A stepped high-power-density solid-state relay structure and its assembly method

Abstract

This invention discloses a stepped high-power-density solid-state relay structure and its assembly method. The relay structure includes a control component, a power component, and a cover plate. The power component includes a two-channel DC structure, a two-channel bidirectional structure, and a four-channel combined structure, all composed of a ceramic housing, a light-emitting diode chip, and a power chip. The ceramic housing has a cavity, and the interior of the cavity is divided into a first step, a second step, and a third step from bottom to top. The light-emitting diode chip is disposed on the first step. The front of the control component is bonded to the interior of the power component, and the back of the control component is electrically connected to the interior of the power component, forming an assembly. The assembly is hermetically sealed to the cover plate. The assembly method includes the following steps: S1: control component assembly; S2: power component assembly; S3: assembly of the assembly; S4: finished product assembly and sealing. This application achieves a compact assembly of the control component and the power component by adding a compact stepped structure and using a double-sided bonding process, thereby improving the power density of the device.

Description

Technical Field

[0001] This invention belongs to the field of electronic component application technology, specifically relating to a stepped high power density solid-state relay structure and its assembly method. Background Technology

[0002] With the rapid development of the electronics and information industry, electronic components are steadily advancing towards miniaturization and high integration, which has become an inevitable trend in the field of electronic technology. In the field of solid-state relays, in line with this trend, the industry has put forward technical requirements for products to continuously reduce the size of switches and continuously increase the output current, in order to adapt to various miniaturized, high-performance electronic equipment application scenarios.

[0003] However, current solid-state relays generally adopt the traditional planar design, which has gradually shown significant limitations in practical applications. Specifically, the traditional planar design makes it difficult to further improve the power density of solid-state relays, and the bottleneck in increasing power density directly restricts further reduction in product size. As a result, existing solid-state relay products cannot fully meet the market's stringent demands for miniaturization and high integration, becoming a key technical bottleneck hindering the further development of solid-state relay technology. Summary of the Invention

[0004] The purpose of this invention is to address the technical problems described in the background art by providing a stepped high-power-density solid-state relay structure and its assembly method. This relay and its assembly method feature a compact stepped structure and a double-sided bonding process, enabling a compact assembly of control and power components, thus increasing device power density. Physical and optical isolation between circuits is achieved through internal metal partitions in the ceramic substrate and internal cavities in the ceramic housing. Reasonable heat distribution ensures internal thermal balance. Separate electrical and mechanical connections provide a design solution for miniaturization and high-density electronic components, while also improving the reliability of electronic component applications and ensuring overall system performance improvement.

[0005] The technical solution of the present invention: A stepped high-power-density solid-state relay structure includes a control component, a cover plate, and a power component composed of a ceramic tube shell, a light-emitting diode chip, and a power chip. The front of the control component is bonded to the interior of the power component, and the back of the control component is electrically connected to the interior of the power component to form an assembly. The assembly is hermetically sealed to the cover plate. The ceramic tube shell has a cavity, and the interior of the cavity is divided into a first step, a second step, and a third step from bottom to top. The light-emitting diode chip is disposed on the first step, and the power chip is disposed on the second step and the third step, respectively.

[0006] The control components include a two-way control component structure and a four-way control component structure. The two-way control component structure consists of a ceramic substrate and two photovoltaic chips, which are respectively fixedly mounted on the ceramic substrate. The four-way control component structure consists of a ceramic substrate and four photovoltaic chips, which are respectively fixedly mounted on the ceramic substrate. A metal partition is provided on the ceramic substrate, and the photovoltaic chips are separated by the metal partition.

[0007] The power component includes a two-channel DC structure, a two-channel bidirectional structure, and a four-channel combined structure. The power chip includes a first power chip and a second power chip. The two-channel DC structure consists of a light-emitting diode chip, a ceramic housing, and two first power chips, which are respectively disposed on the second and third steps of the ceramic housing. The two-channel bidirectional structure consists of a light-emitting diode chip, a ceramic housing, two first power chips, and two second power chips, which are respectively disposed alternately on the second and third steps. The four-channel combined structure is a repeated combination of the two-channel bidirectional structure and the two-channel DC structure.

