Gluing equipment for semiconductor lead frame

Abstract

The utility model relates to the technical field of semiconductor packaging, in particular to semiconductor lead frame gluing equipment which comprises a conveying transmission device, a gluing device and a gluing driving device, the gluing driving device is provided with a grating displacement sensor, and when the gluing driving device drives the gluing device to move, the grating displacement sensor is driven to move. The grating displacement sensor detects the actual moving distance of the gluing device in real time and feeds back the actual moving distance to the gluing driving device. According to the utility model, the grating displacement sensor is arranged on the gluing driving device, the grating displacement sensor is used for measuring the mobile end of the equipment in real time, and the moving distance of the gluing device is fed back to the gluing driving device, so that the calibration of the moving position is realized; the grating displacement sensor acquires actual movement data from the mobile terminal to correct the movement error of the gluing driving device, so that the position precision of the gluing device in actual movement is further improved, the positioning accuracy during implementation of the gluing process is guaranteed, the gluing quality of the lead frame is improved, and the yield of production and processing is favorably improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, specifically a semiconductor lead frame coating device. Background Technology

[0002] Leadframes, as chip carriers for integrated circuits, are key structural components that use bonding materials to achieve electrical connections between the internal circuit leads and external leads of the chip, forming an electrical circuit. They are the main materials for semiconductor components and integrated circuit packaging.

[0003] In the manufacturing process, the lead frame needs to be coated with adhesive. This coating process is an important step in semiconductor packaging. It not only ensures the physical connection between the chip and the lead frame, but also involves multiple aspects such as thermal management, electrical insulation and stress relief, which are crucial to improving the reliability and performance of semiconductor products.

[0004] In actual production, the glue coating device of the glue coating machine inevitably has gaps (assembly tolerances) during the movement of mechanical transmission (such as gear transmission, thread transmission, belt transmission, etc.) to facilitate movement or installation. These gaps directly affect the positioning accuracy of the transmission during the mechanical transmission process. Reducing the gaps will greatly increase the assembly difficulty and production cost of the equipment. The most common way to control positioning accuracy is to use a servo control system. However, after long-term use, the servo control system may experience thermal offset or thermal extension due to the heat generated by its own transmission friction, which will limit the accuracy control. The encoder of the servo control system can only measure the movement of the drive end (such as the motor) and cannot directly measure the actual movement distance of the transmission end (such as the lead screw). The transmission end is easily affected by thermal offset or thermal extension, which will cause changes in accuracy. This is not conducive to ensuring positioning accuracy control and affects the glue coating quality that requires high-precision positioning.

[0005] To address the above shortcomings, we need to develop a semiconductor leadframe coating equipment to meet the needs of a wide range of users. Utility Model Content

[0006] To address the aforementioned problem that existing glue-applying machines and their coating devices may experience thermal offset or thermal expansion due to heat generated by their own transmission friction during movement, leading to changes in accuracy and hindering the control of positioning precision, the technical solution adopted by this utility model is as follows:

[0007] A semiconductor leadframe coating device includes a conveying and transmission device for placing the leadframe, a coating device for applying adhesive, and a coating drive device for driving the coating device to move. The coating drive device is equipped with a grating displacement sensor for auxiliary positioning. When the coating drive device drives the coating device to move, the grating displacement sensor detects the actual moving distance of the coating device in real time and feeds it back to the coating drive device.

[0008] Furthermore, it also includes a control unit for controlling the conveying transmission device, the coating device, and the coating drive device. The control unit is electrically connected to a grating displacement sensor, which detects the actual moving distance of the coating device in real time and feeds it back to the control unit.

[0009] Furthermore, it also includes a vision device for detecting lead frame information, wherein the camera end of the vision device faces the conveyor bearing part of the conveyor drive device for placing the lead frame, and the camera end collects the position information of the lead frame and sends it to the control unit.

[0010] Furthermore, the conveying transmission device includes a conveying support for placing the lead frame and a conveying drive for driving the support. The conveying support has a limiting structure for restricting the placement position of the lead frame. The control unit is electrically connected to the conveying drive to control the moving speed of the conveying support.

[0011] Furthermore, the conveying transmission device adopts a belt drive structure, the conveying load-bearing part is a conveyor belt, and the conveying drive part is a drive motor for driving the conveyor belt.

[0012] Furthermore, the conveying transmission device adopts a threaded transmission structure, the conveying bearing part is a carrying slider, and the conveying driving part includes a threaded transmission shaft for moving the carrying slider and a drive motor for driving the threaded transmission shaft.

[0013] Furthermore, the limiting structure includes at least two positioning pins, which taper from the root toward the top into a conical structure, and the positioning pins pass through the lead frame to limit the placement position of the lead frame.

