Wafer lifting mechanism capable of being leveled and wafer carrying table

Abstract

The utility model discloses a wafer lifting mechanism capable of leveling. The wafer lifting mechanism comprises a cavity connecting plate, a first adjusting plate, a second adjusting plate, a leveling mechanism and a lifting mechanism, the first adjusting plate is arranged on the cavity connecting plate in a sliding mode in the Y direction, and the second adjusting plate is arranged on the first adjusting plate in a sliding mode in the X direction. The lifting mechanism can drive the wafer carrying table to move in the Z direction, the lifting mechanism is installed on the second adjusting plate through the leveling mechanism, and the leveling mechanism can adjust the included angle between the stroke direction of the lifting mechanism and the plane where the second adjusting plate is located. The utility model further discloses a wafer carrying platform which comprises the wafer lifting mechanism capable of being leveled. According to the wafer lifting mechanism and the wafer carrying table, displacement adjustment of the wafer carrying table in the X direction, the Y direction and the Z direction can be achieved, and the requirement for levelness adjustment of the wafer carrying table can be met.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor manufacturing, especially to a wafer lifting mechanism with adjustable level and wafer table. BACKGROUND

[0002] In the field of semiconductor manufacturing, wafers as core substrates play a pivotal role in the production process of chips, integrated circuits and electronic devices. In the process of wafer processing, in order to ensure that the processing effect reaches the best state, a wafer table must be used to carry the wafer.

[0003] In order to make rational use of space, by reducing the volume of the vapor deposition device, reducing the difficulty of cleanliness control, part of the wafer table for the reaction chamber in the vapor deposition device adopts cantilever design, which is easy to cause the wafer table to be not level, which may cause the wafer to be displaced during loading, and thus cause the failure of the loading operation. In addition, it may also cause adverse conditions such as wafer sliding, which has a significant negative impact on the overall processing accuracy.

[0004] In order to ensure that the wafer manufacturing can reach a high pass rate, it is necessary to ensure that the wafer table is in a horizontal state. However, the traditional lifting structure is mainly used to realize the displacement adjustment of the wafer table in XYZ three directions, which is difficult to meet the demand of horizontal adjustment of the wafer table. SUMMARY

[0005] The utility model provides a wafer lifting mechanism with adjustable level and wafer table to provide a wafer lifting mechanism and wafer table which can be used to realize the displacement adjustment of the wafer table in XYZ three directions and meet the demand of horizontal adjustment of the wafer table.

[0006] In order to achieve the above purpose, the technical scheme of the utility model is:

[0007] A wafer lifting mechanism with adjustable level, comprising: a cavity connecting plate, a first adjusting plate, a second adjusting plate, a leveling mechanism and a lifting mechanism;

[0008] The first adjusting plate is slidably arranged on the cavity connecting plate along the Y direction, and the second adjusting plate is slidably arranged on the first adjusting plate along the X direction;

[0009] The lifting mechanism can drive the wafer table to displace along the Z direction, the lifting mechanism is installed on the second adjusting plate through the leveling mechanism, and the leveling mechanism can adjust the included angle between the stroke direction of the lifting mechanism and the plane where the second adjusting plate is located.

[0010] Further, the leveling mechanism comprises three groups of leveling modules in a triangular distribution, each group of leveling modules comprises a connecting bolt and a leveling top screw;

[0011] The lifting mechanism comprises a support, the leveling top screw is threadedly connected with the support, a through hole is formed in the support to allow the connecting bolt to pass through, and the connecting bolt is threadedly connected with the second adjusting plate after passing through the through hole;

[0012] The leveling top screw is screwed to adjust the length of the leveling top screw protruding from the top surface of the support.

[0013] Further, the cavity connecting plate is provided with a Y-direction sliding groove, the first adjusting plate is provided with a Y-direction sliding rail, and the Y-direction sliding rail is slidably connected with the Y-direction sliding groove.

[0014] The first adjusting plate is provided with an X-direction sliding groove, the second adjusting plate is provided with an X-direction sliding rail, and the X-direction sliding rail is slidably connected with the X-direction sliding groove.

