Feeding device of semiconductor device testing machine

Abstract

The utility model discloses a semiconductor device testing machine feeding device which comprises a conveying belt and a supporting frame, the top end of the conveying belt is provided with the supporting frame, the outer wall of the conveying belt is symmetrically provided with integrated frames, the inner wall of the conveying belt is provided with an auxiliary plate, the top end of the supporting frame is provided with a bearing frame, and the bearing frame is provided with an auxiliary plate. A material box is installed at the top end of the bearing frame, a rotating motor is installed at the bottom end of the material box, a rotating shaft is installed at the output end of the rotating motor, the surface of the rotating shaft is sleeved with a rotating disc, a plurality of sets of grooves are formed in the surface of the rotating disc at equal intervals, and the rotating disc penetrates through the lower portion of the material blocking frame and is in sliding connection with the material blocking frame. According to the utility model, the semiconductor devices can be conveniently and sequentially conveyed, the orientation of the semiconductor devices can be conveniently turned and adjusted, the semiconductor devices can be conveniently centered, clamped and straightened, and the input accuracy of the semiconductor devices is improved.

Description

Technical Field

[0001] This utility model relates to the field of feeding device technology, specifically a feeding device for a semiconductor device testing machine. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature falls between that of conductors and insulators. The conductivity of these materials can be controlled by external conditions such as temperature and light, allowing them to transition from insulators to conductors. The conductivity of semiconductors can also be adjusted through processes such as doping to meet different application requirements. Common semiconductor materials include silicon, germanium, and gallium arsenide, with silicon being the most influential and widely used in various semiconductor materials. After production, semiconductors need to be tested before they can be shipped. Traditional testing methods are mostly manual, which is slow. To improve the feeding and testing of semiconductors, a feeding device for a semiconductor device testing machine is proposed.

[0003] For example, a semiconductor testing and feeding device disclosed in the authorization announcement number CN220316454U includes a platform, an electrical distribution box installed at the bottom of the platform, guardrails fixedly connected to both sides of the platform, and a motor installed on the inner surface of the guardrails.

[0004] Although the pressing mechanism allows the device to adjust its height according to changes in the height of the semiconductor device, avoiding the problem that the pressure roller cannot be adjusted when the height of the semiconductor device changes, thus improving the versatility of the semiconductor testing and feeding device; the use of the straightening mechanism allows the device to be moved to the center position when it is tilted or placed on the edge, avoiding the problem that the current solution cannot automatically straighten the device and that the operator needs to manually straighten it when the device is tilted, thus improving the automation of the semiconductor testing and feeding device;

[0005] However, the existing feeding device does not solve the problem that it is not convenient to transport semiconductor devices sequentially and to flip and adjust the orientation of semiconductor devices during use, and it is not convenient to center and clamp the semiconductor devices, which affects the accuracy of semiconductor device input. Utility Model Content

[0006] The purpose of this utility model is to provide a feeding device for a semiconductor device testing machine, so as to solve the problems mentioned in the background art, which are not convenient for sequentially conveying semiconductor devices and conveniently flipping and adjusting the orientation of semiconductor devices, which are not conducive to centering and clamping the semiconductor devices, thus affecting the accuracy of semiconductor device input.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a feeding device for a semiconductor device testing machine, comprising a conveyor belt and a support frame. The support frame is installed at the top of the conveyor belt, and an integrated frame is symmetrically installed on the outer wall of the conveyor belt. An auxiliary plate is installed on the inner wall of the conveyor belt. A carrier frame is installed at the top of the support frame, and a material box is installed at the top of the carrier frame. A rotary motor is installed at the bottom of the material box, and a rotating shaft is installed at the output end of the rotary motor. A rotating disk is fitted on the surface of the rotating shaft, and multiple sets of equally spaced grooves are installed on the surface of the rotating disk. A baffle is installed on the inner wall of the material box, and the rotating disk passes through the bottom of the baffle and is slidably connected to the baffle. A conveying channel is installed on the outer wall of the material box, and the conveying channel is connected to the baffle.

