Wafer level optical fiber array bonding fixture
By designing a wafer-level fiber array bonding fixture and employing a chuck mechanism driven by a threaded rod and a lifting threaded shaft, precise horizontal and vertical positioning is achieved, solving the problems of easy damage and inaccurate positioning of traditional fixtures, and improving bonding quality and stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NANTONG OUYUE OPTOELECTRONIC COMM EQUIP CO LTD
- Filing Date
- 2025-09-09
- Publication Date
- 2026-06-02
AI Technical Summary
In the existing wafer-level fiber array bonding process, traditional fixtures lack fine-tuning capabilities and buffer protection, which makes the fiber array and wafer susceptible to damage. Furthermore, the lack of an effective vertical positioning and pressing mechanism affects the bonding quality.
A wafer-level fiber array bonding fixture was designed, which uses a horizontal chuck driven by a threaded rod, threaded block and connecting block, and a vertical pressing mechanism driven by a lifting threaded shaft and lifting positioning plate to achieve precise horizontal and vertical positioning, and provides flexible clamping by a buffer pad.
It improves the alignment accuracy before bonding and the stability during the bonding process, avoids device damage, and ensures high-quality bonding results.
Smart Images
Figure CN224317814U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of wafer-level fiber array fixture technology, specifically a wafer-level fiber array bonding fixture. Background Technology
[0002] In the fields of optical communication, sensing, and high-performance computing, high-precision and high-reliability coupling between wafer-level optical devices and fiber arrays is one of the key processes. This process typically involves active or passive alignment followed by permanent connection using methods such as UV adhesive curing or thermal bonding. During this process, a precision fixture is required to stably and non-damagingly fix the fiber array and wafer, ensuring extremely high alignment accuracy during bonding and preventing a surge in insertion loss due to micrometer-level displacement.
[0003] Traditional fiber array bonding fixtures often employ simple mechanical clamping or single positioning methods, which have several drawbacks. First, traditional horizontal clamping mechanisms often lack fine-tuning capabilities and buffer protection. When clamping fragile fiber arrays and wafers, stress concentration or hard contact can easily cause surface damage or even breakage of the devices, leading to a decrease in product yield. Second, the lack of an effective vertical positioning and pressing mechanism means that components may warp or shift during bonding due to uneven pressure, affecting bonding quality. Therefore, a wafer-level fiber array bonding fixture is proposed to address these issues. Utility Model Content
[0004] To address the shortcomings of existing technologies, this invention provides a wafer-level fiber array bonding fixture with advantages such as bidirectional precision positioning, thus solving the problems mentioned in the background.
[0005] To achieve the above objectives, this utility model provides the following technical solution:
[0006] A wafer-level fiber array bonding fixture includes a base and a limiting frame fixedly connected to the top of the base, wherein the inner side of the base is provided with a positioning component for positioning.
[0007] The positioning component includes a support plate fixedly connected between the top and bottom walls of the base. Threaded rods are rotatably connected to both sides of the support plate. Threaded blocks are threaded to the outer sides of the threaded rods. A connecting block is fixedly connected to the top of the threaded blocks. A chuck is fixedly connected to the top of the connecting blocks.
[0008] Furthermore, a pull wheel is fixedly connected to the outer side of each of the two threaded rods, and a first buffer pad is fixedly connected to the opposite side of each of the two clamps.
[0009] Furthermore, the top of the inner side of the base has two sliding openings that are adapted to the connecting block, and the sliding openings are connected to the limiting frame. The clamp is slidably connected between the inner front and rear side walls of the limiting frame.
[0010] Furthermore, guide shafts are fixedly connected to the opposite side walls of the left and right clamps, and fixing plates are fixedly connected to the opposite ends of the guide shafts on both sides.
[0011] Furthermore, guide holes adapted to the guide shaft are provided on both the left and right sides inside the limiting frame.
[0012] Furthermore, a lifting threaded shaft is rotatably connected to the top of the fixed plate, a lifting positioning plate is threadedly connected to the outer side of the lifting threaded shaft, and an anti-deviation shaft and a second buffer pad are fixedly connected to the bottom of the lifting positioning plate.
