Temperature control device and temperature control system

Abstract

The utility model provides a temperature control system and a temperature control device. The temperature control system comprises a power supply, coating equipment, a temperature control device and a controller. The coating equipment comprises a furnace tube and a heating assembly. The temperature control device comprises a temperature sensing module, a silicon controlled rectifier trigger board and a silicon controlled rectifier control module. The temperature sensing module is used for sensing the temperature of a thermal field in the coating equipment and generating a temperature sensing signal; the silicon controlled trigger board processes the temperature sensing signal and then outputs a temperature conversion signal. The silicon controlled rectifier control module comprises a plurality of silicon controlled rectifier devices, a signal transmission unit and a control unit. Each silicon controlled device establishes an electrical connection between the power supply and the heating assembly to form a plurality of thermal field paths. And the controller reads the current current in each silicon controlled device through the signal transmission unit. Rated current is set in the controller, and the controller compares the current current with the rated current and controls the corresponding silicon controlled rectifier device to be switched between a conducting state and a cut-off state according to a comparison result.

Description

Technical Field

[0001] This application relates to the field of battery cell processing technology, and in particular to a temperature control device and a temperature control system. Background Technology

[0002] Plasma-enhanced chemical vapor deposition (PECVD) is a commonly used thin film deposition technique in the semiconductor industry. This technique combines the basic principles of chemical vapor deposition (CVD) with plasma technology, enabling the production of high-quality thin films with precise control over their properties. Unlike traditional CVD, PECVD uses plasma to improve deposition efficiency, allowing material deposition at lower temperatures. Current technologies typically employ solid-state relays for temperature control. However, frequent switching on and off of the solid-state relay during temperature control can lead to excessively high temperatures, potentially causing it to burn out. Furthermore, solid-state relays cannot monitor current. Utility Model Content

[0003] In view of the above, it is necessary to provide a temperature control device and a temperature control system that can realize current monitoring and reduce the problem of easy burn-out of devices during temperature control.

[0004] A first aspect of this application provides a temperature control system, the temperature control system comprising:

[0005] A power supply is used to provide power voltage.

[0006] Coating equipment, which includes furnace tubes and heating components;

[0007] A temperature control device includes a temperature sensing module, a SCR trigger board, and a SCR control module. The temperature sensing module senses the temperature of the thermal field within the coating equipment and generates a temperature sensing signal. The SCR trigger board is electrically connected to the temperature sensing module and processes the temperature sensing signal to output a temperature conversion signal. The SCR control module is electrically connected to the SCR trigger board, a power supply, and a heating assembly. The SCR control module includes multiple SCR devices, a signal transmission unit, and a control unit. Each SCR device establishes an electrical connection between the power supply and the heating assembly to form multiple thermal field paths. The signal transmission unit transmits the current current within each SCR device.

[0008] The controller reads the current current in each thyristor through the signal transmission unit; the controller has a rated current set inside, and compares the current current with the rated current and controls the corresponding thyristor to switch between the on and off states based on the comparison result.

[0009] In some embodiments, when the current is greater than the rated current, the controller outputs a cutoff control signal to the signal transmission unit, and the signal transmission unit is further configured to output the cutoff control signal to the control unit, and the control unit controls the corresponding thyristor device to switch to the cutoff state according to the cutoff control signal; when the current is less than or equal to the rated current, the controller outputs a conduction control signal to the signal transmission unit; the signal transmission unit is further configured to output a conduction control signal to the control unit, and the control unit controls the corresponding thyristor device to switch to the conduction state according to the conduction control signal.

[0010] In some embodiments, the connection between the controller and the signal transmission unit adopts RS485 two-wire system and uses the Modbus Remote Terminal Unit (RTU) mode standard protocol for data communication.

[0011] In some embodiments, the signal transmission unit includes multiple communication terminals and multiple contact terminals; the communication terminals are electrically connected to the controller for data communication with the controller; the contact terminals are electrically connected to the thyristor trigger board to receive temperature processing signals.

[0012] In some embodiments, the temperature sensing signal includes a positive signal and a negative signal; the thyristor trigger board has multiple connection terminals and a common terminal; the connection terminals are used to receive the positive signal, and the common terminal is used to receive the negative signal; each contact terminal is electrically connected to a connection terminal or a common terminal.

