Electronic device

Abstract

The utility model provides electronic equipment, and belongs to the technical field of electronic equipment, and the electronic equipment comprises a frame body, the interior of the frame body is provided with a cooling channel, and the cooling channel forms a first opening and a second opening in the surface of the frame body; and the pump body is arranged on the frame body, the pump body is provided with a suction inlet and a discharge outlet, the suction inlet is communicated with the first opening, and the discharge outlet is communicated with the second opening.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of electronic equipment, and particularly relates to an electronic equipment. BACKGROUND

[0002] At present, with the continuous improvement of the performance of electronic equipment and the complication of the use environment of users, the electronic equipment has stronger heat dissipation requirements.

[0003] In the related art, since the heat of the electronic equipment mainly comes from elements such as processors, cameras or batteries, that is, the internal part of the electronic equipment is locally heated, therefore, some electronic equipment is provided with a heat plate under the screen to evenly heat the local heat, and the heat is dissipated to the outside of the electronic equipment through the screen. Due to the layout and process technology of the internal part of the electronic equipment, the area and shape of the heat plate are limited, so that the heat dissipation capacity of the electronic equipment is poor. CONTENT OF THE UTILITY MODEL

[0004] The purpose of the embodiment of the present application is to provide an electronic equipment which can effectively solve the technical problem of poor heat dissipation capacity of the electronic equipment due to the limited size of the heat plate.

[0005] The embodiment of the present application provides an electronic equipment, which comprises:

[0006] A frame body, the internal part of the frame body has a cooling channel, and the cooling channel forms a first opening and a second opening on the surface of the frame body;

[0007] A pump body is arranged on the frame body, and the pump body has a suction inlet and a discharge outlet, the suction inlet is communicated with the first opening, and the discharge outlet is communicated with the second opening.

[0008] As a possible implementation, it further comprises:

[0009] A heat insulation frame is arranged on the periphery of the frame body, and the heat insulation frame is attached to the frame body.

[0010] As a possible implementation, it further comprises:

[0011] A decorative frame is arranged on the periphery of the heat insulation frame, and the decorative frame is attached to the heat insulation frame.

[0012] As a possible implementation, it further comprises:

[0013] A cover body is arranged on the frame body;

[0014] A heat dissipation member is attached to the frame body and the cover body.

[0015] As a possible implementation, the frame body comprises:

[0016] A plate body, the internal part of the plate body has a part of the cooling channel;

[0017] a frame is arranged at the periphery of the plate body, and the frame has another part of the cooling channel inside;

[0018] The first opening is arranged on the plate body or the frame, and the second opening is arranged on the plate body or the frame.

[0019] As a possible implementation, the frame is a polygonal ring structure, and the another part of the cooling channel is distributed in each side of the frame.

[0020] As a possible implementation, the cooling channel is in a spiral or corrugated shape, and the cooling channel is uniformly distributed in the frame.

[0021] As a possible implementation, the frame is manufactured by stereoscopic printing.

[0022] As a possible implementation, the electronic device further comprises:

[0023] a processor, which is attached to the frame; or

[0024] a camera, which is attached to the frame; or

[0025] a battery, which is attached to the frame; or

[0026] a screen, which is attached to the frame.

[0027] As a possible implementation, the pump body is arranged at a corner of the inside of the frame.

[0028] As a possible implementation, the electronic device further comprises:

[0029] a phase change material, which is arranged in the cooling channel.

[0030] In the embodiments of the present application, the electronic device comprises a frame and a pump body, the frame has a cooling channel inside, the cooling channel can be filled with a cooling medium, and the pump body can drive the cooling medium to flow in the cooling channel, so as to realize the uniform heating and heat dissipation of the inside of the electronic device, that is, the entire frame can be regarded as a uniform heating plate, and the area of the frame is not limited, so as to effectively improve the uniform heating and heat dissipation effect of the electronic device. BRIEF DESCRIPTION OF DRAWINGS

[0031] The above and / or additional aspects and advantages of the present application will become apparent and be readily appreciated from the following description, including the references to the figures, in which:

[0032] Figure 1 One of the cross-sectional views of the electronic device provided by one embodiment of the present application is shown;

