Four-channel MZI wavelength division multiplexing FR456G chip

Abstract

The utility model relates to the technical field of silicon optical modulation chips, and particularly discloses a four-channel MZI wavelength division multiplexing FR456G chip. Comprising an optical input port I1, an optical input port I2, an optical input port I3, an optical input port I4, an optical output port O, an optical splitter BSI1, an optical splitter BSI2, an optical splitter BSI3, an optical splitter BSI4, a first MZI photoelectric modulator, a second MZI photoelectric modulator, a third MZI photoelectric modulator, a fourth MZI photoelectric modulator, a wavelength division multiplexing multiplexer MUX, an optical splitter BSO1, a photodiode MPDI1, a photodiode MPDI2, a photodiode MPDI3 and a photodiode MPDI4. The utility model relates to a 400G FR4 optical module and a photodiode MPD1O, and aims to solve the problems that in the prior art, a 400G FR4 optical module needs four single-path lasers and is realized by being matched with a four-channel wavelength division multiplexer (MUX), and the scheme is high in cost and low in integration level.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of silicon optical modulation chips, in particular to a four-channel MZI wavelength division multiplexing FR456G chip. BACKGROUND

[0002] The existing 400G FR4 optical module needs four single-channel lasers, and is implemented in cooperation with a four-channel wavelength division multiplexer (MUX), and this scheme has problems of high cost and low integration SUMMARY

[0003] The application aims to provide a four-channel MZI wavelength division multiplexing FR456G chip, so as to solve the problem that the existing 400G FR4 optical module needs four single-channel lasers and is implemented in cooperation with a four-channel wavelength division multiplexer (MUX), and this scheme has problems of high cost and low integration.

[0004] To achieve the above-mentioned purpose, the embodiment of the application provides a four-channel MZI wavelength division multiplexing FR456G chip, which comprises an optical input port I1, an optical input port I2, an optical input port I3, an optical input port I4, an optical output port O, a beam splitter BSI1, a beam splitter BSI2, a beam splitter BSI3, a beam splitter BSI4, a first MZI optoelectronic modulator, a second MZI optoelectronic modulator, a third MZI optoelectronic modulator, a fourth MZI optoelectronic modulator, a wavelength division multiplexing combiner MUX, a beam splitter BSO1, an optoelectronic diode MPDI1, an optoelectronic diode MPDI2, an optoelectronic diode MPDI3, an optoelectronic diode MPDI4, and an optoelectronic diode MPD1O, wherein

[0005] The optical input port I1 is connected with an optical input end of the beam splitter BSI1, a first optical output end of the beam splitter BSI1 is connected with an optical input end of the optoelectronic diode MPDI1, and a second optical output end of the beam splitter BSI1 is connected with an optical input end of the first MZI optoelectronic modulator;

[0006] The optical input port I2 is connected with an optical input end of the beam splitter BSI2, a first optical output end of the beam splitter BSI2 is connected with an optical input end of the optoelectronic diode MPDI2, and a second optical output end of the beam splitter BSI2 is connected with an optical input end of the second MZI optoelectronic modulator;

[0007] The optical input port I3 is connected with an optical input end of the beam splitter BSI3, a first optical output end of the beam splitter BSI3 is connected with an optical input end of the optoelectronic diode MPDI3, and a second optical output end of the beam splitter BSI3 is connected with an optical input end of the third MZI optoelectronic modulator;

[0008] The light input port I4 is connected with the light input end of the optical splitter BSI4, the first light output end of the optical splitter BSI4 is connected with the light input end of the photodiode MPDI4, and the second light output end of the optical splitter BSI4 is connected with the light input end of the fourth MZI photoelectric modulator;

[0009] The light output ends of the first MZI photoelectric modulator, the second MZI photoelectric modulator, the third MZI photoelectric modulator and the fourth MZI photoelectric modulator are respectively connected with four light input ends of the wavelength division multiplexing combiner MUX, the light output end of the wavelength division multiplexing combiner MUX is connected with the light input end of the optical splitter BSO1, the first light output end of the optical splitter BSO1 is connected with the light input end of the photodiode MPD1O, and the second light output end of the optical splitter BSO1 is connected with the light output port O.