[0008] The first combination of the four-way combination structure consists of a light-emitting diode chip, a ceramic tube shell, and eight first power chips, which are respectively arranged on the second and third steps of the ceramic tube shell.

[0009] The second combination of the four-way combination structure consists of a ceramic tube shell, four first power chips and four second power chips. The four first power chips are set on the second step of the ceramic tube shell, and the four second power chips are set on the third step of the ceramic tube shell.

[0010] The front of the control component is bonded to the inside of the power component with insulating adhesive, and the back of the control component is electrically connected to the inside of the power component by bonding.

[0011] The cover plate is a metal cover plate, and the assembly is hermetically sealed to the cover plate using three methods: parallel sealing welding, laser sealing welding, and sintering.

[0012] The ceramic substrate is a substrate made of ceramic material. The ceramic substrate has a front area and a back area that are electrically connected internally. The photovoltaic chip is disposed in the front area.

[0013] An assembly method for a stepped high-power-density solid-state relay structure includes the following steps: S1: Control component assembly: Take a ceramic substrate and a corresponding number of photovoltaic chips, connect the photovoltaic chips and the ceramic substrate by bonding or welding to achieve the connection between the lower electrode of the chip and the ceramic substrate, and achieve the connection between the electrode on the photovoltaic chip and the ceramic substrate by bonding process to obtain the control component; S2: Power component assembly: Take LED chips, a corresponding number of power chips and ceramic housings. Connect the LED chips and corresponding power chips to the ceramic housing by bonding or welding. Achieve electrical connection through bonding process to obtain power components. S3: Assembly of components: Take the corresponding structural control components and the corresponding structural power components, mechanically connect the front of the control components to the inside of the power components with insulating glue, and electrically connect the back of the control components to the inside of the power components with bonding to obtain the assembly; S4: Finished product assembly and sealing: Take the assembly parts and cover plate, put the cover plate on the assembly parts, and use the sealing process to airtightly seal the cover plate and the assembly parts to obtain the finished relay structure.

[0014] In step S4, the cover plate and the assembly are hermetically sealed using parallel sealing welding, laser sealing welding, or sintering processes.

[0015] The beneficial effects of this invention are: The relay structure and assembly method of this application adopt a three-dimensional multi-path approach to increase product installation density. This three-dimensional multi-path scheme enhances power density, thereby enabling high-power-density product design. Products using this solution can achieve a power density of 8000 W / cm². 3 The output current is more than three times that of existing traditional products, and the output current capability is four to ten times that of similar products. This application achieves thermal equilibrium within the product and maximizes internal heat dissipation efficiency by controlling the double-sided bonding process of the components, the compact stepped structure of the ceramic shell, and setting metal partitions on the ceramic substrate.

[0016] Furthermore, by adding a compact stepped structure and using a double-sided bonding process, the control components and power components can be assembled in a compact manner, thereby improving the power density of the device.

[0017] The relay structure product obtained using the solution of this application achieves more than double the power density and more than triple the current output within the same installation area. Under the same current capability, the product volume is reduced by more than 50%. The structure of this application solution has better heat dissipation efficiency and inter-circuit optical isolation, which improves the reliability and lifespan of the product.

