Robot capable of carrying wafers of multiple specifications in range extending mode

Abstract

The utility model discloses a robot capable of carrying wafers of multiple specifications in an extended range, which belongs to the technical field of wafer equipment and comprises a base, an extended range moving mechanism is arranged on the base, a telescopic moving mechanism is mounted on the extended range moving mechanism, a wafer taking mechanism is arranged on the telescopic moving mechanism, and the wafer taking mechanism is connected with the extended range moving mechanism. And at least one wafer box is arranged on the base. The device is compatible with wafers of multiple specifications, wafers of multiple common specifications such as 6 inches, 8 inches and 12 inches can be carried at the same time, and the universality and flexibility of the device are greatly improved. And through combination of the range extending moving mechanism and the telescopic moving mechanism, multi-degree-of-freedom movement is achieved, so that the running stroke of the robot is expanded, and the positioning precision in the carrying process is improved. According to the self-adaptive adjusting mechanism, the positions and the distances of the tooth forks are automatically adjusted according to the different sizes of the wafers, stable grabbing of the wafers of various specifications is guaranteed, and operation errors and wafer pollution are avoided.

Description

TECHNICAL FIELD

[0001] The utility model belongs to wafer equipment technical field especially a kind of robot of carrying multi-specification wafer of range increasing. BACKGROUND

[0002] With the rapid development of consumer electronics, communication, artificial intelligence and other fields, the demand for semiconductor chips is growing exponentially. To meet the market's large demand, semiconductor manufacturing companies need to continuously improve production efficiency and yield. In the semiconductor manufacturing industry, wafers as the core processing object, its handling link is crucial. Different production processes and product demand involve a variety of specifications of wafers, manual handling not only slow, but also prone to fatigue and other factors leading to operational errors, causing pollution to wafers, affecting production efficiency and product quality, traditional robots have deficiencies in carrying distance and adaptability to multi-specification wafers. SUMMARY

[0003] The utility model aims to provide a kind of robot of carrying multi-specification wafer of range increasing to solve the above problems existing in prior art.

[0004] Technical scheme: a kind of robot of carrying multi-specification wafer of range increasing, it includes: base, the base is provided with range increasing movement mechanism, the range increasing movement mechanism is installed with telescopic movement mechanism, the telescopic movement mechanism is provided with wafer taking mechanism, the base is provided with at least one wafer box.

[0005] Further, the range increasing movement mechanism includes: horizontal movement mechanism, the base is provided with horizontal movement mechanism, the horizontal movement mechanism is installed with lifting mechanism, the lifting mechanism is provided with first rotary motor, the first rotary motor is installed with telescopic movement mechanism.

[0006] Further, the horizontal movement mechanism includes: guide rail support platform, the guide rail support platform is installed on the base by first linear guide rail pair, the base is provided with first rack, the guide rail support platform is provided with first servo motor, the first servo motor output is provided with gear, the gear is engaged transmission with the first rack, the guide rail support platform is provided with lifting mechanism.

[0007] Further, the lifting mechanism comprises a guide rod pair, which is slidingly arranged on the guide rail support platform, and a motor fixing plate is arranged at the upper end of the guide rod pair, and a jacking fixing plate is arranged at the lower end of the guide rod pair, and a first ball screw pair is arranged on the guide rail support platform, and the upper end of the first ball screw pair is connected with the motor fixing plate, and the lower end of the first ball screw pair is connected with the jacking fixing plate, and a second servo motor is arranged on the jacking fixing plate, and the output end of the second servo motor is connected with the first ball screw pair through a synchronous belt assembly, and a rotating mechanism is arranged on the motor fixing plate.

[0008] Further, the telescopic moving mechanism comprises a telescopic moving platform, a second linear guide rail pair and a support plate are arranged on the telescopic moving platform, a nut seat connecting plate is slidingly arranged on the second linear guide rail pair, a second ball screw pair is arranged on the support plate, the nut seat connecting plate is mounted on the second ball screw pair through a nut seat, a third servo motor is arranged on the telescopic moving platform, and the third servo motor is connected with the second ball screw pair through a belt assembly, and a second rotating motor is arranged on the nut seat connecting plate, and the output end of the second rotating motor is provided with a wafer taking mechanism.

[0009] Further, the wafer taking mechanism comprises a driving part, a bearing part is arranged at one end of the driving part, and a detection part is arranged at the other end of the driving part.

[0010] Further, the driving part comprises a driving shell, a driving straight hole is arranged in the driving shell, a piston is arranged in the driving straight hole, a first air channel and a second air channel are arranged on the driving shell, the first air channel and the second air channel are arranged on both sides of the piston for driving the movement of the piston, a driving rod is arranged on the piston, and the driving rod is connected with the bearing part.

