Novel LED lamp with high color rendering index

Abstract

The utility model discloses a novel LED lamp with a high color rendering index, which comprises an LED mounting support, a filling area is arranged at the bottom of the LED mounting support, a mounting groove is arranged on the inner wall of the filling area, a light-emitting diode wafer is mounted on the inner wall of the mounting groove, and two leads are connected onto the light-emitting diode wafer. According to the utility model, the red fluorescent light with poor temperature resistance is close to the light-emitting diode wafer inside, so that the heat conduction of the wafer is conveniently realized, the heat attenuation of the first fluorescent glue inside is greatly reduced, and after the light-emitting diode wafer generates blue light, the red powder is excited once by the blue light, but the blue light cannot be completely absorbed, so that the light-emitting diode wafer can emit blue light. When the red powder is covered with the yellow powder, redundant blue light continues to be projected out through gaps of the red powder, the projected blue light is absorbed again by the covered yellow powder, the problem of temperature difference resistance of the red powder is solved, the absorptivity is improved, the absorptivity of the blue light in the light source is greatly improved, high-conversion white light is obtained through high absorption, and then the lighting effect is high.

Description

TECHNICAL FIELD

[0001] The utility model relates to LED lamp technical field, concretely relates to a novel high display index LED lamp. BACKGROUND

[0002] The existing 3030 high display index LED is composed of a wire guide frame, gold wire, light emitting diode wafer and fluorescent glue, wherein the fluorescent glue is red and yellow powder mixed together and dispensing.

[0003] The 3030 high display index LED product has always existed the problems of large red powder attenuation, low light efficiency and continuous improvement in the industry, therefore, the professional personnel in the field provides a novel high display index LED lamp to solve the above-mentioned problems. CONTENT OF THE UTILITY MODEL

[0004] In view of the problems in the prior art, the utility model aims at providing a novel high display index LED lamp, solves the problem of red powder temperature difference, improves the blue light absorption rate in the light source, can absorb high conversion white light, and has the advantages of high light efficiency.

[0005] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme:

[0006] A novel high display index LED lamp, comprising an LED mounting bracket, the bottom of the LED mounting bracket is provided with a filling area, an installation groove is formed in the inner wall of the filling area, a light emitting diode wafer is mounted on the inner wall of the installation groove, two wires are connected to the light emitting diode wafer, the inside of the installation groove is filled with first fluorescent glue, and the filling area is filled with second fluorescent glue.

[0007] As a further description of the above technical scheme, the wire is a metal wire for connecting the light emitting diode wafer.

[0008] As a further description of the above technical scheme, the first fluorescent glue is red fluorescent glue, and the second fluorescent glue is yellow fluorescent glue.

[0009] As a further description of the above technical scheme, the LED mounting bracket is detachably connected with an assembly plate, and the assembly plate is provided with a mounting hole.

[0010] Compared with the prior art, the utility model has the advantages of:

[0011] The utility model discloses a kind of novel high-luminance LED lamps, including LED mounting bracket 1, the bottom of LED mounting bracket 1 is provided with filling area 2, installation groove 3 is set on the inner wall of filling area 2, and light-emitting diode chip 4 is installed on the inner wall of installation groove 3, two wires 5 are connected on light-emitting diode chip 4, first fluorescent glue 6 is filled in the inside of installation groove 3, and second fluorescent glue 7 is filled in filling area 2.

[0012] And improve the absorption rate, the blue light absorption rate in light source is greatly improved, high absorption obtains high conversion white light, and then the light efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is the three-dimensional structure schematic diagram of the utility model;

[0014] Figure 2 It is the bottom structure schematic diagram of the utility model.

[0015] Mark explanation in drawing:

[0016] 1, LED mounting bracket;2, filling area;3, installation groove;4, light-emitting diode chip;5, wire;6, first fluorescent glue;7, second fluorescent glue;8, assembly plate. DETAILED DESCRIPTION

[0017] The technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model.

[0018] Please refer to Figure 1 With 2 The utility model discloses a kind of novel high-luminance LED lamps, including LED mounting bracket 1, the bottom of LED mounting bracket 1 is provided with filling area 2, installation groove 3 is set on the inner wall of filling area 2, and light-emitting diode chip 4 is installed on the inner wall of installation groove 3, two wires 5 are connected on light-emitting diode chip 4, first fluorescent glue 6 is filled in the inside of installation groove 3, and second fluorescent glue 7 is filled in filling area 2.