[0013] A second aspect of this application provides a temperature control device for sensing the temperature of a thermal field within a coating apparatus and for data communication with a controller; the temperature control device includes:

[0014] Temperature sensing module: The temperature sensing module is used to sense the temperature of the thermal field inside the coating equipment and generate a temperature sensing signal.

[0015] The thyristor trigger board is electrically connected to the temperature sensing module and is used to process the temperature sensing signal and output a temperature conversion signal; and

[0016] The thyristor control module is electrically connected to the thyristor trigger board, power supply, and heating components within the coating equipment. The thyristor control module includes multiple thyristor devices, a signal transmission unit, and a control unit. Each thyristor device is used to establish an electrical connection between the power supply and the heating components to form multiple thermal field paths. The signal transmission unit is used to send the current in each thyristor device to the controller.

[0017] In some embodiments, when the current is greater than the rated current, the controller outputs a cutoff control signal to the signal transmission unit, and the signal transmission unit is further configured to output the cutoff control signal to the control unit, and the control unit controls the corresponding thyristor device to switch to the cutoff state according to the cutoff control signal; when the current is less than or equal to the rated current, the controller outputs a conduction control signal to the signal transmission unit; the signal transmission unit is further configured to output a conduction control signal to the control unit, and the control unit controls the corresponding thyristor device to switch to the conduction state according to the conduction control signal.

[0018] In some embodiments, the connection between the controller and the signal transmission unit adopts RS485 two-wire system and uses the Modbus Remote Terminal Unit (RTU) mode standard protocol for data communication.

[0019] In some embodiments, the signal transmission unit includes multiple communication terminals and multiple contact terminals; the communication terminals are electrically connected to the controller for data communication with the controller; the contact terminals are electrically connected to the thyristor trigger board to receive temperature processing signals.

[0020] In some embodiments, the temperature sensing signal includes a positive signal and a negative signal; the thyristor trigger board has multiple connection terminals and a common terminal; the connection terminals are used to receive the positive signal, and the common terminal is used to receive the negative signal; each contact terminal is electrically connected to a connection terminal or a common terminal.

[0021] The temperature control device and system provided in this application utilize the thermal path between the power supply of the thyristor and the heating component. Control of the thermal path is achieved through the on / off switching of the thyristor, preventing burnout of the thyristor even during frequent switching. Communication between the controller and the thyristor is established using a signal transmission unit, enabling real-time reading of the current within the thyristor and providing real-time feedback on the heating status of the heating wire within the coating equipment. In case of an anomaly, the controller can quickly disconnect the thermal path, achieving a rapid response. Attached Figure Description

[0022] Figure 1 A schematic diagram of the temperature control system provided in this application.

[0023] Figure 2 for Figure 1 A partial schematic diagram of the coating equipment.

[0024] Figure 3 for Figure 1 A schematic diagram of the medium temperature control device module.

[0025] Figure 4 for Figure 3 A schematic diagram of the thyristor control module.

[0026] Explanation of main component symbols

[0027] 1. Temperature control system; 100. Temperature control device; 200. Coating equipment; 300. Controller; 400. Power supply; 201. Furnace tube; 203. Heating assembly; 2031. Heating resistance wire; 10. Temperature sensing module; 20. Thyristor trigger board; 30. Thyristor control module; 31_1~31_n. Thyristor device; 32. Signal transmission unit; 321_1~321_m. Communication terminal; 322_~322_k. Contact terminal; 34. Control unit.

[0028] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0029] In the description of the embodiments of this application, when an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an element centrally located simultaneously. When an element is considered to be "set" on another element, it can be directly set on the other element or there may be an element centrally located simultaneously. In this application, unless otherwise expressly specified and limited, the terms "installed," "connected," "attached," "fixed," etc., should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances. The directional descriptions in this embodiment, such as "up," "down," "top," "bottom," etc., are all based on the direction of the product in the actual use scenario.

[0030] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0031] Plasma-enhanced chemical vapor deposition (PECVD) is a commonly used thin film deposition technique in the semiconductor industry. This technique combines the basic principles of chemical vapor deposition (CVD) with plasma technology, enabling the production of high-quality thin films with precise control over their properties. Unlike traditional CVD, PECVD uses plasma to improve deposition efficiency, allowing material deposition at lower temperatures. Current technologies typically employ solid-state relays for temperature control. However, frequent switching on and off of the solid-state relay during temperature control can lead to excessively high temperatures, potentially causing it to burn out. Furthermore, solid-state relays cannot monitor or control current.

