Optical device testing device capable of rapidly heating and cooling

Abstract

The utility model provides an optical device testing device capable of rapidly heating and cooling, which comprises a clamp, a heating assembly, a loading platform and a cooling water pipe, and is characterized in that the clamp is provided with a plurality of jacks for inserting optical devices to be tested; the heating assembly comprises a heat conducting plate and a heating wire fixedly arranged on the heat conducting plate, and the heat conducting plate is tightly attached to the clamp; a test cavity with an opening is formed in the loading table, and the test cavity is used for placing the clamp; the cooling water pipe is fixedly arranged on the loading table and surrounds the testing cavity. According to the scheme, the heating assembly, the cooling water pipe and the semiconductor chilling plate are reasonably designed and matched, and the temperature is accurately controlled through the temperature control assembly, so that rapid heating and cooling can be realized, and the high-temperature and high-humidity aging test of the optical device can be more accurately and efficiently completed; moreover, the optical device in the clamp is cooled through the cooling water pipe, and the problem that the performance of the optical device is affected due to the fact that condensate water is attached to the surface of the optical device in the prior art is solved.

Description

Technical Field

[0001] This utility model relates to the field of optical device testing technology, and in particular to an optical device testing device capable of rapid heating and cooling. Background Technology

[0002] For non-hermetic packaged optical devices, such as TO-CAN (Transistor Outline CAN, coaxial laser diode module), the chips on the optical devices are required to have a certain tolerance to high temperature and high humidity under constant temperature and humidity conditions. Therefore, it is necessary to perform charged aging of the chips of the optical devices under high temperature and high humidity conditions.

[0003] Patent CN219997236U discloses a chip high and low temperature testing device, which includes a temperature control device, a fluid circulation heat exchange device, a chip testing fixture, and a chip limiting frame. The chip testing fixture includes an opening and closing knob, a testing shell, a temperature adjustment device, and a buckle. The temperature adjustment device includes a heat exchanger, a thermoelectric cooler, a temperature sensor, a metal pressure block, and a heat insulation cover. The upper surface of the thermoelectric cooler is attached to the heat exchanger. The thermoelectric cooler can switch between a cooling surface and a heating surface by changing the positive and negative power supply mode through a positive and negative electrode converter. The lower surface of the thermoelectric cooler is attached to the metal pressure block. In this solution, heating and cooling of the chip are achieved by transferring heat to the chip through the metal pressure block attached to the chip. When the temperature of the thermoelectric cooler is low, condensation will form on the surface of the metal pressure block. When the metal pressure block comes into contact with the chip surface, the condensation will adhere to the chip surface, thus affecting the chip's performance. Utility Model Content

[0004] Based on the problems existing in the prior art, the present invention aims to solve the technical problem that in the prior art, the heating and cooling of the chip in the high and low temperature test device is achieved by transferring heat to the chip through a metal block that is attached to the chip. When the temperature of the semiconductor cooling chip is low, condensation will be generated on the surface of the metal block. When the metal block comes into contact with the chip surface, the condensation will adhere to the chip surface, thereby affecting the chip performance.

[0005] This utility model provides a testing device for optical devices capable of rapid heating and cooling, comprising:

[0006] The fixture has several holes for inserting the optical device under test;

[0007] The heating assembly includes a heat-conducting plate and a heating wire fixedly disposed on the heat-conducting plate, wherein the heat-conducting plate is disposed in close contact with the clamp.

[0008] A loading platform having an open test cavity for inserting the fixture;

[0009] A cooling water pipe is detachably fixed on the loading table and surrounds the test cavity.

[0010] According to an embodiment of the present application, the light device testing device capable of rapid temperature rising and falling further comprises a plurality of semiconductor refrigerating sheets, which are detachably fixed on the loading table and closely arranged with the cooling water pipe.

[0011] According to an embodiment of the present application, the light device testing device capable of rapid temperature rising and falling further comprises a temperature control assembly, which comprises a temperature control module and a temperature sensor.

[0012] According to an embodiment of the present application, the temperature control module is arranged between the heat conduction plate and the heat insulation plate.

[0013] According to an embodiment of the present application, the light device testing device capable of rapid temperature rising and falling further comprises a heat insulation plate detachably fixed on the surface of the heat conduction plate, which is arranged between the temperature control module and the heat conduction plate.

[0014] According to an embodiment of the present application, the light device testing device capable of rapid temperature rising and falling further comprises a plurality of support columns fixed on the surface of the heat insulation plate side by side, and the temperature control module is fixedly connected to one end of the support column away from the heat insulation plate.

[0015] According to an embodiment of the present application, the inner wall of the test cavity extends radially inward to form a support part for supporting the clamp and the heat conduction plate.