[0014] Furthermore, the conveying transmission device is also equipped with a grating displacement sensor for auxiliary positioning. When the conveying transmission device drives the lead frame to move, the grating displacement sensor detects the actual moving distance of the lead frame in real time and feeds it back to the glue application drive device.

[0015] Furthermore, the adhesive application drive device includes a vertical lifting mechanism and a horizontal transmission mechanism for linear movement of the adhesive application device, and the grating displacement sensor is mounted on the vertical lifting mechanism and / or the horizontal transmission mechanism.

[0016] Furthermore, the adhesive application drive device includes a steering transmission mechanism for circumferential rotation of the adhesive application device, and the steering transmission mechanism is equipped with an encoder for auxiliary positioning.

[0017] The beneficial effects of this utility model are as follows:

[0018] 1. This utility model installs a grating displacement sensor for auxiliary positioning on the glue-coating drive device used to drive the glue-coating device to move. The grating displacement sensor uses real-time measurement of the moving end of the device (glue-coating device) and feeds back the actual moving distance of the glue-coating device to the glue-coating drive device to achieve calibration of the moving position. The grating displacement sensor collects actual moving data from the moving end to correct the moving error of the glue-coating drive device, further improving the positional accuracy of the glue-coating device in actual movement, ensuring the positioning accuracy when implementing the glue-coating process, improving the glue-coating quality of the lead frame, and helping to improve the yield rate of production and processing.

[0019] 2. This utility model also applies the grating displacement sensor to the conveying transmission device used to place the lead frame. The grating displacement sensor is used to measure the moving end (conveyor bearing part) of the lead frame in real time, and the actual moving distance of the conveyor bearing part is fed back to the glue application drive device. This allows the glue application drive device to know the moving position and moving speed of the conveying transmission device, realizing high-precision synchronous cooperation between the glue application drive device and the conveying transmission device. This further improves the positional accuracy of the glue application device in actual movement, ensures the positioning accuracy during the glue application process, improves the glue application quality of the lead frame, and helps to improve the yield rate of production and processing.

[0020] 3. This utility model connects and coordinates the mechanical movements of the conveying transmission device, the glue coating device, and the glue coating drive device through a control unit. By collecting real-time detection data from a grating displacement sensor, it effectively controls the operation of the equipment, including the conveying speed of the conveying transmission device, the glue dispensing amount of the glue coating device, and the moving position of the glue coating drive device. In addition, a vision device is installed to detect the position information of the lead frame and glue leakage defects. The vision device captures the position of the lead frame through its camera end or takes pictures of the appearance of the lead frame. The information of the lead frame is fed back to the control unit for processing, which makes the moving position of the glue coating drive device more accurate. It can also avoid glue leakage defects caused by the misplacement of the lead frame, which is conducive to improving the yield rate of production and processing. Attached Figure Description

[0021] Figure 1 This is one of the structural schematic diagrams of a semiconductor lead frame coating device according to the present invention.

[0022] Figure 2 for Figure 1 A magnified view of A.

[0023] Figure 3 This is the second structural schematic diagram of a semiconductor lead frame coating device according to the present invention.

[0024] Figure 4 for Figure 3 A magnified view of B. Detailed Implementation

[0025] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0026] Optionally, in some embodiments, the conveying bearing part 11 may adopt one of the following types of conveyor belt structures: flat belt, V-belt, multi-wedge belt, round belt, toothed belt, etc. Preferably, the conveying bearing part 11 adopts a synchronous belt made of toothed belt, which can improve the stability of the conveying transmission, improve the relative displacement accuracy of the conveying transmission, and facilitate the equipment to control the conveying speed.

[0027] Optionally, in some embodiments, the conveying drive unit 12 may adopt a threaded drive shaft with one of the following thread structures: triangular thread, trapezoidal thread, pipe thread, or ball screw thread. Preferably, the conveying drive unit 12 adopts a ball screw as the threaded drive shaft. The friction coefficient of the ball screw drive is small, which is suitable for high-frequency motion scenarios where the glue application drive device 3 drives the glue application device 2 to move back and forth. Compared with the traditional sliding screw, the driving torque of the ball screw is less than one-third, that is, the power required to achieve the same motion effect is one-third of that of the traditional sliding screw. The ball screw drive has the characteristics of high transmission accuracy, small transmission backlash, and smooth transmission, which is suitable for use in high-precision positioning glue application equipment.

[0028] Example 1:

[0029] Based on Example 000, such as Figures 1 to 4 The semiconductor lead frame coating equipment shown includes a conveying and transmission device 1 for placing the lead frame, a coating device 2 for applying adhesive, and a coating drive device 3 for driving the coating device 2 to move. The coating drive device 3 is equipped with a grating displacement sensor 4 for auxiliary positioning. When the coating drive device 3 drives the coating device 2 to move, the grating displacement sensor 4 detects the actual moving distance of the coating device 2 in real time and feeds it back to the coating drive device 3.

