Plating bath with adjustable in-bath space

By designing an adjustable space within the electroplating tank and using sliders and connecting rods to connect the circuit board and ion exchange membrane, the problem of wasted space caused by fixed electroplating tank dimensions is solved, enabling flexible adjustment and efficient utilization of the space within the electroplating tank.

CN223620514UActive Publication Date: 2025-12-02SHANGHAI RIME ELECTRONICS EQUIP CO LTD
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Patent Information

Application Number
CN202423322947.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-31
Publication Date
2025-12-02
Estimated Expiration
2034-12-31

AI Technical Summary

Technical Problem

The existing electroplating tanks have fixed dimensions, which means that the production site needs to be equipped with multiple electroplating tanks of different sizes and specifications, resulting in a waste of production space.

Method used

Design an electroplating tank with adjustable internal space. The circuit board and ion exchange membrane are connected by a slider and a telescopic connecting rod, so that the internal space of the tank can be adjusted. The position of the circuit board and ion exchange membrane can be adjusted by moving the slider, and the tank can be divided into multiple electroplating chambers of different sizes.

Benefits of technology

This reduces the waste of production space caused by the need to equip multiple tanks due to different electroplating tank sizes, improves space utilization, and reduces the risk of movement and damage during the electroplating process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to an electroplating bath with an adjustable space in the bath, and relates to the technical field of electroplating baths, the electroplating bath comprises a bath body with an opening in the top, a plurality of electroplating assemblies are arranged in the bath body, each electroplating assembly comprises a pair of circuit boards, a workpiece hanging plate is arranged between the circuit boards, and an ion exchange membrane is arranged on the side, close to the workpiece hanging plate, of each circuit board; sliding rails are arranged on the two sides of the tank body respectively, the circuit board is connected with the sliding rails through first sliding blocks, the ion exchange membrane is connected with the sliding rails through second sliding blocks, and the workpiece hanging plate is connected with the sliding rails through third sliding blocks. The first sliding block and the second sliding block are connected through a telescopic connecting rod. The electroplating bath has the advantages that the internal space of the electroplating bath can be adjusted, and production space waste caused by the fact that electroplating baths of various sizes are arranged is reduced.
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Description

Technical Field

[0001] This application relates to the technical field of electroplating tanks, and in particular to an electroplating tank with adjustable internal space. Background Technology

[0002] In the electroplating process, the electroplating tank, as a key basic component, plays an important role in containing the electroplating solution to achieve various electroplating operations such as zinc plating, copper plating, nickel plating, and gold plating.

[0003] In actual electroplating production operations, the size of the electroplating tank is generally calculated and selected based on the scale of the electroplating process or in combination with existing DC power supply equipment and other practical conditions to meet the electroplating requirements of the workpiece. The size of the electroplating tank refers to the volume of the inner cavity used to hold the electrolyte, and its value is obtained by multiplying the length of the inner cavity, the width of the inner cavity, and the depth of the electrolyte.

[0004] Currently, the size of electroplating tanks is fixed, requiring multiple tanks of different sizes to meet varying electroplating needs. However, this results in multiple tanks occupying significant space in the production area, leading to a waste of production space resources. Summary of the Invention

[0005] The purpose of this application is to provide an electroplating tank with adjustable internal space, thereby reducing the waste of production space caused by equipping electroplating tanks of various sizes.

[0006] An electroplating tank with adjustable internal space includes a tank body with an open top. Several electroplating components are disposed within the tank body. Each electroplating component includes a pair of circuit boards, with a workpiece mounting plate disposed between the pair of circuit boards. An ion exchange membrane is disposed on the side of each circuit board near the workpiece mounting plate. Slide rails are respectively disposed on both sides of the tank body. The circuit boards are connected to the slide rails via a first slider, the ion exchange membrane is connected to the slide rails via a second slider, and the workpiece mounting plate is connected to the slide rails via a third slider. The first slider and the second slider are connected by a retractable connecting rod.

[0007] Through the above technical solution, the movement of the first slider, which in turn drives the movement of the second slider, enables the movement of the circuit board and the ion exchange membrane. This allows for the adjustment of the internal space of the tank, dividing it into multiple spaces of different sizes, making it suitable for electroplating workpieces of various sizes. The first slider and the second slider are connected by a telescopic connecting rod, further improving the adjustability of the circuit board and the ion exchange membrane, making fuller use of the space within the tank, and reducing the waste of production space caused by equipping electroplating tanks of various sizes.