[0015] Further, the Y-direction adjusting mechanism and the X-direction adjusting structure are further included.

[0016] The Y-direction adjusting mechanism comprises a first connecting plate, a first hollow bolt, a Y-direction guide screw and a first fixing nut, and the first connecting plate is fixed on the cavity connecting plate.

[0017] The first hollow bolt is provided with a first guide through hole, the first connecting plate is threadedly connected with the first hollow bolt, the Y-direction guide screw is threadedly connected with the first adjusting plate after passing through the first guide through hole, and the Y-direction guide screw can slide along the first guide through hole.

[0018] The first fixing nut is arranged on the side of the first hollow bolt away from the first adjusting plate, and the first fixing nut is arranged on the Y-direction guide screw.

[0019] The first hollow bolt is screwed to allow the end of the first hollow bolt to abut or leave the side surface of the first adjusting plate.

[0020] The X-direction adjusting structure comprises a second connecting plate, a second hollow bolt, an X-direction guide screw and a second fixing nut, and the second connecting plate is fixed on the first adjusting plate.

[0021] The second hollow bolt is provided with a second guide through hole, the second connecting plate is threadedly connected with the second hollow bolt, the X-direction guide screw is threadedly connected with the second adjusting plate after passing through the second guide through hole, and the X-direction guide screw can slide along the second guide through hole.

[0022] The second fixing nut is arranged on the side of the second hollow bolt away from the second adjusting plate, and the second fixing nut is arranged on the X-direction guide screw.

[0023] Screwing the second hollow bolt can make the end of the second hollow bolt abut against or leave the second adjusting plate side.

[0024] Further, it further comprises Y direction resistance mechanism and X direction resistance mechanism;

[0025] The Y direction resistance mechanism comprises a Y direction spring, one end of the Y direction spring being connected to the first connecting plate, and the other end of the Y direction spring being connected to the first adjusting plate.

[0026] The X direction resistance mechanism comprises an X direction spring, one end of the X direction spring being connected to the second connecting plate, and the other end of the X direction spring being connected to the second adjusting plate.

[0027] Further, the X direction sliding groove and the Y direction sliding groove are dovetail sliding grooves, and the X direction sliding rail and the Y direction sliding rail are dovetail sliding rails.

[0028] Further, it further comprises Y direction inlay and X direction inlay, the Y direction inlay being arranged in the Y direction sliding groove, and the X direction inlay being arranged in the X direction sliding groove.

[0029] Further, the leveling module further comprises a leveling locking nut, the leveling locking nut being arranged on the side of the support away from the second adjusting plate, and the leveling locking nut being arranged on the leveling top wire.

[0030] Further, the lifting mechanism further comprises a motor, a lead screw, a Z direction sliding rail, a Z direction sliding block, a fixed shaft clamping portion and a lead screw nut fixing seat, the fixed shaft clamping portion being used for clamping a fixed shaft of the wafer carrier, and the fixed shaft clamping portion being arranged on the lead screw nut fixing seat.

[0031] The lead screw is rotationally arranged on the support, the motor is fixed on the support, the motor can drive the lead screw to rotate, the Z direction sliding rail is arranged on the support, the Z direction sliding block is mounted on the Z direction sliding rail, the lead screw nut fixing seat is fixedly connected with the Z direction sliding block, the lead screw nut fixing seat is provided with a lead screw nut, and the lead screw nut is mounted on the lead screw.

[0032] The utility model further includes a wafer carrier, comprising the adjustable leveling wafer lifting mechanism of any preceding.

[0033] Beneficial effects:

[0034] The adjustable leveling wafer lifting mechanism and wafer carrier provided by the utility model realize the Z direction displacement of the wafer carrier through the lifting of the lifting mechanism, realize the Y direction and X direction displacement of the lifting mechanism through the first adjusting plate slidingly arranged on the cavity connecting plate and the second adjusting plate slidingly arranged on the first adjusting plate, and further realize the Y direction and X direction displacement of the wafer carrier.