[0033] Figure 2 One of the cross-sectional views of the electronic device provided by one embodiment of the present application is shown;

[0034] Figure 3 A schematic diagram of a middle frame and a pump body of an electronic device is shown;

[0035] Figure 4 A schematic diagram of a middle frame, a pump body, a heat insulation frame and a decoration frame of an electronic device is shown;

[0036] Figure 5 An exploded view of a middle frame, a pump body, a heat insulation frame and a decoration frame of an electronic device is shown;

[0037] Figure 6 A partial cross-sectional view of a middle frame and a pump body of an electronic device is shown;

[0038] Figure 7 A schematic diagram of a middle frame of an electronic device is shown;

[0039] Figure 8 A schematic diagram of a cooling channel of an electronic device is shown;

[0040] Figure 9 A schematic diagram of a pump body of an electronic device is shown;

[0041] Figure 10 A partial schematic diagram of a middle frame of an electronic device is shown;

[0042] Figure 11 A cross-sectional view of a middle frame and a phase change material of an electronic device is shown.

[0043] Figures 1 to 11 Reference signs:

[0044] 100 electronic device, 110 frame, 112 cooling channel, 114 first opening, 116 second opening, 118 plate body, 120 bezel, 130 pump body, 132 suction port, 134 discharge port, 140 heat insulation frame, 150 decoration frame, 160 cover body, 170 heat dissipation member, 180 processor, 190 camera, 200 battery, 210 screen, 220 phase change material, 230 first circuit board, 240 second circuit board. DETAILED DESCRIPTION

[0045] The embodiments of the present application will be described below in detail, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explanation, and are not to be understood as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work under the premise that the present application falls within the scope of protection.

[0046] The terms "first", "second" in the specification and claims of the present application can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specified. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / ", generally means that the front and rear associated objects are in an "or" relationship.

[0047] In the description of the present application, it is to be understood that the orientation or position relationship indicated by the terms "upper", "inner" and the like is based on the orientation or position relationship shown in the drawings, and is only for the purpose of facilitating the description of the present application and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0048] In the description of the present application, it is to be understood that, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0049] The electronic device 100 according to the embodiments of the present application will be described below in detail. Among them, Figures 1 to 11 The arrow in the figure indicates the heat dissipation direction. Figure 1

[0050] As shown in Figures 1 to 5 The electronic device 100 according to the embodiments of the present application is provided, which comprises a frame body 110, the inside of the frame body 110 has a cooling channel 112; a pump body 130 is arranged on the frame body 110; wherein, as shown in Figure 8 and Figure 10 The cooling channel 112 forms a first opening 114 and a second opening 116 on the surface of the frame body 110, as Figure 9 ​As shown, the pump body 130 has a suction port 132 and a discharge port 134. The suction port 132 is connected to the first opening 114, and the discharge port 134 is connected to the second opening 116.

[0051] In this embodiment, the electronic device 100 includes a frame 110 and a pump body 130. The frame 110 has a cooling channel 112 inside, which can be filled with a cooling medium. The pump body 130 can drive the cooling medium to flow in the cooling channel 112, thereby achieving heat dissipation and heat equalization inside the electronic device 100. That is, the entire frame 110 can be considered as a heat spreader, and the area of ​​the frame 110 is basically unlimited, thereby effectively improving the heat dissipation and heat equalization effect of the electronic device 100.

[0052] Furthermore, the frame 110 serves as a carrier for the components within the electronic device 100, enabling three-dimensional heat transfer to the complex stacked structure, resulting in more uniform heat distribution within the entire electronic device 100 and reducing the possibility of excessive localized heat in the electronic device 100.

[0053] This application utilizes a pump body 130 to drive the cooling medium to flow throughout the entire frame 110, transferring heat generated by the heat source to the entire electronic device 100 for heat dissipation. The frame 110, as the carrier of the entire electronic device 100, carries all the components of the electronic device 100. The frame 110 itself is not a heat source; heat transfer through the entire frame 110 effectively reduces the overall temperature of the electronic device 100, helping to improve its performance. Furthermore, the frame 110's heat dissipation and heat distribution are not limited by the layout of the heat source, allowing heat generated by any heat source to be evenly distributed throughout the entire electronic device 100, thus reducing the overall temperature of the electronic device 100.