[0011] Further, the bearing part comprises a prong plate, the prong plate is fixedly connected with the driving shell, a clamping arm is connected with the driving rod, a driven arm is slidingly arranged on the prong plate, a second rack is arranged on the clamping arm and the driven arm, and a gear is arranged between the second racks.

[0012] Further, a plurality of adsorption holes for adsorbing wafers are arranged on the prong plate.

[0013] Further, the detection part comprises a detection disc, the detection disc is mounted on the driving shell, two pairs of photoelectric sensors and a proximity sensor are arranged on the detection disc, and a detection gap is arranged between the two pairs of photoelectric sensors.

[0014] Beneficial effects:

[0015] 1. Compatible with multiple specifications of wafers: can simultaneously transport 6-inch, 8-inch, 12-inch and other commonly used specifications of wafer pieces, greatly improving the versatility and flexibility of the equipment.

[0016] 2. Improve the efficiency and accuracy of transportation: through the combination of the range increasing movement mechanism and the telescopic movement mechanism, multi-degree of freedom movement is realized, thereby expanding the running stroke of the robot and improving the positioning accuracy during the transportation process.

[0017] 3. Self-adaptive adjustment mechanism: automatically adjusts the position and spacing of the prongs according to the different sizes of the wafers, ensuring stable grabbing of various specifications of wafer pieces and avoiding operational errors and wafer contamination.

[0018] 4. High reliability: adopts a combination of negative pressure suction and physical clamping to solve the problem of unstable suction of large-sized wafer pieces by single negative pressure suction, further improving the reliability of the transportation process. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 is a structural schematic view of the utility model;

[0020] Figure 2 is a structural schematic view of the telescopic movement mechanism of the utility model;

[0021] Figure 3 is a structural schematic view of the lifting mechanism of the utility model;

[0022] Figure 4 is a structural schematic view of the wafer taking mechanism of the utility model;

[0023] Figure 5 is a sectional view of the wafer taking mechanism of the utility model.

[0024] The figure mark is: base 1, range increasing movement mechanism 2, horizontal movement mechanism 21, guide rail support platform 211, first linear guide rail pair 212, first rack 213, first servo motor 214, gear 215, lifting mechanism 22, guide rod pair 221, motor fixed plate 222, jacking fixed plate 223, first ball screw pair 224, second servo motor 225, synchronous belt assembly 226, first rotary motor 23, telescopic movement mechanism 3, telescopic movement platform 31, second linear guide rail pair 32, nut seat connecting plate 33, second ball screw pair 34, support plate 35, nut seat 36, third servo motor 37, second rotary motor 38, wafer taking mechanism 4, driving part 41, driving shell 411, driving straight hole 412, piston 413, driving rod 414, bearing part 42, prong plate 421, clamping arm 422, driven arm 423, second rack 424, gear 425, detection part 43, detection disc 431, through transmission sensor 432, detection gap 433. DETAILED DESCRIPTION

[0025] In the following description, numerous specific details are set forth to provide a more thorough understanding of the present application. However, it will be apparent to one of skill in the art that the present application can be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the present application.