[0035] The leveling mechanism adjusts the included angle between the stroke direction of the lifting mechanism and the second adjusting plate, so that the levelness of the wafer carrier is adjusted, the horizontal state of the wafer carrier is ensured, and the displacement of the wafer carrier in three directions of XYZ is realized. BRIEF DESCRIPTION OF DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0037] Figure 1 A structure schematic view of the wafer lifting mechanism and the wafer carrier disclosed by the present application is shown in the figure.

[0038] Figure 2 A front view of the wafer lifting mechanism and the wafer carrier disclosed by the present application is shown in the figure.

[0039] Figure 3 A Figure 2 B-B sectional view of the wafer lifting mechanism and the wafer carrier disclosed by the present application is shown in the figure.

[0040] Figure 4 A Figure 2 C-C sectional view of the wafer lifting mechanism and the wafer carrier disclosed by the present application is shown in the figure.

[0041] Figure 5 A side view of the wafer lifting mechanism and the wafer carrier disclosed by the present application is shown in the figure.

[0042] Figure 6 A Figure 5 D-D sectional view of the wafer lifting mechanism and the wafer carrier disclosed by the present application is shown in the figure.

[0043] Figure 7 A Figure 5 E-E sectional view of the wafer lifting mechanism and the wafer carrier disclosed by the present application is shown in the figure.

[0044] Figure 8 A top view of the wafer lifting mechanism and the wafer carrier disclosed by the present application is shown in the figure.

[0045] Figure 9 A Figure 8 F-F sectional view of the wafer lifting mechanism and the wafer carrier disclosed by the present application is shown in the figure.

[0046] In the figure:

[0047] 1, cavity connecting plate;

[0048] 2, first adjusting plate; 201, Y direction sliding rail;

[0049] 3, second adjusting plate; 301, X direction sliding rail;

[0050] 4, lifting mechanism; 401, support; 402, motor; 403, screw rod; 404, Z direction sliding rail; 405, Z direction sliding block; 406, fixed shaft clamping part; 407, screw rod nut; 408, screw rod nut fixing seat; 409, clamping block;

[0051] 501, connecting bolt; 502, leveling top wire; 503, leveling locking nut;

[0052] 6, Y direction adjusting mechanism; 601, first connecting plate; 602, first hollow bolt; 603, first guide screw; 604, first fixed nut;

[0053] 7, X direction adjusting structure; 701, second connecting plate; 702, second hollow bolt; 703, second guide screw; 704, second fixed nut;

[0054] 801, Y direction spring; 802, Y direction spring mounting pin; 803, Y direction spring mounting screw;

[0055] 901, X direction spring; 902, X direction spring mounting pin; 903, X direction spring mounting screw;

[0056] 10, Y direction insert strip;

[0057] 11, X direction insert strip;

[0058] 12, first bolt;

[0059] 13, first nut;

[0060] 14, second bolt;

[0061] 15, second nut;

[0062] 16, third bolt;

[0063] A, wafer carrier; A1, fixed shaft. DETAILED DESCRIPTION

[0064] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be described clearly and completely below in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0065] Embodiment 1

[0066] The embodiment provides a levelling wafer lifting mechanism, as shown inFigure 1 , Figure 2 , Figure 5 and Figure 8 As shown, it includes: cavity connecting plate 1, first adjusting plate 2, second adjusting plate 3, leveling mechanism and lifting mechanism 4. In this embodiment, the cavity connecting plate 1 is fixed to the cavity of the reaction chamber by bolts.

[0067] The first adjustment plate 2 is slidably disposed on the cavity connecting plate 1 along the Y direction, and the second adjustment plate 3 is slidably disposed on the first adjustment plate 2 along the X direction;

[0068] The lifting mechanism 4 can drive the wafer stage A to move along the Z direction. The lifting mechanism 4 is mounted on the second adjustment plate 3 through a leveling mechanism. The leveling mechanism can adjust the angle between the stroke direction of the lifting mechanism 4 and the plane where the second adjustment plate 3 is located.

