Single-head PCB bonding detection device

Abstract

The single-head PCB bonding detection device comprises a machine base and a machine frame which covers the machine base and provides a mounting position, and further comprises a conveying mechanism which comprises an adsorption platform, and a plurality of adsorption areas are arranged on the adsorption platform; the detection mechanism is arranged on the upper side of the conveying mechanism and is provided with a first visual module and a second visual module which have different shooting visual angles; and the material moving mechanism is arranged beside the detection mechanism, is positioned above the conveying mechanism, and is used for taking and placing the PCBs positioned on the adsorption platform. In the process, the detection head is provided with the first visual module and the second visual module which have different shooting visual angles, and the first visual module and the second visual module have different forming patterns due to different shooting visual angles, so that more comprehensive detection can be carried out on the PCB surface-mounted electrical components, and the bonding effect of the PCB is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to PCB board bonding detection technical field, concretely relates to a single -end PCB board bonding detection device. BACKGROUND

[0002] PCB board is the most needed electronic device in the current electronic equipment, and is the most important electronic component, is the support of electronic components, is the carrier of electrical interconnection of electronic components.

[0003] After PCB printing is completed, a relatively important processing link is bonding, that is, the process of fixing and connecting electronic components and circuits, which is crucial in the process, to ensure that electronic components have sufficient stability and firmness when fixed and connected to the circuit, therefore, after completing bonding, the PCB board needs to be detected to check the installation state of electronic components.

[0004] At present, when the PCB board bonding is detected, a visual camera is arranged above the PCB board, so that the PCB board can be photographed and recognized for detection, but a single visual camera can only take photos from top to bottom of the PCB board, producing a flat photo, therefore, there is often a blind area in detection, and electronic components cannot be more comprehensively photographed, therefore, there is still a situation of incomplete detection.

[0005] Therefore, a new technology is needed to solve the above technical problems. UTILITY MODEL CONTENTS

[0006] The utility model aims at providing a single -end PCB board bonding detection device, in order to solve above at least technical problem, the utility model adopts the following technical scheme:

[0007] Single -end PCB board bonding detection device, including a machine base and the machine frame that the machine base is covered in it and provides installation site, still including having:

[0008] Conveying mechanism, the conveying mechanism includes two shaft movement components that are arranged on the machine base and the adsorption platform that is driven along the XY axle direction reciprocating movement by two shaft movement components, a plurality of adsorption areas are arranged on the adsorption platform;

[0009] Detection mechanism, the detection mechanism is arranged on the conveying mechanism upside, in order to be detected to the PCB board that is located on the adsorption platform, the detection mechanism includes detection head, and detection head is equipped with the first visual module and second visual module with different shooting visual angle;

[0010] A material moving mechanism is arranged beside the detecting mechanism and above the conveying mechanism to take and place the PCB on the adsorption platform, which comprises a plate and a plurality of suction cups on the plate.

[0011] Further, the two-axis moving assembly comprises

[0012] A first linear module is arranged along the Y-axis direction.

[0013] A second linear module is arranged along the X-axis direction and assembled on the first linear module to be driven to reciprocate along the Y-axis direction, and the adsorption platform is assembled on the second linear module to be driven to reciprocate along the X-axis direction.

[0014] Further, the adsorption platform comprises

[0015] A bottom plate is formed with a plurality of recessed areas recessed on the top surface of the bottom plate, the recessed areas are isolated from each other, and the bottom of each recessed area is provided with a suction hole in communication with an external suction device.

[0016] A top plate is tightly assembled on the bottom plate to seal the recessed areas, and the top plate is provided with a plurality of suction holes at least at positions corresponding to the recessed areas, the suction holes are arranged in an array, and the positions corresponding to the recessed areas on the top plate define the adsorption area.

[0017] Further, the detecting mechanism further comprises a support column vertically arranged on the base, and a third linear module arranged in a vertical direction on the support column, the detecting head further comprises a mounting plate assembled on the third linear module and driven to reciprocate along the vertical direction, and the first vision module and the second vision module are assembled on the mounting plate.