[0026] Example 1 : As Figures 1-5The robot for carrying multi-specification wafers is shown, which comprises a base 1, a range extension moving mechanism 2 arranged on the base 1, a telescopic moving mechanism 3 mounted on the range extension moving mechanism 2, a wafer taking mechanism 4 arranged on the telescopic moving mechanism 3, and at least one wafer box 5 arranged on the base 1. The range extension moving mechanism 2 comprises a horizontal moving mechanism 21 arranged on the base 1, a lifting mechanism 22 mounted on the horizontal moving mechanism 21, a first rotary motor 23 arranged on the lifting mechanism 22, and the telescopic moving mechanism 3 mounted on the first rotary motor 23. The horizontal moving mechanism 21 comprises a guide rail support platform 211 mounted on the base 1 through a first linear guide rail pair 212, a first rack 213 arranged on the base 1, a first servo motor 214 arranged on the guide rail support platform 211, a gear 215 arranged at the output end of the first servo motor 214 and in mesh transmission with the first rack 213, and the lifting mechanism 22 arranged on the guide rail support platform 211. The lifting mechanism 22 comprises a guide rod pair 221 slidingly arranged on the guide rail support platform 211, a motor fixing plate 222 arranged at the upper end of the guide rod pair 221, a jacking fixing plate 223 arranged at the lower end of the guide rod pair 221, a first ball screw pair 224 arranged on the guide rail support platform 211, the upper end of the first ball screw pair 224 connected with the motor fixing plate 222, the lower end of the first ball screw pair 224 connected with the jacking fixing plate 223, a second servo motor 225 arranged on the jacking fixing plate 223, the output end of the second servo motor 225 connected with the first ball screw pair 224 through a synchronous belt assembly 226, and the rotary mechanism 23 arranged on the motor fixing plate 222. The telescopic moving mechanism 3 comprises a telescopic moving platform 31, a second linear guide rail pair 32 and a support plate 35 arranged on the telescopic moving platform 31, a nut seat connecting plate 33 slidingly arranged on the second linear guide rail pair 32, a second ball screw pair 34 arranged on the support plate 35, the nut seat connecting plate 33 mounted on the second ball screw pair 34 through a nut seat 36, a third servo motor 37 arranged on the telescopic moving platform 31, the third servo motor 37 connected with the second ball screw pair 34 through a belt assembly, a second rotary motor 38 arranged on the nut seat connecting plate 33, and the wafer taking mechanism 4 arranged at the output end of the second rotary motor 38. The wafer taking mechanism 4 comprises a driving part 41, a bearing part 42 arranged at one end of the driving part 41, and a detection part 43 arranged at the other end of the driving part 41.The driving part 41 comprises a driving shell 411, a driving straight hole 412 is arranged in the driving shell 411, a piston 413 is arranged in the driving straight hole 412, a first air channel and a second air channel are arranged on the driving shell 411, the first air channel and the second air channel are arranged on both sides of the piston 413 for driving the movement of the piston 413, a driving rod 414 is arranged on the piston 413, and the driving rod 414 is connected with the bearing part 42. The bearing part 42 comprises a fork plate 421, the fork plate 421 is fixedly connected with the driving shell 411, a clamping arm 422 is connected with the driving rod 414, a driven arm 423 is slidably arranged on the fork plate 421, a second rack 424 is arranged on the clamping arm 422 and the driven arm 423, a gear 425 is arranged between the second racks 424, and a plurality of adsorption holes 426 for adsorbing wafers are arranged on the fork plate 421. The detection part 43 comprises a detection disc 431, the detection disc 431 is installed on the driving shell 411, two opposite radiation sensors 432 and a proximity sensor 433 are arranged on the detection disc 431, and a detection gap 434 is arranged between the two opposite radiation sensors 432.

[0027] The base 1 is the basic support platform of the entire robot, which not only provides a stable foundation for other components, but also integrates power supply and other necessary control systems. The design of the base takes into account the actual use environment of the industrial site, has good shock resistance and stability, and ensures that the robot remains stable during high-speed operation.

[0028] The range-increasing moving mechanism 2 is the key part of the robot to realize long-distance carrying. The range-increasing moving mechanism mainly includes a horizontal moving mechanism 21, a lifting mechanism 22 and a first rotary motor 23. The horizontal moving mechanism 21 is installed on the base through a guide rail support platform 211 and a first linear guide rail pair 212, a first servo motor 214 is arranged on the guide rail support platform 211, and the horizontal movement is realized through the meshing transmission of the gear 215 and the first rack 213. The lifting mechanism 22 is slidably arranged on the guide rail support platform 211 through a guide rod pair 221, and realizes vertical lifting through a first ball screw pair 224. The first rotary motor 23 is installed on the lifting mechanism, and is responsible for driving the telescopic moving mechanism 3 to rotate. This design enables the robot to move greatly in Y and Z directions, greatly expanding its working range.

[0029] The telescopic movement mechanism 3 is an important part of the robot for fine adjustment and positioning. It includes a telescopic movement platform 31, a second linear guide pair 32, a support plate 35, and a second ball screw pair 34. The telescopic movement platform 31 is provided with a nut seat connecting plate 33, and the second ball screw pair 34 is used to realize the accurate telescopic movement in the X or Y direction. The third servo motor 37 drives the second ball screw pair 34 through the belt assembly, thereby realizing accurate position control. The multi-degree-of-freedom design of the telescopic movement mechanism enables it to flexibly cope with different height and position requirements, ensuring high precision in wafer handling.

[0030] The wafer taking mechanism 4 is a key component for directly contacting and handling wafers. The wafer taking mechanism is composed of a driving part 41, a bearing part 42, and a detection part 43. The driving part 41 is internally provided with a driving straight hole 412 and a piston 413. The movement of the piston 413 is driven through the first and second air channels, and then the driving rod 414 completes the action. The bearing part 42 includes a fork plate 421 and a clamping arm 422, which are used to grab and release the wafer. In particular, the fork plate 421 is provided with a plurality of suction holes 426, which can suck the wafer through negative pressure to ensure the stability and safety during the handling process. The detection part 43 is equipped with two reflection sensors 432 and one proximity sensor 433, which are used to monitor the position and state of the wafer in real time, preventing collision and misoperation.

