Multi-channel wide-temperature SIM (Subscriber Identity Module) card testing device and system

Abstract

The utility model discloses a multichannel wide temperature SIM card testing device and system, relates to the SIM card testing field, the device comprises a thermoregulation box, a control module and N card slots, N is an integer greater than 1, each card slot is arranged in the thermoregulation box, a temperature regulation module is also arranged in the thermoregulation box, the power supply end of the control module is connected with a power supply, and the power supply end of the control module is connected with the power supply. N control transmission ends of the control module are connected with the N card slots in a one-to-one correspondence manner; the control module is used for sending corresponding test instructions to the to-be-tested SIM cards and receiving response results of the to-be-tested SIM cards to the test instructions. According to the scheme, synchronous testing of the N to-be-tested SIM cards can be realized, and the testing efficiency can be improved; and the temperature adjusting module can change the environment temperature in the temperature adjusting box, namely, the environment temperature when the SIM card to be tested is tested is changed, so that the compatibility of the SIM card to be tested in different temperature environments can be better known.

Description

TECHNICAL FIELD

[0001] The utility model relates to SIM card test technical field especially, and relate to a kind of multi-channel wide temperature SIM card testing device and system. BACKGROUND

[0002] With the rapid development of mobile communication technology, from the initial GSM (Global System for Mobile Communications), CDMA (Code Division Multiple Access) to WCDMA (Wide band Code Division Multiple Access), TDSCDMA (Time Division-Synchronous Code Division Multiple Access) and then LTE (Long Term Evolution), the capacity of its network system is getting larger and larger, the data transmission is getting faster and faster, and the communication quality is getting higher and higher. The SIM card of each major communication operator is undoubtedly the key to realize wireless communication. In order to ensure its reliable application, it is necessary to test the SIM card. However, the current testing device can only test one SIM card at the same time, the testing efficiency is low, and the influence of temperature on the realization of SIM card function is ignored in the testing process, which cannot effectively obtain the stability of SIM card and is not conducive to practical application. SUMMARY

[0003] Therefore, the utility model provides a kind of multi-channel wide temperature SIM card testing device and system, can realize the synchronous test of N to be measured SIM card, it is favorable to improve testing efficiency;And can change the environmental temperature when to be measured SIM card is tested, it is favorable to better obtain the compatibility of to be measured SIM card under different temperature environment.

[0004] To solve the above technical problems, the present application provides a kind of multi-channel wide temperature SIM card testing device, including temperature regulating box, control module and N to be measured SIM card for placing card slot, N is the integer greater than 1;Each card slot is located in the temperature regulating box, and the temperature regulating box is also provided with temperature adjusting module for changing the environmental temperature in the temperature regulating box;

[0005] The power supply end of the control module is connected with power supply, and the N control transmission ends of the control module are connected with N card slots one by one.

[0006] The control module is used to send corresponding test instructions to each to be measured SIM card and receive the response results of the to be measured SIM card to the test instructions.

[0007] Further, the N card slots are at least M different sizes, M is an integer not less than 1 and M is not greater than N.

[0008] Further, the N protocol conversion modules are connected with the N control transmission ends of the control module one by one, and the N output ends of the protocol conversion modules are connected with the N card slots one by one, for protocol conversion of transmission data when the control module communicates with any of the SIM cards to be tested.

[0009] Further, the protocol conversion module includes N 7816_GL892S chips.

[0010] Further, the SIM card testing device further includes a first board and a second board.

[0011] The control module is arranged on the first board, and the first board is further provided with a first connector; the N card slots are arranged on the second board, and the second board is further provided with a second connector.

[0012] The first board is arranged outside the temperature control box, and the second board is arranged inside the temperature control box; the N control transmission ends of the control module are connected with the N card slots one by one through the first connector and the second connector.

[0013] Further, the first board is further provided with a voltage conversion module; the input end of the voltage conversion module is connected with the power supply, and the output end of the voltage conversion module is connected with the power supply end of the control module, for voltage conversion of the output voltage of the power supply.

[0014] Further, the control module includes an upper control module and a lower master control module in communication connection with the upper control module.

[0015] The power supply end of the lower master control module is connected with the power supply, and the N control transmission ends of the lower master control module are connected with the N card slots one by one.