[0069] This embodiment provides an adjustable wafer lifting mechanism. By lifting the lifting mechanism 4, the Z-axis displacement of the wafer stage A is realized. By sliding the first adjustment plate 2 on the cavity connecting plate 1 and the second adjustment plate 3 on the first adjustment plate 2, the Y-axis and X-axis displacement of the lifting mechanism 4 are realized, thereby realizing the Y-axis and X-axis displacement of the wafer stage A.

[0070] The leveling mechanism adjusts the angle between the stroke direction of the lifting mechanism 4 and the second adjustment plate 3, thereby adjusting the level of the wafer stage A. While ensuring the level of the wafer stage A, it also realizes the displacement of the wafer stage A in the XYZ directions. The leveling function and the displacement function are integrated together, resulting in high space utilization and reducing the volume of the vapor deposition device.

[0071] In a specific embodiment, the leveling mechanism includes three sets of leveling modules arranged in a triangular pattern, such as... Figure 2 and Figure 9 As shown, each leveling module includes a connecting bolt 501, a leveling screw 502, and a leveling lock nut 503;

[0072] The lifting mechanism 4 includes a support 401, and the leveling screw 502 is threadedly connected to the support 401. The support 401 has a through hole that allows the connecting bolt 501 to pass through. After the connecting bolt 501 passes through the through hole, it is threadedly connected to the second adjusting plate 3.

[0073] The leveling screw 502 abuts against the second adjusting plate 3. Tightening the leveling screw 502 can adjust the length of the leveling screw 502 protruding from the top surface of the support 401, so that the support 401 is away from or close to the second adjusting plate 3.

[0074] The leveling locking nut 503 is arranged on the side of the support 401 away from the second adjusting plate 3, and the leveling locking nut 503 is arranged on the leveling top screw 502;

[0075] By respectively screwing the three leveling top screws 502 capable of abutting the bottom surface of the second adjusting plate 3, the plane is determined by three points, so that the included angle between the bottom surface of the second adjusting plate 3 and the top surface of the support 401 can be changed, so that the included angle between the stroke direction of the lifting mechanism 4 and the second adjusting plate 3 is changed, thereby adjusting the levelness of the wafer stage A connected with the lifting mechanism 4 through the three groups of leveling modules distributed in a triangular shape;

[0076] In actual use, the connecting bolt 501 can be loosened first, so that a gap for adjusting the levelness is generated between the support 401 and the second adjusting plate 3, and then the leveling top screw 502 is screwed to adjust the levelness. After leveling, the connecting bolt 501 and the leveling locking nut 503 are tightened, and the leveling locking nut 503 can prevent the leveling top screw 502 from loosening. In the embodiment, the connecting bolt 501 is sleeved with a flat washer and a spring washer, and the spring washer is arranged to prevent the connecting bolt 501 from loosening.

[0077] In specific embodiments, the cavity connecting plate 1 is provided with a Y-direction sliding groove, the first adjusting plate 2 is provided with a Y-direction sliding rail 201, and the Y-direction sliding rail 201 is in sliding connection with the Y-direction sliding groove.

[0078] The first adjusting plate 2 is provided with an X-direction sliding groove, the second adjusting plate 3 is provided with an X-direction sliding rail 301, and the X-direction sliding rail 301 is in sliding connection with the X-direction sliding groove.

[0079] In this embodiment, instead of using the form of sliding block and sliding rail cooperation, the form of sliding groove and sliding rail direct cooperation is adopted, which occupies less space, thereby reducing the volume of the vapor deposition device.

[0080] In specific embodiments, as shown in Figure 1 It also includes a Y-direction adjusting mechanism 6 and an X-direction adjusting structure 7.

[0081] As shown in Figure 4 The Y-direction adjusting mechanism 6 includes a first connecting plate 601, a first hollow bolt 602, a Y-direction guide screw 603, and a first fixed nut 604. The first connecting plate 601 is fixed on the cavity connecting plate 1 by a bolt.