[0031] Working process:

[0032] Initial preparation stage:

[0033] Firstly, the operator places different specifications of wafer into the corresponding wafer boxes, such as 6-inch wafer boxes, 8-inch wafer boxes, and 12-inch wafer boxes.

[0034] After the robot is started, it enters a standby state and waits for task instructions from the production line. At this time, the telescopic movement mechanism 2 and the telescopic movement mechanism 3 are in the initial position, and the wafer taking mechanism 4 is in a safe position, ready to start work.

[0035] Wafer identification and positioning:

[0036] After receiving the handling instructions, the robot first uses the reflection sensors 432 and the proximity sensor 433 in the detection part 43 to preliminarily identify and position the wafer in the wafer box. The reflection sensor 432 is used to detect the specific position of the single wafer, ensuring that the robot can accurately find and pick up the target wafer. The proximity sensor 433 is responsible for monitoring the position of the wafer box to prevent collision during the wafer picking process.

[0037] After determining the position of the target wafer, the robot will automatically adjust the position and spacing of the fork plate 421 in the wafer taking mechanism 4 according to the size of the wafer to ensure that it can stably grab wafers of different specifications.

[0038] Action of the extended range moving mechanism 2:

[0039] After determining the target wafer position, the extended range moving mechanism 2 starts to act. The horizontal moving mechanism 21 drives the meshing transmission of the gear 215 and the first rack 213 through the first servo motor 214, so that the guide rail support platform 211 slides along the first linear guide rail pair 212 on the base 1, realizing the horizontal movement in the Y direction. This process moves the robot body to the vicinity of the wafer box.

[0040] Next, the lifting mechanism 22 starts to act. The second servo motor 225 drives the first ball screw pair 224 through the synchronous belt assembly 226, so that the motor fixed plate 222 moves up and down along the guide rod pair 221, completing the vertical lifting in the Z direction. This step lifts the robot to the appropriate height, so that the wafer taking mechanism 4 can accurately contact and grasp the wafer.

[0041] Action of the telescopic moving mechanism 3:

[0042] After reaching the specified height, the telescopic moving mechanism 3 starts to act. The third servo motor 37 drives the second ball screw pair 34 through the belt assembly, so that the nut seat connecting plate 33 slides along the second linear guide rail pair 32, realizing the telescopic movement in the X or Y direction. This step accurately moves the wafer taking mechanism 4 to the exact position above the target wafer.

[0043] The second rotary motor 38 rotates by a certain angle as needed to ensure that the wafer taking mechanism 4 can accurately align with the center position of the wafer.

[0044] Action of the wafer taking mechanism 4:

[0045] When the telescopic moving mechanism 3 moves the wafer taking mechanism 4 into position, the driving part 41 starts to act. The piston 413 in the driving housing 411 performs telescopic movement through the control of the air pressure of the first and second air passages, driving the driving rod 414 to push the clamping arm 422 to expand outward, while the driven arm 423 transmits the meshing transmission through the gear 425, ensuring that the fork plate 421 can stably grasp the wafer.

[0046] The multiple suction holes 426 on the fork plate 421 perform suction on the wafer through the negative pressure system, ensuring that the wafer is firmly fixed on the fork plate. During this process, the detection part 43 continuously monitors the state of the wafer, ensuring that it will not fall off or be damaged during the entire wafer taking process.

[0047] Wafer carrying and placing:

[0048] After the wafer is grabbed, the robot moves to the next station according to the predetermined path through the cooperation of the range increasing movement mechanism 2 and the telescopic movement mechanism 3. During the movement, the range increasing movement mechanism 2 and the telescopic movement mechanism 3 continuously adjust the position to ensure that the wafer is always in a stable state.

[0049] After arriving at the destination, the wafer taking mechanism 4 acts again to release the wafer and accurately place it at the target position. The driving part 41 releases the wafer by reversing the operation of the clamping arm 422, and closes the negative pressure system to complete the wafer placement operation.

[0050] Return to standby state:

[0051] After the placement is completed, the robot returns to the initial position and is ready to perform the next task. If there are other wafers to be moved, repeat the above steps; otherwise, the robot enters the standby state and waits for the next instruction.

[0052] The preferred embodiments of the utility model are described in detail above in combination with the drawings, but the utility model is not limited to the specific details in the above embodiments, and various equivalent transformations of the technical solutions of the utility model can be made within the technical concept of the utility model, and these equivalent transformations all belong to the protection scope of the utility model.