[0008] Preferably, each integrated frame has a threaded rod movably installed inside, and each integrated frame has a lifting motor installed at its top, with the output end of the lifting motor connected to the threaded rod.

[0009] Preferably, the surface of the threaded rod is fitted with a threaded sleeve, and the threaded sleeve is threadedly connected to the threaded rod, and the threaded sleeve is slidably connected to the integrated frame.

[0010] Preferably, a flip seat is installed on the side wall of each threaded sleeve, a flip motor is installed on the inner wall of each flip seat, and a worm gear is installed at the output end of each flip motor, with the worm gear being movably connected to the flip seat.

[0011] Preferably, a flip shaft is movably installed inside the flip seat on one side of the worm, and the flip shaft extends to the outside of the flip seat. An adjustment frame is installed at one end of the flip shaft. A worm wheel is fitted on the surface of the flip shaft, and the worm wheel meshes with the worm.

[0012] Preferably, each of the adjustment frames has a linkage shaft symmetrically and movably installed inside, and gears and clamping arms are respectively installed on the surface of the linkage shaft.

[0013] Preferably, a clamping block is installed at the end of the clamping arm away from the adjustment frame, and a clamping motor is installed at the top of the adjustment frame.

[0014] Preferably, the output end of the clamping motor is connected to a set of linkage shafts, and the two sets of gears mesh with each other.

[0015] Compared with the prior art, the beneficial effects of this utility model are: the feeding device not only realizes the convenient sequential conveying of semiconductor devices and the convenient flipping and adjusting of the orientation of semiconductor devices, which facilitates the centering, clamping and straightening of semiconductor devices, but also improves the accuracy of semiconductor device input.

[0016] (1) The rotary motor drives the rotating disk to rotate through the rotating shaft, and the rotating disk drives the groove to rotate. The semiconductor device is embedded in the inside of the groove. The groove drives the semiconductor device to move to the inside of the baffle. Under the action of gravity and the slope, the semiconductor device is separated from the inside of the groove, passes through the baffle, slides down to the surface of the conveyor belt through the conveying channel, and is driven by the conveyor belt to move. With the action of the auxiliary plate, the semiconductor device is assisted to be conveyed to the middle position of the conveyor belt. Then the conveyor belt drives the semiconductor device to continue to move. When the semiconductor device moves between the clamping arms, the clamping motor drives a set of linkage shafts to rotate. A set of linkage shafts drives a set of gears to rotate. A set of gears drives another set of gears to rotate. The two sets of gears drive the clamping arms to rotate in opposite directions through the linkage shafts. The clamping arms drive the clamping blocks to rotate so that the clamping blocks contact the outer wall of the semiconductor device. With the cooperation of multiple sets of clamping blocks, the semiconductor device is clamped, centered and aligned to facilitate subsequent testing. This realizes convenient sequential conveying of semiconductor devices, facilitates the centering and clamping of semiconductor devices, and improves the accuracy of semiconductor device input.

[0017] (2) If the semiconductor device is facing up, after the clamping block clamps it, the lifting motor drives the threaded rod to rotate, the threaded rod drives the threaded sleeve to move upward, the threaded sleeve drives the flipping seat, the adjusting frame, the clamping arm and the clamping block to move upward, the flipping motor drives the worm to rotate, the worm drives the worm wheel to rotate, and the worm wheel drives the adjusting frame, the clamping arm, the clamping block and the semiconductor device to flip through the flipping shaft, so as to flip and adjust its orientation, thereby facilitating the testing machine to perform testing, and realizing convenient flipping and adjusting of the orientation of the semiconductor device. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0019] Figure 2 This is a top view of the structure of this utility model;

[0020] Figure 3 This is a three-dimensional structural diagram of the material box of this utility model;

[0021] Figure 4 This is a three-dimensional structural diagram of the rotating disk of this utility model;

[0022] Figure 5 This is a side cross-sectional view of the integrated frame of this utility model.

