403 is perpendicular to the top of the polishing belt 301. The screw rod 404 is rotatably installed on the top of the partition plate 403, and the top of the screw rod 404 extends above the L-shaped plate 401.

[0041] When adjusting the blocking mechanism 4, the screw rod 404 is rotated to control the downward movement of the screw rod 404 and drive the partition plate 403 to vertically move downward, so as to adjust the distance between the partition plate 403 and the polishing belt 301. The partition plate 403 blocks the circuit board which has not been polished, and the circuit board can pass through the bottom of the partition plate 403 only after being polished.

[0042] AsFigure 3 As shown, in a preferred embodiment, based on the above method, an adjustment disc 405 is further installed on the top of the screw 404, and the outer side of the adjustment disc 405 is provided with anti-slip texture.

[0043] During the rotation of screw 404, the rotation of adjustment disc 405 is manually controlled to drive screw 404 to rotate, making operation more convenient.

[0044] like Figure 1 and Figure 4 As shown, in a preferred embodiment, based on the above method, the copper powder collection mechanism 5 further includes a collection chamber 501, a filter bag 502, a negative pressure fan 503, an exhaust pipe 504, and a vibration assembly. The collection chamber 501 is located inside the dissociation box 1. The filter bag 502 is installed at one end of the collection chamber 501, and the negative pressure fan 503 is installed at the other end of the collection chamber 501. The output end of the negative pressure fan 503 is connected to the outside of the dissociation box 1. The exhaust pipe 504 is installed at the end of the collection chamber 501 near the filter bag 502. A gas collection hood 505 is installed at the top of the exhaust pipe 504. The gas collection hood 505 is located below the end of the sanding belt 301. A vibration assembly is provided on the top of the gas collection hood 505 to shake off the debris on the surface of the circuit board.

[0045] During the polishing process of the circuit board, the negative pressure fan 503 is always on, keeping the inside of the collection chamber 501 under negative pressure. The gas inside the dissociation box 1 is drawn out through the gas collection hood 505. Since the gas collection hood 505 is located below the end of the polishing belt 301, the metal dust adhering to the surface of the polishing belt 301 can be directly drawn into the inside of the collection chamber 501 and filtered and collected by the filter bag 502.

[0046] like Figure 1 and Figure 4 As shown, in a preferred embodiment, based on the above method, the vibration assembly further includes a support plate 506, a filter plate 507 and a spring 508. The support plate 506 is horizontally fixed inside the disintegration box 1. The filter plate 507 is inclinedly arranged above the support plate 506. The spring 508 is provided between the bottom of the filter plate 507 and the support plate 506. The air collection hood 505 is fixed to the top of the support plate 506.

[0047] After polishing, the circuit board that slides off the polishing belt 301 will fall directly onto the top of the filter plate 507. Since the bottom of the filter plate 507 is a spring 508, it will cause the circuit board to vibrate, completely shaking off the debris on its surface, thereby improving the collection effect of the gas collection hood 505.

[0048] like Figure 4As shown, as a preferred embodiment, on the basis of the above mode, further, the sliding rod 509 is arranged on the base plate 506 and vertically slides uniformly, the sliding rod 509 passes through the inside of the spring 508 and is fixedly connected with the filter plate 507.

[0049] By using the sliding rod 509, it can be ensured that the filter plate 507 can only be shaken vertically and will not cause the deviation of the filter plate 507.

[0050] Embodiment 3

[0051] The schemes in the embodiments 1 and 2 are further introduced in combination with specific working modes, and details are described as follows:

[0052] Before use, according to the thickness of the circuit board and the polishing degree, the screw rod 404 is rotated to control the downward movement of the screw rod 404 and drive the vertical downward movement of the partition plate 403, so as to adjust the gap between the partition plate 403 and the polishing belt 301, and the partition plate 403 is used to block the circuit board which is not polished, and the circuit board can pass through the bottom of the partition plate 403 only after the polishing is completed. When in use, the processed circuit board is horizontally placed into the top of the polishing belt 301 from the feeding port 2, the front surface of the circuit board is attached to the polishing belt 301, and the polishing belt 301 is rotated and conveyed towards the partition plate 403. Due to the blocking effect of the partition plate 403, when the thickness of the circuit board is greater than the gap between the partition plate 403 and the polishing belt 301, the polishing belt 301 will always polish the surface of the circuit board to separate the copper powder from the circuit board, until the thickness of the circuit board is less than the gap between the partition plate 403 and the polishing belt 301. In the process of polishing the circuit board, the negative pressure fan 503 is always in an open state, so that the inside of the collecting cavity 501 is in a negative pressure state, and the gas in the separation box 1 is extracted through the gas collecting hood 505. Since the gas collecting hood 505 is located below the end portion of the polishing belt 301, the metal dust adhered to the surface of the polishing belt 301 can be directly extracted into the inside of the collecting cavity 501 and filtered and collected by the filter bag 502. After polishing and passing through the bottom of the partition plate 403, the circuit board which slides off the polishing belt 301 will directly fall onto the top of the filter plate 507. Since the bottom of the filter plate 507 is the spring 508, the vibration of the circuit board will be caused, so that the debris on the surface of the circuit board is completely shaken off, so as to improve the collection effect of the gas collecting hood 505.