[0030] More specifically, the semiconductor leadframe coating equipment is one link in the leadframe production line. Other input devices on the production line (such as robots, conveyors, and handling machines) transport semi-finished leadframes to this equipment for coating. After processing, this equipment continues to transport the leadframes to other output devices in the next process (such as welding equipment and packaging equipment). The conveyor drive unit 1 is a product transport device that allows the input devices to place and move the leadframes. The conveyor drive unit 1 includes a conveyor bearing section 11 and a conveyor drive section 12. The conveyor bearing section 11 is the main component that contacts and transports the leadframes. The conveyor drive section 12 is the power source that drives the conveyor bearing section 11 and provides it with operating power. In use, the conveyor drive section 12 is powered on and activated. The conveyor drive section 12 drives the conveyor bearing section 11 to move, causing the leadframes placed on the conveyor bearing section 11 to move towards the output direction of the next process, thus achieving product transport.

[0031] More specifically, the conveying transmission device 1 in this embodiment can drive the lead frame to move back and forth along the length direction to adapt to different production processes and production environments.

[0032] More specifically, the coating device 2 is a semiconductor lead frame coating equipment mainly used for coating. The coating device 2 includes a glue chamber mounting structure for connecting the coating drive device 3, a glue storage section 21 installed in the glue chamber mounting structure, and a coating nozzle 22 for dispensing glue. The glue storage section 21 is connected to an external air pressure controller via an air pipe. The air pressure controller controls the glue dispensing volume and speed. The glue storage section 21 is also connected to an external glue storage container for storing a large amount of glue via an inlet pipe to avoid the coating efficiency being affected by the size of its own glue storage capacity. In use, the external air pressure controller drives the glue to be squeezed from the glue storage section 21 to the coating nozzle 22. The external glue storage container supplies glue to the glue storage section 21 according to the glue dispensing speed, preventing the glue from overflowing the glue storage section 21 and causing glue inlet blockage and abnormal air pressure.

[0033] More specifically, the semiconductor lead frame coating equipment is further equipped with a coating drive device 3 for driving the coating device 2. The coating drive device 3 can drive the coating device 2 to move horizontally and vertically, and can also drive the coating device 2 to rotate circumferentially around the central axis of the coating nozzle 22 to achieve a flexible coating effect. In this embodiment, the coating drive device 3 drives the coating device 2 to move by means of a lead screw drive. Preferably, the coating drive device 3 adopts a ball screw drive in the lead screw drive. The ball screw drive has a low coefficient of friction and is suitable for high-frequency motion scenarios where the coating drive device 3 drives the coating device 2 to move back and forth. Compared with the traditional sliding lead screw, the driving torque of the ball screw is less than one-third, that is, the power required to achieve the same motion effect is one-third of that of the traditional sliding lead screw. The ball screw drive has the characteristics of high transmission accuracy, small transmission backlash and smooth transmission, and is suitable for use in high-precision positioning coating equipment.

[0034] More specifically, an optical grating displacement sensor 4 for auxiliary positioning is installed on the glue application drive device 3. The optical grating displacement sensor 4 can use an optical grating ruler as the detection end. The optical grating ruler displacement sensor, also known as an optical grating ruler, is a measurement feedback device that uses the optical principle of moiré fringes to measure the positional movement of an object. It "reads" the grating scale by detecting the number of moiré fringes, and then calculates the displacement and velocity of the measured object according to the action of the drive circuit. It has the characteristics of high accuracy, ease of use, and strong anti-electromagnetic interference capability. The detection end of the optical grating displacement sensor 4 faces the glue application device 2, or is fixedly connected to the glue application device 2, so as to detect the moving distance of the glue application device 2 through the optical principle. In use, the optical grating displacement sensor 4 is electrically connected to the control end of the glue application drive device 3. When the glue application drive device 3 drives the glue application device 2 to move, the optical grating displacement sensor 4 detects the actual moving distance of the glue application device 2 in real time and feeds it back to the control end of the glue application drive device 3 for distance difference compensation or distance difference correction, so that the glue application drive device 3 controls the actual movement and positioning of the glue application device 2 to obtain higher accuracy detection data support.

[0035] In this embodiment, a grating displacement sensor is used to measure the moving end (coating device 2) of the semiconductor leadframe coating equipment in real time, and the actual moving distance of the coating device 2 is fed back to the coating drive device 3 to achieve calibration of the moving position. The grating displacement sensor 4 collects actual moving data from the moving end to correct the moving error of the coating drive device 3, further improving the positional accuracy of the coating device 2 in actual movement, ensuring the positioning accuracy during the coating process, improving the coating quality of the leadframe, and helping to improve the yield rate of production processing.

