Power board layout structure, transformer installation structure and inverter

By dividing the inverter's power board into a high-voltage side and a low-voltage side, and setting a gap between them, the transformer is installed on the back side. Combined with a heat sink, the problem of poor heat dissipation in the inverter is solved, improving stability and safety.

CN223613610UActive Publication Date: 2025-11-28深圳迈格瑞能技术有限公司
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Patent Information

Application Number
CN202423162059.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-20
Publication Date
2025-11-28
Estimated Expiration
2034-12-20

AI Technical Summary

Technical Problem

The stacked installation structure of transformers and power boards in existing inverters results in poor heat dissipation, high heat generation, and affects operational stability and safety.

Method used

The power board is divided into a high-voltage side power board and a low-voltage side power board, with a gap between them. The transformer is installed on the back side of the power board, and the lead wires are led out from the gap and connected to the heat sink for heat dissipation.

Benefits of technology

This improved the transformer's heat dissipation, enhanced its operational stability and safety, and reduced heat generation.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to an energy storage inverter, in particular to a power board layout structure, a transformer and an inverter. The power board layout structure, the transformer and the inverter comprise power boards, the power boards comprise a low-voltage-side power board and a high-voltage-side power board, the low-voltage-side power board is provided with a low-voltage-side terminal, the high-voltage-side power board is provided with a high-voltage-side terminal, and a gap is formed between the low-voltage-side power board and the high-voltage-side power board. The power board is divided into the high-voltage side power board and the low-voltage side power board, and the gap is arranged between the high-voltage side power board and the low-voltage side power board. After the transformer is installed on the back side of the power board, an outgoing line of the transformer can be led out to the front faces of the low-voltage-side power board and the high-voltage-side power board and then is connected with the low-voltage-side power board and the high-voltage-side power board, and therefore enough heat dissipation space is formed between the primary side and the secondary side of the transformer. Good heat dissipation of the transformer and the primary and secondary circuit boards is facilitated, and the working stability and safety of the transformer are improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to energy storage inversion device especially a power board layout structure, transformer and inverter. BACKGROUND

[0002] With the development of electric power technology, in domestic or commercial occasions, the clean energy power generation such as commercial power, photovoltaic or wind power is stored by energy storage equipment, and then the related technology such as power distribution is more and more widely used. The combination of energy storage equipment and conventional power supply can effectively improve the stability of power consumption, reduce the electricity expenditure of high power consumption of users through peak clipping and valley filling, capacity price reduction and other modes, and improve the power consumption economy.

[0003] In the process of supplying power by the output alternating current of the energy storage equipment, the inverter is an important component, and the inverter converts the low-voltage direct current in the energy storage equipment into high-voltage alternating current for output. The existing inverter has components such as transformer, transformer board and power board in structure, the transformer is welded on the transformer board, and the wiring terminal on the transformer board is electrically connected with the IGBT pin on the power board, forming a structure in which the transformer board is located between the transformer and the power board. Since the existing inverter usually adopts LLC topology layout, the bus capacitor is charged after being boosted by LLC transformer, so the total current input by the battery on the low-voltage side of the transformer is very large, for example, in the 48V low-voltage battery energy storage inversion process, when the battery output power is 12KW, the battery input side current of the transformer reaches 250A, so the heat generation is large, the transformer board is between the power board and the transformer, and the heat cannot be effectively dissipated, resulting in large overall heat generation, high working temperature, affecting the stability and safety of the work. SUMMARY

[0004] In a first aspect, the embodiments of the present application provide a power board layout structure that solves the problem of poor heat dissipation caused by the structural relationship of components, improves the working stability and safety.

[0005] The power board layout structure comprises a power board,

[0006] The power board comprises a low-voltage side power board and a high-voltage side power board, the low-voltage side power board is provided with a low-voltage side terminal, the high-voltage side power board is provided with a high-voltage side terminal, and the low-voltage side power board and the high-voltage side power board have a gap for the transformer lead wire to pass through.

[0007] Due to the above structure, the transformer plate layout structure in the embodiment of the application omits the original transformer plate, divides the power plate into a high-voltage side power plate and a low-voltage side power plate, and sets a gap between the high-voltage side power plate and the low-voltage side power plate, so that the lead-out wire of the transformer can be led out to the front side of the low-voltage side power plate and the high-voltage side power plate and connected with the low-voltage side power plate and the high-voltage side power plate, thereby making the transformer have sufficient heat dissipation space between the primary side and the secondary side, forming a convection path of heat dissipation air, and being beneficial to good heat dissipation of the transformer and the primary side and secondary side circuit boards, and improving the stability and safety of the transformer work.