[0032] Therefore, this application provides a temperature control system that can achieve the technical effects of current monitoring and reducing the risk of device burnout during temperature control.

[0033] Figure 1 This is a schematic diagram of a temperature control system 1 provided in this application. The temperature control system 1 includes a temperature control device 100, a coating equipment 200, a controller 300, and a power supply 400. The temperature control system 1 uses the temperature control device 100 to control the temperature of the thermal field of the coating equipment 200. In at least one embodiment of this application, the coating equipment 200 has a tubular structure and is used to deposit a thin film on the surface of a sheet-like material (not shown). The sheet-like material is a raw material for solar cells, including but not limited to silicon wafers and silicon carbide wafers. The thin film deposition process can be, but is not limited to, plasma-enhanced chemical vapor deposition (PECVD).

[0034] The coating apparatus 200 includes a furnace tube 201 and a heating assembly 203. The heating assembly 203 is wound around the outer wall of the furnace tube 201. In at least one embodiment of this application, the heating assembly 203 includes multiple heating resistance wires 2031 (e.g., Figure 2 (As shown).

[0035] Please see Figure 3 This is a schematic diagram of the temperature control device 100. The temperature control device 100 includes a temperature sensing module 10, a silicon controlled rectifier (SCR) trigger board 20, and a SCR control module 30.

[0036] The temperature sensing module 10 is used to sense the temperature of the thermal field within the coating equipment 200 and output a temperature sensing signal. Specifically, the temperature sensing module 10 is used to sense the temperature at different locations within the coating equipment 200 and output corresponding temperature sensing signals. The temperature sensing module 10 is electrically connected to the thyristor trigger board 20 via traces (not shown). In at least one embodiment of this application, the traces of the temperature sensing module 10 are electrically connected to the thyristor trigger board 20 via a low-voltage tank to transmit the temperature sensing signal. The temperature sensing signal includes a positive signal and a negative signal. In at least one embodiment of this application, the temperature sensing signal is an analog signal. In at least one embodiment of this application, the temperature sensing module 10 can be a temperature sensing chip.

[0037] The thyristor trigger board 20 is electrically connected to the temperature sensing module 10. The thyristor trigger board 20 processes the received temperature sensing signal and outputs multiple temperature conversion signals to the thyristor control module 30. In at least one embodiment of this application, the thyristor trigger board 20 has multiple connection terminals and a common terminal. The multiple connection terminals receive positive signals through wiring, and the common terminal receives negative signals through wiring. In at least one embodiment of this application, the thyristor trigger board 20 can be used to amplify the temperature sensing signal or perform other types of signal processing on the temperature sensing signal.

[0038] Please refer to the following: Figure 4 This is a schematic diagram of the SCR control module 30. The SCR control module 30 is electrically connected to the SCR trigger board 20, the power supply 400, and the heating assembly 203. The SCR control module 30 includes a plurality of SCR devices 31_1 to 31_n, at least one signal transmission unit 32, and a control unit 34. Here, n is a positive integer greater than or equal to 1. In at least one embodiment of this application, the SCR control module 30 may include one signal transmission unit 32; in other embodiments, the SCR control module 30 may include two signal transmission units 32.

[0039] Each SCR device 31_1~31_n has one end electrically connected to the power supply 400 and the other end electrically connected to the heating assembly 203. In at least one embodiment of this application, the SCR control module 30 includes 24 SCR devices 31_1~31_24. Each SCR device 31_1~31_n is used to establish an electrical connection between the power supply 400 and a heating resistor 2031 when it is turned on, so as to form multiple thermal field paths, and to disconnect the electrical connection between the power supply 400 and the corresponding heating resistor 2031 when it is turned off, so as to cut off the corresponding thermal field path.