[0016] Further, the lower master control module includes S Fe2.1_Hub chips, S is an integer not less than 1.

[0017] To solve the above technical problems, the application further provides a multi-channel wide-temperature SIM card testing system, including a power supply, and further including the multi-channel wide-temperature SIM card testing device as described above.

[0018] The power supply is connected with the multi-channel wide-temperature SIM card testing device.

[0019] The application provides a multi-channel wide-temperature SIM card testing device and system, the device comprises a temperature adjusting box, a control module and N card slots for placing to-be-tested SIM cards, N is an integer greater than 1, each card slot is arranged in the temperature adjusting box, and a temperature adjusting module is further arranged in the temperature adjusting box, a power supply end of the control module is connected with a power supply, and N control transmission ends of the control module are connected with the N card slots in one-to-one correspondence; the control module is used for sending corresponding test instructions to each to-be-tested SIM card and receiving response results of the to-be-tested SIM cards to the test instructions. It can be seen that the scheme can realize synchronous testing of N to-be-tested SIM cards, is beneficial to improving testing efficiency, the temperature adjusting module can change the environmental temperature in the temperature adjusting box, that is, change the environmental temperature when the to-be-tested SIM cards are tested, is beneficial to better knowing the compatibility of the to-be-tested SIM cards under different temperature environments, is beneficial to better knowing the stability of the to-be-tested SIM cards, and is beneficial to practical application.

[0020] The above description is only a summary of the technical scheme of the application, in order to more clearly understand the technical means of the application, the application can be implemented according to the content of the specification, and in order to make the above and other purposes, characteristics and advantages of the application more obvious and easy to understand, the following specific embodiments of the application are described. BRIEF DESCRIPTION OF DRAWINGS

[0021] The drawings described herein are used to provide further understanding of the application, constitute a part of the application, the schematic embodiments of the application and the description thereof are used to explain the application, and do not constitute improper limitation on the application. In the drawings:

[0022] Figure 1 A structural schematic view of a multi-channel wide-temperature SIM card testing device provided by the application;

[0023] Figure 2 A structural schematic view of another multi-channel wide-temperature SIM card testing device provided by the application. DETAILED DESCRIPTION

[0024] The core of the application is to provide a multi-channel wide-temperature SIM card testing device and system, which can realize synchronous testing of N to-be-tested SIM cards, is beneficial to improving testing efficiency, and can change the temperature when the to-be-tested SIM cards are tested, is beneficial to better knowing the compatibility of the to-be-tested SIM cards under different temperature environments.

[0025] The technical solutions in the embodiments of the application will be clearly described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art belong to the scope of protection of the application.

[0026] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of a kind and do not limit the number of objects, for example, the first object can be one or more. In addition, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / ", generally indicates that the objects before and after are in a "or" relationship.

[0027] Please refer to Figure 1 , Figure 1 A structure diagram of a multi-channel wide-temperature SIM card testing device provided by the present application is provided.

[0028] The multi-channel wide-temperature SIM card testing device comprises a temperature adjusting box, a control module 1 and N card slots 2 for placing SIM cards to be tested, N being an integer greater than 1; each card slot 2 is arranged in the temperature adjusting box, and a temperature adjusting module for changing the environmental temperature in the temperature adjusting box is further arranged in the temperature adjusting box.

[0029] The power supply end of the control module 1 is connected with a power supply 3, and the N control transmission ends of the control module 1 are connected with the N card slots 2 one by one.

[0030] The control module 1 is used for sending corresponding test instructions to each SIM card to be tested respectively and receiving the response results of the SIM card to be tested to the test instructions.