[0018] This application's relay structure product uses a two-sided bonding mounting method for the control component and power component, transforming the traditional single-sided bonding mounting structure into a stacked structure, thereby increasing the product's power density. By directly connecting the power device to the ceramic housing, the main heat generation power is directly introduced from inside the ceramic housing to the bottom of the product. The control component isolates the input and output heat generation devices through a metal partition, improving the internal thermal balance of the product while miniaturizing it, achieving the goal of increasing the power density of the traditional ceramic housing. This solves the problem of realizing and improving the reliability of switching or power products under miniaturization and high power density. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the four-way combined relay structure in this invention; Figure 2 In this invention Figure 1 The main view; Figure 3 In this invention Figure 1 Partial sectional view; Figure 4 This is a schematic diagram of the structure of the two-way bidirectional or two-way DC relay in this invention; Figure 5 In this invention Figure 4 The main view; Figure 6 In this invention Figure 4 Partial sectional view; Figure 7 This is a schematic diagram of the assembled structure of the four-way combination structure in this invention; Figure 8 In this invention Figure 7 The main view; Figure 9 This is a schematic diagram of the assembled structure of the two-way bidirectional structure in this invention; Figure 10 In this invention Figure 9 The main view; Figure 11 This is a schematic diagram of the assembled structure of the two DC-DC structure in this invention; Figure 12 In this invention Figure 11 The main view; Figure 13 This is a schematic diagram of the power component assembly structure of the four-way combined structure in this invention; Figure 14 In this invention Figure 13 The main view; Figure 15 This is a schematic diagram of the assembled structure of the two-way bidirectional power component in this invention; Figure 16 In this invention Figure 15The main view; Figure 17 This is a schematic diagram of the power component assembly structure with two DC power channels in this invention; Figure 18 In this invention Figure 17 The main view; Figure 19 This is a schematic diagram of the assembled structure of the four-way control component in this invention; Figure 20 In this invention Figure 19 The main view; Figure 21 In this invention Figure 19 Rear view; Figure 22 This is a schematic diagram of the assembled structure of the two-way control component in this invention; Figure 23 In this invention Figure 22 The main view; Figure 24 In this invention Figure 22 Rear view.

[0020] Reference numerals: 1-Control component, 2-Power component, 3-Assembly, 4-Cover plate, 5-Ceramic housing, 6-Light emitting diode chip, 7-First step, 8-Second step, 9-Third step, 10-Ceramic substrate, 11-Photovoltaic chip, 12-First power chip, 13-Second power chip, 14-Metal partition, 15-Cavity. Detailed Implementation

[0021] refer to Figures 1-24 A stepped high-power-density solid-state relay structure includes a control component 1, a cover plate 4, and a power component 2 composed of a ceramic tube shell 5, a light-emitting diode chip 6, and a power chip. The front of the control component 1 is bonded to the inside of the power component 2, and the back of the control component 1 is electrically connected to the inside of the power component 2 to form an assembly 3. The assembly 3 is hermetically sealed to the cover plate 4. The ceramic tube shell 5 has a cavity 15, which is divided into a first step 7, a second step 8, and a third step 9 from bottom to top. The light-emitting diode chip 6 is disposed on the first step 7, and the power chip is disposed on the second step 8 and the third step 9, respectively.

[0022] The ceramic tube shell 5 is provided with a cavity 15. Inside the cavity 15, from bottom to top, there are a first step 7, a second step 8, and a third step 9. The light-emitting diode chip 6 is disposed on the first step 7, and the power chip is disposed on the second step 8 and the third step 9 respectively. This method, by adding a compact stepped structure and cooperating with double-sided bonding process, enables the control component 1 and the power component 2 to form a compact assembly, thereby improving the power density of the device.

[0023] The control component 1 includes a two-way control component structure and a four-way control component structure. The two-way control component structure consists of a ceramic substrate 10 and two photovoltaic chips 11, which are respectively fixedly mounted on the ceramic substrate 10. The four-way control component structure consists of a ceramic substrate 10 and four photovoltaic chips 11, which are respectively fixedly mounted on the ceramic substrate 10. A metal partition 14 is provided on the ceramic substrate 10, and the photovoltaic chips 11 are separated by the metal partition 14.

[0024] In this application, the concave cavity 15 provided in the ceramic tube shell 5 cooperates with the metal partition 14 provided on the ceramic substrate 10 to achieve physical and optical isolation between the paths, and achieve internal thermal balance of the product through reasonable heat distribution.