[0010] Optionally, the optical splitter BSI1, the optical splitter BSI2, the optical splitter BSI3 and the optical splitter BSI4 are 5% to 95% one-to-two optical power splitting devices, wherein the first light output end of the optical splitter BSI1, the optical splitter BSI2, the optical splitter BSI3 and the optical splitter BSI4 outputs 5% of the input light wave energy and inputs into the light input end of the photodiode MPDI1, the photodiode MPDI2, the photodiode MPDI3 and the photodiode MPDI4 respectively, and the second light output end of the optical splitter BSI1, the optical splitter BSI2, the optical splitter BSI3 and the optical splitter BSI4 outputs 95% of the input light wave energy and inputs into the light input end of the first MZI photoelectric modulator, the second MZI photoelectric modulator, the third MZI photoelectric modulator and the fourth MZI photoelectric modulator respectively.

[0011] Optionally, the light input port I1, the light input port I2, the light input port I3, the light input port I4 and the light output port O are all edge couplers arranged on a chip.

[0012] Optionally, the two electrical modulation signal input ends of the first MZI photoelectric modulator are respectively connected with the radio frequency port RF1P and the radio frequency port RF1N arranged on the chip, the two electrical modulation signal input ends of the second MZI photoelectric modulator are respectively connected with the radio frequency port RF2P and the radio frequency port RF2N arranged on the chip, the two electrical modulation signal input ends of the third MZI photoelectric modulator are respectively connected with the radio frequency port RF3P and the radio frequency port RF3N arranged on the chip, and the two electrical modulation signal input ends of the fourth MZI photoelectric modulator are respectively connected with the radio frequency port RF4P and the radio frequency port RF4N arranged on the chip.

[0013] Optionally, the two voltage terminals of the first MZI optoelectronic modulator are connected to the VPN1 terminal and the VDD1 terminal provided on the chip respectively, the two voltage terminals of the second MZI optoelectric modulator are connected to the VPN2 terminal and the VDD2 terminal provided on the chip respectively, the two voltage terminals of the third MZI optoelectric modulator are connected to the VPN3 terminal and the VDD3 terminal provided on the chip respectively, and the two voltage terminals of the fourth MZI optoelectric modulator are connected to the VPN4 terminal and the VDD4 terminal provided on the chip respectively.

[0014] Optionally, the beamsplitter BSO1 is a 5% to 95% splitting optical power device, wherein the first light output terminal of the beamsplitter BSO1 outputs 5% of the input light wave energy and inputs into the light input terminal of the photodiode MPD10, and the second light output terminal of the beamsplitter BSO1 outputs 95% of the input light wave energy and inputs into the light output port O.

[0015] Optionally, the two electrical output terminals of the photodiode MPDI1 are connected to the IPD1+ terminal and the IPD1- terminal provided on the chip respectively, the two electrical output terminals of the photodiode MPDI2 are connected to the IPD2+ terminal and the IPD2- terminal provided on the chip respectively, the two electrical output terminals of the photodiode MPDI3 are connected to the IPD3+ terminal and the IPD3- terminal provided on the chip respectively, and the two electrical output terminals of the photodiode MPDI4 are connected to the IPD4+ terminal and the IPD4- terminal provided on the chip respectively.

[0016] The two electrical output terminals of the photodiode MPD10 are connected to the OPD1+ terminal and the OPD1- terminal provided on the chip respectively.