[0031] In the embodiment, the temperature adjusting box can be a cuboid box or a cube box, which is not particularly limited here; the specific arrangement position of the temperature adjusting module in the temperature adjusting box is not particularly limited, for example, it can be placed at the upper right corner of the box, and the temperature adjusting module can be various devices or apparatuses capable of changing the environmental temperature in the temperature adjusting box. In addition, as shown in the figure, the arrangement of the temperature adjusting box is omitted here due to the emphasis of the picture display, and only the connection between the power supply 3, the control module 1 and the card slot 2 is shown, wherein the ellipsis represents the omission of the plurality of card slots 2 in the middle and the connection lines between the card slots 2 and the control module 1. Figure 1

[0032] ​Specifically, after the to-be-tested SIM card is placed into the card slot 2 according to the placement rule (for example, the gold finger of the SIM card is placed in correspondence with the corresponding position of the card slot 2), the to-be-tested SIM card can be connected to the corresponding control end of the control module 1 through the card slot 2 and the corresponding connecting line, so as to realize subsequent bidirectional data transmission. More specifically, during testing, the ambient temperature can be changed to-40 DEG C to 125 DEG C through the temperature adjusting module. After the ambient temperature reaches the target temperature to be adjusted, the control module 1 can send a test instruction to the to-be-tested SIM card through the corresponding connecting link, receive and acquire the response result of the to-be-tested SIM card to the test instruction, so as to realize wide-temperature testing. It should be noted that the test content performed on the to-be-tested SIM card is not limited here, including but not limited to the collection of the power supply voltage, current and power consumption of the to-be-tested SIM card under different ambient temperatures, the stability of the memory in the to-be-tested SIM card, the stability of the communication process of the to-be-tested SIM card, etc. Taking the collection of the power supply voltage as an example, a test signal representing the capture of the power supply voltage waveform can be sent to the to-be-tested SIM card, so as to receive the power supply voltage waveform returned by the to-be-tested SIM card in response to the test signal, thereby determining whether the to-be-tested SIM card is stably powered.

[0033] It should be noted that N can be 8 to realize 8-way simultaneous testing of to-be-tested SIM cards, and N can also be 16 to realize 16-way simultaneous testing of to-be-tested SIM cards. Here, the specific value of N is not particularly limited. In addition, preferably, the control module 1 is arranged outside the temperature adjusting box, and since the card slot 2 and part of the connecting line between the card slot 2 and the control transmission end of the control module 1 are arranged inside the temperature adjusting box, the materials of the card slot 2 and the above connecting line are high and low temperature resistant materials, so as to ensure reliable testing.

[0034] It should be further noted that the power supply 3 can be a 5V power supply.

[0035] In summary, the application provides a multi-channel wide-temperature SIM card testing device, which can realize the synchronous testing of N to-be-tested SIM cards, thereby improving the testing efficiency. The temperature adjusting module can change the ambient temperature in the temperature adjusting box to change the ambient temperature when the to-be-tested SIM card is tested, thereby better knowing the compatibility of the to-be-tested SIM card under different temperature environments, better knowing the stability of the to-be-tested SIM card, and being more practical and flexible, thereby being more suitable for practical application.

[0036] On the basis of the above embodiment:

[0037] In some embodiments, the N card slots 2 are at least M different sizes, M is an integer not less than 1 and M is not greater than N.

[0038] In the embodiment, considering that the size of the to-be-tested SIM card can be various, the N card slots 2 are set according to the above setting, specifically, can include a first card slot corresponding to the size of a standard SIM card, a second card slot corresponding to the size of a Micro-SIM card, a third card slot corresponding to a Nano-SIM card, etc., which are not particularly limited here, and the specific number of card slots of the same size is also not particularly limited.

[0039] It can be seen that the above setting makes the SIM card testing device adapt to various sizes of to-be-tested SIM cards, which is conducive to reliable testing.

[0040] In some embodiments, N protocol conversion modules are further included, the N input ends of the protocol conversion modules are connected to the N control transmission ends of the control module 1 one by one, and the N output ends of the protocol conversion modules are connected to the N card slots 2 one by one, for protocol conversion of transmission data when the control module 1 and any to-be-tested SIM card communicate.

[0041] In the embodiment, considering that the communication protocol followed by the to-be-tested SIM card can be different from the communication protocol followed by the control module 1, therefore, the protocol conversion module is set, and then when the control module 1 and any to-be-tested SIM card communicate, the transmission data when the two communicate is protocol-converted, specifically, taking the to-be-tested SIM card following the 7816 protocol and the control module 1 following the USB protocol as an example, the first data following the USB protocol sent by the control module 1 is converted by the protocol conversion module into second data following the 7816 protocol and sent to the to-be-tested SIM card, or the third data following the 7816 protocol sent by the to-be-tested SIM card is converted by the protocol conversion module into fourth data following the USB protocol and sent to the control module 1.