[0018] Further, the first vision module comprises a CCD camera with a lens facing downward and a light source, and the second vision module is a 3D camera.

[0019] Further, the detecting head further comprises a first code scanner fixedly assembled on the mounting plate, and a code scanning lens of the first code scanner faces downward to scan the PCB on the adsorption platform.

[0020] Further, the material moving mechanism further comprises a mounting frame fixedly arranged on the rack, a driving cylinder fixedly arranged on the mounting frame, and the driving cylinder is in transmission connection with the plate for driving the plate to move up and down.

[0021] Further, the conveying mechanism further comprises a second code scanner fixedly arranged on the side wall of the adsorption platform, and the code scanning lens of the second code scanner faces upward.

[0022] Further, the rack is formed with an operation platform arranged at the end of the rack away from the detection mechanism, and the operation platform is provided with an operation window exposed after the adsorption platform moves away from the detection mechanism, and at least one edge of the operation window is provided with an electrostatic elimination device for blowing ionized air towards the inside of the operation window.

[0023] Further, the operation window is provided with a safety grating comprising a transmitting end and a receiving end fixedly arranged on two opposite edges of the operation window.

[0024] The present application has the following beneficial effects:

[0025] In the process of detecting the PCB, the PCB is placed on the adsorption platform and is adsorbed on the adsorption platform by negative pressure, so as to ensure that the PCB keeps stable during movement, and the adsorption platform carrying the PCB is moved to the position directly below the detection mechanism under the driving of the two-axis moving assembly, so that the detection head can irradiate and detect the PCB on the adsorption platform, and in this process, the detection head is provided with the first vision module and the second vision module having different shooting angles, so that different patterns are formed, so that the PCB mounted with electrical components can be more comprehensively detected, and the effect of PCB bonding is ensured. After detection, the material moving device takes out the PCB that has passed or failed the detection and transports it. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 It is a three-dimensional structure schematic diagram of the present application.

[0027] Figure 2 It is a structure schematic diagram of the conveying mechanism in the present application.

[0028] Figure 3 It is an explosion structure schematic diagram of the adsorption platform in the present application.

[0029] Figure 4It is a structure schematic view of the material moving mechanism in the utility model.

[0030] Figure 5 It is a structure schematic view of the combination of the conveying mechanism and the detecting mechanism in the utility model.

[0031] Figure 6 It is a structure schematic view of the detecting head in the utility model.

[0032] In the drawing: 10 - base; 20 - frame; 100 - conveying mechanism; 110 - two-axis moving assembly; 120 - adsorption platform; 200 - detecting mechanism; 210 - detecting head; 211 - first visual module; 212 - second visual module; 300 - material moving mechanism; 310 - plate; 111 - first linear module; 112 - second linear module; 121 - bottom plate; 122 - recessed area; 123 - air extraction hole; 124 - top plate; 125 - air suction hole; 201 - support column; 202 - third linear module; 213 - mounting plate; 2111 - CCD camera; 2112 - light source; 214 - first code scanner; 301 - mounting frame; 302 - driving cylinder; 101 - second code scanner; 21 - operation platform; 22 - operation window; 23 - static electricity elimination device; 24 - safety grating; 25 - transmitting end; 26 - receiving end. DETAILED DESCRIPTION

[0033] In order to facilitate the understanding of those skilled in the art, the utility model is further described below in combination with examples and drawings, and the content mentioned in the embodiment is not a limitation on the utility model. The utility model is described in detail below in combination with the drawings.

[0034] The utility model embodiment provides a single head PCB board bonding detection device for detecting the installation state of electrical components installed on the PCB board, in the technical scheme provided by the utility model embodiment, two visual modules with different illumination angles are arranged to irradiate the PCB board, so that the angle can be detected, the detection of the PCB board is more comprehensive, and the detection effect is guaranteed.