[0016] According to an embodiment of the present application, an annular groove is formed in the outer wall of the loading table, and the cooling water pipe and the semiconductor refrigerating sheet are installed in the annular groove.

[0017] According to an embodiment of the present application, the light device testing device capable of rapid temperature rising and falling further comprises a base, and the heat conduction plate is detachably fixed to the bottom end of the base.

[0018] According to an embodiment of the present application, the cooling water pipe is in communication with an external water circulation system.

[0019] The present application has the following advantages:

[0020] The optical device testing device with rapid temperature rising and falling function provided by the utility model realizes the rapid temperature rising and falling operation of the optical device to be tested, and can more accurately and efficiently complete the high-temperature and high-humidity aging test of the optical device. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0022] Figure 1 It is a structure schematic view of the optical device testing device with rapid temperature rising and falling function provided by the utility model embodiment;

[0023] Figure 2 It is a structure schematic view of the clamp in the utility model embodiment;

[0024] Figure 3 It is a front view of the optical device testing device with rapid temperature rising and falling function provided by the utility model embodiment;

[0025] Figure 4 It is Figure 3 B-B sectional view schematic diagram;

[0026] Reference signs: 1, clamp;10, jack;2, heating assembly;21, heat-conducting plate;22, heating wire;3, loading table;30, test cavity;31, support part;32, annular groove;4, cooling water pipe;5, semiconductor refrigeration sheet;6, temperature control assembly;61, temperature control module;62, temperature sensor;7, heat insulation plate;8, support column;9, base. DETAILED DESCRIPTION

[0027] The following description of each embodiment is with reference to the additional drawings, which illustrate specific embodiments that the utility model can be used to implement.

[0028] The utility model provides a kind of optical device testing device with rapid temperature rising and falling function, its structure as Figure 1 Shown, the optical device testing device with rapid temperature rising and falling function includes clamp 1, heating assembly 2, loading table 3 and cooling water pipe 4, specifically, please refer to Figure 2The clamp 1 is a block structure with certain size and shape, and the material can be metal material with good heat conduction performance, such as stainless steel. A plurality of insertion holes 10 for inserting the optical device to be tested are formed on the clamp 1, and the insertion holes 10 are arranged regularly to facilitate batch testing of the optical device to be tested. The size of the insertion hole 10 is accurately designed according to the size of the optical device to be tested, so as to ensure that the optical device to be tested can be inserted tightly and stably.

[0029] Please refer to Figure 3 and Figure 4 The heating assembly 2 comprises a heat conduction plate 21 and a heating wire 22 fixed on the heat conduction plate 21. The heat conduction plate 21 is also made of metal material with good heat conduction performance, such as copper or aluminum. The heating wire 22 is made of carbon fiber heating wire, which has the advantages of rapid heating, high electric heating conversion efficiency and long service life. The heating wire 22 is tightly connected with the heat conduction plate 21 by welding, bolt fixing or other methods to ensure that the heat can be effectively transferred from the heating wire 22 to the heat conduction plate 21. The heat conduction plate 21 is tightly arranged on the clamp 1, and when the heating wire 22 is electrified and heated, the heat will be quickly transferred to the clamp 1 through the heat conduction plate 21, thereby heating the optical device to be tested.

[0030] In this embodiment, as shown in Figure 4 , one end surface of the heat conduction plate 21 is provided with a groove matching the shape of the heating wire 22, and the heating wire 22 is embedded in the groove. This design not only increases the contact area of the heating wire 22 and the heat conduction plate 21, improves the heat transfer efficiency, but also better fixes the heating wire 22 to prevent displacement during use.

[0031] Please refer to Figure 1 or Figures 3-4 The loading table 3 is the main bearing component of the device, which is made of heat conduction material (such as stainless steel), and an open test cavity 30 is formed on the loading table 3. The test cavity 30 is used to place the clamp 1 and the heat conduction plate 21. The inner wall of the test cavity 30 extends radially inward to form a support part 31 for supporting the clamp 1 and the heat conduction plate 21. The support part 31 can be a continuous annular protrusion or a plurality of spaced block protrusions. In this embodiment, the support part 31 is preferably a continuous annular protrusion. When the clamp 1 and the heat conduction plate 21 are placed in the test cavity 30, one of them will be placed on the support part 31 to ensure stability. In this embodiment, the heat conduction plate 21 is preferably placed on the support part 31, and the heat conduction plate 21 is in contact with the support part 31 to achieve heat conduction.

[0032] In addition, the outer wall of the loading platform 3 is provided with an annular groove 32 for installing the cooling water pipe 4 and the semiconductor refrigeration sheet 5 (to be described later). The depth and width of the annular groove 32 are designed according to the size of the cooling water pipe 4 and the semiconductor refrigeration sheet 5, so that they can be closely installed therein.