[0082] The first hollow bolt 602 is provided with a first guide through hole, the first connecting plate 601 is connected with the first hollow bolt 602 through threads, the Y-direction guide screw 603 passes through the first guide through hole and is connected with the first adjusting plate 2 through threads, and the Y-direction guide screw 603 can slide along the first guide through hole.

[0083] The first fixed nut 604 is arranged on the side of the first hollow bolt 602 away from the first adjusting plate 2, and the first fixed nut 604 is arranged on the Y-direction guide screw rod 603;

[0084] The first hollow bolt 602 is screwed in the positive direction, so that the end of the first hollow bolt 602 abuts against the side surface of the first adjusting plate 2, the first hollow bolt 602 can push the first adjusting plate 2 away from the first connecting plate 601, and the positive displacement of the wafer carrier A in the Y direction is realized;

[0085] The first hollow bolt 602 is screwed in the reverse direction, so that the end of the first hollow bolt 602 is away from the side surface of the first adjusting plate 2, at this time, the Y-direction guide screw rod 603 is pulled, the Y-direction guide screw rod 603 slides along the first guide through hole, and the first adjusting plate 2 can be close to the first connecting plate 601, and the reverse displacement of the wafer carrier A in the Y direction is realized;

[0086] After the displacement of the wafer carrier A in the Y direction is adjusted, the first fixed nut 604 is tightened, the first fixed nut 604 abuts against the end of the first hollow bolt 602 away from the first adjusting plate 2, and the locking of the first adjusting plate 2 in the Y direction is realized;

[0087] As shown in Figure 7 The X-direction adjusting structure 7 includes a second connecting plate 701, a second hollow bolt 702, an X-direction guide screw rod 703 and a second fixed nut 704, and the second connecting plate 701 is fixed on the first adjusting plate 2 by bolts;

[0088] The second hollow bolt 702 is provided with a second guide through hole, the second connecting plate 701 is connected with the second hollow bolt 702 through threads, the X-direction guide screw rod 703 is connected with the second adjusting plate 3 through threads after penetrating through the second guide through hole, and the X-direction guide screw rod 703 can slide along the second guide through hole;

[0089] The second fixed nut 704 is arranged on the side of the second hollow bolt 702 away from the second adjusting plate 3, and the second fixed nut 704 is arranged on the X-direction guide screw rod 703;

[0090] The second hollow bolt 702 is screwed in the positive direction, so that the end of the second hollow bolt 702 abuts against the side surface of the second adjusting plate 3, the second hollow bolt 702 can push the second adjusting plate 3 away from the second connecting plate 701, and the positive displacement of the wafer carrier A in the X direction is realized;

[0091] By reversing the rotation of the second hollow bolt 702, the end of the second hollow bolt 702 can be moved away from the side of the second adjusting plate 3. At this time, the X-direction guide screw 703 is pulled, and the X-direction guide screw 703 slides along the second guide through hole, so that the second adjusting plate 3 can move closer to the second connecting plate 701, thereby realizing the reverse displacement of the wafer stage A in the X direction.

[0092] After adjusting the displacement of the wafer stage A in the X direction, tighten the second fixing nut 704 so that the second fixing nut 704 abuts against the end of the second hollow bolt 702 away from the second adjusting plate 3, thereby locking the second adjusting plate 3 in the X direction.

[0093] In a specific embodiment, it also includes a Y-axis resistance mechanism and an X-axis resistance mechanism;

[0094] like Figure 3 As shown, the Y-direction resistance mechanism includes a Y-direction spring 801, one end of which is connected to the first connecting plate 601, and the other end of which is connected to the first adjusting plate 2.

[0095] like Figure 6 As shown, the X-direction resistance mechanism includes an X-direction spring 901, one end of which is connected to the second connecting plate 701, and the other end of which is connected to the second adjusting plate 3.

[0096] When the first connecting plate 601 and the first adjusting plate 2 move away from each other, the elastic force generated by the stretching of the Y-direction spring 801 will become the resistance to the first connecting plate 601 and the first adjusting plate 2 moving away from each other, so that the first adjusting plate 2 will not move easily, the displacement change is more controllable, and it is convenient to make accurate adjustment.

