Heat dissipation explosion-proof capacitor structure
By designing a double-layer heat dissipation cavity and a multi-layer positioning structure, the problem of heat dissipation and explosion prevention of capacitors under high temperature and high pressure environments is solved, achieving efficient heat dissipation, safe pressure relief and precise positioning, and significantly extending the service life of the capacitors.
Patent Information
- Application Number
- CN202422890763.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-26
- Publication Date
- 2025-11-28
- Estimated Expiration
- 2034-11-26
AI Technical Summary
Existing capacitor structures have shortcomings in terms of heat dissipation, explosion protection, and assembly precision. Especially under high power or high frequency operating conditions, the heat dissipation effect is limited, the pressure is difficult to release effectively, and the assembly is not precise enough, which affects the safety and lifespan of the capacitor.
It adopts a double-layer heat dissipation cavity design, combined with a multi-layer positioning structure and a pressure relief system. Through the heat convection of the inner and outer heat dissipation cavities and the automatic pressure relief function of the pressure relief diaphragm, it achieves efficient heat dissipation and safe pressure relief. At the same time, it adopts multi-layer positioning slots and positioning rings to ensure accurate positioning and stable installation.
It significantly improves the heat dissipation efficiency of capacitors, prevents overheating and explosion risks, ensures stable operation of capacitors under high temperature and high pressure environments, extends service life, and improves assembly stability and safety.
Smart Images

Figure CN223612240U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a capacitor technical field, and specifically relates to a heat dissipation explosion -proof capacitor structure. BACKGROUND
[0002] In the long -term operation process of the capacitor, due to the continuous work of internal electronic components, a large amount of heat is often generated. If these heat cannot be effectively dissipated in time, the capacitor structure will overheat, thereby affecting the normal working life and safety of the capacitor. The traditional capacitor heat dissipation structure mostly relies on simple cooling fins or air cooling mode, and the heat dissipation effect is limited, especially in high power or high frequency working state, the heat accumulates too fast, and the existing heat dissipation means is difficult to keep up, thereby leading to frequent capacitor overheating.
[0003] In addition, in order to improve the heat dissipation performance, some cooling liquid is introduced into the capacitor structure to assist heat dissipation. However, when the cooling liquid temperature gradually increases, the pressure in the heat dissipation cavity also increases. If the pressure cannot be effectively released, the capacitor body may expand, leak or even explode, greatly threatening the working safety of the capacitor. At the same time, in the prior art, the capacitor body and the heat dissipation assembly are often difficult to realize accurate positioning during assembly, especially in a complex multilayer heat dissipation structure, the installation of the heat dissipation sleeve and the capacitor package body requires high-precision cooperation, and the traditional positioning mode is relatively single, which is difficult to guarantee the stability and sealing performance of the structure.
[0004] Therefore, the existing capacitor structure still has great improvement space in heat dissipation, explosion prevention and assembly accuracy, and how to realize efficient heat dissipation, pressure safety release and component accurate positioning is a key technical challenge to improve the performance of the capacitor structure. INVENTION CONTENTS
[0005] In view of the above deficiencies in the prior art, the utility model aims to provide a heat dissipation explosion -proof capacitor structure, which has significant improvement in efficient heat dissipation, explosion safety, accurate assembly and leakage prevention, can significantly prolong the service life of the capacitor, and is suitable for harsh working environments such as high temperature and high pressure.
[0006] The utility model discloses the technical scheme adopted for realizing the above-mentioned purpose is: a heat dissipation explosion -proof capacitor structure, including the outer sleeve, the inner sleeve, the capacitor package body arranged in order from outside to inside, the outer sleeve top is equipped with the assembly through -opening, and the outer wall of outer sleeve is uniformly fixed with the cooling fin, the outer sleeve and the inner sleeve form the outer layer heat dissipation cavity, the inner sleeve and capacitor package body form the inner layer heat dissipation cavity, the side wall top, bottom of inner sleeve are equipped with upper layer through -hole, lower layer through -hole respectively, and the lower layer through -hole, lower layer through -hole keep communication with the outer layer heat dissipation cavity, the inner layer heat dissipation cavity.
[0007] Further comprising an assembly cover fixedly installed at the assembly opening, a pressure relief opening is formed at the top center of the assembly cover, a plurality of groups of communication holes in annular array are uniformly formed in the assembly cover, and the communication holes are in communication with the outer heat dissipation cavity and the pressure relief opening.
