Chip heat dissipation structure on audio equipment

Abstract

The utility model relates to the field of audio equipment, in particular to a chip radiating structure on audio equipment, which comprises a main circuit board and an auxiliary circuit board with a chip, at least one radiator is arranged on the top surface of the main circuit board, the auxiliary circuit board is arranged below the main circuit board, and the chip radiating structure is characterized by further comprising a heat conducting column. The main circuit board is provided with a vertically-penetrating through hole, one end of the heat conduction column is connected with the auxiliary circuit board, and the other end of the heat conduction column penetrates through the through hole and then is arranged beside the radiator or on the radiator. According to the utility model, not only can the normal heat dissipation requirement of the chip on the auxiliary circuit board be met, but also the use of the radiator on the circuit structure can be reduced, so that the purpose of reducing the overall volume can be achieved, a large-volume shell and a large heat dissipation fan are not required, and the heat dissipation fans are not required to be respectively arranged; the manufacturing difficulty and the manufacturing cost of the audio equipment can be greatly reduced, and the audio equipment has very high reliability and applicability.

Description

TECHNICAL FIELD

[0001] The utility model relates to audio equipment field, especially a chip heat dissipation structure on audio equipment. BACKGROUND

[0002] At present, several chips are generally installed on the top surface of the main circuit board of the audio equipment (for example: power amplifier, multimedia machine, sound equipment, etc.), wherein in order to avoid the interference of other chips on the individual chip during work, the structure that the chip and the related circuit thereof are separately arranged on a sub-circuit board and the sub-circuit board is arranged below the main circuit board appears. Since there are still many chips on the top surface of the main circuit board, and a large amount of heat is generated during the work of the chip, at least one heat sink is arranged on the top surface of the main circuit board. Since the chip on the sub-circuit board also needs to be cooled by the heat sink, the heat sink is also arranged on the sub-circuit board. Among them, in order to make the heat sink have good heat dissipation effect, the heat sink is mostly made of profile structure with large height and several cooling fins at present, so that the heat sink occupies a large installation space, and in addition, the heat sink is arranged above and below the main circuit board, so that the audio equipment needs to adopt a large-size shell to meet the installation; and in order to make the heat sinks on the main circuit board and the sub-circuit board be affected by the cooling fan, a large cooling fan or separate cooling fans need to be used; thus, the audio equipment has the problems of large manufacturing difficulty and high manufacturing cost. Therefore, it is necessary to design a chip heat dissipation structure on the audio equipment to solve the above technical problems. SUMMARY

[0003] The utility model aims at solving the above problems and deficiencies, and provides a chip heat dissipation structure on audio equipment, which can not only meet the normal heat dissipation demand of the chip on the sub-circuit board, but also be beneficial to reducing the use of heat sinks on such circuit structure, so as to reduce the overall size, without using a large-size shell, a large cooling fan and separate cooling fans, which can greatly reduce the manufacturing difficulty and manufacturing cost of the audio equipment, and have high reliability and applicability.

[0004] The technical scheme of the utility model is as follows:

[0005] A chip heat dissipation structure on audio equipment, comprising a main circuit board and a sub-circuit board with a chip, at least one heat sink is arranged on the top surface of the main circuit board, the sub-circuit board is arranged below the main circuit board, and the chip heat dissipation structure further comprises a heat conduction column, a vertical through hole is formed in the main circuit board, one end of the heat conduction column is connected with the sub-circuit board, and the other end of the heat conduction column is arranged beside the heat sink or on the heat sink after passing through the through hole.

[0006] Preferably, the heat conduction column is a copper column.

[0007] Preferably, at least one heat dissipation ring groove is formed on the outer circumferential surface of the heat conduction column, and the heat dissipation ring groove is located on the end of the heat conduction column penetrating through the main circuit board.

[0008] Preferably, an annular heat insulation gap is reserved between the hole wall of the through hole and the outer circumferential surface of the heat conduction column.