[0019] First fluorescent glue 6 is red fluorescent glue, and second fluorescent glue 7 is yellow fluorescent glue.

[0020] In the process of processing assembly, the mounting groove 3 is opened in the LED mounting support 1 for installing the light emitting diode wafer 4, the wafer is fixed inside the mounting groove 3, the red and yellow powders are not mixed, the first red fluorescent glue 6 is filled in the mounting groove 3, after centrifugation, baking and solidification, the second yellow fluorescent glue 7 is taken out and filled in the filling area 2, after centrifugation, high-temperature baking and complete solidification, the poor temperature resistance of the red fluorescent light is close to the inside of the light emitting diode wafer 4, so that the heat conduction of the wafer is facilitated, and the heat loss of the first fluorescent glue 6 in the inside is greatly reduced, after the light emitting diode wafer 4 generates blue light, the red powder is excited by the blue light once, but the blue light cannot be completely absorbed, and the excess blue light can continue to be projected through the gap of the red powder, the projected blue light is absorbed by the covered yellow powder again, so that the blue light absorption rate in the light source is greatly improved, high absorption obtains high conversion white light, and the light efficiency is high.

[0021] In the utility model, through filling the first fluorescent glue 6 and the second fluorescent glue 7 respectively, the poor temperature resistance of the red fluorescent light is close to the inside of the light emitting diode wafer 4, so that the heat conduction of the wafer is facilitated, and the heat loss of the first fluorescent glue 6 in the inside is greatly reduced, after the light emitting diode wafer 4 generates blue light, the red powder is excited by the blue light once, but the blue light cannot be completely absorbed, and the excess blue light can continue to be projected through the gap of the red powder, the projected blue light is absorbed by the covered yellow powder again, the problem of the poor temperature resistance of the red powder is solved, the absorption rate is improved, the blue light absorption rate in the light source is greatly improved, high absorption obtains high conversion white light, and the light efficiency is high.

[0022] Please refer to Figure 2 Wherein: the wire 5 is a metal wire 5 for connecting the light emitting diode wafer 4.

[0023] In the utility model, the gold wire connects the electrode of the light emitting diode wafer 4 and the external circuit, so that the current can flow into the wafer, thereby activating the LED light emission, gold is a kind of metal with very stable chemical properties, not easy to oxidize, so in the environment of high temperature and high humidity, gold wire can maintain good electrical performance and mechanical strength, and gold wire is easy to weld.

[0024] Please refer to Figure 1 And 2 Wherein: the assembly plate 8 is detachably connected on the LED mounting support 1, and the mounting hole is formed in the assembly plate 8.

[0025] In the utility model, the assembly plate 8 at the top of the LED mounting support 1 can realize the subsequent rapid installation of the LED lamp group by the mounting hole.

[0026] The above merely describes a preferred embodiment of the present application; the scope of protection of the present application is not limited thereto. Any skilled person in the art, according to the technical scheme and improvement concept of the present application, makes equivalent replacement or change within the technical range disclosed by the present application, which should be covered in the scope of protection of the present application.

Claims

1. A new high-illuminance LED lamp comprising an LED mounting bracket (1), characterized in that: The bottom of the LED mounting support (1) is provided with a filling area (2), an installation groove (3) is formed in the inner wall of the filling area (2), a light emitting diode wafer (4) is mounted on the inner wall of the installation groove (3), two wires (5) are connected to the light emitting diode wafer (4), the inside of the installation groove (3) is filled with first fluorescent glue (6), the filling area (2) is filled with second fluorescent glue (7), the first fluorescent glue (6) is red fluorescent glue, and the second fluorescent glue (7) is yellow fluorescent glue.

2. A new high-visibility LED lamp according to claim 1, characterized in that: The wire (5) is a metal wire (5) for connecting the light emitting diode wafer (4).

3. A new high-visibility LED lamp according to claim 1, characterized in that: The LED mounting support (1) is detachably connected with an assembly plate (8), and the assembly plate (8) is provided with a mounting hole.

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