[0008] Further comprising a pressure relief pipe fixedly connected to the end of the pressure relief opening, and a pressure bearing diaphragm is fixedly connected to the inner side of the pressure relief pipe.
[0009] In some embodiments, to ensure that the capacitor package and the inner sleeve can be stably installed in the outer sleeve and accurately positioned, the following technical solutions are provided.
[0010] A positioning sink A is formed at the bottom of the inner cavity of the outer sleeve, a positioning sink B is formed at the bottom of the positioning sink A, and a positioning clamping groove A and a positioning clamping groove B are respectively formed on the side walls of the positioning sink A and the positioning sink B.
[0011] The capacitor package is nested and installed in the positioning sink B, a positioning clamping block B that is nested and fitted with the positioning clamping groove B is fixedly connected to the bottom of the capacitor package, a positioning disc that is arranged in the positioning sink A is fixedly connected to the bottom of the capacitor package, a positioning clamping groove C that is arranged above the positioning disc is formed on the capacitor package, and a positioning clamping block C and a positioning clamping block A are respectively fixedly connected to the inner and outer sides of the bottom of the inner sleeve, the positioning clamping block C and the positioning clamping block A are arranged above the positioning disc and are respectively nested and fitted with the positioning clamping groove C and the positioning clamping groove A.
[0012] In some embodiments, to ensure that the inner sleeve can further position the capacitor package and ensure that the capacitor package is stably installed in the inner sleeve, the following technical solutions are provided.
[0013] A pressing disc that is arranged above the upper layer through hole is fixedly connected to the top of the inner sleeve, a positioning ring is fixedly connected to the inner wall of the outer sleeve, the outer edge of the pressing disc is arranged above the positioning ring and abuts against the positioning ring, and the top of the capacitor package abuts against the pressing disc.
[0014] In some embodiments, to ensure that the capacitor package can be effectively connected with the external circuit and that the cooling liquid in the outer heat dissipation cavity and the inner heat dissipation cavity can stably enter the communication holes in the assembly cover through the pressing disc, the following technical solutions are provided.
[0015] A wiring pin is arranged at the top of the capacitor package, assembly through holes A and B are respectively formed in the assembly cover and the pressing disc, the wiring pin is arranged and extends to the outside of the assembly cover by penetrating the assembly through holes A and B, and a liquid guide hole that is in communication with the outer heat dissipation cavity is formed in the pressing disc.
[0016] In some implementations, to ensure that the capacitor structure can be stably installed, a support seat is fixedly connected to the bottom of the outer sleeve.
[0017] The utility model discloses the beneficial effects of:
[0018] 1. High efficiency heat dissipation: the design of the inner and outer double-layer heat dissipation cavities, the cooling liquid in the inner heat dissipation cavity directly heats the capacitor package, and the outer heat dissipation cavity quickly dissipates heat to the outside through the heat dissipation fin. The temperature difference between the inner and outer heat dissipation cavities promotes the formation of thermal convection of the cooling liquid in the two cavities, further improves the heat dissipation efficiency, and effectively prevents the capacitor package from overheating during long-time work.
[0019] 2. Explosion-proof safety is improved: during the heat dissipation process, when the cooling liquid temperature rises and the pressure in the cavity increases, the cooling liquid can enter the pressure relief port through the designed communication hole, and act on the pressure-bearing diaphragm in the pressure relief pipe. When the pressure reaches the set threshold, the diaphragm automatically breaks, realizing the pressure relief function, thereby avoiding the explosion risk caused by the high internal pressure, improving the safety and reliability of the capacitor structure.
[0020] 3. Precise positioning and stable assembly: through the design of multiple layers of positioning structure in the outer sleeve, inner sleeve and capacitor package, including positioning groove, positioning slot, positioning block, etc., the stable embedding of the capacitor package and the inner sleeve in the outer sleeve is realized. In addition, the cooperation design of the pressure plate at the top of the inner sleeve and the positioning ring ensures that the capacitor package can be further fixed during assembly, effectively avoiding the positioning deviation problem caused by vibration or movement, and improving the assembly stability of the entire capacitor structure.