[0009] Preferably, the chip is arranged on the bottom surface of the auxiliary circuit board, and the heat conduction column is vertically arranged on the auxiliary circuit board and located directly above the chip.

[0010] Preferably, one end of the heat conduction column abuts against the chip after penetrating through the auxiliary circuit board.

[0011] Preferably, two insulating bosses are arranged on the bottom surface of the main circuit board, input pins and output pins are respectively arranged on the bottom surfaces of the two insulating bosses, and the auxiliary circuit board is respectively lapped on the two insulating bosses, and the input pins and the output pins are respectively inserted into the input end and the output end of the auxiliary circuit board.

[0012] Preferably, the two insulating bosses are respectively located on the two sides of the through hole.

[0013] Preferably, the heat dissipation device has at least two, and a flow channel for passing cooling air is reserved between adjacent heat dissipation devices, and the other end of the heat conduction column is arranged in the flow channel.

[0014] The chip heat dissipation structure of the audio device has the heat conduction column on the chip heat dissipation structure, the heat conduction column is arranged on the auxiliary circuit board, and the heat conduction column is arranged on the side of the heat dissipation device or on the heat dissipation device after penetrating through the through hole on the main circuit board. The heat conduction column can conduct the heat generated by the chip on the auxiliary circuit board to the side of the heat dissipation device or the heat dissipation device, so that the chip on the auxiliary circuit board can be cooled by the cooling fan matched with the heat dissipation device and / or by the heat dissipation device. This not only meets the normal heat dissipation demand of the chip on the auxiliary circuit board, but also does not need to arrange the heat dissipation device on the auxiliary circuit board, which can reduce the use of the heat dissipation device on the circuit structure, thereby reducing the overall volume, without using a large volume shell, using a large cooling fan and arranging a cooling fan respectively, which can greatly reduce the manufacturing difficulty and manufacturing cost of the audio device. Therefore, the chip heat dissipation structure of the audio device has very high reliability and applicability. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a structural schematic view of the chip heat dissipation structure in the utility model.

[0016] Figure 2 It is a structural schematic view of the main circuit board and the heat dissipation device in the utility model.

[0017] Figure 3 It is the structure schematic view of the installation state of the heat conduction column not penetrating the auxiliary circuit board in the utility model.

[0018] Figure 4 It is the structure schematic view of the installation state of the heat conduction column not penetrating the auxiliary circuit board in the utility model. DETAILED DESCRIPTION

[0019] As Figure 1 With Figure 2 The utility model discloses a chip heat dissipation structure on audio equipment, including main circuit board 1, the auxiliary circuit board 2 of chip 21, be provided with at least one radiator 3 on the top surface of main circuit board 1, the auxiliary circuit board 2 is arranged below main circuit board 1, to realize the invention purpose of the utility model, still include heat conduction column 4, the vertical through perforation 11 that is set up on main circuit board 1, one end of heat conduction column 4 meets with auxiliary circuit board 2, the other end of heat conduction column 4 is placed on the side of radiator 3 or on radiator 3 after passing through perforation 11.

[0020] There is heat conduction column 4 on the chip heat dissipation structure on audio equipment, and heat conduction column 4 is arranged on auxiliary circuit board 2, also make heat conduction column 4 pass through the perforation 11 on main circuit board 1 and be placed on the side of radiator 3 or on radiator 3.This can utilize heat conduction column 4 to conduct the heat generated by chip 21 on auxiliary circuit board 2 to the side of radiator 3 or on radiator 3, so that chip 21 on auxiliary circuit board 2 can utilize the heat dissipation fan matched with radiator 3 to dissipate heat and / or utilize radiator 3 to dissipate heat.This not only can satisfy the normal heat dissipation demand of chip 21 on auxiliary circuit board 2, also need not set up radiator 3 on auxiliary circuit board 2, this can benefit to reduce the use of radiator on this kind of circuit structure, this can play the purpose of reducing the overall volume, need not adopt large volume shell, adopt large heat dissipation fan and set up heat dissipation fan respectively, its can benefit to greatly reduce the manufacturing difficulty and manufacturing cost of audio equipment.Therefore, the chip heat dissipation structure on audio equipment can have very high reliability and applicability.