[0036] As another embodiment of Example 1, the glue application drive device 3 drives the glue application device 2 to move by belt transmission. Preferably, the glue application drive device 3 uses a synchronous belt and synchronous pulley to drive the glue application device 2 to move along the slide rail. The extensibility of the synchronous belt is the lowest among all belt types. Therefore, the synchronous belt can maintain good precision control. The synchronous belt drive is a meshing transmission, which can ensure that the belt pitch remains unchanged and achieve synchronous transmission without slippage. It has high transmission efficiency. Compared with ball screws, the production and procurement cost of synchronous belts is lower, and the assembly is simpler and faster. It reduces assembly difficulty and assembly time, improves production efficiency, and is suitable for users who value cost performance.

[0037] As another embodiment of Example 1, the glue application drive device 3 can be driven by one of the following transmission methods: chain drive, gear drive, worm gear drive, crank-slider drive, pneumatic drive, hydraulic drive, electromagnetic drive, etc.

[0038] Example 2:

[0039] Based on Example 1, such as Figures 1 to 4 The semiconductor lead frame coating equipment shown also includes a control unit for controlling the conveying transmission device 1, the coating device 2, and the coating drive device 3. The control unit can be one of the following information processing devices as the control terminal: PLC (Programmable Logic Controller), microcontroller, or electronic computer. Preferably, the control unit uses a PLC as the control terminal. PLCs are mainly used in the field of industrial automation control. They can handle complex input / output (I / O) signals and have high reliability and stability. In terms of design, they pay more attention to the durability and reliability of industrial environments. PLCs are usually equipped with a dedicated HMI (Human Machine Interface) for monitoring and control, making it convenient for users to use.

[0040] More specifically, the control unit is electrically connected to the grating displacement sensor 4, which collects the movement data of the coating device 2 in real time and feeds the movement data back to the control unit for processing. The control unit processes the positioning difference and positioning compensation. Since the grating displacement sensor 4 detects the actual moving end of the equipment, the detection data is more direct and accurate, avoiding the influence of gaps and backlash on the transmission detection method, and further improving the detection accuracy and positioning accuracy. On this basis, the control unit is used to perform linkage control between multiple devices, and can collect the specific situation of each device in real time. This avoids the lack of information interaction between the conveyor transmission device 1, the coating device 2 and the coating drive device 3, which leads to asynchronous collaborative processing. Using the control unit for unified collaborative processing can further improve the smoothness of production, increase coating efficiency, reduce coating errors and increase the yield of coated products.

[0041] Example 3:

[0042] Based on Example 2, such as Figures 1 to 4 The semiconductor lead frame coating equipment shown also includes a vision device 5 for detecting lead frame information. The vision device 5 is a machine vision system that uses a machine vision product (i.e., an image acquisition device, which can be either CMOS or CCD) to convert the captured target into an image signal and transmit it to a dedicated image processing system to obtain the shape information of the captured target. Based on pixel distribution and information such as brightness and color, the image system converts the image signal into a digital signal. The image system performs various operations on these signals to extract the features of the target and then controls the operation of the equipment on site based on the judgment result.

[0043] More specifically, the vision device 5 is electrically connected to the control unit. The vision device 5 captures the position of the lead frame on the conveyor drive device 1, analyzes and processes the image data, and then sends the processed data back to the control unit for adjustment and coordination. This processed data can be the product's position information or the product's surface defect information. In this embodiment, the vision device 5 mainly processes the product's position information. It calculates the specific position and coordinate deviation value of the lead frame through the captured image data, so that the control unit can compensate for the positioning deviation of the conveyor drive device 1, the glue application device 2, and the glue application drive device 3, thereby improving the positioning accuracy of the equipment.

[0044] More specifically, the vision device 5 can be installed on the frame 6 of the semiconductor lead frame coating equipment. The camera end 51 of the vision device 5 faces the conveyor drive device 1 for placing the conveyor support part 11 of the lead frame, so as to capture the products flowing through. The vision device 5 is installed on the frame 6 above the conveyor drive device 1. The installation of the vision device 5 avoids the obstruction area of ​​the coating drive device 3, so as to avoid the phenomenon of unclear or partial obstruction of the shooting effect caused by the movement of the coating drive device 3, and avoid affecting the image data and image analysis structure. Preferably, the camera end 51 of the vision device 5 adopts an industrial high-speed camera. The industrial high-speed camera has the effect of high-resolution imaging and high shooting speed, and can operate continuously for a long time in the industrial environment, which is convenient for users.

[0045] As another embodiment of Example 3, the vision device 5 can be installed on the glue application drive device 3. The camera end 51 of the vision device 5 moves together with the glue application device 2, which can be easily aligned with the lead frame placed at different positions on the conveyor drive device 1. The control unit controls the glue application drive device 3 to drive the camera end 51 of the vision device 5 to the top of the corresponding lead frame for shooting. Compared with the method of installing on the frame 6, it is closer to the product, the detection position is more flexible and targeted, and the quality of the captured image is clearer and more specific, which is conducive to improving the accuracy of information processing.