[0021] In summary, the scheme has significant improvement in high-efficiency heat dissipation, explosion-proof safety, precise assembly and leakage prevention, can significantly prolong the service life of the capacitor, and is suitable for harsh working environments such as high temperature and high pressure. BRIEF DESCRIPTION OF DRAWINGS
[0022] Figure 1 It is a structural schematic diagram of the utility model;
[0023] Figure 2 It is a structural schematic diagram of the utility model;
[0024] Figure 3 It is Figure 2 It is a structural schematic diagram of the outer sleeve;
[0025] Figure 4 It is Figure 2 It is a structural schematic diagram of the inner sleeve;
[0026] Figure 5 It is a structural schematic diagram of the capacitor package;
[0027] Figure 6 Structure diagram of another perspective of the capacitor package;
[0028] Figure 7 Structure diagram of another perspective of the capacitor package; Figure 2 Structure diagram of another perspective of the capacitor package.
[0029] In the figure: 1 outer sleeve, 11 assembly opening, 12 heat dissipation fin, 13 positioning groove A, 131 positioning clamping groove A, 14 positioning groove B, 141 positioning clamping groove B, 15 positioning ring, 16 support seat, 2 inner sleeve, 21 upper layer through hole, 22 lower layer through hole, 23 positioning clamping block C, 24 positioning clamping block A, 25 pressure plate, 251 assembly through hole B, 252 liquid guide hole, 3 capacitor package, 31 positioning clamping block B, 32 positioning disc, 33 positioning clamping groove C, 34 wiring pin, 41 outer layer heat dissipation cavity, 42 inner layer heat dissipation cavity, 5 assembly cover, 51 pressure relief port, 52 communication hole, 53 assembly through hole A, 6 pressure relief pipe, 61 pressure membrane. DETAILED DESCRIPTION
[0030] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0031] Please refer to Figures 1-7 A heat dissipation explosion-proof capacitor structure, comprising, from outside to inside, an outer sleeve 1, an inner sleeve 2, and a capacitor package 3, the top of the outer sleeve 1 is provided with an assembly opening 11, the outer wall of the outer sleeve 1 is uniformly and fixedly connected with heat dissipation fins 12, the outer layer heat dissipation cavity 41 is formed between the outer sleeve 1 and the inner sleeve 2, the inner layer heat dissipation cavity 42 is formed between the inner sleeve 2 and the capacitor package 3, the top and bottom of the side wall of the inner sleeve 2 are respectively provided with an upper layer through hole 21 and a lower layer through hole 22, and the lower layer through hole 22 and the lower layer through hole 22 are in communication with the outer layer heat dissipation cavity 41 and the inner layer heat dissipation cavity 42.
[0032] Further comprising an assembly cover 5 fixedly installed at the assembly opening 11, the top center of the assembly cover 5 is provided with a pressure relief port 51, a plurality of groups of annular array distributed communication holes 52 are uniformly provided in the assembly cover 5, and the communication holes 52 are in communication with the outer layer heat dissipation cavity 41 and the pressure relief port 51.
[0033] Further comprising a pressure relief pipe 6 fixedly connected to the end of the pressure relief port 51, and a pressure membrane 61 is fixedly connected to the inner side of the pressure relief pipe 6.
[0034] The cover 5 is assembled on the top of the outer sleeve 1 in a bolted manner and seals the outer sleeve 1. The outer layer heat dissipation cavity 41 and the inner layer heat dissipation cavity 42 are filled with cooling liquid. The capacitor package 3 generates heat during operation. The cooling liquid in the inner layer heat dissipation cavity 42 can dissipate heat of the capacitor package 3 and cause the temperature of the cooling liquid to rise. The inner sleeve 2 is made of heat insulation material. The cooling liquid in the outer layer heat dissipation cavity 41 is cooled by the heat dissipation fins 12 and has a lower temperature. The cooling liquid on both sides of the inner sleeve 2 has a temperature difference and generates heat convection. The hot cooling liquid in the inner layer heat dissipation cavity flows into the outer layer heat dissipation cavity through the upper layer through hole 21 and is cooled by the heat dissipation fins 12 to the external environment. The cooled cooling liquid in the outer layer heat dissipation cavity flows into the inner layer heat dissipation cavity through the lower layer through hole 22 and continues to dissipate heat of the capacitor package 3.
[0035] When the temperature of the capacitor package 3 is too high, the temperature of the cooling liquid is higher than the set threshold value. The pressure of the outer layer heat dissipation cavity 41 and the inner layer heat dissipation cavity 42 increases, and the cooling liquid enters the hydraulic port through the communication hole 52 to generate an action pressure on the pressure-bearing diaphragm 61 of the pressure relief pipe 6. When the action pressure reaches the set threshold value, the pressure-bearing diaphragm 61 breaks and the cooling liquid is discharged to reduce the internal pressure and avoid explosion.