[0035] As Figures 1-6As shown, the single-head PCB bonding detection device provided by the embodiment comprises a base 10, a rack 20 covering the base 10 and providing mounting positions, a conveying mechanism 100, a detection mechanism 200 and a material moving mechanism 300. Specifically, the conveying mechanism 100 comprises two-axis moving assemblies arranged above the base 10 and an adsorption platform 120 driven by the two-axis moving assemblies to move back and forth along the XY-axis direction, and a plurality of adsorption areas are arranged on the adsorption platform 120; the detection mechanism 200 is arranged on the upper side of the conveying mechanism and used to identify and detect the PCB on the adsorption platform 120, and the detection mechanism 200 comprises a detection head 210 provided with a first vision module 211 and a second vision module 212 having different shooting angles; the material moving mechanism 300 is arranged beside the detection mechanism 200 and above the conveying mechanism 100 and used to take and place the PCB on the adsorption platform 120, and the material moving mechanism 300 comprises a plate member 310 and a plurality of suction cups 320 arranged on the plate member 310.

[0036] In the process of detecting the PCB, the PCB is placed on the adsorption platform 120 and adsorbed thereon by negative pressure, so that the PCB keeps a stable state during movement, the adsorption platform 120 carrying the PCB is moved to the directly below the detection mechanism 200 under the drive of the two-axis moving assemblies, and the detection head 210 is facilitated to irradiate and detect the PCB on the adsorption platform 120. In this process, the detection head 210 is provided with the first vision module 211 and the second vision module 212 having different shooting angles, so that different forming patterns are obtained, and the PCB mounted electrical components can be more comprehensively detected, and the bonding effect of the PCB is ensured. Meanwhile, after the detection is completed, the PCB that has passed or failed the detection is taken down by the material moving device and transported.

[0037] In the embodiment, the first vision module 211 comprises a CCD camera 2111 with a lens facing downward and a light source 2112, and the second vision module 212 is a 3D camera. Therefore, the PCB can be photographed from the front to detect the accuracy of the position of the electrical components on the PCB by the first vision module 211, and the PCB can be stereographically formed by the 3D camera to detect the bonding effect of the PCB from multiple angles, so that the accuracy and effect of the detection are improved.

[0038] As Figures 1-3As shown, in the embodiment, the two-axis moving assembly comprises a first linear module 111 and a second linear module 112, wherein the first linear module 111 is arranged along the Y-axis direction; the second linear module 112 is arranged along the X-axis direction and is assembled on the first linear module 111, and is driven by the first linear module 111 to reciprocate along the Y-axis direction; the adsorption platform 120 is assembled on the second linear module 112 and is driven by the second linear module 112 to reciprocate along the X-axis direction.

[0039] The first linear module 111 and the second linear module 112 arranged in mutual superposition and mutual intersection can drive the adsorption platform 120 to move in two directions, so that the position of the adsorption platform 120 can be adjusted during visual detection, so that the detection head 210 can be directly connected with the PCB to be detected, and the detection accuracy is ensured.

[0040] In the embodiment, a plurality of adsorption areas are arranged on the adsorption platform 120, so that a plurality of PCBs to be detected can be placed, and the efficiency is improved. In order to save energy and ensure that each adsorption area has sufficient negative pressure suction, as shown in the figure, Figure 3 As shown, the adsorption platform 120 comprises a bottom plate 121 and a top plate 124. Specifically, a plurality of recessed areas 122 recessed on the top surface of the bottom plate 121 are formed on the top surface of the bottom plate 121. The plurality of recessed areas 122 are isolated from each other, and the bottom of each recessed area 122 is provided with a gas extraction hole 123 in communication with an external air suction device. The top plate 124 is tightly assembled on the bottom plate 121 to seal the plurality of recessed areas 122, and a plurality of air suction holes 125 are formed in the top plate 124 at least at positions corresponding to the plurality of recessed areas 122. The plurality of air suction holes 125 are arranged in an array, and the positions corresponding to the recessed areas 122 on the top plate 124 define adsorption areas. That is, by arranging a plurality of recessed areas 122 and respectively providing a gas extraction hole 123 in communication with the air suction device, negative pressure suction can be generated in each recessed area 122, and the PCB can be adsorbed on the predetermined adsorption area. At the same time, when the number of PCBs placed on the adsorption platform 120 is reduced after adjustment, the air suction device of the corresponding recessed area 122 can be closed, and the adsorption of the entire adsorption platform 120 will not be affected.