[0097] When the second connecting plate 701 and the second adjusting plate 3 move away from each other, the elastic force generated by the stretching of the X-direction spring 901 will become the resistance to the second connecting plate 701 and the second adjusting plate 3 moving away from each other, so that the second adjusting plate 3 will not move easily, the displacement change is more controllable, and it is convenient to make accurate adjustment.

[0098] In this embodiment, as Figure 3 As shown, the Y-direction resistance mechanism also includes a Y-direction spring mounting pin 802 and a Y-direction spring mounting screw 803. The Y-direction spring mounting pin 802 is threadedly connected to the first connecting plate 601, and the Y-direction spring mounting screw 803 is threadedly connected to the first adjusting plate 2. The hooks at both ends of the Y-direction spring 801 are respectively sleeved on the Y-direction spring mounting pin 802 and the Y-direction spring mounting screw 803.

[0099] In this embodiment, as Figure 6As shown, the X-direction resistance mechanism further comprises an X-direction spring mounting pin 902 and an X-direction spring mounting screw 903, the X-direction spring mounting pin 902 is threadedly connected with the second connecting plate 701, the X-direction spring mounting screw 903 is threadedly connected with the second adjusting plate 3, and the hooks at both ends of the X-direction spring 901 are respectively sleeved on the X-direction spring mounting pin 902 and the X-direction spring mounting screw 903.

[0100] In specific embodiments, the X-direction sliding groove and the Y-direction sliding groove are dovetail sliding grooves, and the X-direction sliding rail 301 and the Y-direction sliding rail 201 are dovetail sliding rails, which have high accuracy and good rigidity and can bear large loads.

[0101] In specific embodiments, the Y-direction strip 10 and the X-direction strip 11 are further included, as shown in Figure 7 As shown, the Y-direction strip 10 is arranged in the Y-direction sliding groove, as shown in Figure 9 As shown, the X-direction strip 11 is arranged in the X-direction sliding groove;

[0102] The Y-direction strip 10 reduces the fitting gap between the Y-direction sliding rail 201 and the Y-direction sliding groove, avoids the shaking of the lifting mechanism 4 during movement, and thus ensures the movement accuracy and position accuracy of the wafer carrier A;

[0103] The X-direction strip 11 reduces the fitting gap between the X-direction sliding rail 301 and the X-direction sliding groove, avoids the shaking of the lifting mechanism 4 during movement, and thus ensures the movement accuracy and position accuracy of the wafer carrier A;

[0104] In the present embodiment, as shown in Figure 7 The first bolt 12 is arranged on the cavity connecting plate 1, and the size of the gap between the Y-direction strip 10 and the Y-direction sliding rail 201 can be adjusted by screwing the first bolt 12, the first nut 13 is sleeved on the first bolt 12, and the first nut 13 is used to prevent the first bolt 12 from loosening;

[0105] In the present embodiment, as shown in Figure 9 The third bolt 16 is arranged on the first adjusting plate 2, the size of the gap between the X-direction strip 11 and the X-direction sliding rail 301 can be adjusted by screwing the third bolt 16, the X-direction strip 11 in the present embodiment is arranged on the right side of Figure 9 In actual use, this side is close to the cavity of the reaction chamber, and the operation space is small and inconvenient to screw, therefore, the second bolt 14 is additionally arranged on the first adjusting plate 2, the size of the gap between the X-direction strip 11 and the X-direction sliding rail 301 can be adjusted by screwing the second bolt 14, the second nut 15 is sleeved on the second bolt 14, and the second nut 15 is used to prevent the second bolt 14 from loosening

[0106] In the embodiment, the first hollow bolt 602 and the second bolt 14 are arranged on the side away from the cavity of the reaction chamber, and the second hollow bolt 702 and the first bolt 12 are arranged on the side away from the fixed shaft A1, so as to ensure that the operator has sufficient operation space for screwing.