[0025] By separating electrical and mechanical connections, design solutions are provided for the miniaturization and high-density of electronic components, while improving the reliability of electronic component applications and ensuring the overall performance improvement of the system.

[0026] The power component 2 includes a two-channel DC structure, a two-channel bidirectional structure, and a four-channel combined structure. The power chips include a first power chip 12 and a second power chip 13. The two-channel DC structure consists of a light-emitting diode chip 6, a ceramic housing 5, and two first power chips 12, which are respectively disposed on the second step 8 and the third step 9 of the ceramic housing 5. The two-channel bidirectional structure consists of a light-emitting diode chip 6, a ceramic housing 5, two first power chips 12, and two second power chips 13, which are respectively disposed crosswise on the second step 8 and the third step 9. The four-channel combined structure is a repeated combination of the two-channel bidirectional structure and the two-channel DC structure.

[0027] The first combination of the four-way combination structure consists of a light-emitting diode chip 6, a ceramic tube shell 5, and eight first power chips 12, which are respectively disposed on the second step 8 and the third step 9 of the ceramic tube shell 5.

[0028] The second combination of the four-way combination structure consists of a ceramic tube shell 5, four first power chips 12 and four second power chips 13. The four first power chips 12 are arranged on the second step 8 of the ceramic tube shell 5, and the four second power chips 13 are arranged on the third step 9 of the ceramic tube shell 5.

[0029] In this application, the ceramic housing 5 can be a dual-path housing, a four-path housing, or a multi-path housing. Its lead wire configuration can be different forms such as QFN, LCC, SMD, DIP, etc., and the lead wire spacing can be 1.27mm, 2.54mm, or other spacing forms.

[0030] The front of the control component 1 is bonded to the inside of the power component 2 with insulating adhesive, and the back of the control component 1 is electrically connected to the inside of the power component 2 by bonding.

[0031] The cover plate 4 is a metal cover plate 4, and the assembly 3 is hermetically sealed to the cover plate 4 in three ways: parallel sealing welding, laser sealing welding and sintering.

[0032] The ceramic substrate 10 is a substrate made of ceramic material. The ceramic substrate 10 has a front area and a back area that are electrically connected internally. The photovoltaic chip 11 is disposed in the front area.

[0033] An assembly method for a stepped high-power-density solid-state relay structure includes the following steps: S1: Control component assembly: Take a ceramic substrate 10 and a corresponding number of photovoltaic chips 11, and connect the lower electrode of the photovoltaic chip 11 to the ceramic substrate 10 by bonding or welding. Connect the electrode on the photovoltaic chip 11 to the ceramic substrate 10 through a bonding process to obtain the control component 1. S2: Power component assembly: Take LED chip 6, a corresponding number of power chips and ceramic housing 5, connect the LED chip 6 and the corresponding power chips to the ceramic housing 5 by bonding or welding, and achieve electrical connection by bonding process to obtain power component 2. S3: Assembly of components: Take the corresponding structural control component 1 and the corresponding structural power component 2, make a mechanical connection between the front of the control component 1 and the inside of the power component 2 by means of insulating glue, and make an electrical connection between the back of the control component 1 and the inside of the power component 2 by means of bonding, to obtain the assembly 3; S4: Finished product assembly and sealing: Take the assembly 3 and cover plate 4, put the cover plate 4 on the assembly 3, and use the sealing process to airtightly seal the cover plate 4 and the assembly 3 to obtain the finished relay structure.

[0034] In step S4, the cover plate 4 and the assembly 3 are hermetically sealed using parallel sealing welding, laser sealing welding, or sintering processes.

[0035] The following case studies will illustrate this application.

[0036] The ceramic substrate 10 uses ceramic material as its base. Electrical connections between the front and back areas are achieved through internal interconnections. Internal height control and inter-path light isolation are achieved through a metal partition 14. The photovoltaic chip 11 is mounted within the metallized area on the front of the ceramic substrate 10. The lower electrode connection is achieved through bonding or welding processes, and the upper electrode connection is achieved through bonding processes, thus forming the control component 1 (reference). Figures 19-24 .