[0021] The radiator 3 can be used for the chip on main circuit board 1 to stick, so that the chip on main circuit board 1 can be very well heat dissipated.In actual manufacturing, heat conduction column 4 is spaced apart from the chip on main circuit board 1, which can avoid the heat on heat conduction column 4 from affecting the use performance of the chip on main circuit board 1, thereby very well meeting the actual use demand.

[0022] The heat conduction column 4 is a copper column.This can make heat conduction column 4 have very good heat conduction performance, thereby helping to further improve the reliability and applicability of the chip heat dissipation structure.

[0023] As Figure 1 , Figure 3 WithFigure 4 As shown, at least one heat dissipation groove 41 is formed on the outer circumferential surface of the heat-conducting pillar 4, and the heat dissipation groove 41 is located at the end of the heat-conducting pillar 4 that passes through the main circuit board 1. The heat dissipation groove 41 increases the heat dissipation area on the heat-conducting pillar 4, so that when the airflow generated by the heat dissipation fan used with the heat sink 3 acts on the heat-conducting pillar 4, it will have a better heat dissipation effect, which will help to further improve the reliability and applicability of the chip heat dissipation structure.

[0024] like Figure 1 As shown, an annular heat insulation gap 12 is reserved between the hole wall of the perforation 11 and the outer circumferential surface of the heat-conducting pillar 4. This prevents the heat-conducting pillar 4 from conducting heat to the main circuit board 1, thereby preventing heat from affecting the performance of related electronic components on the main circuit board 1, and further improving the applicability of the chip heat dissipation structure.

[0025] like Figure 3 and Figure 4 As shown, the chip 21 is disposed on the bottom surface of the sub-circuit board 2, and the heat-conducting pillar 4 is vertically disposed on the sub-circuit board 2, with the heat-conducting pillar 4 positioned directly above the chip 21. This not only facilitates the installation and positioning of the heat-conducting pillar 4 and the chip 21 on the sub-circuit board 2, but also allows the heat generated by the chip 21 to be conducted to the heat-conducting pillar 4 very efficiently, thereby improving the heat dissipation effect of the chip 21 and further enhancing the reliability and applicability of the chip heat dissipation structure.

[0026] like Figure 3 As shown, one end of the heat-conducting pillar 4 passes through the sub-circuit board 2 and abuts against the chip 21. In this way, the heat generated by the chip 21 can be directly conducted to the heat-conducting pillar 4, which can more directly and quickly remove the heat generated by the chip 21, thereby helping to further improve the heat dissipation performance of the chip 21, and further improving the reliability and applicability of the chip heat dissipation structure.

[0027] The heat-conducting column 4 can be stably installed on the sub-circuit board 2 by tightly embedding it in the sub-circuit board 2 and bonding it with insulating adhesive, thus meeting normal manufacturing and usage requirements.

[0028] like Figure 1 and Figure 2As shown, the bottom surface of the main circuit board 1 is provided with two insulating bosses 13, the bottom surface of each of the two insulating bosses 13 is provided with an input pin 14 and an output pin 15, the two ends of the secondary circuit board 2 are respectively overlapped on the two insulating bosses 13, and the input pin 14 and the output pin 15 are respectively inserted into the input end and the output end of the secondary circuit board 2. This not only can conveniently and quickly install the secondary circuit board 2 on the main circuit board 1, but also can avoid the adverse effects between the secondary circuit board 2 and the main circuit board 1, and can make the overall structure of the chip heat dissipation structure more stable and reliable, which is helpful to further improve the reliability and applicability of the chip heat dissipation structure. And this can realize quick and stable connection through the input pin 14 and the output pin 15 when the secondary circuit board 2 and the main circuit board 1 need to be electrically connected.