[0107] In specific embodiments, as shown in Figure 2 , the lifting mechanism 4 further comprises a motor 402, a lead screw 403, a Z-direction sliding rail 404, a Z-direction sliding block 405, a fixed shaft clamping portion 406, and a lead screw nut fixing seat 408, the fixed shaft clamping portion 406 is used for clamping the fixed shaft A1 of the wafer carrier A, the fixed shaft clamping portion 406 is arranged on the lead screw nut fixing seat 408, and in the embodiment, the lead screw 403 is a trapezoidal lead screw.

[0108] In the embodiment, as shown in Figure 6 , the fixed shaft clamping portion 406 comprises two clamping blocks 409, and after the two clamping blocks 409 clamp the fixed shaft A1, the two clamping blocks 409 are fixed on the lead screw nut fixing seat 408 through bolts.

[0109] The lead screw 403 is rotatably arranged on the support 401 through a bearing, the motor 402 is fixed on the support 401, the motor 402 can drive the lead screw 403 to rotate, in the embodiment, the motor 402 drives the lead screw 403 to rotate through a belt drive, the Z-direction sliding rail 404 is arranged on the support 401, the Z-direction sliding block 405 is installed on the Z-direction sliding rail 404, the lead screw nut fixing seat 408 is fixedly connected with the Z-direction sliding block 405, the lead screw nut fixing seat 408 is provided with a lead screw nut 407, and the lead screw nut 407 is installed on the lead screw 403.

[0110] Embodiment 2

[0111] The embodiment provides a wafer carrier, as shown in Figure 1 , Figure 2 , Figure 5 and Figure 8 , comprising the adjustable flat wafer lifting mechanism of the embodiment 1, while ensuring the horizontal state of the wafer carrier A, the displacement of the wafer carrier A in the XYZ three directions is realized.

[0112] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the utility model, and not to limit them; although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the utility model.

Claims

1. A level-adjustable wafer lifting mechanism, characterized by, The utility model relates to a wafer carrier (A) and a wafer carrier (A) adjusting device, and the wafer carrier (A) adjusting device comprises: The cavity connecting plate (1), the first adjusting plate (2), the second adjusting plate (3), the leveling mechanism and the lifting mechanism (4); The first adjusting plate (2) is slidably arranged on the cavity connecting plate (1) along the Y direction, and the second adjusting plate (3) is slidably arranged on the first adjusting plate (2) along the X direction; The lifting mechanism (4) can drive the wafer carrier (A) to displace along the Z direction, the lifting mechanism (4) is installed on the second adjusting plate (3) through the leveling mechanism, and the leveling mechanism can adjust the included angle between the stroke direction of the lifting mechanism (4) and the plane where the second adjusting plate (3) is located.

2. The wafer lift mechanism of claim 1, wherein, The leveling mechanism comprises three groups of leveling modules in a triangular distribution, each group of leveling modules comprises a connecting bolt (501) and a leveling jack (502); The lifting mechanism (4) comprises a support (401), the leveling jack (502) is threadedly connected with the support (401), a through hole allowing the connecting bolt (501) to pass through is formed in the support (401), and the connecting bolt (501) is threadedly connected with the second adjusting plate (3) after passing through the through hole; By screwing the leveling jack (502), the length of the leveling jack (502) protruding from the top surface of the support (401) can be adjusted.

3. The wafer lift mechanism of claim 1, wherein, The cavity connecting plate (1) is provided with a Y-direction sliding groove, the first adjusting plate (2) is provided with a Y-direction sliding rail (201), and the Y-direction sliding rail (201) is slidably connected with the Y-direction sliding groove; The first adjusting plate (2) is provided with an X-direction sliding groove, the second adjusting plate (3) is provided with an X-direction sliding rail (301), and the X-direction sliding rail (301) is slidably connected with the X-direction sliding groove.