[0017] The embodiments of the present application have the following advantages:

[0018] Compared with the prior art, the above technical solution provides an 8x56G baud rate silicon optical modulation chip based on MZI technology, which includes eight-channel high-bandwidth MZI optoelectronic modulators and a four-channel wavelength division multiplexer (MUX) integrated on the chip, and can be used for four-channel 56G baud / channel rate applications of wavelength division multiplexing, thereby realizing a higher integration and lower cost solution and reducing the application cost of the optical module. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only exemplary, and for those skilled in the art, other drawings can be derived from the provided drawings without creative labor.

[0020] Figure 1The application provides a circuit structure block diagram of a four-channel MZI wavelength division multiplexing FR456G chip. DETAILED DESCRIPTION

[0021] The application has other advantages and effects which can be easily understood by those skilled in the art according to the content disclosed in the specification. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the application.

[0022] In the description of the application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the application and simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance. Unless otherwise specified and limited, the terms "set", "mount", "connected", "connected" should be interpreted broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0023] In addition, the technical features involved in different embodiments of the application described below can be combined with each other as long as there is no conflict.

[0024] The application provides a four-channel MZI wavelength division multiplexing FR456G chip, which is described with reference to Figure 1 , comprising:

[0025] The optical input port I1, the optical input port I2, the optical input port I3, the optical input port I4, the optical output port O, the optical splitter BSI1, the optical splitter BSI2, the optical splitter BSI3, the optical splitter BSI4, the first MZI optoelectronic modulator, the second MZI optoelectronic modulator, the third MZI optoelectronic modulator, the fourth MZI optoelectronic modulator, the wavelength division multiplexing combiner MUX, the optical splitter BSO1, the photodiode MPDI1, the photodiode MPDI2, the photodiode MPDI3, the photodiode MPDI4, the photodiode MPD1O, wherein

[0026] The optical input port I1 is connected with the optical input end of the optical splitter BSI1, the first optical output end of the optical splitter BSI1 is connected with the optical input end of the photodiode MPDI1, and the second optical output end of the optical splitter BSI1 is connected with the optical input end of the first MZI optical modulator.

[0027] The optical input port I2 is connected with the optical input end of the optical splitter BSI2, the first optical output end of the optical splitter BSI2 is connected with the optical input end of the photodiode MPDI2, and the second optical output end of the optical splitter BSI2 is connected with the optical input end of the second MZI optical modulator.

[0028] The optical input port I3 is connected with the optical input end of the optical splitter BSI3, the first optical output end of the optical splitter BSI3 is connected with the optical input end of the photodiode MPDI3, and the second optical output end of the optical splitter BSI3 is connected with the optical input end of the third MZI optical modulator.

[0029] The optical input port I4 is connected with the optical input end of the optical splitter BSI4, the first optical output end of the optical splitter BSI4 is connected with the optical input end of the photodiode MPDI4, and the second optical output end of the optical splitter BSI4 is connected with the optical input end of the fourth MZI optical modulator.

[0030] The optical output ends of the first MZI optical modulator, the second MZI optical modulator, the third MZI optical modulator and the fourth MZI optical modulator are respectively connected with four optical input ends of the wavelength division multiplexing combiner MUX, the optical output end of the wavelength division multiplexing combiner MUX is connected with the optical input end of the optical splitter BSO1, the first optical output end of the optical splitter BSO1 is connected with the optical input end of the photodiode MPD1O, and the second optical output end of the optical splitter BSO1 is connected with the optical output port O.

[0031] Specifically, Figure 1 The MUX in the above formula refers to an optical wavelength division multiplexing combiner, which functions to combine four optical signals of different wavelengths into one.

[0032] In some embodiments, the beam splitters BSI1, BSI2, BSI3, BSI4 are 5% to 95% beam splitting devices, wherein the first optical output end of the beam splitters BSI1, BSI2, BSI3, BSI4 outputs 5% of the input light wave energy and inputs into the light input end of the photodiodes MPDI1, MPDI2, MPDI3, MPDI4 respectively, and the second optical output end of the beam splitters BSI1, BSI2, BSI3, BSI4 outputs 95% of the input light wave energy and inputs into the light input end of the first MZI electro-optical modulator, the second MZI electro-optical modulator, the third MZI electro-optical modulator, the fourth MZI electro-optical modulator respectively.