[0033] The cooling water pipe 4 is a pipe material with flexibility and corrosion resistance, such as a rubber pipe or a plastic pipe. It is detachably fixed in the annular groove 32 of the loading platform 3 and arranged around the test cavity 30. The cooling water pipe 4 is in communication with an external water circulation system provided with a water pump. When cooling of the device is needed, the water pump will deliver cold water into the cooling water pipe 4, and the cold water will flow in the cooling water pipe 4 to take away the heat in the loading platform 3 and the test cavity, so as to achieve the purpose of cooling the clamp 1 and the optical device. Compared with the prior art of directly using a semiconductor refrigeration sheet to cool the chip, the use of the cooling water pipe 4 can avoid the attachment of condensed water on the surface of the optical device during cooling, and ensure that the performance of the optical device during detection is not affected by the condensed water. In addition, the cooling water pipe 4 can also appropriately cool the loading platform 3 and the clamp 1 when the heating wire 22 heats the clamp 1 through the heat conduction plate 21, so that the temperature of the clamp 1 is maintained within a suitable range.

[0034] The device further comprises a plurality of semiconductor refrigeration sheets 5 which are detachably fixed in the annular groove 32 of the loading platform 3 and closely arranged with the cooling water pipe 4, so that the cooling water pipe 4 can be quickly cooled to rapidly reduce the temperature of the device and achieve rapid cooling. The semiconductor refrigeration sheet 5 has the advantages of high refrigeration efficiency and small size (when the semiconductor refrigeration sheet 5 is powered on, one side will be cooled and the other side will be heated, and only the cooling function of the semiconductor refrigeration sheet 5 is utilized in this embodiment).

[0035] Please continue to refer to Figure 3 and Figure 4 The temperature control assembly 6 comprises a temperature control module 61 and a temperature sensor 62. The temperature sensor 62 is detachably fixed on the clamp 1 for real-time measurement of the temperature of the clamp 1, and can be installed by means of adhesion, clamping groove fixation, etc. The temperature control module 61 is electrically connected with the temperature sensor 62, the heating wire 22 and the semiconductor refrigeration sheet 5. The temperature sensor 62 transmits the measured temperature signal to the temperature control module 61, and the temperature control module 61 controls the heating power of the heating wire 22 and the working state of the semiconductor refrigeration sheet 5 according to the preset temperature value, so as to realize accurate control of the temperature of the test environment. Specifically, the temperature control module 61 is a TEC controller which can realize accurate temperature control, and the temperature fluctuation range is ±0.1℃.

[0036] In order to prevent the heat of the heat conduction plate 21 from affecting the temperature control module 61, the temperature control module 61 is spaced apart from the heat conduction plate 21. Meanwhile, a heat insulation plate 7 is detachably fixed on the surface of the heat conduction plate 21 and located between the temperature control module 61 and the heat conduction plate 21. The heat insulation plate 7 is preferably fixed on the surface of the heat conduction plate 21 by screws. The heat insulation plate 7 can be made of a material with good heat insulation performance, such as a heat-resistant laminated composite material, and the heat-resistant laminated composite material is specifically epoxy resin, which plays a role in blocking heat transfer.

[0037] In order to fix the temperature control module 61, a plurality of support columns 8 are fixed side by side on the surface of the heat insulation plate 7, and the temperature control module 61 is fixedly connected to one end of the support column 8 away from the heat insulation plate 7. The support column 8 provides a mounting position for the temperature control module 61 and further increases the distance between the temperature control module 61 and the heat conduction plate 21, thereby reducing the influence of heat transfer.

[0038] In order to facilitate the placement of the clamp 1 with the optical device into the test cavity 30, the device further comprises a base 9, and the heat conduction plate 21 is detachably fixed to the bottom end of the base 9. Preferably, the heat conduction plate 21 is mounted to the bottom end of the base 9 by screws. During testing, the clamp 1 can be placed into or taken out of the test cavity 30 by moving the base 9.

[0039] In order to facilitate the understanding of the present application, the following will be described in combination with Figures 1-4 The working process of the present application will be described in detail:

[0040] The heating process

[0041] When high-temperature aging test of the optical device to be tested is needed, the optical device to be tested is first inserted into the insertion hole 10 of the clamp 1, and then the clamp 1 and the heat conduction plate 21 are placed into the test cavity 30 of the loading table 3 by moving the base 9 and placed on the support part 31, and the top of the base 9 protrudes from the upper end surface of the loading table 3. The temperature control module 61 sends a power-on command to the heating wire 22 according to the preset high-temperature value, and the heating wire 22 operates at full power to start rapid heating. The heat is quickly transferred to the clamp 1 through the heat conduction plate 21, and then the optical device to be tested is heated. The temperature sensor 62 measures the temperature of the clamp 1 in real time and feeds back the temperature signal to the temperature control module 61, and the temperature control module 61 adjusts the heating power of the heating wire 22 according to the feedback information, so that the temperature of the test environment gradually increases and stabilizes at the preset high-temperature value. After reaching the preset high-temperature value, the heating power is reduced, and the water circulation is started to keep the temperature constant by the temperature control module 61.