[0013] Furthermore, a vertical groove adapted to the anti-deviation shaft is provided on the top of the inner side of the chuck.
[0014] Compared with the prior art, this utility model provides a wafer-level fiber array bonding fixture, which has the following advantages:
[0015] This wafer-level fiber array bonding fixture, by setting up a horizontal chuck driven by a threaded rod, threaded block and connecting block, and a vertical pressing mechanism driven by a lifting threaded shaft and lifting positioning plate, are independent yet integrated. It can perform precise horizontal center positioning and vertical pressing positioning of the workpiece, which greatly improves the alignment accuracy before bonding and the stability during bonding. Attached Figure Description
[0016] Figure 1 This is a cross-sectional view of the structure of this utility model;
[0017] Figure 2 This is a front view of the structure of this utility model;
[0018] Figure 3 This is a perspective view of the lifting threaded shaft and the lifting positioning plate in the structure of this utility model.
[0019] In the diagram: 1. Base; 2. Limiting frame; 3. Support plate; 4. Threaded rod; 5. Threaded block; 6. Connecting block; 7. Chuck; 8. Actuating wheel; 9. First buffer pad; 10. Guide shaft; 11. Fixing plate; 12. Lifting threaded shaft; 13. Lifting positioning plate; 14. Anti-deviation shaft; 15. Second buffer pad. Detailed Implementation
[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0021] Please see Figures 1 to 3 In this embodiment, a wafer-level fiber array bonding fixture includes a base 1 and a limiting frame 2 fixedly connected to the top of the base 1. The inner side of the base 1 is provided with a positioning component for positioning.
[0022] Please see Figure 1 In this embodiment, the positioning component includes a support plate 3 fixedly connected between the top and bottom walls of the base 1. Threaded rods 4 are rotatably connected to both the left and right sides of the support plate 3. Threaded blocks 5 are threadedly connected to the outer side of the threaded rods 4. A connecting block 6 is fixedly connected to the top of the threaded block 5. A chuck 7 is fixedly connected to the top of the connecting block 6.
[0023] Specifically, a pull wheel 8 is fixedly connected to the outer side of each of the two threaded rods 4, and a first buffer pad 9 is fixedly connected to the opposite side of each of the two clamps 7.
[0024] It should be noted that the setting of the actuating wheel 8 allows the operator to manually rotate the threaded rod 4, thereby precisely controlling the lateral displacement of the chuck 7. The first buffer pad 9 is made of an elastic material, such as rubber or polyurethane, to provide cushioning when clamping wafers or fiber arrays, avoiding hard contact that could cause scratches or stress concentration on the device surface.
[0025] Specifically, the top of the inner side of the base 1 has two sliding openings that are adapted to the connecting block 6, and the sliding openings are connected to the limiting frame 2. The clamp 7 is slidably connected between the inner front and rear side walls of the limiting frame 2.
[0026] Specifically, guide shafts 10 are fixedly connected to the opposite side walls of the left and right clamps 7, and fixing plates 11 are fixedly connected to the opposite ends of the left and right guide shafts 10.
[0027] It should be noted that the guide shaft 10 and the fixing plate 11 form a rigidly connected whole, and its core function is to provide a mounting base and guide reference for the subsequent vertical positioning components.
[0028] Specifically, guide holes adapted to guide shaft 10 are provided on both the left and right sides inside the limiting frame 2.
[0029] Specifically, the top of the fixed plate 11 is rotatably connected to a lifting threaded shaft 12, the outer side of the lifting threaded shaft 12 is threadedly connected to a lifting positioning plate 13, the bottom of the lifting positioning plate 13 is fixedly connected to an anti-deviation shaft 14 and a second buffer pad 15, and the top of the inner side of the chuck 7 is provided with a vertical slide groove that is compatible with the anti-deviation shaft 14.