[0046] As another embodiment of Example 3, the vision device 5 can also process the surface defect information of the product. It collects the image data of the outer surface of the lead frame through the camera end 51, compares the image data of the outer surface of the lead frame that belongs to the good product, finds the difference between the image of the tested product and the reference product image, and analyzes whether the difference belongs to the product with a defective structure as defined by the reference product image. When a product with a defective structure is found to be flowing through, the surface defect information and its location information of the corresponding product are sent back to the control unit. The control unit then controls other equipment to remove or remove the product with the defective structure from the semiconductor lead frame coating equipment, so as to avoid the defective products from affecting production efficiency and production progress, reduce production costs and production time, and improve production quality.

[0047] Example 4:

[0048] Based on any of the above embodiments, such as Figures 1 to 2 The semiconductor lead frame coating equipment shown includes a conveying transmission device 1 comprising a conveying support part 11 and a conveying drive part 12. The conveying support part 11 is the main component that contacts and conveys the lead frame, and the conveying drive part 12 is the main power source that drives the conveying support part 11 and provides it with operating power. In use, the conveying drive part 12 is powered on and started, and the conveying drive part 12 drives the conveying support part 11 to move and move the lead frame placed on the conveying support part 11 toward the output direction of the next process, thereby achieving the effect of product transportation.

[0049] More specifically, the conveying transmission device 1 in this embodiment adopts a belt drive structure. The belt drive structure can continuously convey products in the same direction. Compared with the threaded drive structure, it has better conveying continuity and consistency. The conveying load 11 is a conveyor belt. Preferably, the conveying load 11 is a synchronous belt made of toothed belt, which can improve the stability of the conveying transmission, improve the relative displacement accuracy of the conveying transmission, and facilitate the equipment to control the conveying speed. Synchronous belt transmission is a meshing transmission, which can ensure that the belt pitch remains unchanged and achieve synchronous transmission without slippage. It has high transmission efficiency. Compared with ball screws, the production and procurement cost of synchronous belts is lower, and the assembly is simpler and faster, reducing assembly difficulty and assembly time, improving production efficiency, and making it suitable for users who value cost performance.

[0050] More specifically, the conveying drive unit 12 is a drive motor for driving the conveyor belt. Preferably, the conveying drive unit 12 uses a permanent magnet synchronous motor or a DC motor as the drive motor to provide good smoothness of conveying transmission, which is suitable for high-precision and high-stability applications.

[0051] More specifically, to further stabilize the position of the lead frame, a limiting structure 13 for restricting the placement position of the lead frame is provided on the conveying support 11. The limiting structure 13 can be a movable snap-fit ​​structure or a fixed pin structure. Preferably, in this embodiment, the limiting structure 13 is a fixed pin structure set on the surface of the conveying support 11 for placing the lead frame. The lead frame has a positioning hole for the pin structure to pass through. When the lead frame is placed on the conveying support 11 by other handling devices, the position of the lead frame can be fixed by aligning the pin structure and allowing the pin structure to pass through the positioning hole, thus avoiding slight positional shifts during glue application and helping to improve the positioning accuracy of the lead frame.

[0052] More specifically, the control unit is electrically connected to the conveying drive unit 12 to control the moving speed of the conveying carrier unit 11.

[0053] As another embodiment of Example 4, the limiting structure 13 adopts a movable snap-fit ​​structure (not shown). When the lead frame is placed on the conveying bearing part 11 by other handling devices, after the lead frame comes into contact with the snap-fit ​​structure, the snap-fit ​​structure presses the lead frame into the placement position. During the pressing process, several snap-fit ​​structures tightly clamp the lead frame from multiple pressing points, so that the placement position of the lead frame is in the preset position, ensuring that the placement of the lead frame can be located at the glue dispensing position of the glue applicator 2.

[0054] As another embodiment of Example 4, the limiting structure 13 includes at least two positioning pins 131. The positioning pins 131 taper from the root to the top into a conical structure. The positioning pins 131 pass through the positioning holes of the lead frame to limit the placement position of the lead frame. The conical positioning pins 131 can use the conical shape to clamp the positioning holes of the lead frame. The top with a smaller outer diameter allows the positioning hole to fit more easily, while the middle with a larger outer diameter clamps the positioning hole. After the positioning hole is clamped, the lead frame will be fixed in place and will not easily move. On this basis, a movable clamping member can also be used to clamp the lead frame fitted with the positioning pins 131 to prevent the lead frame from moving vertically due to the influence of the adhesive, thereby improving the placement accuracy of the lead frame and improving the quality of the adhesive application.