[0053] The above is only a further embodiment of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can make equivalent replacement or change according to the technical scheme and concept of the present application within the scope disclosed by the present application, which belongs to the protection scope of the present application.

Claims

1. A dissociation mechanism for recovering copper powder from waste circuit boards, comprising a dissociation box (1) and a feed inlet (2) formed on the top of the dissociation box (1), characterized in that: Both ends of the top of the dissociation box (1) and below the feed inlet (2) are rotatably installed with rotating rollers (3), the outside of the dissociation box (1) is provided with a drive motor for controlling the rotation of the rotating roller (3), a grinding belt (301) is arranged between the two groups of rotating rollers (3), the top of the grinding belt (301) is horizontal, the end of the top of the dissociation box (1) close to the feed inlet (2) is provided with a blocking mechanism (4), a gap is left between the bottom end of the blocking mechanism (4) and the top of the grinding belt (301), and a copper powder collecting mechanism (5) is arranged inside the dissociation box (1) and below the conveying direction of the grinding belt (301).

2. The dissociation mechanism for recovering copper powder from waste circuit boards according to claim 1, characterized in that: The top of the feed inlet (2) is obliquely provided with a feed guide plate (201), and both sides of the feed guide plate (201) are provided with side baffles.

3. The dissociation mechanism for recovering copper powder from waste circuit boards according to claim 1, characterized in that: The blocking mechanism (4) comprises a U-shaped plate (401), a sliding groove (402), a partition plate (403) and a screw rod (404), the U-shaped plate (401) is fixed on the top of the dissociation box (1) along the width direction of the dissociation box (1), the bottom of the U-shaped plate (401) is provided with the sliding groove (402) along the length direction, the partition plate (403) is vertically and slidably installed in the sliding groove (402), the length of the partition plate (403) is the same as the width of the inside of the dissociation box (1), and the partition plate (403) is perpendicular to the top of the grinding belt (301), and the screw rod (404) is rotatably installed on the top of the partition plate (403), and the top of the screw rod (404) extends to above the U-shaped plate (401).

4. The dissociation mechanism for recovering copper powder from waste circuit boards according to claim 3, characterized in that: The top of the screw rod (404) is provided with an adjusting disc (405), and the outer side of the adjusting disc (405) is provided with anti-skid lines.

5. The dissociation mechanism for recovering copper powder from waste circuit boards according to any one of claims 1-4, characterized in that: The copper powder collecting mechanism (5) comprises a collecting cavity (501), a filter bag (502), a negative pressure fan (503), an air exhaust pipe (504), an air exhaust pipe (504) and a vibration assembly, the collecting cavity (501) is arranged in the inside of the dissociation box (1), one end of the inside of the collecting cavity (501) is provided with the filter bag (502), the other end of the inside of the collecting cavity (501) is provided with the negative pressure fan (503), the output end of the negative pressure fan (503) is in communication with the outside of the dissociation box (1), the end of the collecting cavity (501) close to the filter bag (502) is provided with the air exhaust pipe (504), the top end of the air exhaust pipe (504) is provided with a gas collecting hood (505), the gas collecting hood (505) is located below the end of the grinding belt (301), and the top of the gas collecting hood (505) is provided with a vibration assembly for shaking off the debris on the surface of the circuit board.

6. The dissociation mechanism for recovering copper powder from waste circuit boards according to claim 5, characterized in that: The vibration assembly comprises a supporting plate (506), a filter plate (507) and a spring (508), the supporting plate (506) is horizontally fixed in the inside of the dissociation box (1), the filter plate (507) is obliquely arranged above the supporting plate (506), the spring (508) is arranged between the bottom of the filter plate (507) and the supporting plate (506), and the gas collecting hood (505) is fixed on the top of the supporting plate (506).

7. The dissociation mechanism for recovering copper powder from waste circuit boards according to claim 6, characterized in that: The supporting plate (506) is uniformly and vertically slidably provided with a slide rod (509), the slide rod (509) penetrates through the inside of the spring (508) and is fixedly connected with the filter plate (507).

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