[0054] Furthermore, by manufacturing cooling channels 112 inside the housing 110, the weight of the housing 110 and the electronic device 100 can be reduced.

[0055] like Figure 4 , Figure 5 and Figure 6 As shown, as one possible implementation, it also includes: a heat insulation frame 140 disposed on the periphery of the frame 110, and the heat insulation frame 140 and the frame 110 are attached to each other.

[0056] Specifically, the electronic device 100 also includes a heat insulation frame 140, which is disposed around the periphery of the frame 110, thereby reducing the heat transferred from the frame 110 to the user, reducing the possibility of burning the user, and improving the grip feel of the electronic device 100.

[0057] The heat insulation frame 140 can be made of at least one of the following materials: metal, plastic, rubber, and fiberglass.

[0058] As shown in Figure 4 , Figure 5 and Figure 6 , as a possible implementation, it further includes a decorative frame 150 arranged on the periphery of the heat insulation frame 140, and the decorative frame 150 and the heat insulation frame 140 are in close contact.

[0059] Specifically, the electronic device 100 further includes the decorative frame 150 arranged on the periphery of the heat insulation frame 140, so as to improve the appearance of the electronic device 100 and improve the holding feeling of the electronic device 100.

[0060] In addition, the decorative frame 150 can be made of high-strength material, which can improve the appearance, optimize the holding feeling, and protect the entire electronic device 100.

[0061] The heat insulation frame 140 can be at least one of metal material and plastic material.

[0062] In this application, the frame 110 has a cooling channel 112, the heat insulation frame 140 is arranged on the periphery of the frame 110, and the decorative frame 150 is arranged on the periphery of the heat insulation frame 140. The frame 110 realizes the three-dimensional heat transfer of the complex laminated structure inside the electronic device 100, and uniformly distributes the heat generated by the heat source to the entire body of the electronic device 100. The heat insulation frame 140 insulates the heat transfer from the periphery of the frame 110 to the outside, that is, it insulates the heat transfer from the frame 110 to the decorative frame 150, which reduces the possibility of hot hand feeling when the user holds the electronic device 100. The decorative frame 150 can be made of high-strength material, which can improve the appearance, optimize the holding feeling, and protect the entire electronic device 100.

[0063] As shown in Figure 1 and Figure 2 , as a possible implementation, it further includes a cover 160 arranged on the frame 110, and a heat dissipation member 170 in close contact with the frame 110 and the cover 160.

[0064] Specifically, the electronic device 100 further includes the cover 160 arranged on the frame 110 to enclose the electronic device 100, and the heat dissipation member 170 connected with the frame 110 and the cover 160, so as to transfer the heat of the frame 110 to the cover 160 and dissipate it to the outside of the electronic device 100.

[0065] The heat dissipation member 170 can be a heat dissipation film or a heat dissipation plate, for example, a Pyrolytic Graphite Sheet (PGS) film, a graphene film, an aluminum alloy heat dissipation fin, or a copper heat dissipation fin.

[0066] The heat dissipation member 170 is combined with the frame 110, so that heat can be dissipated from various directions more flexibly, the heat dissipation capacity of the electronic device 100 is increased, and the possibility of overheating of local parts (the screen 210, the camera 190, the battery 200, the processor 180, etc.) of the electronic device 100 is reduced.

[0067] As shown in Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 7 , Figure 10 , and Figure 11 , as one possible implementation, the frame 110 includes a plate body 118, the inside of the plate body 118 having a part of the cooling channels 112; a frame 120, disposed on the periphery of the plate body 118, the inside of the frame 120 having another part of the cooling channels 112, the heat dissipation member 170 being in contact with the frame 120; and wherein the first opening 114 is located on the plate body 118 or the frame 120, and the second opening 116 is located on the plate body 118 or the frame 120.

[0068] Specifically, the frame 110 includes the plate body 118 and the frame 120, the frame 120 being disposed on the periphery of the plate body 118, the cooling channels 112 being distributed in the plate body 118 and the frame 120, that is, a part of the cooling channels 112 being disposed in the inside of the plate body 118, and another part of the cooling channels 112 being disposed in the inside of the frame 120, so as to further increase the length of the cooling channels 112, improve the heat equalization and dissipation effect of the frame 110, and make the cooling channels 112 form a three-dimensional structure, so that the frame 110 can heat and dissipate heat to any position inside the electronic device 100, thereby improving the heat equalization and dissipation effect of the frame 110.