[0055] As another embodiment of Example 4, the conveyor transmission device 1 is also equipped with a grating displacement sensor 4 for auxiliary positioning. The detection end of the grating displacement sensor 4 faces the conveyor bearing part 11 of the conveyor transmission device 1. When the conveyor bearing part 11 adopts a belt drive structure, the detection end of the grating displacement sensor 4 faces the surface of the conveyor belt for contacting the lead frame. The surface of the conveyor belt is printed with optical marks for the grating displacement sensor 4 to identify. When the conveyor belt moves, the grating displacement sensor 4 detects and calculates the movement information of the conveyor belt in real time through the optical marks, and transmits the detection results back to the control center or the glue application drive device 3. This allows the control center or the glue application drive device 3 to calculate the movement distance and speed of the conveyor belt based on the movement information of the conveyor belt, so that the control center or the glue application drive device 3 can cooperate with the conveyor belt's conveying speed and position to implement the glue application process.

[0056] Example 5:

[0057] Based on any one of Examples 1-3, the difference from Example 4 is as follows: Figures 3 to 4 The semiconductor leadframe coating equipment shown employs a threaded drive structure in its conveying transmission device 1. This threaded drive structure provides smoother and more powerful transmission. Compared to belt drives, it exhibits almost no elastic deformation displacement, enabling more stable and precise movement of the leadframe. The conveying support unit 11 includes a carrier slider for placing the leadframe and a guide rail structure for the slider's movement. The guide rail structure is laid along the leadframe's forward direction and can be configured with one or two rails. The conveying drive unit 12 drives the carrier slider to reciprocate linearly along the guide rail structure. Preferably, two guide rails are used as supports on both sides of the carrier slider's movement direction to improve force balance and increase the bearing area.

[0058] More specifically, the limiting structure 13 is set on the surface of the carrier slider used to place the lead frame. The carrier slider can be made of a material with a certain hardness and resistance to deformation, such as metal, glass, or plastic. Compared with the conveyor belt structure, the carrier slider has higher hardness, and the lead frame placed on the carrier slider will hardly produce elastic displacement, making it more stable when placed.

[0059] The conveying drive unit 12 includes a threaded drive shaft for moving the carrier slider and a drive motor for driving the threaded drive shaft. Preferably, the conveying drive unit 12 uses a ball screw as the threaded drive shaft. The ball screw drive has a low coefficient of friction and is suitable for high-frequency motion scenarios where the glue application drive device 3 drives the glue application device 2 to move back and forth. Compared with the traditional sliding screw, the driving torque of the ball screw is less than one-third, that is, the power required to achieve the same motion effect is one-third of that of the traditional sliding screw. The ball screw drive has the characteristics of high transmission accuracy, small transmission backlash and smooth transmission, and is suitable for use in high-precision positioning glue application equipment.

[0060] As another embodiment of Example 5, the conveying transmission device 1 is also equipped with a grating displacement sensor 4 for auxiliary positioning. The detection end of the grating displacement sensor 4 faces the conveying carrier 11 of the conveying transmission device 1. When the conveying carrier 11 adopts a threaded transmission structure, the detection end of the grating displacement sensor 4 adopts a grating positioning block 41. The grating positioning block 41 is fixedly connected to the carrier slider. When the carrier slider moves, the grating displacement sensor 4 collects the movement information of the carrier slider by detecting the movement of the grating positioning block 41, and transmits the detection result back to the control center or the glue application drive device 3. This allows the control center or the glue application drive device 3 to calculate the moving distance and moving speed of the carrier slider based on the movement information of the carrier slider, so that the control center or the glue application drive device 3 can cooperate with the conveying speed and conveying position of the carrier slider and implement the glue application process.

[0061] Example 6:

[0062] Based on any of the above embodiments, such as Figures 1 to 4 The semiconductor leadframe coating equipment shown includes a coating drive device 3 comprising a vertical lifting mechanism 31 and a horizontal transmission mechanism 32 for linear movement of the coating device 2. The vertical lifting mechanism 31 controls the linear movement of the coating device 2 in the vertical direction (up and down), while the horizontal transmission mechanism 32 controls the linear movement of the coating device 2 in the horizontal direction (front, back, left, and right). More specifically, the horizontal transmission mechanism 32 includes a front-back movement mechanism and a left-right movement mechanism. The vertical lifting mechanism 31, the front-back movement mechanism, and the left-right movement mechanism form a coordinate relationship of three directional axes. The coating drive device 3 can flexibly move the coating device 2 to any positioning point in space, enabling the coating device 2 to coat a straight contour trajectory. Furthermore, through the linkage of the vertical lifting mechanism 31 and the horizontal transmission mechanism 32, the coating device 2 can also be driven to make arc or curve movements in space, enabling the coating device 2 to coat a curved contour trajectory.