[0008] In a possible implementation, the low-voltage side power plate further comprises a Hall sensor and a Mos driving optical coupling circuit, the Hall sensor is located on one side of the front side of the low-voltage side power plate, and the Mos driving optical coupling circuit is arranged side by side on the front side of the low-voltage side power plate.

[0009] In a possible implementation, the high-voltage side power plate further comprises a bus capacitor, a battery high-voltage side igbt and an LLC resonance capacitor, the bus capacitor is arranged in multiple rows and multiple columns on one side of the front side of the high-voltage side power plate, and the battery high-voltage side igbt and the LLC resonance capacitor are arranged on one side of the front side of the high-voltage side power plate.

[0010] In a second aspect, the embodiment of the application further provides a transformer mounting structure, characterized in comprising a transformer and the power plate layout structure in the first aspect, and the transformer is mounted on the back side of the low-voltage side power plate and the high-voltage side power plate.

[0011] In a possible implementation, the transformer comprises a transformer body and a lead-out wire connected with the transformer body, the transformer body is arranged on the back side of the low-voltage side power plate and the high-voltage side power plate, the lead-out wire passes through the gap to the front side of the low-voltage side power plate and the high-voltage side power plate, and is electrically connected with the low-voltage side power plate and the high-voltage side power plate.

[0012] In a possible implementation, the back side of the low-voltage side power plate and the high-voltage side power plate is provided with a heat sink, and the transformer is mounted on the heat sink.

[0013] In a possible implementation, the low-voltage side power plate and the high-voltage side power plate are mounted on the back side of the heat sink through surface mounting nut columns.

[0014] In a possible implementation, the transformer comprises a plurality of transformers, the high-voltage sides of the plurality of transformers are connected in series, and the high-voltage side lead-out wire of one of the transformers is connected with the high-voltage side terminal; the low-voltage sides of the plurality of transformers are respectively connected with the low-voltage side terminal through separate low-voltage side lead-out wires.

[0015] In a possible implementation, the heat sink comprises a bottom plate and heat dissipation fins arranged on the bottom plate, and a transformer mounting position is arranged on the heat sink corresponding to the gap between the low-voltage side power board and the high-voltage side power board, and the transformer is arranged in the transformer mounting position.

[0016] In a third aspect, the embodiments of the present application further provide an inverter, which comprises a transformer adopting the layout structure of the first aspect. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 Fig. 1 is a front view of a power board according to the first embodiment of the present application;

[0018] Figure 2 Fig. 2 is a back view of the power board according to the second embodiment of the present application;

[0019] Figure 3 Fig. 3 is a side view of the power board according to the second embodiment of the present application;

[0020] Figure 4 Fig. 4 is a view of a heat sink according to the second embodiment of the present application. DETAILED DESCRIPTION

[0021] The embodiments will be described in further detail below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments but not all of them. Based on the embodiments below, all other embodiments obtained by those of ordinary skill in the art without creative efforts should fall within the scope of the present application.

[0022] It should be understood that, in the embodiments, all directional terms such as "upper", "lower", "left", "right", "front", "back", etc. are intended to indicate the orientation or positional relationship shown in the drawings or the orientation or positional relationship used in use, and are only intended to simplify the description, and do not indicate or imply that the device, element or component must have a particular orientation or have a particular orientation structure, and should not be understood as a limitation on the embodiments. It is only used to explain the relative position relationship, movement condition, etc. between the components shown in the drawings, and when the specific posture changes, the directional indication may also change accordingly.

[0023] In addition, ordinal indicators, such as "first", "second", and the like, are used in the embodiments merely for distinguishing between the purposes, and cannot be understood as indicating or implying relative importance or an indicated number of technical features. The features defined as "first", "second" can be explicitly or implicitly at least one of the technical features. In the description of the embodiments, "a plurality of" means at least two, that is, two or more, unless otherwise explicitly limited; "at least one" means one or more.

