Full-automatic wafer protective film tearing machine

Abstract

The utility model discloses a full-automatic wafer protective film tearing machine, which relates to the technical field of film tearing machines and comprises a frame, an electric push rod fixedly arranged at the bottom of the inner wall of the frame, a positioning sucker fixedly arranged at the top of the electric push rod, a motor fixedly arranged at the top of the inner wall of the frame, and a driving screw fixedly arranged on an output shaft of the motor. The bottom of the driving screw is rotatably sleeved with a supporting cylinder, a supporting rod is fixedly arranged between the supporting cylinder and the top of the rack, a bottom plate is fixedly arranged at the bottom of the supporting cylinder, a plurality of sleeve plates which are symmetrically arranged in a surrounding mode are arranged outside the bottom plate, penetrating holes are formed in the ends of the sleeve plates, moving plates are arranged at the ends of the moving plates in a sliding and penetrating mode, and film tearing suction cups are arranged at the ends of the moving plates. And a lifting film tearing mechanism for lifting the film tearing sucking disc is arranged between the driving screw rod and the sleeve plate. According to the utility model, a plurality of film tearing suckers are arranged in a surrounding manner, so that the protective film on the surface of the wafer can be uniformly torn in a multi-point manner, the film tearing effect is normal, and the surface structure of the wafer is prevented from being damaged as much as possible.

Description

TECHNICAL FIELD

[0001] The utility model relates to a tear membrane machine technical field, concretely relates to a full -automatic wafer protection film tear membrane machine. BACKGROUND

[0002] In the wafer manufacturing process, the protection film is used for protecting the wafer surface from outside pollution, scratch and chemical corrosion etc., after completing specific process steps, it needs to be removed to carry out subsequent processing, at this time, it needs to be assisted by tear membrane machine to operate, and the patent document with the announcement number CN208576269U also discloses a full -automatic wafer protection film tear membrane machine, the above tear membrane equipment can only tear the one end of the protection film when carrying out tear membrane work, makes the rest of the protection film easily be pulled and increase the adhesion between the wafer, makes the protection film easily tear the wafer surface structure, makes the wafer surface quality be affected, and leads to the wafer unable to use. CONTENT OF THE UTILITY MODEL

[0003] In view of the above existing full -automatic wafer protection film tear membrane machine problem, the utility model is provided.

[0004] Therefore, the utility model aims at providing a full -automatic wafer protection film tear membrane machine, solves the problem that the existing tear membrane machine can only tear the one end of the wafer surface protection film, makes the protection film be pulled and be deformed and damage wafer surface structure.

[0005] In order to realize the above -mentioned purpose, the utility model provides the following technical scheme:

[0006] A full -automatic wafer protection film tear membrane machine, including the frame, the inner wall bottom of frame is fixedly arranged with electric push rod, the top of electric push rod is fixedly arranged with positioning suction cup, the inner wall top of frame is fixedly arranged with motor, the output shaft of motor is fixedly arranged with drive screw, the bottom of drive screw is rotatably sleeved with support cylinder, the top between support cylinder and frame is fixedly arranged with support rod, the bottom of support cylinder is fixedly arranged with bottom plate, the outside of bottom plate is equipped with a plurality of ring -shaped symmetrical arrangement of sleeve plate, the end of sleeve plate is provided with the perforation, and the mobile plate is slidably arranged, the end of mobile plate is provided with tear membrane suction cup;

[0007] The drive screw and sleeve plate are equipped with the lifting tear membrane mechanism for lifting tear membrane suction cup.

[0008] Preferably, the lifting tear membrane mechanism includes a sliding plate, the sliding plate is slidably sleeved on the outside of the drive screw, a plurality of recesses are formed in the outer wall of the sliding plate, the top of the sleeve plate is fixedly provided with a U-shaped plate, and the recesses and the U-shaped plate on the same side are rotatably provided with a pull plate through a shaft pin.

[0009] Preferably, the outer wall of the bottom plate is provided with a plurality of rotation grooves arranged in a surrounding symmetry, and a horizontal rod is fixedly arranged in the rotation grooves.

[0010] Preferably, the top of the moving plate is provided with a plurality of positioning grooves arranged at intervals, a positioning rod is slidably arranged at the top of the cover plate, the lower end of the positioning rod is inserted into the positioning groove, a spring is arranged on the rod wall of the positioning rod, and the two ends of the spring are fixedly connected with the positioning rod and the cover plate respectively.

[0011] Further, the bottom of each of the plurality of moving plates is provided with a rolling groove, and a guide ball is rollingly arranged in the rolling groove.

[0012] Preferably, the positioning suction disc and the film tearing suction disc are connected with an external air source.

[0013] Preferably, the support cylinder is rotationally connected with the lower end of the driving screw through an internal bearing.

[0014] In the above technical solution, the technical effects and advantages of the utility model are provided:

[0015] 1. The utility model discloses a positioning suction disc, a motor, a driving screw, a support cylinder, a bottom plate, a cover plate, a moving plate, a film tearing suction disc and a film tearing mechanism, a plurality of ring-shaped film tearing suction discs can uniformly tear the wafer surface protection film from multiple points, and the wafer surface structure can be prevented from being damaged as much as possible.