4. The wafer lift mechanism of claim 3, wherein, Further comprising a Y-direction adjusting mechanism (6) and an X-direction adjusting structure (7); The Y-direction adjusting mechanism (6) comprises a first connecting plate (601), a first hollow bolt (602), a Y-direction guide screw (603) and a first fixed nut (604), and the first connecting plate (601) is fixed on the cavity connecting plate (1); The first hollow bolt (602) is provided with a first guide through hole, the first connecting plate (601) is threadedly connected with the first hollow bolt (602), the Y-direction guide screw (603) is threadedly connected with the first adjusting plate (2) after passing through the first guide through hole, and the Y-direction guide screw (603) can slide along the first guide through hole; The first fixed nut (604) is arranged on the side, away from the first adjusting plate (2), of the first hollow bolt (602), and the first fixed nut (604) is arranged on the Y-direction guide screw (603); By screwing the first hollow bolt (602), the end of the first hollow bolt (602) can abut against or be away from the side surface of the first adjusting plate (2); The X-direction adjusting structure (7) comprises a second connecting plate (701), a second hollow bolt (702), an X-direction guide screw (703) and a second fixed nut (704), and the second connecting plate (701) is fixed on the first adjusting plate (2); The second hollow bolt (702) is provided with a second guide through hole, the second connecting plate (701) is connected with the second hollow bolt (702) through thread connection, the X-direction guide screw rod (703) is connected with the second adjusting plate (3) through thread connection after passing through the second guide through hole, and the X-direction guide screw rod (703) can slide along the second guide through hole; The second fixed nut (704) is arranged on the side of the second hollow bolt (702) away from the second adjusting plate (3), and the second fixed nut (704) is arranged on the X-direction guide screw rod (703). Screwing the second hollow bolt (702) can make the end of the second hollow bolt (702) abut or leave the side of the second adjusting plate (3).

5. The levelable wafer lift mechanism of claim 4, wherein, Further comprising a Y-direction resistance mechanism and an X-direction resistance mechanism; The Y-direction resistance mechanism comprises a Y-direction spring (801), one end of the Y-direction spring (801) is connected to the first connecting plate (601), and the other end of the Y-direction spring (801) is connected to the first adjusting plate (2); The X-direction resistance mechanism comprises an X-direction spring (901), one end of the X-direction spring (901) is connected to the second connecting plate (701), and the other end of the X-direction spring (901) is connected to the second adjusting plate (3).

6. The wafer lift mechanism of claim 3, wherein, The X-direction sliding groove and the Y-direction sliding groove are dovetail sliding grooves, and the X-direction sliding rail (301) and the Y-direction sliding rail (201) are dovetail sliding rails.

7. The wafer lift mechanism of claim 3, wherein, Further comprising a Y-direction strip (10) and an X-direction strip (11), the Y-direction strip (10) is arranged in the Y-direction sliding groove, and the X-direction strip (11) is arranged in the X-direction sliding groove.

8. The wafer lift mechanism of claim 2, wherein, The leveling module further comprises a leveling locking nut (503), the leveling locking nut (503) is arranged on the side of the support (401) away from the second adjusting plate (3), and the leveling locking nut (503) is arranged on the leveling top wire (502).

9. The wafer lift mechanism of claim 2, wherein, The lifting mechanism (4) further comprises a motor (402), a lead screw (403), a Z-direction sliding rail (404), a Z-direction sliding block (405), a fixed shaft clamping portion (406) and a lead screw nut fixing seat (408), the fixed shaft clamping portion (406) is used for clamping a fixed shaft (A1) of the wafer carrier (A), and the fixed shaft clamping portion (406) is arranged on the lead screw nut fixing seat (408); The lead screw (403) is rotationally arranged on the support (401), the motor (402) is fixed on the support (401), the motor (402) can drive the lead screw (403) to rotate, the Z-direction sliding rail (404) is arranged on the support (401), the Z-direction sliding block (405) is installed on the Z-direction sliding rail (404), the lead screw nut fixing seat (408) is fixedly connected with the Z-direction sliding block (405), the lead screw nut fixing seat (408) is provided with a lead screw nut (407), and the lead screw nut (407) is installed on the lead screw (403). 10.A wafer carrier comprising the leveling wafer lifting mechanism according to any one of claims 1-9.

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