[0036] To ensure that the capacitor package 3 and the inner sleeve 2 can be stably installed in the outer sleeve 1 and accurately positioned, the following technical solutions are provided.
[0037] The inner cavity of the outer sleeve 1 is provided with a positioning recess A13 at the bottom. The bottom of the positioning recess A13 is provided with a positioning recess B14. The side walls of the positioning recess A13 and the positioning recess B14 are respectively provided with a positioning clamping groove A131 and a positioning clamping groove B141.
[0038] The capacitor package 3 is nested and installed in the positioning recess B14. The bottom of the capacitor package 3 is fixedly connected with a positioning clamping block B31 which is nested and matched with the positioning clamping groove B141. The bottom of the capacitor package 3 is fixedly connected with a positioning disc 32 which is arranged in the positioning recess A13. The capacitor package 3 is provided with a positioning clamping groove C33 which is arranged above the positioning disc 32. The inner and outer sides of the bottom of the inner sleeve 2 are respectively fixedly connected with a positioning clamping block C23 and a positioning clamping block A24. The positioning clamping block C23 and the positioning clamping block A24 are arranged above the positioning disc 32 and are respectively nested and matched with the positioning clamping groove C33 and the positioning clamping groove A131.
[0039] The positioning clamping block B31 arranged at the bottom of the capacitor packaging body 3 can ensure that the capacitor packaging body 3 is stably installed in the positioning sink B14 at the bottom of the outer sleeve 1, the positioning disc 32 is arranged in the positioning sink A13 and is pressed and positioned by the bottom of the inner sleeve 2, and the positioning clamping block A24 and the positioning clamping block C23 at the bottom of the inner sleeve 2 can ensure that the capacitor packaging body 3 is stably installed and positioned in the positioning clamping groove A131 and the positioning clamping groove C33, and the capacitor packaging body 3 and the inner sleeve 2 are stably installed and accurately positioned in the outer sleeve 1.
[0040] To ensure that the inner sleeve 2 can further position the capacitor packaging body 3 and ensure that the capacitor packaging body 3 is stably installed in the inner sleeve 2, the following technical solutions are provided.
[0041] The pressing disc 25 is fixedly connected to the top of the inner sleeve 2 and arranged above the upper layer through hole 21, the positioning ring 15 is fixedly connected to the inner wall of the outer sleeve 1, the outer edge of the pressing disc 25 is arranged above the positioning ring 15 and abuts against the positioning ring 15, and the top of the capacitor packaging body 3 abuts against the pressing disc 25.
[0042] The arrangement of the pressing disc 25 can further fix and position the capacitor packaging body 3, and the arrangement of the positioning ring 15 can further accurately position the inner sleeve 2, so as to ensure the stable installation of the inner sleeve 2 and the capacitor packaging body 3.
[0043] To ensure that the capacitor packaging body 3 can be effectively connected with the external circuit, and at the same time, the cooling liquid in the outer layer heat dissipation cavity 41 and the inner layer heat dissipation cavity 42 can stably enter the communication hole 52 in the assembly cover 5 through the pressing disc 25, the following technical solutions are provided.
[0044] The wiring pin 34 is arranged at the top of the capacitor packaging body 3, the assembly through hole A53 and the assembly through hole B251 are respectively arranged in the assembly cover 5 and the pressing disc 25, the wiring pin 34 penetrates through the assembly through hole A53 and the assembly through hole B251 and extends to the outside of the assembly cover 5, and the liquid guiding hole 252 is arranged in the pressing disc 25 and communicates with the outer layer heat dissipation cavity 41.
[0045] The wiring pin 34 can extend to the outside of the assembly cover 5 through the assembly through hole A53 and the assembly through hole B251, so as to ensure that the capacitor packaging body 3 can be effectively connected with the external circuit, and the gap between the assembly through hole A53, the assembly through hole B251 and the wiring pin 34 is sealed to avoid leakage of the cooling liquid.
[0046] The arrangement of the liquid guiding hole 252 in the pressing disc 25 can ensure that the overheated cooling liquid in the outer layer heat dissipation cavity 41 and the inner layer heat dissipation cavity 42 enters the pressure relief port 51 through the liquid guiding hole 252 and the communication hole 52.
[0047] In order to ensure that the capacitor structure can be stably installed, the support base 16 is fixedly connected at the bottom of the outer sleeve 1. The support base 16 can ensure that the capacitor structure is stably installed and operated.