[0008] Optionally, the connecting rod includes a first connecting part connected to the first slider, the first connecting part being sleeved inside a second connecting part, and the end of the second connecting part away from the first connecting part being connected to the second slider; a locking member is provided between the first connecting part and the second connecting part.

[0009] By using the above technical solution, the first connecting part is sleeved in the second connecting part, and the locking member is provided, the spacing between the ion exchange membrane and the circuit board can be adjusted, further improving the operability of spatial separation.

[0010] Optionally, the ion exchange membrane has a frame on its outer side, and a connecting plate is provided on the frame. The connecting plate is detachably connected to the second slider.

[0011] Through the above technical solution, the ion exchange membrane and the second slider are detachably connected, which facilitates the replacement of the ion exchange membrane.

[0012] Optionally, a reinforcing plate is provided on the periphery of the frame, and the reinforcing plate abuts against the inner wall of the groove.

[0013] By using the above technical solutions, the reinforcing plate is provided on the periphery of the frame, which further improves the strength of the frame, reduces the offset of the frame when the ion exchange membrane is moved, and reduces damage to the ion exchange membrane.

[0014] Optionally, the first slider is provided with a first connecting hole, and a first tightening bolt is provided in the first connecting hole, the first tightening bolt abutting against the slide rail.

[0015] Through the above technical solution, when the first slider moves to the target position, the position of the first slider is fixed by the first tightening bolt, and the position of the second slider is also fixed, which reduces the movement of the circuit board and the ion exchange membrane during use and the impact on the electroplating work.

[0016] Optionally, the third slider is provided with a second connecting hole, and a second tightening bolt is provided in the second connecting hole, the second tightening bolt abutting against the slide rail.

[0017] Through the above technical solution, after the workpiece is adjusted to a suitable position by the third slider, the third locking bolt is used to fix the third slider, which reduces the possibility of the workpiece moving during electroplating.

[0018] Optionally, the first slider is provided with an insulated first support base, a conductive rod is inserted into the first support base, and the circuit board is hung on the conductive rod.

[0019] Through the above technical solutions, the conductive rod is connected to the first support base, which facilitates the hanging of the circuit board on the conductive rod during electroplating, and makes it easy to install and remove the circuit board; the first support base is insulated to reduce the current transmission to the tank during electroplating.

[0020] Optionally, a second support base is connected to the third slider, and the workpiece mounting plate is connected to the second support base.

[0021] By adopting the above technical solution, the workpiece mounting plate is installed on the third slider, which facilitates the adjustment of the workpiece position and the movement of the circuit board and the ion exchange membrane, so that the space inside the tank can be fully utilized.

[0022] In summary, this application includes at least one of the following beneficial technical effects:

[0023] 1. By utilizing the movement of the first slider, which in turn drives the movement of the second slider, the circuit board and the ion exchange membrane are moved, thereby adjusting the internal space of the tank and dividing the tank into multiple spaces of different sizes, which is suitable for electroplating workpieces of various sizes.

[0024] 2. The first and second sliders are connected by a telescopic connecting rod, which further improves the adjustability of the circuit board and ion exchange membrane, makes fuller use of the space in the tank, and reduces the waste of production space caused by equipping electroplating tanks of various sizes.

[0025] 3. By setting reinforcing plates around the perimeter of the frame, the strength of the frame is further improved, reducing the possibility of frame displacement when moving the ion exchange membrane and reducing damage to the ion exchange membrane. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall structure of this application;

[0027] Figure 2 yes Figure 1 A magnified view of part A in the middle;

[0028] Figure 3 This is a schematic diagram of the border structure of this application.

[0029] In the diagram, 1 is the tank; 2 is the circuit board; 3 is the ion exchange membrane; 4 is the workpiece mounting plate; 5 is the slide rail; 6 is the first slider; 601 is the first support base; 7 is the second slider; 8 is the third slider; 801 is the second support base; 9 is the connecting rod; 901 is the first connecting part; 902 is the second connecting part; 903 is the locking element; 10 is the frame; 1001 is the connecting plate; 1002 is the reinforcing plate; and 11 is the conductive rod. Detailed Implementation

[0030] The following is in conjunction with the appendix Figure 1 - Appendix Figure 3 This application will be described in further detail below.