[0030] It should be noted that the lifting threaded shaft 12 converts the rotational motion into the precise linear lifting motion of the lifting positioning plate 13 through threaded transmission. The anti-deviation shaft 14 is inserted into the vertical groove of the chuck 7 to prevent the lifting positioning plate 13 from rotating during the lifting process, ensuring that its movement trajectory is vertical. The second buffer pad 15 provides soft contact in the vertical direction to protect the top surface of the wafer or fiber array.
[0031] The working principle of the above embodiments is as follows:
[0032] The wafer or fiber array workpiece to be bonded is placed on the base 1, between the two chucks 7. The operator manually rotates the two actuating wheels 8 to drive the threaded rods 4 on both sides to rotate synchronously. The threaded block 5, which is threaded to the threaded rod 4, converts the rotational motion into horizontal linear motion. Through the connecting block 6, it drives the chuck 7 to slide in the left and right direction along the limit frame 2, so that the two chucks 7 move towards each other or away from each other until the first buffer pad 9 on the chuck 7 contacts the workpiece, thereby achieving horizontal center positioning and flexible clamping of the workpiece.
[0033] After horizontal clamping is completed, vertical operation is performed. The lifting threaded shaft 12 installed on the fixed plate 11 is rotated. The rotation of the lifting threaded shaft 12 drives the lifting positioning plate 13, which is threaded with it, to move in the vertical direction. The anti-deviation shaft 14 fixed at the bottom of the lifting positioning plate 13 is simultaneously embedded in the vertical slide groove of the chuck 7, effectively preventing the lifting positioning plate 13 from circumferentially shifting during the descent. The lifting positioning plate 13 continues to descend until the second buffer pad 15 at its bottom presses against the upper surface of the workpiece, completing the vertical positioning of the workpiece.
[0034] The installation, connection, or setting methods disclosed in this embodiment are all common mechanical connection methods, and any method that can achieve its beneficial effects can be implemented.
[0035] It should be noted that the orientations or positional relationships indicated herein are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the purpose of facilitating the description of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A wafer-level fiber array bonding fixture, comprising a base (1) and a limiting frame (2) fixedly connected to the top of the base (1), characterized in that: The base (1) is provided with a positioning component for positioning on its inner side; The positioning component includes a support plate (3) fixedly connected between the top and bottom walls of the base (1). Threaded rods (4) are rotatably connected to both the left and right sides of the support plate (3). Threaded blocks (5) are threadedly connected to the outer side of the threaded rods (4). A connecting block (6) is fixedly connected to the top of the threaded block (5). A chuck (7) is fixedly connected to the top of the connecting block (6).
2. The wafer-level fiber array bonding fixture according to claim 1, characterized in that: A pull wheel (8) is fixedly connected to the outer side of each of the two threaded rods (4), and a first buffer pad (9) is fixedly connected to the opposite side of each of the two clamps (7).
3. The wafer-level fiber array bonding fixture according to claim 1, characterized in that: The top of the inner side of the base (1) has two sliding openings that are adapted to the connecting block (6), and the sliding openings are connected to the limiting frame (2). The clamp (7) is slidably connected between the inner front and rear side walls of the limiting frame (2).
4. The wafer-level fiber array bonding fixture according to claim 1, characterized in that: Guide shafts (10) are fixedly connected to the opposite side walls of the left and right clamps (7), and fixing plates (11) are fixedly connected to the opposite ends of the left and right guide shafts (10).
5. A wafer-level fiber array bonding fixture according to claim 1, characterized in that: The limiting frame (2) has guide holes on both the left and right sides that are adapted to the guide shaft (10).
6. A wafer-level fiber array bonding fixture according to claim 4, characterized in that: The top of the fixed plate (11) is rotatably connected to a lifting threaded shaft (12), the outer side of the lifting threaded shaft (12) is threadedly connected to a lifting positioning plate (13), and the bottom of the lifting positioning plate (13) is fixedly connected to an anti-deviation shaft (14) and a second buffer pad (15).
7. A wafer-level fiber array bonding fixture according to claim 1, characterized in that: The top of the inner side of the chuck (7) is provided with a vertical groove that is compatible with the anti-deviation shaft (14).