[0024] In the embodiments, unless otherwise explicitly specified and limited, the terms "mount", "set", "connect", "fix", "screw", and the like should be understood in a broad sense, for example, the relative positional relationship between the components can be fixed, or there can be a physically fixed connection between the components, which can be detachable or integrated structure; it can be mechanical connection, or electrical signal connection; it can be direct connection, or indirect connection through intermediate media or components; it can be internal communication of two elements, or interaction relationship between two elements, the specific connection mode should be understood according to the device properties, unless the specification is explicitly limited, and other understandings cannot achieve the corresponding functions or effects. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific situation.

[0025] In the embodiments, the controllers and control circuits involved are the conventional control technology or units of those skilled in the art, for example, the control circuit of the controller can be realized by the existing technology, such as simple programming by those skilled in the art. The software or program involved in the control result realized by cooperating with the hardware, such as the control process of the software or program not described in detail in the specification, belongs to the use of existing technology or the conventional technology of those skilled in the art. The power supply also uses the existing technology in the art, and the main technical point is the improvement of the mechanical device, so the specific circuit control relationship and circuit connection are not described in detail in the embodiments.

[0026] The disclosure of the embodiments provides many different embodiments or examples for implementing different structures of the utility model. In order to simplify the disclosure of the utility model, the components and settings of specific examples are described in the embodiments. Of course, they are only examples, and the purpose is not to limit the utility model. In addition, the reference numerals and / or reference letters can be repeated in different examples in the embodiments. Such repetition is for the purpose of simplification and clarity, and it does not indicate the relationship between the various embodiments and / or settings discussed by itself. In addition, if various specific process and material examples are provided in the embodiments, those skilled in the art can realize the application of other processes and / or the use of other materials.

[0027] The preferred embodiments of the present application are described below in conjunction with the accompanying drawings, it should be understood that the preferred embodiments described here are only used to explain and describe the present application, and are not used to limit the protection scope of the present application.

[0028] In addition, it should be noted that the embodiments of the present application mainly explain the layout positions of the transformer, the circuit board and the devices and circuits on the circuit board, and the specific device and circuit connection is set according to the existing circuit of the transformer of the inverter, which is not described in the embodiments.

[0029] The first embodiment of the present application provides a power board layout structure.

[0030] As shown in Figure 1 The power board layout structure comprises a power board, wherein:

[0031] The power board 1 comprises a low-voltage side power board 11 and a high-voltage side power board 12, the low-voltage side power board 11 is provided with a low-voltage side terminal 111, the high-voltage side power board 12 is provided with a high-voltage side terminal 121, and the low-voltage side power board 11 and the high-voltage side power board 12 have a gap 13 for the transformer outgoing line to pass through.

[0032] Since the original transformer is installed on the transformer board, the transformer board is installed as a whole with the power board to form a kind of laminated structure, and the heat generated by the transformer board and the heat generated by the power board are located in the same area during work, and the front and back of the area are blocked by the two layers of the transformer board and the power board, so the air flow introduced by the external fan or the heat conduction hole is also blocked in this direction, so there are problems of large heat generation, rapid temperature rise and poor heat dissipation effect. In the power board layout structure of the embodiments of the present application, the original transformer board is omitted, the power board is divided into a high-voltage side power board 11 and a low-voltage side power board 12, a gap 13 is arranged between the low-voltage side power board 11 and the high-voltage side power board 12, the transformer 2 is installed on the back side of the power board, and the outgoing line 22 of the transformer 2 is led out to the front side of the low-voltage side power board 11 and the high-voltage side power board 12 and connected with the low-voltage side power board 11 and the high-voltage side power board 12, so that the primary and secondary sides of the transformer, i.e. the low-voltage side power board 11 and the high-voltage side power board 12, are unfolded on the same plane, and there is enough heat dissipation space between the two heat sources, and the gap 13 in the middle forms a convection path of heat dissipation air, which is conducive to the good heat dissipation of the transformer and the primary and secondary circuit boards, and improves the stability and safety of the transformer work.

[0033] As a typical example, the low-voltage side power board 11 and the high-voltage side power board 12 in the embodiment are two independent circuit boards, i.e. the low-voltage side power board 11 and the high-voltage side power board 12 are structurally divided into two independent circuit boards and are kept a certain distance apart when installed, forming the gap 13. In actual application, the devices on the low-voltage side power board 11 and the high-voltage side power board 12 can also be arranged on the same circuit board according to the circuit requirements, and then a certain amount of free space is provided at a specific position on the circuit board and a through hole or a gap is provided, as long as the lead-out wire of the transformer can be led out from the corresponding through hole or gap to the front side of the low-voltage side power board and the high-voltage side power board and connected with the low-voltage side terminal 111 and the high-voltage side terminal 121 when the transformer is installed on the back side.