Claims

1. A robot capable of handling multiple sizes of wafers over a range, the robot comprising: The utility model relates to a wafer taking device, including: The base (1) is provided with a range increasing moving mechanism (2), the range increasing moving mechanism (2) is installed with telescopic moving mechanism (3), and the telescopic moving mechanism (3) is provided with wafer taking mechanism (4), and the base (1) is provided with at least one wafer box (5).

2. The robot capable of handling multi-specification wafers in a stepped mode according to claim 1, wherein, The range increasing moving mechanism (2) includes: horizontal moving mechanism (21), the base (1) is provided with horizontal moving mechanism (21), the horizontal moving mechanism (21) is installed with lifting mechanism (22), and the lifting mechanism (22) is provided with first rotary motor (23), and the first rotary motor (23) is installed with telescopic moving mechanism (3).

3. The robot capable of handling multi-specification wafers in a step-up manner according to claim 2, wherein, The horizontal moving mechanism (21) includes: guide rail support platform (211), the guide rail support platform (211) is installed on the base (1) through first linear guide rail pair (212), the base (1) is provided with first rack (213), the guide rail support platform (211) is provided with first servo motor (214), the output of first servo motor (214) is provided with gear (215), the gear (215) is meshed with the first rack (213) and is driven, and the guide rail support platform (211) is provided with lifting mechanism (22).

4. The robot capable of handling multi-specification wafers in a stepped mode according to claim 3, wherein, The lifting mechanism (22) includes: guide rod pair (221), the guide rod pair (221) is slidably arranged on the guide rail support platform (211), the upper end of guide rod pair (221) is provided with motor fixed plate (222), the lower end of guide rod pair (221) is provided with jacking fixed plate (223), the guide rail support platform (211) is provided with first ball screw pair (224), the upper end of first ball screw pair (224) is connected with motor fixed plate (222), the lower end of first ball screw pair (224) is connected with jacking fixed plate (223), the jacking fixed plate (223) is provided with second servo motor (225), the output of second servo motor (225) is connected with first ball screw pair (224) through synchronous belt assembly (226), and the motor fixed plate (222) is provided with rotary mechanism (23).

5. The robot capable of handling multi-specification wafers in a stepped mode according to claim 1, wherein, The telescopic moving mechanism (3) includes: telescopic moving platform (31), the telescopic moving platform (31) is provided with second linear guide rail pair (32) and support plate (35), the nut seat connecting plate (33) is slidably arranged on the second linear guide rail pair (32), the support plate (35) is provided with second ball screw pair (34), the nut seat connecting plate (33) is installed on the second ball screw pair (34) through nut seat (36), the telescopic moving platform (31) is provided with third servo motor (37), third servo motor (37) is connected with second ball screw pair (34) through belt assembly, the nut seat connecting plate (33) is provided with second rotary motor (38), and the output of second rotary motor (38) is provided with wafer taking mechanism (4).

6. The overrangeable robot for handling multi-specification wafers according to claim 1, wherein, The taking-out mechanism (4) comprises a driving part (41), one end of which is provided with a bearing part (42), and the other end of which is provided with a detection part (43).

7. The extended range handling multi-specification wafer robot according to claim 6, wherein, The driving part (41) comprises a driving shell (411), a driving straight hole (412) is arranged in the driving shell (411), a piston (413) is arranged in the driving straight hole (412), a first air channel and a second air channel are arranged on the driving shell (411), the first air channel and the second air channel are arranged on both sides of the piston (413) for driving the movement of the piston (413), a driving rod (414) is arranged on the piston (413), and the driving rod (414) is connected with the bearing part (42).

8. The extended range handling multi-specification wafer robot according to claim 7, wherein, The bearing part (42) comprises a prong plate (421), the prong plate (421) is fixedly connected with the driving shell (411), a clamping arm (422) is connected with the driving rod (414), a driven arm (423) is slidably arranged on the prong plate (421), a second rack (424) is arranged on the clamping arm (422) and the driven arm (423), and a gear (425) is arranged between the second racks (424).

9. The extended range handling multi-specification wafer robot according to claim 8, wherein, A plurality of adsorption holes (426) for adsorbing wafers are arranged on the prong plate (421).

10. The extended range handling multi-specification wafer robot according to claim 6, wherein, The detection part (43) comprises a detection disc (431), the detection disc (431) is installed on the driving shell (411), two pairs of photoelectric sensors (432) and a proximity sensor (433) are arranged on the detection disc (431), and a detection gap (433) is arranged between the two pairs of photoelectric sensors (432).

Images