[0037] The ceramic housing 5, the first power chip 12, the second power chip 13, and the light-emitting diode chip 6 are connected to the lower electrode of the chips via welding or bonding processes, and the upper electrode of the chips is connected via bonding processes. When the output is DC, only the first power chip 12 is assembled; when the output is bidirectional, both the first power chip 12 and the second power chip 13 are assembled to form a power component reference. Figures 13-18 .

[0038] Control component 1 employs a double-sided bonding structure to achieve electrical connection with the power component. The front side of control component 1 is bonded to the interior of power component 2 with insulating adhesive, while the metallized area on the back side is connected to the corresponding position of the chip inside the power component via a bonding process, forming the overall product assembly reference. Figures 6-12 .

[0039] Assembly 3 and cover plate 4 are hermetically sealed by parallel sealing welding, laser sealing welding, or welding. See the schematic diagram of the finished product for reference. Figures 1-6 .

[0040] The relay structure and assembly method of this application adopt a three-dimensional multi-path approach to increase product installation density. This three-dimensional multi-path scheme enhances power density, thereby enabling high-power-density product design. Products using this solution can achieve a power density of 8000 W / cm². 3 The output current is more than three times that of existing traditional products, and the output current capability of the product is four to ten times that of similar products.

[0041] This application achieves thermal equilibrium within the product by controlling the double-sided bonding process of component 1, the compact stepped structure of ceramic tube shell 5, and the presence of metal partition 14 on ceramic substrate 10, thereby maximizing the internal heat dissipation efficiency of the product.

[0042] Furthermore, by adding a compact stepped structure and using a double-sided bonding process, the control component 1 and the power component 2 are assembled in a compact manner, thereby improving the power density of the device.

[0043] The relay structure product obtained using the solution of this application achieves more than double the power density and more than triple the current output within the same installation area. Under the same current capability, the product volume is reduced by more than 50%. The structural design of this application provides better heat dissipation efficiency and inter-circuit optical isolation, thereby improving product reliability and lifespan.

[0044] This application's relay structure product uses a two-sided bonding mounting method to transform the traditional single-sided bonding mounting structure into a stacked structure, thereby increasing the product's power density. The power device 2 is directly connected to the ceramic housing 5, allowing the main heat generation power to be directly introduced from inside the ceramic housing 5 to the bottom of the product. The control component 1 isolates the input and output heat generation devices through a metal partition 14, improving the internal thermal balance of the product while miniaturizing it. This achieves the goal of increasing the power density of the traditional ceramic housing 5, solving the problem of realizing and improving the reliability of switching or power products under miniaturization and high power density.

Claims

1. A stepped high-power-density solid-state relay structure, characterized in that... The device includes a control component (1), a cover plate (4), and a power component (2) consisting of a ceramic tube shell (5), a light-emitting diode chip (6), and a power chip. The front of the control component (1) is bonded to the inside of the power component (2), and the back of the control component (1) is electrically connected to the inside of the power component (2) to form an assembly (3). The assembly (3) is hermetically sealed to the cover plate (4). The ceramic tube shell (5) has a cavity (15). The cavity (15) is divided into a first step (7), a second step (8), and a third step (9) from bottom to top. The light-emitting diode chip (6) is set on the first step (7), and the power chip is set on the second step (8) and the third step (9), respectively.

2. The stepped high-power-density solid-state relay structure according to claim 1, characterized in that: The control component (1) includes a two-way control component structure and a four-way control component structure. The two-way control component structure consists of a ceramic substrate (10) and two photovoltaic chips (11). The two photovoltaic chips (11) are fixedly mounted on the ceramic substrate (10). The four-way control component structure consists of a ceramic substrate (10) and four photovoltaic chips (11). The four photovoltaic chips (11) are fixedly mounted on the ceramic substrate (10). A metal partition (14) is provided on the ceramic substrate (10), and the photovoltaic chips (11) are separated by the metal partition (14).