[0029] The two insulating bosses 13 are insulating plastic bosses, and the input pins 14 and the output pins 15 on the two insulating bosses 13 are several. Each input pin 14 and each output pin 15 vertically penetrates the secondary circuit board 2 and is fixed on the corresponding input end and output end of the secondary circuit board 2 by soldering. This can meet the actual manufacturing and use requirements.

[0030] As shown in Figure 2 The two insulating bosses 13 are respectively located on the two sides of the through hole 11. This can better position the heat conduction column 4, thereby further improving the stability and reliability of the chip heat dissipation structure.

[0031] As shown in Figure 1 And Figure 2 The heat dissipation structure comprises at least two heat sinks 3, and a flow passage 16 for the heat dissipation wind is reserved between adjacent heat sinks 3, and the other end of the heat conduction column 4 is arranged in the flow passage 16. The heat dissipation wind is provided by a heat dissipation fan (not shown in the figure, the heat dissipation fan is arranged in Figure 1 And Figure 2 The front or rear of the heat sink 3, and the heat dissipation wind flows in the front-rear direction), and the heat conduction column 4 is arranged in the flow passage 16. This can make full use of the heat dissipation fan to dissipate heat, thereby further improving the heat dissipation performance.

Claims

1. A chip heat dissipation structure on an audio device, comprising a main circuit board (1), a sub-circuit board (2) with a chip (21), at least one heat sink (3) is arranged on the top surface of the main circuit board (1), and the sub-circuit board (2) is arranged below the main circuit board (1), characterized in that: Further comprising a heat-conducting column (4), a vertical through hole (11) is formed on the main circuit board (1), one end of the heat-conducting column (4) is connected with the sub-circuit board (2), and the other end of the heat-conducting column (4) is placed beside or on the heat sink (3) after passing through the through hole (11).

2. The chip heat dissipation structure on the audio device according to claim 1, wherein: The heat-conducting column (4) is a copper column.

3. The chip heat dissipation structure on the audio device according to claim 1 or 2, characterized in that: At least one heat-dissipating ring groove (41) is formed on the outer circumferential surface of the heat-conducting column (4), and the heat-dissipating ring groove (41) is located on the end of the heat-conducting column (4) passing through the main circuit board (1).

4. The chip heat dissipation structure on the audio device of claim 1, wherein: An annular heat-insulating gap (12) is reserved between the hole wall of the through hole (11) and the outer circumferential surface of the heat-conducting column (4).

5. The chip heat dissipation structure on the audio device according to claim 1, wherein: The chip (21) is arranged on the bottom surface of the sub-circuit board (2), and the heat-conducting column (4) is vertically arranged on the sub-circuit board (2) and located directly above the chip (21).

6. The chip heat dissipation structure on the audio device according to claim 1, wherein: One end of the heat-conducting column (4) is abutted against the chip (21) after passing through the sub-circuit board (2).

7. The chip heat dissipation structure on the audio device according to claim 1, wherein: Two insulating bosses (13) are arranged on the bottom surface of the main circuit board (1), input pins (14) and output pins (15) are respectively arranged on the bottom surfaces of the two insulating bosses (13), and the two ends of the sub-circuit board (2) are respectively overlapped on the two insulating bosses (13), and the input pins (14) and the output pins (15) are respectively inserted into the input end and the output end of the sub-circuit board (2).

8. The chip heat dissipation structure on the audio device according to claim 7, characterized in that: The two insulating bosses (13) are respectively located on the two sides of the through hole (11).

9. The chip heat dissipation structure on the audio device of claim 1, wherein: The heat sink (3) is at least two, and a flow passage (16) for passing cooling air is reserved between adjacent heat sinks (3), and the other end of the heat-conducting column (4) is placed in the flow passage (16).

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