[0042] It can be seen that the above setting can make the testing device realize reliable communication when the control module 1 and the to-be-tested SIM card follow different communication protocols, which is conducive to reliable testing.

[0043] In some embodiments, the protocol conversion module includes N 7816_GL892S chips 4.

[0044] In the embodiment, as shown in Figure 2 , Figure 2 Taking N=16 as an example, when the to-be-tested SIM cards all follow the 7816 protocol, the protocol conversion module can include N 7816_GL892S chips 4, the input end of the i-th 7816_GL892S chip 4 is connected to the i-th control transmission end of the control module 1, and the output end of the i-th 7816_GL892S chip 4 is connected to the i-th card slot 2, to realize the connection of the control module and each to-be-tested SIM card, 1≤i≤N and i is an integer.

[0045] It can be understood that, in order to be compatible with more to-be-tested SIM cards following different communication protocols, N chips implementing at least O different communication protocol conversion functions can also be arranged in the protocol conversion module, O is an integer not less than 1 and not greater than N.

[0046] In some embodiments, the SIM card testing device further comprises a first board card 5 and a second board card 6;

[0047] The control module 1 is arranged on the first board card 5, and the first board card 5 is further provided with a first connector 7; the N card slots 2 are arranged on the second board card 6, and the second board card 6 is further provided with a second connector 8;

[0048] The first board card 5 is arranged outside the temperature control box, and the second board card 6 is arranged inside the temperature control box; the N control transmission ends of the control module 1 are connected with the N card slots 2 one by one through the first connector 7 and the second connector 8.

[0049] In the embodiment, considering that the materials of devices arranged in the temperature control box, such as the card slots 2, need to be high and low temperature resistant materials, the control module 1 is arranged on the first board card 5, and the first board card 5 is arranged outside the temperature control box, and the second board card 6 is arranged inside the temperature control box, so that the materials of the second board card 6, the N card slots 2, the connecting lines between the card slots 2 and the second connector 8, the second connector 8, and the connecting lines between the second connector 8 and the first connector 7 are all high and low temperature resistant materials.

[0050] It should be noted that, when the SIM card testing device comprises a protocol conversion module, the protocol conversion module is also arranged on the first board card 5, and the N output ends of the protocol conversion module are connected with the N input ends of the first connector 7, the N output ends of the first connector 7 are connected with the N input ends of the second connector 8, and the N output ends of the second connector 8 are connected with the N card slots 2 one by one.

[0051] In some embodiments, the first board card 5 is further provided with a voltage conversion module; the input end of the voltage conversion module is connected with the power supply 3, and the output end of the voltage conversion module is connected with the power supply end of the control module 1, for voltage conversion of the output voltage of the power supply 3.

[0052] In the embodiment, considering that the output voltage of the power supply 3 cannot necessarily meet the power supply requirements of the on-board module, the voltage conversion module is arranged to perform voltage conversion on the above output voltage, so as to meet the power supply requirements and realize stable output of the power supply voltage.

[0053] In some embodiments, the control module 1 comprises an upper control module 12 and a lower master control module in communication connection with the upper control module 12;

[0054] The power supply end of the lower host control module is connected with the power supply 3, and the N control transmission ends of the lower host control module are connected with the N card slots 2 one by one.

[0055] Specifically, the upper control module 12 can send corresponding test information according to the current test item for the to-be-tested SIM card, the lower host control module generates a substantial test instruction for testing the to-be-tested SIM card after receiving the test information, in addition, the lower host control module can also send the response result of the to-be-tested SIM card to the upper control module 12 after receiving the response result of the to-be-tested SIM card to the test instruction, and display on the upper control module 12, so that the technician can grasp the test progress in time on the upper control module 12; and since the upper control module 12 and the lower host control module are in communication connection, it is beneficial to realize remote control of the technician to test and grasp the test result. More specifically, the upper control module 12 here can be an upper PC.

[0056] In some embodiments, the lower host control module comprises S Fe2.1_Hub chips 11, S is an integer not less than 1.