[0023] Figure 6 This is a three-dimensional perspective structural diagram of the adjustment frame of this utility model.

[0024] In the diagram: 1. Conveyor belt; 2. Support frame; 3. Material box; 4. Conveying channel; 5. Auxiliary plate; 6. Integrated frame; 7. Clamping arm; 8. Rotary disc; 9. Rotating shaft; 10. Groove; 11. Material stop; 12. Rotary motor; 13. Threaded sleeve; 14. Lifting motor; 15. Threaded rod; 16. Tilting motor; 17. Tilting seat; 18. Adjusting frame; 19. Worm gear; 20. Worm wheel; 21. Linkage shaft; 22. Gear; 23. Clamping block; 24. Tilting shaft; 25. Clamping motor; 26. Bearing frame. Detailed Implementation

[0025] To further illustrate the technical means and effects adopted by this utility model in order to achieve the intended utility model purpose, the following detailed description of the specific implementation methods, structure, features and effects of this utility model is provided in conjunction with the accompanying drawings and preferred embodiments.

[0026] Please see Figure 1-6 The present invention provides an embodiment of a semiconductor device testing machine feeding device, comprising a conveyor belt 1 and a support frame 2. The support frame 2 is installed at the top of the conveyor belt 1. An integrated frame 6 is symmetrically installed on the outer wall of the conveyor belt 1. An auxiliary plate 5 is installed on the inner wall of the conveyor belt 1. A bearing frame 26 is installed at the top of the support frame 2. A material box 3 is installed at the top of the bearing frame 26. A rotary motor 12 is installed at the bottom of the material box 3. The rotary motor 12 serves as a power drive. A rotating shaft 9 is installed at the output end of the rotary motor 12. A rotating disk 8 is fitted on the surface of the rotating shaft 9. Multiple sets of grooves 10 with equal spacing are installed on the surface of the rotating disk 8. A baffle 11 is installed on the inner wall of the material box 3. The rotating disk 8 passes through the bottom of the baffle 11 and is slidably connected to the baffle 11. A conveying channel 4 is installed on the outer wall of the material box 3 and is connected to the baffle 11.

[0027] A large number of circular semiconductor devices to be tested are placed inside the material box 3. The rotary motor 12 is turned on, and the rotary motor 12 drives the rotating disk 8 to rotate via the rotating shaft 9. The rotating disk 8 drives the groove 10 to rotate, and the semiconductor devices are embedded inside the groove 10. The groove 10 moves the semiconductor devices to the inside of the retainer 11. Under the action of gravity and the slope, the semiconductor devices are released from the inside of the groove 10, pass through the retainer 11, and slide down through the conveyor channel 4 onto the surface of the conveyor belt 1. The conveyor belt 1 is turned on, and the conveyor belt 1 moves the semiconductor devices. With the help of the auxiliary plate 5, the semiconductor devices are assisted in being conveyed to the middle position of the conveyor belt 1. Then the conveyor belt 1 continues to move the semiconductor devices. When the device moves between the clamping arms 7, the clamping motor 25 is turned on, which drives a set of linkage shafts 21 to rotate. The set of linkage shafts 21 drives a set of gears 22 to rotate. Under the mutual meshing of the two sets of gears 22, one set of gears 22 drives the other set of gears 22 to rotate. The two sets of gears 22 drive the clamping arms 7 to rotate in opposite directions through the linkage shafts 21. The clamping arms 7 drive the clamping blocks 23 to rotate, so that the clamping blocks 23 contact the outer wall of the semiconductor device. With the cooperation of multiple sets of clamping blocks 23, the semiconductor device is clamped, centered and aligned to facilitate subsequent testing. This realizes convenient sequential delivery of semiconductor devices, facilitates the centering and clamping of semiconductor devices, and improves the accuracy of semiconductor device input.