[0063] More specifically, the grating displacement sensor 4 can be installed on the vertical lifting mechanism 31 and the horizontal transmission mechanism 32. The grating displacement sensor 4 accurately detects the position of the vertical lifting mechanism 31 and the horizontal transmission mechanism 32 during movement. The grating positioning block 41 is fixedly connected to the moving end of the vertical lifting mechanism 31 and the moving end of the horizontal transmission mechanism 32. When the moving end of the glue application drive device 3 moves, the grating displacement sensor 4 collects the movement information of the moving end by detecting the movement of the grating positioning block 41, and transmits the detection result back to the control center or the glue application drive device 3. This allows the control center or the glue application drive device 3 to calculate the moving distance and speed of the glue application device 2 based on the movement information of the moving end, so that the control center or the glue application drive device 3 can control the precise movement of the glue application device 2 and implement the glue application process. This ensures the positioning accuracy of the glue application device 2 in both lifting and horizontal movement, effectively improving the efficiency of glue application trajectory positioning and the quality of glue application.

[0064] As another embodiment of Example 6, the grating displacement sensor 4 can be installed on either the vertical lifting mechanism 31 or the horizontal transmission mechanism 32 to detect the movement and positioning accuracy of either the vertical lifting mechanism 31 or the horizontal transmission mechanism 32. This is suitable for user products that only require movement in the direction of either the vertical lifting mechanism 31 or the horizontal transmission mechanism 32. Users can choose the installation position of the grating displacement sensor 4 according to the actual production situation to meet production needs and reduce equipment costs.

[0065] Example 7:

[0066] Based on any of the above embodiments, such as Figures 1 to 4 The semiconductor leadframe coating equipment shown includes a coating drive device 3 comprising a steering transmission mechanism 33 for circumferential rotation of the coating device 2. The steering transmission mechanism 33 is a rotating mechanism used by the coating drive device 3 to control the rotation of the coating device 2 in the rotational direction. The steering transmission mechanism 33 can use one of the following transmission methods to drive the coating device 2 in circumferential rotation: threaded drive, gear drive, worm gear drive, pneumatic drive, hydraulic drive, or electromagnetic drive. Preferably, the steering transmission mechanism 33 uses a direct motor drive to control the forward and reverse rotation of the coating device 2. The motor is installed between the glue storage section 21 and the coating drive device 3. The steering transmission mechanism 33 is equipped with an encoder for auxiliary positioning. When the motor drives the coating device 2 to rotate, the encoder can convert the physical signal (rotation angle) into an electrical signal (such as pulse, code, etc.) to identify the position after rotation. The position information after the rotation of the steering transmission mechanism 33 is transmitted back to the control unit or the coating drive device 3, facilitating the collaborative processing of the coating process by the control unit or the coating drive device 3, resulting in a better coating effect.

[0067] like Figures 1 to 4As shown, one specific embodiment of this utility model is as follows:

[0068] In use, the semi-finished lead frame is transported by other input devices on the production line (such as robots, conveyor tables, handling machines, etc.) and placed on the conveying transmission device 1. When the lead frame is placed on the conveying bearing part 11 by other handling devices, the position of the lead frame can be fixed by aligning with the limiting structure 13 and making the positioning pin 131 pass through the positioning hole. The conveying drive part 12 drives the conveying bearing part 11 to move and drives the lead frame placed on the conveying bearing part 11 to move in the forward direction.

[0069] During the movement of the lead frame, the glue application drive device 3 controls the movement or rotation of the glue application device 2 through the linkage of the vertical lifting mechanism 31, the horizontal transmission mechanism 32 and the steering transmission mechanism 33, so that the glue application device 2 is aligned with the lead frame to perform the glue application process. During glue application, the glue liquid is driven by the external air pressure controller to be squeezed from the glue storage section 21 to the glue application nozzle 22. The glue liquid is input from the external glue storage container to replenish the glue storage section 21 according to the glue application speed. The glue application nozzle 22 squeezes the glue onto the corresponding position of the lead frame. After the glue application of a single lead frame is completed, the glue application drive device 3 continues to control the glue application device 2 to move to the next lead frame to continue the glue application process.

[0070] The pre-processed lead frame is conveyed by the conveyor drive 1 to other output equipment in the next process (such as welding equipment, packaging equipment, etc.) to complete the coating process of the semiconductor lead frame coating equipment.

[0071] During the movement of the glue application device 2, the grating displacement sensor 4 is electrically connected to the control terminal of the glue application drive device 3. When the glue application drive device 3 drives the glue application device 2 to move, the grating displacement sensors 4 located in the vertical lifting mechanism 31 and the horizontal transmission mechanism 32 respectively detect the actual moving distance of the glue application device 2 in real time and feed it back to the control terminal of the glue application drive device 3 for distance difference compensation or distance difference correction. The encoder located in the steering transmission mechanism 33 detects the actual steering angle of the glue application device 2 in real time and feeds it back to the control terminal of the glue application drive device 3 for steering difference compensation or angle difference correction, so that the glue application drive device 3 controls the actual movement and positioning of the glue application device 2 with higher precision detection data support.