[0016] 2. The utility model discloses a cover plate, a perforation, a moving plate, a positioning rod, a positioning groove, a spring and a pull ring, the positions of the plurality of film tearing suction discs can be adjusted according to the wafer specification, and the film tearing suction disc can be stably contacted with the surface of the protection film to tear the film. DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings needed in the embodiments will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained by those skilled in the art according to the drawings.

[0018] Figure 1 It is a three-dimensional structure schematic view of the utility model;

[0019] Figure 2 It is a three-dimensional structure schematic view of the driving screw, the support cylinder, the bottom plate and the film tearing mechanism of the utility model;

[0020] Figure 3 It is partial structure schematic view of the moving plate and the film tearing suction cup of the utility model;

[0021] Figure 4 It is partial structure schematic view of the moving plate and the film tearing suction cup of the utility model; Figure 2 It is A part enlarged schematic view of the utility model.

[0022] Mark explanation:

[0023] 1, rack;2, electric push rod;3, positioning suction cup;4, motor;5, drive screw;6, support cylinder;7, support rod;8, bottom plate;9, sleeve plate;10, moving plate;11, film tearing suction cup;12, sliding plate;13, U-shaped plate;14, pull plate;15, cross rod;16, positioning groove;17, positioning rod;18, spring;19, pull ring;20, guide ball;21, connecting rod. Specific implementation

[0024] In order to make those skilled in the art better understand the technical scheme of the utility model, the utility model will be further introduced in detail below in conjunction with the drawings.

[0025] The utility model embodiment discloses a full-automatic wafer protective film film tearing machine.

[0026] The utility model provides a kind of full-automatic wafer protective film film tearing machine as Figures 1-4 As shown in the schematic view, a full-automatic wafer protective film film tearing machine includes rack 1, the inner wall bottom of rack 1 is fixedly provided with electric push rod 2, the top of electric push rod 2 is fixedly provided with positioning suction cup 3, the inner wall top of rack 1 is fixedly provided with motor 4, the output shaft of motor 4 is fixedly provided with drive screw 5, the bottom of drive screw 5 is rotatably sleeved with support cylinder 6, support cylinder 6 is rotatably matched with the lower light pole end of drive screw 5 through its internal bearing, support rod 7 is fixedly arranged between the top of support cylinder 6 and rack 1, the bottom of support cylinder 6 is fixedly provided with bottom plate 8, the outside of bottom plate 8 is provided with a plurality of sleeve plates 9 arranged in a ring around symmetry, a plurality of rotating grooves arranged in a ring around symmetry are formed in the outer wall of bottom plate 8, cross rod 15 is fixedly arranged in rotating groove, sleeve plate 9 is rotatably sleeved on the outside of cross rod 15, perforation is formed in the end of sleeve plate 9, and moving plate 10 is slidably arranged in perforation, the end of moving plate 10 is provided with film tearing suction cup 11, positioning suction cup 3 and film tearing suction cup 11 are connected with external air source;

[0027] The bottom of a plurality of moving plates 10 is provided with rolling groove, guide ball 20 is rotatably arranged in rolling groove, and connecting rod 21 is fixedly connected with film tearing suction cup 11 through guide ball 20.

[0028] Before the film is torn, the wafer is placed on the top of the positioning chuck 3, and the positions of the plurality of film tearing chucks 11 are adjusted so that the plurality of film tearing chucks 11 can stably cover the wafer surface at multiple positions, then the electric push rod 2 is started to push the wafer by the positioning chuck 3 so that the plurality of film tearing chucks 11 can stably contact and adsorb the wafer surface protective film under the rotating cooperation of the guide ball 20 and the rolling groove, then the motor 4 controls the driving screw 5 to rotate, so that the driving screw 5 stably rotates under the support of the support cylinder 6, and the sleeve plate 9 is driven to move the moving plate 11 under the support of the cross bar 15, at this time the plurality of moving plates 11 drive the film tearing chucks 11 to move upwards, so that the plurality of film tearing chucks 11 can synchronously lift the wafer surface protective film when surrounding, to ensure the uniformity of film tearing and avoid damage to the wafer surface as much as possible.

[0029] In order to enable the plurality of sleeve plates 9 to be synchronously rotated, as shown in Figures 1-2 , a lifting film tearing mechanism for lifting the film tearing chuck 11 is arranged between the driving screw 5 and the sleeve plate 9, the lifting film tearing mechanism comprises a sliding plate 12 which is slidably sleeved on the outside of the driving screw 5, a plurality of recesses symmetrically arranged around the outer wall of the sliding plate 12, a U-shaped plate 13 fixedly arranged on the top of the sleeve plate 9, and a pull plate 14 rotatably arranged between the same side recess and the U-shaped plate 13 through a shaft pin.

