High-speed optocoupler lead frame

Abstract

The utility model relates to the technical field of high-speed optocoupler lead frames, in particular to a high-speed optocoupler lead frame. The length of the gold wire is reduced through the arranged extension part, on one hand, the probability that the gold wire is broken after welding due to the fact that the gold wire is too long can be reduced, and on the other hand, the production cost is reduced, and the second output pin with a small part of area is provided with a special bonding process pressing part, namely the pressing part; the second output pins can be guaranteed not to shake during wire welding so as to improve the wire welding quality, through holes are formed in the first output pins and the second output pins, and after the through holes are filled with solidified packaging bodies, further positioning and fixing of the first output pins and the second output pins can be achieved; the problems that due to the fact that the connecting portion of the GND pin and the base island of an existing high-speed optocoupler lead frame supporting base island is too long, shaking is likely to happen in the packaging process, so that a gold wire is disconnected and fails, or dark cracks are caused and cannot be screened to a client side, and product failure is caused through reflow soldering are solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to high -speed optical coupling lead frame technical field, concretely is a high -speed optical coupling lead frame. BACKGROUND

[0002] The traditional high -speed optical coupling lead design is connected with the support base island because of GND pin, in order to prevent chip VCC electrode and VCC pin and VE electrode and VE pin too far, the bonding gold wire makes its conducting line arc too long and causes quality hidden danger, and the conductive gold wire is too long and causes cost increase, in the existing high -speed optical coupling lead frame, the base island needs to be set in the product center, because the GND pin of the support base island of the existing high -speed optical coupling lead frame and the base island connection part are too long, easy to shake in the packaging process and cause gold wire breakage failure, or cause dark crack and cannot be screened to the client through reflow soldering and cause product failure and other problems. SUMMARY

[0003] In view of the defects of the prior art, the utility model provides a high -speed optical coupling lead frame, solves the problem that the GND pin of the support base island of the existing high -speed optical coupling lead frame and the base island connection part are too long, easy to shake in the packaging process and cause gold wire breakage failure, or cause dark crack and cannot be screened to the client through reflow soldering and cause product failure and other problems.

[0004] To achieve the above object, the utility model provides the following technical scheme:

[0005] A high -speed optical coupling lead frame, including the IR support and IP support of mutual superposition setting,

[0006] The IR support includes two first frames that are symmetrically arranged, a plurality of first vertical ribs are arranged between the two first frames, a plurality of groups of IR input pins for setting LED are arranged on the first vertical rib;

[0007] The IP support includes two second frames that are symmetrically arranged, a plurality of second vertical ribs are arranged between the two second frames, a plurality of groups of IP output pins are arranged on the second vertical rib, a first output pin for setting photosensitive chip is arranged in each group of IP output pins, a second output pin for being connected with the photosensitive chip is arranged in each group of IP output pins, and an extension part extending to the first output pin is arranged on the second output pin.

[0008] As preferred, the extension part is L-shaped.

[0009] As preferred, a plurality of the extension parts are provided with pressing parts in the direction away from the photosensitive element.

[0010] As preferred, the base island of the first output pin is provided with a cuttable extension rib connected with a plurality of second output pins.

[0011] As a preference, the extension rib is provided with a cut-off portion having a width smaller than the extension rib.

[0012] As a preference, the first output pins and the second output pins are provided with through holes.

[0013] Compared with the prior art, the high-speed optocoupler lead frame has the following advantages

[0014] Beneficial effects:

[0015] 1. The extension part can reduce the length of the gold wire during the welding process, which can reduce the probability of gold wire breakage after welding due to the excessive length of the gold wire, and reduce the production cost.

[0016] 2. The second output pin is provided with a special bonding process pressing part, i.e. a pressing part, in a part of the area, and the pressing part is pressed by the equipment parts during the welding process, and then the welding is performed, so that the second output pin can be prevented from shaking during the welding process, thereby improving the stability of the welding.

[0017] 3. The first output pin and the second output pin are provided with through holes, and the solidified packaging body is filled into the through hole, so that the first output pin and the second output pin can be further positioned, and the stability of the position of the first output pin and the second output pin after packaging is improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] The drawings described herein are used to provide further understanding of the present application, and form a part of the present application. The schematic embodiments of the present application and the description thereof are used to explain the present application, and do not constitute an improper limitation on the present application. In the drawings:

[0019] Figure 1 It is a schematic diagram of the IR support of the present application;

[0020] Figure 2 It is a schematic diagram of the IP support of the present application Figure 1 It is an enlarged view of A in the present application;

[0021] Figure 3 It is a schematic diagram of the IP support of the present application;

[0022] Figure 4 It is a schematic diagram of the IP support of the present application Figure 3

[0023] ​In the figure: 1, IR support; 11, first frame; 12, first vertical rib; 13, IR input pin; 2, IP support; 21, second frame; 22, second vertical rib; 23, IP output pin; 231, first output pin; 232, second output pin; 233, extension; 234, pressing part; 24, extension rib; 25, cutting part; 26, through hole. DETAILED DESCRIPTION

[0024] The embodiments of the present application will be described in detail below with the accompanying drawings and examples, so that the realization process of how to apply technical means to solve technical problems and achieve technical effects of the present application can be fully understood and implemented.