[0042] The cooling process

[0043] When the high-temperature aging test is completed, the device needs to be cooled down. The temperature control module 61 controls the heating wire 22 to stop power supply, and at the same time, the external water circulation system is started, cold water enters the cooling water pipe 4, and the heat of the loading platform 3 and the clamp 1 in the test cavity is taken away. At the same time, the temperature control module 61 sends a power-on instruction to the semiconductor refrigeration piece 5, and the semiconductor refrigeration piece 5 starts refrigeration. The cold produced by the semiconductor refrigeration piece 5 is transmitted to the clamp 1 in the test cavity 30 through heat conduction, and the cooling process is accelerated. The temperature sensor 62 continuously monitors the temperature of the clamp 1, and when the temperature decreases to the preset value, the temperature control module 61 controls the semiconductor refrigeration piece 5 and the water circulation system to stop working.

[0044] It can be known from the above specific embodiments that the optical device testing device provided by the utility model can realize rapid temperature rising and falling operation of the optical device to be tested through the reasonable design and cooperation of the heating assembly 2, the cooling water pipe 4 and the semiconductor refrigeration piece 5, and the accurate control of the temperature by the temperature control assembly 6, and the high-temperature and high-humidity aging test of the optical device can be more accurately and efficiently completed. Moreover, the optical device in the clamp 1 is cooled by the cooling water pipe 4, and the problem that the performance of the optical device is affected due to the attachment of condensed water on the surface of the optical device in the prior art is avoided.

[0045] It should be noted that although the utility model is disclosed as above with specific embodiments, the above embodiments are not used to limit the utility model, and ordinary skilled persons in the art can make various changes and decorations without departing from the spirit and scope of the utility model, therefore the protection scope of the utility model is defined by the claim.

Claims

1. A testing device for optical devices capable of rapid heating and cooling, characterized in that, include: The fixture (1) has several jacks (10) for inserting the optical device to be tested; The heating assembly (2) includes a heat-conducting plate (21) and a heating wire (22) fixedly disposed on the heat-conducting plate (21), wherein the heat-conducting plate (21) is disposed in close contact with the clamp (1); A loading platform (3) has a test cavity (30) with an opening thereon, the test cavity (30) being used to place the fixture (1); Cooling water pipe (4) is detachably fixed on the loading platform (3) and arranged around the test chamber (30).

2. The optical device testing device with rapid heating and cooling according to claim 1, characterized in that, It also includes several semiconductor cooling chips (5), which are detachably fixed on the loading platform (3) and closely attached to the cooling water pipe (4).

3. The optical device testing device with rapid heating and cooling according to claim 2, characterized in that, It also includes a temperature control component (6), which includes a temperature control module (61) and a temperature sensor (62). The temperature sensor (62) is detachably fixed on the clamp (1) and is used to measure the temperature of the clamp (1) in real time. The temperature control module (61) is electrically connected to the temperature sensor (62), the heating wire (22) and the semiconductor cooling chip (5).

4. The optical device testing device with rapid heating and cooling according to claim 3, characterized in that, The temperature control module (61) is spaced apart from the heat-conducting plate (21).

5. The optical device testing apparatus with rapid heating and cooling according to claim 4, characterized in that, It also includes a heat insulation plate (7) that is detachably fixed to the surface of the heat-conducting plate (21), the heat insulation plate (7) being located between the temperature control module (61) and the heat-conducting plate (21).

6. The optical device testing apparatus with rapid heating and cooling according to claim 5, characterized in that, It also includes several support columns (8) that are fixedly arranged side by side on the surface of the heat insulation board (7), and the temperature control module (61) is fixedly connected to the end of the support column (8) away from the heat insulation board (7).

7. The optical device testing apparatus with rapid heating and cooling capability according to claim 1, characterized in that, The inner wall of the test chamber (30) extends radially inward to form a support (31) for supporting the clamp (1) and the heat-conducting plate (21).

8. The optical device testing apparatus with rapid heating and cooling capability according to claim 1, characterized in that, An annular groove (32) is formed on the outer wall of the loading platform (3), and the cooling water pipe (4) and the semiconductor cooling chip (5) are both installed in the annular groove (32).

9. The optical device testing apparatus with rapid heating and cooling capability according to claim 1, characterized in that, It also includes a base (9), and the heat-conducting plate (21) is detachably fixed to the bottom end of the base (9).

10. The optical device testing apparatus with rapid heating and cooling capability according to claim 1, characterized in that, The cooling water pipe (4) is connected to an external water circulation system.

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