[0028] The integrated frame 6 has a threaded rod 15 installed inside, and a lifting motor 14 is installed at the top of the integrated frame 6. The lifting motor 14 plays a power driving role, and the output end of the lifting motor 14 is connected to the threaded rod 15. The surface of the threaded rod 15 is fitted with a threaded sleeve 13, and the threaded sleeve 13 is threadedly connected to the threaded rod 15, and the threaded sleeve 13 is slidably connected to the integrated frame 6.

[0029] A flip seat 17 is installed on the side wall of the threaded sleeve 13. A flip motor 16 is installed on the inner wall of the flip seat 17. The flip motor 16 serves as a power drive. A worm 19 is installed at the output end of the flip motor 16. The worm 19 is movably connected to the flip seat 17. A flip shaft 24 is movably installed inside the flip seat 17 on one side of the worm 19. The flip shaft 24 extends to the outside of the flip seat 17. An adjustment frame 18 is installed at one end of the flip shaft 24. A worm wheel 20 is fitted on the surface of the flip shaft 24. The worm wheel 20 meshes with the worm 19.

[0030] The internal components of the adjustment frame 18 are symmetrically and movably equipped with linkage shafts 21. Gears 22 and clamping arms 7 are respectively installed on the surface of the linkage shafts 21. A clamping block 23 is installed at the end of the clamping arm 7 away from the adjustment frame 18. A clamping motor 25 is installed at the top of the adjustment frame 18. The clamping motor 25 plays the role of power drive.

[0031] The output end of the clamping motor 25 is connected to a set of linkage shafts 21, and the two sets of gears 22 mesh with each other;

[0032] If the semiconductor device is facing up, after the clamping block 23 has clamped it, the lifting motor 14 is turned on, which drives the threaded rod 15 to rotate. With the threaded connection between the threaded rod 15 and the threaded sleeve 13, and the sliding engagement between the threaded sleeve 13 and the integrated frame 6, the threaded rod 15 drives the threaded sleeve 13 to move upward. The threaded sleeve 13 then drives the flipping seat 17, the adjusting frame 18, the clamping arm 7, and the clamping block 23 to move upward. After that, the flipping motor 16 is turned on, which drives the worm gear 19 to rotate. With the meshing between the worm gear 19 and the worm wheel 20, the worm gear 19 drives the worm wheel 20 to rotate. The worm wheel 20 drives the adjusting frame 18, the clamping arm 7, the clamping block 23, and the semiconductor device to flip and adjust their orientation through the flipping shaft 24. This facilitates testing on the testing machine and enables convenient flipping and adjustment of the semiconductor device's orientation.

[0033] Working principle: A large number of circular semiconductor devices to be tested are placed inside the material box 3. The rotary motor 12 drives the rotating disk 8 to rotate via the rotating shaft 9. The rotating disk 8 drives the groove 10 to rotate, and the semiconductor devices are embedded inside the groove 10. The groove 10 moves the semiconductor devices to the inside of the retainer 11. Under the action of gravity and the slope, the semiconductor devices are released from the groove 10, pass through the retainer 11, and slide down through the conveyor channel 4 onto the surface of the conveyor belt 1. The conveyor belt 1 moves the semiconductor devices to the middle position of the conveyor belt 1. Then the conveyor belt 1 continues to move the semiconductor devices. When the semiconductor devices move between the clamping arms 7, the clamping motor 25 drives a set of linkage shafts 21 to rotate. The set of linkage shafts 21 drives a set of gears 22 to rotate. Under the mutual meshing of the two sets of gears 22, one set of gears 22 drives the other set of gears 22 to rotate. 22 drives the clamping arms 7 to rotate in opposite directions via the linkage shaft 21. The clamping arms 7 drive the clamping blocks 23 to rotate, so that the clamping blocks 23 contact the outer wall of the semiconductor device. With the cooperation of multiple sets of clamping blocks 23, the semiconductor device is clamped, centered and aligned to facilitate subsequent testing. If the semiconductor device is facing up, after the clamping blocks 23 have clamped it, the lifting motor 14 drives the threaded rod 15 to rotate. The threaded rod 15 drives the threaded sleeve 13 to move upward. The threaded sleeve 13 drives the flipping seat 17, the adjusting frame 18, the clamping arms 7 and the clamping blocks 23 to move upward. The flipping motor 16 drives the worm gear 19 to rotate. The worm gear 19 drives the worm wheel 20 to rotate. The worm wheel 20 drives the adjusting frame 18, the clamping arms 7, the clamping blocks 23 and the semiconductor device to flip and align them, so as to facilitate testing by the testing machine and complete the use of the semiconductor device testing machine feeding device.