[0031] An electroplating tank with adjustable internal space includes a tank body 1 with a top opening. Several electroplating components are arranged inside the tank body 1. Each electroplating component includes a pair of circuit boards 2, with a workpiece mounting plate 4 arranged between the pair of circuit boards 2. An ion exchange membrane 3 is arranged on the side of the circuit board 2 near the workpiece mounting plate 4. Slide rails 5 are respectively arranged on both sides of the tank body 1. The circuit board 2 is connected to the slide rail 5 through a first slider 6, the ion exchange membrane 3 is connected to the slide rail 5 through a second slider 7, and the workpiece mounting plate 4 is connected to the slide rail 5 through a third slider 8. The first slider 6 and the second slider 7 are connected by a telescopic connecting rod 9.

[0032] Specifically, by moving the first slider 6, which in turn drives the second slider 7, the circuit board 2 and the ion exchange membrane 3 move synchronously. This allows for the adjustment of the internal space of the tank 1, dividing it into multiple spaces of different sizes, making it suitable for electroplating workpieces of various sizes. The first slider 6 and the second slider 7 are connected by a telescopic connecting rod 9, further improving the adjustability of the circuit board 2 and the ion exchange membrane 3, making fuller use of the space within the tank 1, and reducing the waste of factory space caused by the need for multiple electroplating tanks due to different workpiece sizes.

[0033] like Figure 1 and Figure 2 As shown, the connecting rod 9 includes a first connecting portion 901 connected to the first slider 6, and the first connecting portion 901 is fixedly connected to the first slider 6. The first connecting portion 901 is sleeved inside the second connecting portion 902, and one end of the second connecting portion 902 away from the first connecting portion 901 is fixedly connected to the second slider 7. A locking member 903 is provided between the first connecting portion 901 and the second connecting portion 902. In this embodiment, the locking member 903 is an external fastening member, and a connecting sleeve is provided inside the locking member 903. The connecting sleeve is located at one end of the second connecting portion 902. When the locking member 903 is engaged, the connecting sleeve deforms, thereby clamping the first connecting portion 901 and reducing the possibility of movement of the first connecting portion 901. The connecting rod 9 enables the synchronous and relative movement of the first slider 6 and the second slider 7. When it is necessary to further adjust the size of the chamber separated by the tank 1, the locking member 903 between the first connecting part 901 and the second connecting part 902 is loosened, thereby adjusting the position of the ion exchange membrane 3, which further improves the operability of adjusting the space inside the tank.

[0034] like Figure 3As shown, a frame 10 is provided on the outer side of the ion exchange membrane 3, and a connecting plate 1001 is provided on the frame 10. The connecting plate 1001 is detachably connected to the second slider 7. In this embodiment, a third connecting hole is provided on the second slider 7. The third connecting hole is used to connect a pin. The frame 10 and the second slider 7 are connected by the pin, which facilitates replacement after the ion exchange membrane 3 is damaged.

[0035] like Figure 3 As shown, a reinforcing plate 1002 is provided on the periphery of the frame 10. The reinforcing plate 1002 abuts against the inner wall of the tank 1. The reinforcing plate 1002 on the periphery of the frame 10 further improves the strength of the frame 10, reduces the possibility of the frame 10 shifting when the ion exchange membrane 3 is moved, and reduces the damage to the ion exchange membrane 3.

[0036] The first slider 6 is provided with a first connecting hole and a first tightening bolt. When the first slider 6 moves to the target position, the first tightening bolt tightens the slide rail 5 to fix the position of the first slider 6. At the same time, fixing the first slider 6 also fixes the position of the second slider 7, reducing the movement of the circuit board 2 and ion exchange membrane 3 during use and affecting the electroplating work.

[0037] A second connecting hole is provided on the third slider 8, and a second tightening bolt is provided in the second connecting hole. After the workpiece is adjusted to a suitable position by moving the third slider 8, the slide rail 5 is tightened by the third tightening bolt to fix the third slider 8, thereby reducing the possibility of the workpiece moving during electroplating.