[0041] In order to improve the detection accuracy, the detection head 210 is arranged as a movable structure, and specifically as shown in the figure, Figures 5-6As shown, the detection mechanism 200 further comprises a support column 201 vertically arranged on the base 10, and a third linear module 202 arranged vertically on the support column 201, and the detection head 210 further comprises a mounting plate 213 arranged on the third linear module 202 and driven by the third linear module 202 to reciprocate vertically, and the first vision module 211 and the second vision module 212 are arranged on the mounting plate 213. That is, the detection head 210 can be driven by the third linear module 202 to reciprocate vertically, thereby shortening the distance between the detection head 210 and the PCB board, improving the clarity of the vision module photographing, and improving the detection accuracy.

[0042] Meanwhile, in order to distinguish the PCB board, a label indicating the identity is often attached to the PCB board, which can be a two-dimensional code or a bar code in the embodiment, and the detection head 210 further comprises a first code scanner 214 arranged on the front surface of the PCB board to scan and identify the identity information of the PCB board, so that the detection information can correspond to the PCB board, and the first code scanner 214 is fixedly arranged on the mounting plate 213, and the code scanning lens of the first code scanner 214 faces downward to scan the PCB board on the adsorption platform 120.

[0043] In the embodiment, in order to take off the PCB board on which the detection is completed from the adsorption platform 120, as shown, Figure 4 The material moving mechanism 300 further comprises a mounting frame 301 fixedly arranged on the rack 20, and a driving cylinder 302 fixedly arranged on the mounting frame 301 and in transmission connection with a plate member 310 to drive the plate member 310 to reciprocate vertically. In the process of taking off the material, the adsorption platform 120 is driven by the two-axis moving assembly to move toward the material moving mechanism 300, so as to be located directly below the plate member 310, and is driven by the driving cylinder 302 to reciprocate vertically, thereby adsorbing the PCB board.

[0044] In the process of attaching the label to the PCB board, due to the non-uniform process, the label may be attached to the lower side of the PCB board, and the first code scanner 214 arranged on the detection head 210 cannot scan the label at this time, therefore, in order to solve the above problem, as shown, Figure 2 、 5As shown, the conveying mechanism 100 further comprises a second code scanner 101 fixedly arranged on the side wall of the adsorption platform 120, and the code scanning lens of the second code scanner 101 faces upward. At this time, after the material moving mechanism 300 takes out the PCB board which has completed detection, the adsorption platform 120 moves under the driving of the two-axis moving assembly, so that the second code scanner 101 can correspond to the PCB board taken out by the material moving mechanism 300, thereby scanning the label on the lower side of the PCB board and completing the identification of information.

[0045] In the embodiment, as shown in Figure 1 In order to facilitate the operator to place the PCB on the adsorption platform 120, the rack 20 is further formed with an operation platform 21, the operation platform 21 is arranged at the end of the machine base 10 away from the detection mechanism 200, and is provided with an operation window 22 exposed after the adsorption platform 120 moves away from the detection mechanism 200, and at least one edge of the operation window 22 is provided with an electrostatic elimination device 23 blowing ionized airflow towards the inside of the operation window 22. When placing the PCB board, the operator can pre-store the grain bin containing the PCB board on the operation platform 21, so that intermittent feeding can be realized. In order to eliminate static electricity on the PCB board, the electrostatic elimination device 23 is arranged at the edge of the operation window 22, and the static electricity on the PCB board is neutralized by airflow, so that the influence of static electricity on the detection process is avoided, and some dust is also not adsorbed due to static electricity.

[0046] Meanwhile, in order to improve the safety during placing the PCB board, a safety grating 24 is arranged on the operation window 22, and the safety grating 24 comprises a transmitting end 25 and a receiving end 26 fixedly arranged on two opposite edges of the operation window 22.