[0040] The signal transmission unit 32 is electrically connected to the thyristor trigger board 20 and the controller 300. The signal transmission unit 32 is used to send the temperature conversion signal output by the thyristor trigger board 20 and the current current within each thyristor device 31 to the controller 300, receive multiple control signals output by the controller 300, and provide them to the control unit 34. The signal transmission unit 32 includes multiple communication terminals 321_1~321_m and multiple contact terminals 322_1~322_k. Wherein, m and k are positive integers greater than 1, and k is greater than or equal to n. The communication terminals 321a~321n are electrically connected to the controller 300 for data communication with the controller 300. In at least one embodiment of this application, the connection between the communication terminals 321_1~321_m and the controller 300 adopts an RS485 two-wire system, and the two communicate using the Modbus Remote Terminal Unit (RTU) mode standard protocol. In at least one embodiment of this application, the signal transmission unit 32 has four communication terminals 322_1 to 322_4. Contact terminals 322_1 to 322_k are used for electrical connection with the thyristor trigger board 20 to receive temperature conversion signals. In at least one embodiment of this application, some contact terminals 322_1 to 322_k are electrically connected to the connection terminals of the thyristor trigger board 20, while the other contact terminals 322_1 to 322_k are electrically connected to the common terminal of the thyristor trigger board 20.

[0041] The control unit 34 is electrically connected to the signal transmission unit 32 and the thyristor devices 31_1 to 31_n. The control unit 34 is used to control the corresponding thyristor devices 31_1 to 31_n to switch to the on or off state according to the control signal received by the signal transmission unit 32.

[0042] The controller 300 can communicate with the temperature control device 100. The controller 300 has a rated current and a preset duty cycle. The controller 300 compares the received current with the rated current and outputs a control signal to the temperature control device 100 based on the comparison result. When the current is greater than the rated current, the controller 300 outputs a cutoff control signal to the signal transmission unit 32; when the current is less than or equal to the rated current, the controller 300 outputs a conduction control signal to the signal transmission unit 32. The controller 300 also outputs a power adjustment signal according to the preset duty cycle. The power adjustment signal is used to adjust the heating power of the heating resistance wire 2031, thereby adjusting the current in the heating channel. In at least one embodiment of this application, the controller 300 is a programmable logic controller (PLC). In other embodiments, the controller 300 can be selected from other types of controllers as needed.

[0043] The power supply 400 is electrically connected to the temperature control device 100. The power supply 400 is used to provide a power supply voltage. In at least one embodiment of this application, the power supply 400 is used to provide 220 volts (V) alternating current.

[0044] The specific working principle of temperature control system 1 is as follows:

[0045] The temperature sensing module 10 senses the temperature of the thermal field within the coating equipment 200 and outputs a temperature sensing signal to the thyristor trigger board 20. The thyristor trigger board 20 processes the temperature sensing signal and outputs a temperature conversion signal to the signal transmission unit 32 in the thyristor control module 30. The signal transmission unit 32 acquires the current current of each thyristor device 31_1~31_n and transmits the temperature sensing signal to the controller 300. The controller 300 compares the current current of each thyristor device 31_1~31_n with the rated current. When the current current is greater than or equal to the rated current, the controller 300 outputs a cutoff control signal to the signal transmission unit 32; when the current current is less than or equal to the rated current, the controller 300 outputs a conduction control signal to the signal transmission unit 32. The signal transmission unit 32 sends the multiple cutoff or conduction control signals output by the controller 300 to the control unit 34. The control unit 34 controls the corresponding thyristors 31_1~31_n to switch to the cutoff state according to the cutoff control signal, and controls the corresponding thyristors 31_1~31_n to switch to the on state according to the on control signal. The signal transmission unit 32 is also used to send the power adjustment signal output by the controller 300 to the control unit 34. The control unit 34 further adjusts the current in the thyristors 31_1~31_n according to the power adjustment signal to adjust the heating power of the heating wire 2031.

[0046] The aforementioned temperature control system 1 and temperature control device 100 utilize silicon controlled rectifiers (SCRs) 31_1 to 31_n to establish a thermal path between the power supply 400 and the heating component 203. Control of the thermal path is achieved by switching the SCRs 31_1 to 31_n on and off. Frequent switching of the SCRs 31_1 to 31_n will not cause them to burn out. Communication between the controller 300 and the SCRs 31_1 to 31_n is established using the signal transmission unit 32, enabling real-time reading of the current within the SCRs 31_1 to 31_n and providing real-time feedback on the heating status of the heating resistance wire 2031 within the coating equipment 200. In case of an anomaly, the controller 300 can quickly disconnect the thermal path, achieving a rapid response.