[0033] In some embodiments, the light input ports I1, I2, I3, I4 and the light output port O are all edge couplers arranged on the chip.

[0034] Specifically, the light input ports I1, I2, I3, I4 are four edge couplers for the input of the local oscillator, which are input into the beam splitters BSI1, BSI2, BSI3, BSI4 respectively. The light output port O is an edge coupler for the four-channel output.

[0035] Specifically, the photodiodes MPDI1, MPDI2, MPDI3, MPDI4 are used for light power monitoring of the four input channels, and the photodiode MPD1O is used for light power monitoring of the output channel.

[0036] In some embodiments, the two electrical modulation signal input ends of the first MZI electro-optical modulator are respectively connected to the radio frequency ports RF1P and RF1N arranged on the chip, the two electrical modulation signal input ends of the second MZI electro-optical modulator are respectively connected to the radio frequency ports RF2P and RF2N arranged on the chip, the two electrical modulation signal input ends of the third MZI electro-optical modulator are respectively connected to the radio frequency ports RF3P and RF3N arranged on the chip, and the two electrical modulation signal input ends of the fourth MZI electro-optical modulator are respectively connected to the radio frequency ports RF4P and RF4N arranged on the chip.

[0037] Specifically, the first MZI electro-optical modulator, the second MZI electro-optical modulator, the third MZI electro-optical modulator, the fourth MZI electro-optical modulator, the fifth MZI electro-optical modulator, the sixth MZI electro-optical modulator, the seventh MZI electro-optical modulator, and the eighth MZI electro-optical modulator are respectively Figure 1MZI modulator 1-8 (MZI modulator: Mach-Zehnder optical-electric modulator), a single MZI modulator modulates the differential radio frequency electrical signal input from the radio frequency port (RF1P / RF1N-RF8P / RF8N) to the output end of the optical signal wavelength of the optical splitter BS1, the optical splitter BS2, the optical splitter BS3, and the optical splitter BS4 by intensity modulation. The radio frequency input provides eight pairs of radio frequency drive signal pads for the eight-channel modulator, which works in differential mode (P / N).

[0038] In some embodiments, the two voltage terminals of the first MZI optical-electric modulator are respectively connected to the VPN1 terminal and the VDD1 terminal arranged on the chip, the two voltage terminals of the second MZI optical-electric modulator are respectively connected to the VPN2 terminal and the VDD2 terminal arranged on the chip, the two voltage terminals of the third MZI optical-electric modulator are respectively connected to the VPN3 terminal and the VDD3 terminal arranged on the chip, and the two voltage terminals of the fourth MZI optical-electric modulator are respectively connected to the VPN4 terminal and the VDD4 terminal arranged on the chip.

[0039] Specifically, VDD is an external input direct current voltage input to the direct current bias terminal of the Mach-Zehnder optical-electric modulator, and VPN is an external input direct current voltage input to the PN junction of the high-frequency part of the Mach-Zehnder optical-electric modulator.

[0040] In some embodiments, the optical splitter BS01 is a 5% to 95% one-to-two optical power splitting device, wherein the first optical output end of the optical splitter BS01 outputs 5% of the input optical wave energy and inputs to the light input end of the photodiode MPD10, and the second optical output end of the optical splitter BS01 outputs 95% of the input optical wave energy and inputs to the optical output port O.

[0041] In some embodiments, the two electrical output terminals of the photodiode MPDI1 are respectively connected to the IPD1+ terminal and the IPD1- terminal arranged on the chip, the two electrical output terminals of the photodiode MPDI2 are respectively connected to the IPD2+ terminal and the IPD2- terminal arranged on the chip, the two electrical output terminals of the photodiode MPDI3 are respectively connected to the IPD3+ terminal and the IPD3- terminal arranged on the chip, and the two electrical output terminals of the photodiode MPDI4 are respectively connected to the IPD4+ terminal and the IPD4- terminal arranged on the chip.