[0034] In the embodiment, the low-voltage side power board 11 further comprises a Hall sensor 112 and a Mos drive optocoupler circuit 113, the Hall sensor 112 is located on one side of the front side of the low-voltage side power board 11, and the Mos drive optocoupler circuit 113 is arranged side by side on the front side of the low-voltage side power board 11.

[0035] In the embodiment, the high-voltage side power board 12 further comprises a bus capacitor 122, a battery high-voltage side igbt 123 and an LLC resonance capacitor 124, the bus capacitor 122 is arranged in multiple rows and multiple columns on one side of the front side of the high-voltage side power board, and the battery high-voltage side igbt 123 and the LLC resonance capacitor 124 and the high-voltage side terminal are arranged on one side of the front side of the high-voltage side power board.

[0036] As described above, the main components are arranged on the low-voltage side power board 11 and the high-voltage side power board 12, which can disperse the main components on the circuit board and keep a certain distance apart in space, avoiding the accumulation of heat generated by local components and causing sharp temperature rise.

[0037] Since the power board and the transformer are usually installed and worked together in the inverter, a second embodiment is further proposed based on the first embodiment.

[0038] The second embodiment provides a transformer installation structure.

[0039] As Figure 2 and Figure 3 , and in combination with Figure 1As shown, the transformer 2 of the second embodiment includes a transformer body 21 and a lead-out wire 22 connected to the transformer body, the transformer body 21 is arranged on the back of the low-voltage side power board 11 and the high-voltage side power board 12, and the lead-out wire 22 is led out from the gap 13 to the front of the low-voltage side power board 11 and the high-voltage side power board 12 and is electrically connected to the low-voltage side power board 11 and the high-voltage side power board 12.

[0040] In order to further improve the heat dissipation effect and timely conduct the heat generated by the low-voltage side power board 11 and the high-voltage side power board 12 outwardly, in this embodiment, a heat sink 3 is arranged on the back of the low-voltage side power board 11 and the high-voltage side power board 12, and the transformer 1 is mounted on the heat sink 3. The size of the heat sink 3 covers the entire back of the low-voltage side power board 11 and the high-voltage side power board 12, which can not only serve as a heat dissipation device, but also serve as the mounting base of the transformer 1. Fixing and mounting the transformer on the heat sink is also conducive to the heat dissipation of the heat sink. At the same time, since the heat sink 2 is mounted on the back of the low-voltage side power board 11 and the high-voltage side power board 12, and the transformer 2 is also mounted on the back of the low-voltage side power board 11 and the high-voltage side power board 12, and the lead-out wire 22 of the transformer needs to pass through the gap 13 between the low-voltage side power board 11 and the high-voltage side power board 12 for connection, the lead-out wire 22 of the corresponding transformer 2 also needs to pass through the heat sink 3. Therefore, the heat sink 3 has a corresponding through hole 31 at the position corresponding to the lead-out wire 22, and the lead-out wire 22 passes through the through hole 31 and then passes through the gap 13 to realize electrical connection on the front of the low-voltage side power board 11 and the high-voltage side power board 12.

[0041] In the structure of the heat sink, as shown in the drawings, Figure 4 The heat sink 3 includes a bottom plate 32 and heat dissipation fins 33 arranged on the bottom plate, and the heat sink 3 has a transformer mounting position 34 corresponding to the gap between the low-voltage side power board and the high-voltage side power board, and the transformer is mounted in the transformer mounting position 34.

[0042] The bottom plate 32 of the heat sink 3 covers the back of the main heat generating electronic devices on the low-voltage side power board 11 and the high-voltage side power board 12.

[0043] In actual circuit board design, usually there are some electronic devices on the back of the circuit board, so the back of the low-voltage side power board 11 and the high-voltage side power board 12 is often uneven in actual products. In addition, the insulation and heat dissipation channel problems are also considered. In the embodiment, the low-voltage side power board 11 and the high-voltage side power board 12 are mounted on the back of the heat sink through surface-mounted nut columns. Through the surface-mounted nut columns, the low-voltage side power board 11 and the high-voltage side power board 12 can be stably mounted on the heat sink 3, and the heat sink and the back of the low-voltage side power board 11 and the high-voltage side power board 12 can be supported apart by a certain distance through the surface-mounted nut columns, meeting the space requirements of the back components of the low-voltage side power board 11 and the high-voltage side power board 12.