[0047] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A temperature control system, characterized in that, The temperature control system includes: A power supply is used to provide power voltage. A coating equipment, the coating equipment including a furnace tube and a heating assembly; A temperature control device includes a temperature sensing module, a silicon controlled rectifier (SCR) trigger board, and a SCR control module. The temperature sensing module senses the temperature of the thermal field within the coating equipment and generates a temperature sensing signal. The SCR trigger board is electrically connected to the temperature sensing module and processes the temperature sensing signal to output a temperature conversion signal. The SCR control module is electrically connected to the SCR trigger board, the power supply, and the heating assembly. The SCR control module includes multiple SCR devices, a signal transmission unit, and a control unit. Each SCR device establishes an electrical connection between the power supply and the heating assembly to form multiple thermal field paths. The signal transmission unit transmits the current current within each SCR device. The controller reads the current current in each of the silicon controlled rectifiers (SCRs) through the signal transmission unit; the controller is equipped with a rated current, and compares the current current with the rated current and controls the corresponding SCR to switch between the on and off states based on the comparison result.

2. The temperature control system according to claim 1, characterized in that, When the current is greater than the rated current, the controller outputs a cutoff control signal to the signal transmission unit. The signal transmission unit is also used to output the cutoff control signal to the control unit. The control unit controls the corresponding thyristor device to switch to the cutoff state according to the cutoff control signal. When the current is less than or equal to the rated current, the controller outputs a conduction control signal to the signal transmission unit; the signal transmission unit is also used to output the conduction control signal to the control unit, and the control unit controls the corresponding thyristor device to switch to the conduction state according to the conduction control signal.

3. The temperature control system according to claim 1, characterized in that, The connection between the controller and the signal transmission unit adopts RS485 two-wire system and uses the Modbus Remote Terminal Unit (RTU) mode standard protocol for data communication.

4. The temperature control system according to claim 1, characterized in that, The signal transmission unit includes multiple communication terminals and multiple contact terminals; the communication terminals are electrically connected to the controller for data communication with the controller; the contact terminals are electrically connected to the thyristor trigger board to receive the temperature conversion signal.

5. The temperature control system according to claim 4, characterized in that, The temperature sensing signal includes a positive signal and a negative signal; the thyristor trigger board has multiple connection terminals and a common terminal; the connection terminals are used to receive the positive signal, and the common terminal is used to receive the negative signal; each contact terminal is electrically connected to one of the connection terminals or the common terminal.

6. A temperature control device for sensing the temperature of a thermal field within a coating equipment and communicating data with a controller; the controller is equipped with a rated current; characterized in that, The temperature control device includes: A temperature sensing module is used to sense the temperature of the thermal field inside the coating equipment and generate a temperature sensing signal. A thyristor trigger board, electrically connected to the temperature sensing module, is used to process the temperature sensing signal and output a temperature conversion signal; and A thyristor control module is electrically connected to the thyristor trigger board, the power supply, and the heating component within the coating equipment. The thyristor control module includes multiple thyristor devices, a signal transmission unit, and a control unit. Each thyristor device is used to establish an electrical connection between the power supply and the heating component to form multiple thermal field paths. The signal transmission unit is used to send the current in each thyristor device to the controller.

7. The temperature control device according to claim 6, characterized in that, When the current is greater than the rated current, the controller outputs a cutoff control signal to the signal transmission unit. The signal transmission unit is also used to output the cutoff control signal to the control unit. The control unit controls the corresponding thyristor device to switch to the cutoff state according to the cutoff control signal. When the current is less than or equal to the rated current, the controller outputs a conduction control signal to the signal transmission unit; the signal transmission unit is also used to output the conduction control signal to the control unit, and the control unit controls the corresponding thyristor device to switch to the conduction state according to the conduction control signal.

8. The temperature control device according to claim 6, characterized in that, The connection between the controller and the signal transmission unit adopts RS485 two-wire system and uses the Modbus Remote Terminal Unit (RTU) mode standard protocol for data communication.

9. The temperature control device according to claim 6, characterized in that, The signal transmission unit includes multiple communication terminals and multiple contact terminals; the communication terminals are electrically connected to the controller for data communication with the controller; the contact terminals are electrically connected to the thyristor trigger board to receive the temperature conversion signal.

10. The temperature control device according to claim 9, characterized in that, The temperature sensing signal includes a positive signal and a negative signal; the thyristor trigger board has multiple connection terminals and a common terminal; the connection terminals are used to receive the positive signal, and the common terminal is used to receive the negative signal; each contact terminal is electrically connected to one of the connection terminals or the common terminal.

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