[0047] The above is only the preferred embodiment of the present application, and does not limit the present application in any form. Although the present application is disclosed in the preferred embodiment, it is not intended to limit the present application. Any skilled person in the art can make some changes or modifications to the above disclosed technical content without departing from the technical solution of the present application, and any simple modification, equivalent change and modification of the above embodiment within the technical solution of the present application are all within the scope of the present application.

Claims

1. A single head PCB bonding inspection apparatus comprising a base and a frame housing the base and providing mounting locations, characterized in that, Also include: Conveying mechanism, the conveying mechanism includes two-axis moving assembly provided on the base and the adsorption platform driven by the two-axis moving assembly reciprocating movement along the XY axis direction, the adsorption platform is provided with a plurality of adsorption area; Detection mechanism, the detection mechanism is arranged on the upper side of the conveying mechanism, used for identifying detection of the PCB board located on the adsorption platform, the detection mechanism includes a detection head, detection head is provided with a first vision module and a second vision module with different shooting angles; Material moving mechanism, the material moving mechanism is arranged on the side of the detection mechanism and above the conveying mechanism, used for taking and placing the PCB board located on the adsorption platform, which includes a plate and a plurality of suction cups on the plate.

2. The single-head PCB board bonding inspection apparatus of claim 1, wherein, The two-axis moving assembly includes First linear module, the first linear module is arranged along the Y axis direction; Second linear module, the second linear module is arranged along the X axis direction and assembled on the first linear module, driven by the first linear module to reciprocate along the Y axis direction, the adsorption platform is assembled on the second linear module, driven by the second linear module to reciprocate along the X axis direction.

3. The single-head PCB board bonding inspection apparatus of claim 2, wherein, The adsorption platform includes Bottom plate, the top surface of the bottom plate is formed with a plurality of recessed areas recessed in the top surface of the bottom plate, a plurality of the recessed areas are isolated from each other, and the bottom of each recessed area is provided with a suction hole communicated with the external suction device; Top plate, the top plate is tightly assembled on the bottom plate to close a plurality of recessed areas, and a plurality of suction holes are provided on the top plate at least at positions corresponding to a plurality of recessed areas, a plurality of suction holes are arranged in an array, and the top plate is defined as the adsorption area corresponding to the recessed area.

4. The single-head PCB board bonding inspection apparatus of claim 1, wherein, The detection mechanism further includes a support column, the support column is vertically arranged on the base, the support column is provided with a third linear module arranged in vertical direction, the detection head further includes a mounting plate, the mounting plate is installed on the third linear module and driven by the third linear module to reciprocate along the vertical direction, the first vision module and the second vision module are installed on the mounting plate.

5. The single-head PCB board bonding inspection apparatus of claim 1, wherein, The first vision module includes a CCD camera with lens facing downward and a light source; the second vision module is a 3D camera.

6. The single-head PCB board bonding inspection apparatus of claim 4, wherein, The detection head further includes a first code scanner, the first code scanner is fixedly installed on the mounting plate, and the code scanning lens of the first code scanner faces downward to scan the PCB board located on the adsorption platform.

7. The single-head PCB board bonding inspection apparatus of claim 1, wherein The material moving mechanism further includes a mounting bracket, the mounting bracket is fixedly installed on the rack, a driving cylinder is fixedly installed on the mounting bracket, the driving cylinder is in transmission connection with the plate to drive the plate to reciprocate along the vertical direction.

8. The single-head PCB board bonding inspection apparatus of claim 7, wherein, The conveying mechanism further includes a second code scanner, the second code scanner is fixedly installed on the side wall of the adsorption platform, and the code scanning lens of the second code scanner faces upward.

9. The single-head PCB board bonding inspection apparatus of claim 1, wherein, The rack is also formed with an operation platform, which is arranged at the end of the base away from the detection mechanism and is provided with an operation window exposed after the adsorption platform moves away from the detection mechanism, and at least one edge of the operation window is provided with an electrostatic elimination device for blowing ionized airflow towards the inside of the operation window.

10. The single-head PCB board bonding inspection apparatus of claim 9, wherein, A safety grating is arranged on the operation window, which includes a transmitting end and a receiving end fixedly arranged on two opposite edges of the operation window.

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