[0042] The two electrical output terminals of the photodiode MPD10 are respectively connected to the OPD1+ terminal and the OPD1- terminal arranged on the chip.

[0043] In conclusion, compared with the prior art, the 8x56G baud rate silicon optical modulation chip based on MZI technology provided in the application includes eight-channel high-bandwidth MZI optical-electric modulator and four-channel wavelength division multiplexer (MUX) integrated on the chip, and can be used for four-channel 56G baud / channel rate application of wavelength division multiplexing, realizes a higher integration and lower cost solution, and reduces the application cost of the optical module.

[0044] Note that all features disclosed in the specification, including any accompanying claims, abstract, and drawings, can be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise. Thus, unless expressly stated otherwise, each disclosed feature is only one example out of a group of equivalent or similar features. Further, preferably, more preferably, even more preferably and most preferably are simple starting points for another embodiment, which is stated on the basis of the preceding embodiment. The content tagged with further, preferably, more preferably, even more preferably or most preferably is combined with the preceding embodiment as a complete constituent of another embodiment. The combination of several further, preferably, more preferably, even more preferably or most preferably settings behind one and the same embodiment form again an embodiment.

[0045] In the implementation of functions and steps, the corresponding functions and steps in each embodiment can also occur in a different order than shown. For example, two consecutive functions and steps can actually be executed or implemented substantially in parallel, or they can also be executed or implemented in reverse order, depending on the functions involved.

[0046] Although the present application has been described in detail with general description and specific embodiments above, some modifications or improvements can be made on the basis of the present application, which is obvious to those skilled in the art. Therefore, these modifications or improvements made on the basis of not deviating from the spirit of the present application, all belong to the scope of protection claimed by the present application.

Claims

1. A four-channel MZI wavelength division multiplexing FR456G chip, characterized in that, Comprise: optical input port I1, optical input port I2, optical input port I3, optical input port I4, optical output port O, optical splitter BSI1, optical splitter BSI2, optical splitter BSI3, optical splitter BSI4, first MZI electro-optical modulator, second MZI electro-optical modulator, third MZI electro-optical modulator, fourth MZI electro-optical modulator, wavelength division multiplexing combiner MUX, optical splitter BSO1, photodiode MPDI1, photodiode MPDI2, photodiode MPDI3, photodiode MPDI4, photodiode MPD1O, wherein, the optical input port I1 is connected with the optical input end of the optical splitter BSI1, the first optical output end of the optical splitter BSI1 is connected with the optical input end of the photodiode MPDI1, and the second optical output end of the optical splitter BSI1 is connected with the optical input end of the first MZI electro-optical modulator; the optical input port I2 is connected with the optical input end of the optical splitter BSI2, the first optical output end of the optical splitter BSI2 is connected with the optical input end of the photodiode MPDI2, and the second optical output end of the optical splitter BSI2 is connected with the optical input end of the second MZI electro-optical modulator; the optical input port I3 is connected with the optical input end of the optical splitter BSI3, the first optical output end of the optical splitter BSI3 is connected with the optical input end of the photodiode MPDI3, and the second optical output end of the optical splitter BSI3 is connected with the optical input end of the third MZI electro-optical modulator; the optical input port I4 is connected with the optical input end of the optical splitter BSI4, the first optical output end of the optical splitter BSI4 is connected with the optical input end of the photodiode MPDI4, and the second optical output end of the optical splitter BSI4 is connected with the optical input end of the fourth MZI electro-optical modulator; the optical output ends of the first MZI electro-optical modulator, second MZI electro-optical modulator, third MZI electro-optical modulator, and fourth MZI electro-optical modulator are respectively connected with four optical input ends of the wavelength division multiplexing combiner MUX, the optical output end of the wavelength division multiplexing combiner MUX is connected with the optical input end of the optical splitter BSO1, the first optical output end of the optical splitter BSO1 is connected with the optical input end of the photodiode MPD1O, and the second optical output end of the optical splitter BSO1 is connected with the optical output port O.