[0069] Further, the heat dissipation member 170 is in contact with the frame 120, and the cover 160 is disposed on the frame 120, so as to reduce the volume of the heat dissipation member 170, ensure that other elements have sufficient arrangement space, and make it more convenient for other elements to contact the plate body 118.

[0070] According to requirements, the first opening 114 can be disposed on the plate body 118 or the frame 120, and the second opening 116 can be disposed on the plate body 118 or the frame 120.

[0071] As shown in Figure 3 , Figure 4 , Figure 5 , and Figure 7 , as one possible implementation, the frame 120 is a polygonal ring structure, and another part of the cooling channels 112 is distributed in each side of the frame 120.

[0072] Specifically, the frame 120 is a polygonal ring structure, and each side of the frame 120 is distributed with another part of the cooling channel 112, thereby further increasing the length of the cooling channel 112 and improving the heat equalization and dissipation effect of the frame 110.

[0073] Wherein, the frame 120 can be a three-sided ring structure, a four-sided ring structure, or a five-sided ring structure, and the like.

[0074] As shown in Figure 7 and Figure 8 , as one possible implementation, the cooling channel 112 is corrugated or spiral, and the cooling channel 112 is uniformly distributed in the frame 110.

[0075] Specifically, as shown in Figure 7 , the cooling channel 112 is corrugated, and the cooling channel 112 is uniformly distributed in the frame 110, so that the frame 110 can be uniformly heat-conducted everywhere, thereby improving the heat equalization and dissipation effect of the frame 110.

[0076] Or as shown in Figure 8 , the cooling channel 112 is spiral, and the cooling channel 112 is uniformly distributed in the frame 110, so that the frame 110 can be uniformly heat-conducted everywhere, thereby improving the heat equalization and dissipation effect of the frame 110.

[0077] As one possible implementation, the frame 110 is manufactured by stereoscopic printing.

[0078] Specifically, the frame 110 is manufactured by the process of stereoscopic printing, thereby reducing the manufacturing difficulty of the frame 110.

[0079] That is, the cooling channel 112 inside the frame 110 is manufactured by the process of stereoscopic printing, so that the cooling channel 112 can form a three-dimensional and circulating structure, thereby the cooling medium inside the cooling channel 112 can be pushed by the pump body 130 to flow in the cooling channel 112, so that the local heat of the electronic device 100 can be transmitted to the entire electronic device 100, which will not be affected by the layout of the elements of the electronic device 100, thereby reducing the possibility of local overheating of the electronic device 100.

[0080] As shown in Figure 1 and Figure 2 , as one possible implementation, it further includes: a processor 180 attached to the frame 110; or a camera 190 attached to the frame 110; or a battery 200 attached to the frame 110; or a screen 210 attached to the frame 110.

[0081] Specifically, as shown in Figure 1 and Figure 2As shown in FIG. 1, the electronic device 100 further includes a processor 180, which is attached to the frame 110. The processor 180 generates heat. The attachment of the processor 180 to the frame 110 allows the frame 110 to better carry away the heat generated by the processor 180, thereby improving the heat-distribution and heat-dissipation effects of the frame 110.

[0082] As shown in FIG. 1, the electronic device 100 further includes a camera 190, which is attached to the frame 110. The camera 190 generates heat. The attachment of the camera 190 to the frame 110 allows the frame 110 to better carry away the heat generated by the camera 190, thereby improving the heat-distribution and heat-dissipation effects of the frame 110. Figure 2

[0083] As shown in FIG. 1, the electronic device 100 further includes a battery 200, which is attached to the frame 110. The battery 200 generates heat when charging. The attachment of the battery 200 to the frame 110 allows the frame 110 to better carry away the heat generated by the battery 200, thereby improving the heat-distribution and heat-dissipation effects of the frame 110. Figure 1 Figure 2

[0084] As shown in FIG. 1, the electronic device 100 further includes a screen 210, which is attached to the frame 110. The screen 210 is a surface device of the electronic device 100, which can dissipate the heat of the frame 110 to the outside of the electronic device 100, thereby improving the heat-dissipation effect of the electronic device 100. Figure 1 Figure 2 As shown in FIG. 1, as one possible implementation, the pump body 130 is located at a corner of the inside of the frame 110.