3. The stepped high-power-density solid-state relay structure according to claim 1, characterized in that: The power component (2) includes a two-way DC structure, a two-way bidirectional structure, and a four-way combined structure. The power chip includes a first power chip (12) and a second power chip (13). The two-way DC structure is composed of a light-emitting diode chip (6), a ceramic tube shell (5), and two first power chips (12). The two first power chips (12) are respectively disposed on the second step (8) and the third step (9) of the ceramic tube shell (5). The two-way bidirectional structure is composed of a light-emitting diode chip (6), a ceramic tube shell (5), two first power chips (12), and two second power chips (13). The two first power chips (12) and the two second power chips (13) are respectively cross-distributed on the second step (8) and the third step (9). The four-way combined structure is a repeated combination of the two-way bidirectional structure and the two-way DC structure.

4. The stepped high-power-density solid-state relay structure according to claim 3, characterized in that: The first combination of the four-way combination structure consists of a light-emitting diode chip (6), a ceramic tube shell (5) and eight first power chips (12), with the eight first power chips (12) respectively disposed on the second step (8) and the third step (9) of the ceramic tube shell (5).

5. The stepped high-power-density solid-state relay structure according to claim 3, characterized in that: The second combination of the four-way combination structure consists of a ceramic tube shell (5), four first power chips (12) and four second power chips (13). The four first power chips (12) are set on the second step (8) of the ceramic tube shell (5), and the four second power chips (13) are set on the third step (9) of the ceramic tube shell (5).

6. The stepped high-power-density solid-state relay structure according to claim 1, characterized in that: The front of the control component (1) is bonded to the inside of the power component (2) with insulating adhesive, and the back of the control component (1) is electrically connected to the inside of the power component (2) by bonding.

7. The stepped high-power-density solid-state relay structure according to claim 1, characterized in that: The cover plate (4) is a metal cover plate. The hermetic connection between the fitting (3) and the cover plate (4) includes three methods: parallel sealing welding, laser sealing welding and sintering.

8. The stepped high-power-density solid-state relay structure according to claim 2, characterized in that: The ceramic substrate (10) is a substrate made of ceramic material. The ceramic substrate (10) has a front area and a back area that are electrically connected internally. The photovoltaic chip (11) is disposed in the front area.

9. The assembly method of the stepped high-power-density solid-state relay structure according to any one of claims 1-8, characterized in that: Includes the following steps: S1: Assembly of control components: Take a ceramic substrate (10) and a corresponding number of photovoltaic chips (11), and connect the lower electrode of the chip to the ceramic substrate (10) by bonding or welding. The connection between the electrode on the photovoltaic chip (11) and the ceramic substrate (10) is achieved by bonding process to obtain control component (1). S2: Power component assembly: Take the light-emitting diode chip (6), the corresponding number of power chips and ceramic tube shell (5), and connect the lower electrode of the chip to the ceramic tube shell (5) by bonding or welding. The electrical connection is achieved through bonding process to obtain the power component (2). S3: Assembly of components: Take the corresponding structural control component (1) and the corresponding structural power component (2), make a mechanical connection between the front of the control component (1) and the inside of the power component (2) through insulating glue, and make an electrical connection between the back of the control component (1) and the inside of the power component (2) through bonding to obtain the assembly (3). S4: Finished product assembly and sealing: Take the assembly part (3) and cover plate (4), put the cover plate (4) on the assembly part (3), and use the sealing process to gas seal the cover plate (4) and the assembly part (3) to obtain the finished relay structure.

10. The assembly method of the stepped high-power-density solid-state relay structure according to claim 9: characterized in that: In step S4, the cover plate (4) and the assembly (3) are sealed together using parallel sealing welding, laser sealing welding or sintering processes to achieve gas-tight assembly.

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