[0034] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A feeding device for a semiconductor device testing machine, comprising a conveyor belt (1) and a support frame (2), characterized in that: A support frame (2) is installed at the top of the conveyor belt (1). An integrated frame (6) is symmetrically installed on the outer wall of the conveyor belt (1). An auxiliary plate (5) is installed on the inner wall of the conveyor belt (1). A bearing frame (26) is installed at the top of the support frame (2). A material box (3) is installed at the top of the bearing frame (26). A rotary motor (12) is installed at the bottom of the material box (3). A rotating shaft (9) is installed at the output end of the rotary motor (12). A rotating disk (8) is fitted on the surface of the rotating shaft (9). Multiple sets of grooves (10) with equal spacing are installed on the surface of the rotating disk (8). A baffle (11) is installed on the inner wall of the material box (3). The rotating disk (8) passes under the baffle (11) and is slidably connected to the baffle (11). A conveying channel (4) is installed on the outer wall of the material box (3). The conveying channel (4) is connected to the baffle (11).

2. The feeding device for a semiconductor device testing machine according to claim 1, characterized in that: Each integrated frame (6) has a threaded rod (15) movably installed inside, and a lifting motor (14) is installed at the top of each integrated frame (6), with the output end of the lifting motor (14) connected to the threaded rod (15).

3. The feeding device for a semiconductor device testing machine according to claim 2, characterized in that: The surface of the threaded rod (15) is fitted with a threaded sleeve (13), and the threaded sleeve (13) is threadedly connected to the threaded rod (15), and the threaded sleeve (13) is slidably connected to the integrated frame (6).

4. The feeding device for a semiconductor device testing machine according to claim 3, characterized in that: Each threaded sleeve (13) has a flip seat (17) installed on its side wall, and each flip seat (17) has a flip motor (16) installed on its inner wall. Each flip motor (16) has a worm (19) installed at its output end, and the worm (19) is movably connected to the flip seat (17).

5. The feeding device for a semiconductor device testing machine according to claim 4, characterized in that: A rotating shaft (24) is movably installed inside the rotating seat (17) on one side of the worm (19), and the rotating shaft (24) extends to the outside of the rotating seat (17). An adjustment frame (18) is installed at one end of the rotating shaft (24). A worm wheel (20) is fitted on the surface of the rotating shaft (24), and the worm wheel (20) meshes with the worm (19).

6. The feeding device for a semiconductor device testing machine according to claim 5, characterized in that: The internal components of the adjustment frame (18) are symmetrically and movably mounted with linkage shafts (21), and gears (22) and clamping arms (7) are respectively mounted on the surface of the linkage shafts (21).

7. The feeding device for a semiconductor device testing machine according to claim 6, characterized in that: Each clamping arm (7) is equipped with a clamping block (23) at the end away from the adjustment frame (18), and each adjustment frame (18) is equipped with a clamping motor (25) at the top.

8. The feeding device for a semiconductor device testing machine according to claim 7, characterized in that: The output end of the clamping motor (25) is connected to a set of linkage shafts (21), and the two sets of gears (22) mesh with each other.

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