[0025] In order to solve the problem that the GND pin of the existing high-speed optocoupler lead frame support base island is too long to connect with the base island, which is easy to shake during packaging process, causing the gold wire to be disconnected and invalid, or causing dark cracks that cannot be screened by the customer through reflow soldering to cause product failure, etc., the utility model provides a high-speed optocoupler lead frame, as shown in the figure, the distance between the pin and the base island part is reduced, thereby avoiding the probability of gold wire breakage in the processing process due to the length of the gold wire, comprising an IR support 1 and an IP support 2 arranged on each other, the IR support 1 comprises two first frames 11 arranged symmetrically, a plurality of first vertical ribs 12 are arranged between the two first frames 11, a plurality of groups of IR input pins 13 for setting LED are arranged on the first vertical ribs 12, and the base island with LED installed is generally arranged on the IR input pin 13 in the middle; Figures 1-4

[0026] The IP support 2 comprises two second frames 21 arranged symmetrically, a plurality of second vertical ribs 22 are arranged between the two second frames 21, a plurality of groups of IP output pins 23 are arranged on the second vertical ribs 22, the first output pin 231 for setting the photosensitive chip is arranged in each group of IP output pins 23, the base island located in the middle part of the optocoupler is also arranged on the first output pin 231, the second output pin 232 for connecting with the photosensitive chip is arranged in each group of IP output pins 23, the extension 233 extending to the first output pin 231 is arranged on the second output pin 232, the subsequent gold wire does not need to be welded on the second output pin 232, but welded on the extension 223 which is closer, thereby reducing the length of the gold wire, reducing the probability of breakage of the gold wire due to its length, and reducing the production cost.

[0027] In order to reduce the processing difficulty of the extension 233 and the processing difficulty of the related stamping parts, the extension 233 is in L shape.

[0028] ​The second output pin 232 is pressed in the bonding process, and is unstable and shakes, which causes the problems of poor bonding and false welding.

[0029] In order to improve the stability of the base island on the first output pin 231, the cuttable extension rib 24 connected with the second output pin 232 is arranged on the base island of the first output pin 231, the die bonding and wire bonding processes are completed first, the die bonding and wire bonding quality is improved, and then the extension rib 24 is cut after the die bonding and wire bonding processes.

[0030] In order to facilitate the cutting of the extension rib 24, and at the same time, the part remaining in the subsequent package after the extension rib 24 is cut can assist in improving the stability of the base island on the first output pin 231 under the action of the solidified package, the cut part 25 with a width smaller than that of the extension rib 24 is arranged on the extension rib 24.

[0031] In order to further improve the stability of the position of the first output pin 231 and the second output pin 232 after packaging, prevent the abnormal situation of broken wire caused by shaking and sliding of the first output pin 231 and the second output pin 232 after being made into a finished product light coupling, a plurality of through holes 26 are arranged on the first output pin 231 and the second output pin 232, and after the solidified package is filled into the through hole 26, the first output pin 231 and the second output pin 232 can be further positioned.

[0032] It should be noted that in this text, relational terms such as first and second are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment.

[0033] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A high-speed optocoupler lead frame, comprising an IR bracket (1) and an IP bracket (2) stacked on top of each other, characterized in that, The IR bracket (1) includes two symmetrically arranged first frame (11), and a number of first vertical ribs (12) are arranged between the two first frame (11). A number of sets of IR input pins (13) for setting LEDs are arranged on the first vertical ribs (12). The IP bracket (2) includes two symmetrically arranged second side frames (21), and a plurality of second vertical ribs (22) are arranged between the two second side frames (21). A plurality of sets of IP output pins (23) are arranged on the second vertical ribs (22). Each set of IP output pins (23) is provided with a first output pin (231) for setting a photosensitive chip. Each set of IP output pins (23) is provided with a second output pin (232) for connecting to the photosensitive chip. An extension (233) extending to the first output pin (231) is provided on the second output pin (232).

2. The high-speed optocoupler lead frame according to claim 1, characterized in that, The extension (233) is L-shaped.

3. A high-speed optocoupler lead frame according to claim 1, characterized in that, A pressing portion (234) is provided on several of the extension portions (233) in a direction away from the photosensitive element.

4. A high-speed optocoupler lead frame according to claim 1, characterized in that, The base island of the first output pin (231) is provided with a cut-off extension rib (24) that is connected to a plurality of second output pins (232).

5. A high-speed optocoupler lead frame according to claim 4, characterized in that, The extension rib (24) is provided with a cut-off portion (25) with a width smaller than that of the extension rib (24).

6. A high-speed optocoupler lead frame according to claim 1, characterized in that, A plurality of through holes (26) are provided on a plurality of first output pins (231) and a plurality of second output pins (232).

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