[0085] As shown in FIG. 1, as one possible implementation, the electronic device 100 further includes a phase-change material 220, which is arranged in the cooling channel 112. Figure 3 Figure 4 Figure 7 As shown in FIG. 1, as one possible implementation, the electronic device 100 further includes a phase-change material 220, which is arranged in the cooling channel 112.

[0086] As shown in FIG. 1, as one possible implementation, the electronic device 100 further includes a phase-change material 220, which is arranged in the cooling channel 112.

[0087] As shown in FIG. 1, as one possible implementation, the electronic device 100 further includes a phase-change material 220, which is arranged in the cooling channel 112. Figure 11

[0088] As shown in FIG. 1, as one possible implementation, the electronic device 100 further includes a phase-change material 220, which is arranged in the cooling channel 112.

[0089] ​​​​​​​The phase change material 220 can be an organic phase change material, an inorganic phase change material, or a hybrid phase change material.

[0090] As shown in FIG. 1, the electronic device 100 includes a battery 200, a camera 190, a processor 180, a speaker, a data interface, and a phase change material 220. Figure 1 and Figure 2 As shown in FIG. 1, the electronic device 100 includes a battery 200, a camera 190, a processor 180, a speaker, a data interface, and a phase change material 220.

[0091] The electronic device 100 can be a terminal or other device. For example, the electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted electronic device, a music playing device, a private network communication terminal device (e.g., a walkie-talkie), a mobile Internet device (MID), an augmented reality / virtual reality / mixed reality device, a robot, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc. The electronic device 100 can also be a server, a network attached storage (NAS), a personal computer (PC), a television (TV), a teller machine, or a self-service machine, etc. The embodiments of the present application are not limited in this regard.

[0092] In the description of the present application, the description of the terms "one embodiment", "a specific embodiment", or the like means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. The illustrative expressions of the above terms in the present specification do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0093] Although the embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements, and variations can be made to the embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, comprising: The electronic device comprises: a frame body, an inside of the frame body having a cooling channel, the cooling channel forming a first opening and a second opening on a surface of the frame body; a pump body arranged on the frame body, the pump body having a suction inlet and a discharge outlet, the suction inlet being in communication with the first opening, and the discharge outlet being in communication with the second opening.

2. The electronic device of claim 1, wherein, Further comprising: a heat insulation frame arranged on a periphery of the frame body, the heat insulation frame being attached to the frame body.

3. The electronic device of claim 2, wherein, Further comprising: a decorative frame arranged on a periphery of the heat insulation frame, the decorative frame being attached to the heat insulation frame.

4. The electronic device of any of claims 1-3, wherein, Further comprising: a cover body arranged on the frame body; a heat dissipation member attached to the frame body and the cover body.

5. The electronic device of claim 4, wherein, The frame body comprises: a plate body, an inside of the plate body having a part of the cooling channel; a frame arranged on a periphery of the plate body, an inside of the frame having another part of the cooling channel, the heat dissipation member being attached to the frame; wherein the first opening is located on the plate body or the frame, and the second opening is located on the plate body or the frame.

6. The electronic device according to claim 5, wherein: the frame is a polygonal ring structure, and the frame has the other part of the cooling channel distributed in each side of the frame.

7. The electronic device according to any one of claims 1 to 3, wherein: the cooling channel is in a corrugated or spiral shape, and the cooling channel is uniformly distributed in the frame body.

8. The electronic device according to any one of claims 1 to 3, wherein: the frame body is manufactured by stereolithography.

9. The electronic device of any of claims 1-3, wherein, Further comprising: a processor attached to the frame body; or a camera attached to the frame body; or a battery attached to the frame body; or a screen attached to the frame body.

10. The electronic device according to any one of claims 1 to 3, wherein: the pump body is located at a corner of an inside of the frame body. Further comprising:

11. The electronic device of any of claims 1-3, wherein, a phase change material arranged in the cooling channel. ​

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