[0048] It is apparent for a person skilled in the art that the present application is not limited to the details of the above-described exemplary embodiments, but that it can be implemented in other concrete forms without departing from the spirit or essential characteristics of the application. Therefore, the embodiments should be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than that of the above description, and it is intended to embrace all changes and modifications that fall within the meaning and scope of equivalents of the claims. Any reference signs in the claims should not be construed as limiting the claims to the figures in which the reference signs are used.
[0049] Furthermore, it should be understood that, although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the specification is described in this way only for the sake of clarity, and a person skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by a person skilled in the art.
Claims
1. A heat-dissipating and explosion-proof capacitor structure, characterized in that: The application relates to a capacitor packaging device which comprises, from outside to inside, an outer sleeve (1), an inner sleeve (2) and a capacitor packaging body (3), the top of the outer sleeve (1) is provided with an assembling opening (11), the outer wall of the outer sleeve (1) is uniformly fixed with radiating fins (12), an outer-layer radiating cavity (41) is formed between the outer sleeve (1) and the inner sleeve (2), an inner-layer radiating cavity (42) is formed between the inner sleeve (2) and the capacitor packaging body (3), the top and bottom of the side wall of the inner sleeve (2) are respectively provided with an upper-layer through hole (21) and a lower-layer through hole (22), and the lower-layer through hole (22) and the lower-layer through hole (22) are in communication with the outer-layer radiating cavity (41) and the inner-layer radiating cavity (42). The capacitor packaging device further comprises an assembling cover (5) fixedly installed at the assembling opening (11), the top center of the assembling cover (5) is provided with a pressure relief opening (51), a plurality of groups of communication holes (52) in annular array are uniformly formed in the assembling cover (5), and the communication holes (52) are in communication with the outer-layer radiating cavity (41) and the pressure relief opening (51). The capacitor packaging device further comprises a pressure relief pipe (6) fixedly connected to the end of the pressure relief opening (51), and a pressure-bearing diaphragm (61) is fixedly connected to the inner side of the pressure relief pipe (6).
2. The heat-dissipating explosion-proof capacitor structure according to claim 1, characterized in that: The inner cavity bottom of the outer sleeve (1) is provided with a positioning recess A (13), the bottom of the positioning recess A (13) is provided with a positioning recess B (14), and the side walls of the positioning recess A (13) and the positioning recess B (14) are respectively provided with a positioning clamping groove A (131) and a positioning clamping groove B (141). The capacitor packaging body (3) is nested and installed at the bottom of the positioning recess B (14), the bottom of the capacitor packaging body (3) is fixedly connected with a positioning clamping block B (31) which is nested and matched with the positioning clamping groove B (141), the bottom of the capacitor packaging body (3) is fixedly connected with a positioning disc (32) arranged in the positioning recess A (13), the capacitor packaging body (3) is provided with a positioning clamping groove C (33) arranged above the positioning disc (32), and the inner and outer sides of the bottom of the inner sleeve (2) are respectively fixedly connected with a positioning clamping block C (23) and a positioning clamping block A (24), the positioning clamping block C (23) and the positioning clamping block A (24) are arranged above the positioning disc (32) and are respectively nested and matched with the positioning clamping groove C (33) and the positioning clamping groove A (131).
3. The heat-dissipating explosion-proof capacitor structure according to claim 2, characterized in that: The top of the inner sleeve (2) is fixedly connected with a pressing disc (25) arranged above the upper-layer through hole (21), the inner wall of the outer sleeve (1) is fixedly connected with a positioning ring (15), the outer edge of the pressing disc (25) is arranged above the positioning ring (15) and abuts against the positioning ring (15), and the top of the capacitor packaging body (3) abuts against the pressing disc (25).
4. The heat-dissipating explosion-proof capacitor structure according to claim 3, characterized in that: The capacitor package (3) is provided with a wiring pin (34) at the top, the assembly cover (5) and the pressing disc (25) are respectively provided with an assembly through hole A (53) and an assembly through hole B (251), the wiring pin (34) penetrates through the assembly through hole A (53) and the assembly through hole B (251) and extends to the outside of the assembly cover (5), and the pressing disc (25) is provided with a liquid guide hole (252) in communication with the outer heat dissipation cavity (41).
5. The heat-dissipating explosion-proof capacitor structure according to claim 1, characterized in that: The outer sleeve (1) is fixedly connected with a supporting seat (16) at the bottom.