[0044] In the connection of the transformer lead-out wire, the lead-out wire 22 of the transformer 2 includes a low-voltage side lead-out wire 221 and a high-voltage side lead-out wire 222. The low-voltage side lead-out wire 221 is connected with the low-voltage side terminal 111, and the high-voltage side lead-out wire 222 is connected with the high-voltage side terminal 121.

[0045] In the embodiment, in order to reduce the number of lead-out wires, the transformer 3 includes a plurality of transformers. The high-voltage sides of the plurality of transformers are connected in series, and the high-voltage side lead-out wire 222 of one of the transformers is connected with the high-voltage side terminal 121. The low-voltage sides of the plurality of transformers are respectively connected with the low-voltage side terminal 111 through separate low-voltage side lead-out wires 222. As shown in Figure 1 there are two high-voltage side lead-out wires 222 connected with two corresponding high-voltage side terminals 121, and eight low-voltage side lead-out wires 222 connected with eight corresponding low-voltage side terminals 111.

[0046] In a third aspect, the embodiment of the present application further provides an inverter, which includes the transformer installation structure of the first aspect.

[0047] The above is only the preferred embodiment of the embodiment of the present application, and does not limit the disclosure range of the embodiment of the present application. Any equivalent structure or equivalent flow conversion made by using the content of the specification and drawings of the embodiment of the present application, or directly or indirectly applied in other related technical fields, is also included in the patent protection range supported by the embodiment of the present application.

Claims

1. A power board layout structure comprising a power board, characterized in that, the power board comprises a low-voltage side power board and a high-voltage side power board, the low-voltage side power board is provided with a low-voltage side terminal, the high-voltage side power board is provided with a high-voltage side terminal, and the low-voltage side power board and the high-voltage side power board have a gap for a transformer lead-through line to pass through.

2. The power panel layout of claim 1, wherein, The low-voltage side power board further comprises a Hall sensor and a Mos drive optocoupler circuit, the Hall sensor is located on one side of the front face of the low-voltage side power board, and the Mos drive optocoupler circuit is arranged side by side on the front face of the low-voltage side power board.

3. The power panel layout of claim 1 or 2, wherein, The high-voltage side power board further comprises a bus capacitor, a battery high-voltage side igbt and an LLC resonance capacitor, the bus capacitor is arranged in multiple rows and multiple columns on one side of the front face of the high-voltage side power board, and the battery high-voltage side igbt and the LLC resonance capacitor are arranged on one side of the front face of the high-voltage side power board.

4. A transformer mounting structure characterized by A transformer and a power board layout structure according to any one of claims 1-3, wherein the transformer is mounted on the back side of the low-voltage side power board and the high-voltage side power board.

5. The transformer mounting structure according to claim 4, wherein The transformer comprises a transformer body and a lead-through line connected to the transformer body, the transformer body is arranged on the back face of the low-voltage side power board and the high-voltage side power board, the lead-through line passes through the gap to the front face of the low-voltage side power board and the high-voltage side power board and is electrically connected to the low-voltage side power board and the high-voltage side power board.

6. The transformer mounting structure according to claim 5, wherein The low-voltage side power board and the high-voltage side power board are provided with a heat sink on the back face, and the transformer is mounted on the heat sink.

7. The transformer mounting structure according to claim 6, wherein The low-voltage side power board and the high-voltage side power board are mounted on the back face of the heat sink through surface mounting nut columns.

8. The transformer mounting structure of claim 7, wherein The transformer comprises a plurality of transformers, the high-voltage sides of the plurality of transformers are connected in series, and the high-voltage side lead-through line of one of the transformers is connected to the high-voltage side terminal; the low-voltage sides of the plurality of transformers are respectively connected to the low-voltage side terminal through separate low-voltage side lead-through lines.

9. The transformer mounting structure of claim 8, wherein The heat sink comprises a bottom plate and heat dissipation fins arranged on the bottom plate, the heat sink is provided with a transformer mounting position corresponding to the gap between the low-voltage side power board and the high-voltage side power board, and the transformer is mounted in the transformer mounting position.

10. Inverter, comprising a transformer, characterized in that The transformer adopts the transformer mounting structure according to any one of claims 4-9.