[0072] like Figures 1 to 4 As shown, another specific embodiment of this utility model is as follows:

[0073] Based on the first specific implementation method, the second specific implementation method introduces a control unit to control the conveying transmission device 1, the gluing device 2, and the gluing drive device 3 respectively. The data feedback objects of the grating displacement sensor 4 and the encoder are transferred to the control unit. After the control unit collects the motion position of each motion device or mechanism through the grating displacement sensor 4 and the encoder, it uniformly plans and coordinates the motion trajectory of each motion device or mechanism to form an automated linkage processing gluing process. On this basis, the vision device 5 is installed on the frame 6 or the gluing device 2. The camera end 51 is used to take pictures of the position of the lead frame. After collecting the image data, it is fed back to the control center for position information analysis and product defect judgment. The position information is compensated to the motion data of the gluing drive device 3 to further ensure higher position accuracy. When the lead frame semi-finished product is found to be defective, it is promptly removed from the normal production queue to further ensure a better yield.

[0074] The above examples are merely illustrative of the technical content of this utility model to facilitate reader understanding, but do not imply that the implementation of this utility model is limited to these embodiments. Any technical extensions or re-creations made based on this utility model are protected by this utility model. The scope of protection of this utility model is defined by the claims.

Claims

1. A semiconductor lead frame coating apparatus, characterized in that: It includes a conveying transmission device (1) for placing the lead frame, an adhesive applicator (2) for applying adhesive, and an adhesive applicator drive device (3) for driving the adhesive applicator (2) to move. The adhesive applicator drive device (3) is equipped with a grating displacement sensor (4) for auxiliary positioning. When the adhesive applicator drive device (3) drives the adhesive applicator (2) to move, the grating displacement sensor (4) detects the actual moving distance of the adhesive applicator (2) in real time and feeds it back to the adhesive applicator drive device (3).

2. The semiconductor lead frame coating equipment according to claim 1, characterized in that: It also includes a control unit for controlling the conveying transmission device (1), the glue application device (2) and the glue application drive device (3), the control unit being electrically connected to the grating displacement sensor (4), the grating displacement sensor (4) detecting the actual moving distance of the glue application device (2) in real time and feeding it back to the control unit.

3. The semiconductor lead frame coating equipment according to claim 2, characterized in that: It also includes a vision device (5) for detecting lead frame information, wherein the camera end (51) of the vision device (5) faces the conveyor carrier (11) of the conveyor transmission device (1) for placing the lead frame, and the camera end (51) collects the position information of the lead frame and sends it to the control unit.

4. The semiconductor lead frame coating equipment according to claim 2, characterized in that: The conveying transmission device (1) includes a conveying support part (11) for placing the lead frame and a conveying drive part (12) for driving the support part. The conveying support part (11) has a limiting structure (13) for limiting the placement position of the lead frame. The control unit is electrically connected to the conveying drive part (12) to control the moving speed of the conveying support part (11).

5. The semiconductor lead frame coating equipment according to claim 4, characterized in that: The conveying transmission device (1) adopts a belt drive structure, the conveying bearing part (11) is a conveyor belt, and the conveying drive part (12) is a drive motor for driving the conveyor belt.

6. The semiconductor lead frame coating equipment according to claim 4, characterized in that: The conveying transmission device (1) adopts a threaded transmission structure, the conveying bearing part (11) is a carrying slider, and the conveying driving part (12) includes a threaded transmission shaft for moving the carrying slider and a drive motor for driving the threaded transmission shaft.

7. The semiconductor lead frame coating equipment according to claim 4, characterized in that: The limiting structure (13) includes at least two positioning pins (131), which taper from the root toward the top into a conical structure, and the positioning pins (131) pass through the lead frame to limit the placement of the lead frame.

8. The semiconductor lead frame coating equipment according to claim 1, characterized in that: The conveying transmission device (1) is also equipped with a grating displacement sensor (4) for auxiliary positioning. When the conveying transmission device (1) drives the lead frame to move, the grating displacement sensor (4) detects the actual moving distance of the lead frame in real time and feeds it back to the glue application drive device (3).

9. A semiconductor lead frame coating apparatus according to any one of claims 1-8, characterized in that: The adhesive application drive device (3) includes a vertical lifting mechanism (31) and a horizontal transmission mechanism (32) for linear movement of the adhesive application device (2), and the grating displacement sensor (4) is mounted on the vertical lifting mechanism (31) and / or the horizontal transmission mechanism (32).

10. A semiconductor lead frame coating apparatus according to claim 9, characterized in that: The glue application drive device (3) includes a steering transmission mechanism (33) for circumferential rotation of the glue application device (2), and the steering transmission mechanism (33) is equipped with an encoder for auxiliary positioning.

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