2. The four-channel MZI wavelength division multiplexing FR456G chip according to claim 1, characterized in that, The beam splitter BSI1, the beam splitter BSI2, the beam splitter BSI3, and the beam splitter BSI4 are 5% to 95% beam splitting devices, wherein the first light output end of the beam splitter BSI1, the beam splitter BSI2, the beam splitter BSI3, and the beam splitter BSI4 outputs 5% of the input light wave energy and inputs into the light input end of the photodiode MPDI1, the photodiode MPDI2, the photodiode MPDI3, and the photodiode MPDI4 respectively, and the second light output end of the beam splitter BSI1, the beam splitter BSI2, the beam splitter BSI3, and the beam splitter BSI4 outputs 95% of the input light wave energy and inputs into the light input end of the first MZI optical modulator, the second MZI optical modulator, the third MZI optical modulator, and the fourth MZI optical modulator respectively.

3. The four-channel MZI wavelength division multiplexing FR456G chip according to claim 1, wherein, The light input port I1, the light input port I2, the light input port I3, the light input port I4, and the light output port O are all edge couplers arranged on the chip.

4. The four-channel MZI wavelength division multiplexing FR456G chip according to claim 1, wherein, The two electrical modulation signal input ends of the first MZI optical modulator are connected to the radio frequency port RF1P and the radio frequency port RF1N arranged on the chip respectively, the two electrical modulation signal input ends of the second MZI optical modulator are connected to the radio frequency port RF2P and the radio frequency port RF2N arranged on the chip respectively, the two electrical modulation signal input ends of the third MZI optical modulator are connected to the radio frequency port RF3P and the radio frequency port RF3N arranged on the chip respectively, and the two electrical modulation signal input ends of the fourth MZI optical modulator are connected to the radio frequency port RF4P and the radio frequency port RF4N arranged on the chip respectively.

5. The four-channel MZI wavelength division multiplexing FR456G chip according to claim 1, wherein, The two voltage ends of the first MZI optical modulator are connected to the VPN1 end and the VDD1 end arranged on the chip respectively, the two voltage ends of the second MZI optical modulator are connected to the VPN2 end and the VDD2 end arranged on the chip respectively, the two voltage ends of the third MZI optical modulator are connected to the VPN3 end and the VDD3 end arranged on the chip respectively, and the two voltage ends of the fourth MZI optical modulator are connected to the VPN4 end and the VDD4 end arranged on the chip respectively.

6. The four-channel MZI wavelength division multiplexing FR456G chip according to claim 1, wherein, The beam splitter BSO1 is a 5% to 95% beam splitting device, wherein the first light output end of the beam splitter BSO1 outputs 5% of the input light wave energy and inputs into the light input end of the photodiode MPD1O, and the second light output end of the beam splitter BSO1 outputs 95% of the input light wave energy and inputs into the light output port O.

7. The four-channel MZI wavelength division multiplexing FR456G chip according to claim 1, wherein, Two electrical output terminals of the photodiode MPDI1 are respectively connected with IPD1+ and IPD1- terminals arranged on the chip, two electrical output terminals of the photodiode MPDI2 are respectively connected with IPD2+ and IPD2- terminals arranged on the chip, two electrical output terminals of the photodiode MPDI3 are respectively connected with IPD3+ and IPD3- terminals arranged on the chip, and two electrical output terminals of the photodiode MPDI4 are respectively connected with IPD4+ and IPD4- terminals arranged on the chip. Two electrical output terminals of the photodiode MPD1O are respectively connected with OPD1+ and OPD1- terminals arranged on the chip.

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