[0038] like Figure 1 and Figure 2 As shown, the first slider 6 is provided with an insulated first support base 601. The first support base 601 is provided with an interface, and a conductive rod 11 is inserted into the interface. A conductive sheet is connected to the top of the circuit board 2. The circuit board 2 is hung on the conductive rod 11 through the conductive sheet, which facilitates the installation and removal of the circuit board 2 during electroplating. The support base is made of insulating material. Preferably, the support base is made of polymer rubber material to reduce the current transfer to the tank 1 during electroplating.

[0039] like Figure 1 As shown, a second support base 801 is fixedly connected to the third slider 8. The second support base 801 has limiting grooves, and both ends of the workpiece mounting plate 4 are placed in these grooves, reducing displacement during movement. The movement of the third slider 8 facilitates adjustment of the workpiece position, and in conjunction with the movement of the circuit board 2 and ion exchange membrane 3, fully utilizes the space within the tank 1. Hanging the workpiece on the workpiece mounting plate 4 facilitates its installation and removal during electroplating.

[0040] The implementation principle of an adjustable electroplating tank according to an embodiment of this application is as follows: First, based on the size and shape of the workpiece, the first slider 6 is slid to move the circuit board 2. The movement of the first slider 6 drives the second slider 7 to move via the connecting rod 9. The second slider 7 simultaneously drives the ion exchange membrane 3 to move, thereby dividing the space inside the electroplating tank into multiple electroplating chambers of different sizes. Simultaneously, the position of the third slider 8 is adjusted according to the size of the workpiece to place the workpiece in a suitable electroplating position. Furthermore, the locking element 903 on the connecting rod 9 can be loosened, and the position of the second slider 7 can be moved. By moving the ion exchange membrane 3, the size of the divided spaces can be further fine-tuned, making full use of the space inside the electroplating tank and reducing the waste of production space caused by the need to equip multiple sizes of electroplating tanks during production.

[0041] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, all equivalent changes made to the structure, shape, and principle of this application should be covered within the scope of protection of this application.

Claims

1. An electroplating tank with adjustable internal space, characterized in that, The device includes a tank (1) with an opening at the top, and a plurality of electroplating components are provided inside the tank (1). Each electroplating component includes a pair of circuit boards (2) and a workpiece mounting plate (4) is provided between the pair of circuit boards (2). An ion exchange membrane (3) is provided on the side of the circuit board (2) near the workpiece mounting plate (4). Slide rails (5) are provided on both sides of the tank (1). The circuit board (2) is connected to the slide rail (5) through a first slider (6). The ion exchange membrane (3) is connected to the slide rail (5) through a second slider (7). The workpiece mounting plate (4) is connected to the slide rail (5) through a third slider (8). The first slider (6) and the second slider (7) are connected by a telescopic connecting rod (9).

2. The electroplating tank with adjustable internal space according to claim 1, characterized in that, The connecting rod (9) includes a first connecting part (901) connected to the first slider (6), the first connecting part (901) is sleeved inside the second connecting part (902), and the end of the second connecting part (902) away from the first connecting part (901) is connected to the second slider (7); a locking member (903) is provided between the first connecting part (901) and the second connecting part (902).

3. The electroplating tank with adjustable internal space according to claim 1, characterized in that, The ion exchange membrane (3) is provided with a frame (10) on its outer side, and a connecting plate (1001) is provided on the frame (10). The connecting plate (1001) is detachably connected to the second slider (7).

4. The electroplating tank with adjustable internal space according to claim 3, characterized in that, A reinforcing plate (1002) is provided on the periphery of the frame (10), and the reinforcing plate (1002) abuts against the inner wall of the groove (1).

5. The electroplating tank with adjustable internal space according to claim 1, characterized in that, The first slider (6) is provided with a first connecting hole, and a first tightening bolt is provided in the first connecting hole. The first tightening bolt abuts against the slide rail (5).

6. The electroplating tank with adjustable internal space according to claim 1, characterized in that, The third slider (8) is provided with a second connecting hole, and a second tightening bolt is provided in the second connecting hole. The second tightening bolt abuts against the slide rail (5).

7. The electroplating tank with adjustable internal space according to claim 1, characterized in that, The first slider (6) is provided with an insulated first support seat (601), and a conductive rod (11) is inserted into the first support seat (601). The circuit board (2) is hung on the conductive rod (11).

8. The electroplating tank with adjustable internal space according to claim 1, characterized in that, The third slider (8) is connected to a second support base (801), and the workpiece mounting plate (4) is connected to the second support base (801).