[0057] Specifically, one Fe2.1_Hub chip 11 includes 7 available IO ports, and taking N=16 as an example, 4 Fe2.1_Hub chips 11 are needed, that is, S=4, the first Fe2.1_Hub chip 11 is connected with the upper control module 12 as the first level host chip, and the first Fe2.1_Hub chip 11 is also connected with the three Fe2.1_Hub chips 11 as the second level, and the IO ports of the Fe2.1_Hub chips 11 at the second level are used to be connected with the subsequent 7816_GL892S chips 4 one by one.

[0058] As shown in Figure 2 Taking S=4, N=16, and 16 7816_GL892S chips 4 as an example, a complete schematic diagram of the multi-channel wide-temperature SIM card testing device provided by the application is given, and it can be understood that the setting of the temperature control box is omitted due to the display emphasis of the picture.

[0059] The utility model also provides a kind of multi-channel wide-temperature SIM card testing system, including power supply, still including the multi-channel wide-temperature SIM card testing device as described above;

[0060] Power supply is connected with the multi-channel wide-temperature SIM card testing device.

[0061] For the multi-channel wide-temperature SIM card testing system provided in the application, please refer to the above embodiment of the multi-channel wide-temperature SIM card testing device, which will not be repeated here.

[0062] Any technical features in the above-described embodiments can be combined in any manner, and in order to make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, however, as long as the combinations of the technical features do not exist in contradiction, they shall be considered within the scope of the present application.

[0063] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it shall not be understood as a limitation on the patent scope of the present application. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, and these shall be within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.

[0064] It should also be noted that, in the present specification, the relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or sequence between these entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment. Without more limitations, the element defined by the statement "including one" does not exclude the presence of another identical element in the process, method, article or equipment including the element.

Claims

1. A multi-channel wide-temperature SIM card testing device, characterized in that, The SIM card testing device comprises a temperature control box, a control module and N card slots for placing SIM cards to be tested, wherein N is an integer greater than 1; each of the card slots is arranged in the temperature control box, and a temperature adjusting module for changing the ambient temperature in the temperature control box is further arranged in the temperature control box; a power supply end of the control module is connected with a power supply, and N control transmission ends of the control module are connected with the N card slots one by one; the control module is used for sending corresponding test instructions to each of the SIM cards to be tested and receiving response results of the SIM cards to the test instructions.

2. The multi-channel wide-temperature SIM card testing device of claim 1, wherein, The N card slots are at least N card slots of M different sizes, wherein M is an integer not less than 1 and not greater than N.

3. The multi-channel wide-temperature SIM card testing device of claim 1, wherein, The SIM card testing device further comprises N protocol conversion modules, N input ends of the protocol conversion modules are connected with the N control transmission ends of the control module one by one, and N output ends of the protocol conversion modules are connected with the N card slots one by one, for performing protocol conversion on transmission data when the control module communicates with any of the SIM cards to be tested.

4. The multi-channel wide-temperature SIM card testing device of claim 3, wherein, The protocol conversion module comprises N 7816_GL892S chips.

5. The multi-channel wide-temperature SIM card testing device according to any one of claims 1 to 4, characterized in that, The SIM card testing device further comprises a first board and a second board; the control module is arranged on the first board, and a first connector is further arranged on the first board; the N card slots are arranged on the second board, and a second connector is further arranged on the second board; the first board is arranged outside the temperature control box, and the second board is arranged inside the temperature control box; the N control transmission ends of the control module are connected with the N card slots one by one through the first connector and the second connector.

6. The multi-channel wide-temperature SIM card testing device of claim 5, wherein, A voltage conversion module is further arranged on the first board; an input end of the voltage conversion module is connected with the power supply, and an output end of the voltage conversion module is connected with the power supply end of the control module, for performing voltage conversion on output voltage of the power supply.

7. The multi-channel wide-temperature SIM card testing device of claim 5, wherein, The control module comprises an upper control module and a lower master control module in communication connection with the upper control module; a power supply end of the lower master control module is connected with the power supply, and N control transmission ends of the lower master control module are connected with the N card slots one by one.

8. The multi-channel wide-temperature SIM card testing device of claim 7, wherein, The lower master control module comprises S Fe2.1_Hub chips, wherein S is an integer not less than 1.

9. A multi-channel wide-temperature SIM card testing system, characterized in that, The SIM card testing device further comprises a power supply. The power supply is connected with the SIM card testing device.

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