[0030] When the driving screw 5 rotates, the sliding plate 12 moves upwards so that the pull plate 14 is pulled, at this time the lower end of the pull plate 14 lifts the sleeve plate 9 under the rotating cooperation with the U-shaped plate 13, so that the sleeve plate 9 drives the moving plate 10 to swing upwards so that the film tearing chuck 11 adsorbs and tears the protective film.

[0031] In order to adjust the position of the plurality of film tearing chucks 11 according to the specification of the wafer, as shown in Figure 1 and Figures 3-4 , a plurality of positioning grooves 16 are arranged on the top of the moving plate 10, a positioning rod 17 is slidably arranged on the top of the sleeve plate 9, the lower end of the positioning rod 17 is inserted into the positioning groove 16, a spring 18 is sleeved on the rod wall of the positioning rod 17, the two ends of the spring 18 are fixedly connected with the positioning rod 17 and the sleeve plate 9 respectively, and a pull ring 19 is fixedly arranged on the top of the positioning rod 17.

[0032] After the wafer is placed on the surface of the positioning chuck 3, the specification of the wafer is determined, then the plurality of pull rings 19 are pulled, when the pull ring 19 is pulled, the positioning rod 17 is stretched and pulled to stretch the spring 18 and pull out from the positioning groove 16, then under the sliding support of the through hole, the extension distance of the moving plate 10 can be adjusted, when the film tearing chuck 11 is stably arranged on the wafer surface, the pull ring 19 is released, under the elastic recovery of the spring 18, the positioning rod 17 rebounds and inserts into the positioning groove 16, so that the position of the plurality of film tearing chucks 11 is fixed, to ensure the stability of film tearing.

[0033] Certain exemplary embodiments of this application are described herein by way of illustration. It should be understood that to those skilled in the art, upon consideration of this disclosure, various modifications could be practiced without departing from the spirit and scope of the application. Thus, the foregoing description is by way of example only, and is not intended to be limiting.

Claims

1. A full-automatic wafer protective film stripping machine comprising a rack (1), characterized in that, The inner wall bottom of the rack (1) is fixedly provided with an electric push rod (2), the top of the electric push rod (2) is fixedly provided with a positioning suction cup (3), the inner wall top of the rack (1) is fixedly provided with a motor (4), the output shaft of the motor (4) is fixedly provided with a drive screw (5), the bottom of the drive screw (5) is rotatably sleeved with a supporting cylinder (6), the supporting cylinder (6) and the top of the rack (1) are fixedly provided with a supporting rod (7), the bottom of the supporting cylinder (6) is fixedly provided with a bottom plate (8), the outer part of the bottom plate (8) is provided with a plurality of sleeve plates (9) which are symmetrically arranged in a surrounding manner, the end of the sleeve plate (9) is provided with a perforation, and the perforation is slidably provided with a moving plate (10), and the end of the moving plate (10) is provided with a film tearing suction cup (11). The drive screw (5) and the sleeve plate (9) are provided with a lifting film tearing mechanism for lifting the film tearing suction cup (11).

2. The full-automatic wafer protection film tear-off machine according to claim 1, characterized in that, The lifting film tearing mechanism comprises a sliding plate (12), the sliding plate (12) is slidably sleeved on the outer side of the drive screw (5), the outer wall of the sliding plate (12) is provided with a plurality of recesses which are symmetrically arranged in a surrounding manner, the top of the sleeve plate (9) is fixedly provided with a U-shaped plate (13), and the same side recess and U-shaped plate (13) are rotatably provided with a pull plate (14) through an axle pin.

3. The full-automatic wafer protection film tear-off machine according to claim 1, characterized in that, The outer wall of the bottom plate (8) is provided with a plurality of rotation grooves which are symmetrically arranged in a surrounding manner, the rotation grooves are fixedly provided with a cross rod (15) inside, and the sleeve plate (9) is rotatably sleeved on the outer side of the cross rod (15).

4. The full-automatic wafer protection film tear-off machine according to claim 1, characterized in that, The top of the moving plate (10) is provided with a plurality of positioning grooves (16) which are arranged at intervals, the top of the sleeve plate (9) is slidably provided with a positioning rod (17), the lower end of the positioning rod (17) is inserted into the positioning groove (16), the rod wall of the positioning rod (17) is sleeved with a spring (18), the two ends of the spring (18) are fixedly connected with the positioning rod (17) and the sleeve plate (9) respectively, and the top of the positioning rod (17) is fixedly provided with a pull ring (19).

5. The full-automatic wafer protection film tear-off machine according to claim 1, characterized in that, The bottom of each of the plurality of moving plates (10) is provided with a rolling groove, the rolling groove is rotatably embedded with a guide ball (20), the outer wall of the guide ball (20) is fixedly provided with a connecting rod (21), and the connecting rod (21) is fixedly connected with the film tearing suction cup (11).

6. The full-automatic wafer protection film tear-off machine according to claim 1, wherein, The positioning suction cup (3) and the film tearing suction cup (11) are both connected with an external air source.

7. The full-automatic wafer protection film tear-off machine according to claim 1, wherein, The supporting cylinder (6) is rotatably connected with the lower light rod end of the drive screw (5) through the bearing in the supporting cylinder (6).

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