Notebook computer heat dissipation assembly capable of improving heat dissipation

Abstract

The utility model provides a notebook computer heat dissipation assembly capable of improving heat dissipation, which comprises a first heat dissipation fan, a second heat dissipation fan, bolt mounting seats, auxiliary fins, heat dissipation fins and a heat absorption structure, the heat dissipation fins are fixedly installed between the first heat dissipation fan and the second heat dissipation fan, and the auxiliary fins are fixedly installed on the outer sides of the first heat dissipation fan and the second heat dissipation fan respectively and connected with the heat dissipation fins. The heat absorption structure is fixedly mounted on the auxiliary fins and the heat dissipation fins; due to the arrangement of the first heat dissipation fan, the second heat dissipation fan and the heat absorption structure, the heat conduction area is large, and the heat dissipation efficiency is high.

Description

Technical Field

[0001] This utility model relates to the field of laptop cooling technology, and in particular to a laptop cooling component that improves heat dissipation. Background Technology

[0002] With the continuous advancement of computer technology, modern laptops are becoming increasingly powerful. However, this performance improvement also brings with it increased heat generation. High-performance processors, graphics cards, and other internal components generate a significant amount of heat during prolonged operation, placing higher demands on laptop cooling systems. Ineffective heat dissipation not only leads to decreased system performance but can also shorten hardware lifespan and even cause hardware failure. Therefore, improving the heat dissipation efficiency of laptops has become a crucial technological challenge. However, existing computer cooling structures still suffer from problems such as small heat conduction area and poor heat dissipation efficiency.

[0003] Therefore, it is essential to invent a heat dissipation component for laptops that can improve heat dissipation. Utility Model Content

[0004] To address the aforementioned technical problems, this utility model provides a laptop cooling component that improves heat dissipation, solving the issues of small heat conduction area and poor heat dissipation efficiency still present in existing computer cooling structures. The laptop cooling component includes a first cooling fan, a second cooling fan, a bolt mounting base, auxiliary fins, cooling fins, and a heat-absorbing structure. The first and second cooling fans are fixedly mounted inside the laptop casing via the bolt mounting base, and the cooling fins are fixedly mounted between the first and second cooling fans. The auxiliary fins are fixedly mounted on the outer sides of both the first and second cooling fans and connected to the cooling fins. The heat-absorbing structure is fixedly mounted on the auxiliary fins and the cooling fins.

[0005] The heat absorption structure includes an outwardly extending heat-conducting copper tube, a middle heat-conducting copper tube, a heat-conducting patch, and a heat-absorbing mesh. The outwardly extending heat-conducting copper tube is fixedly mounted on the auxiliary fins, and the middle heat-conducting copper tube is fixedly mounted on the heat dissipation fins. The heat-conducting patch is fixedly mounted at the bottom of the outwardly extending heat-conducting copper tube and the middle heat-conducting copper tube, and the heat-absorbing mesh is fixedly mounted on the heat-conducting patch and contacts the outwardly extending heat-conducting copper tube and the middle heat-conducting copper tube.

[0006] Both the first and second cooling fans are compact and are mounted inside the laptop via bolt mounts. They are equipped with temperature sensors and an intelligent control system. Located in different positions within the laptop, the first and second cooling fans work together to achieve the following: ① Improved cooling efficiency: The rapid rotation of the first and second fans generates airflow, quickly removing heat from the laptop and lowering the internal temperature. This coordinated operation ensures uniform airflow, contributing to more effective heat dissipation. ② Enhanced airflow: The separate installation of the first and second fans creates convection circulation, promoting airflow within the laptop. This design helps prevent air stagnation and localized overheating, maintaining a uniform temperature throughout the laptop. ③ Optimized heat dissipation path: Working in conjunction with the heatsink fins and auxiliary fins, the first and second cooling fans optimize the heat conduction path, improving overall cooling efficiency. The strategic placement and number of fans ensure effective cooling for each heat dissipation area.

[0007] The heat-absorbing structure comprises four outward-extending and intermediate heat-conducting copper pipes, which extend to various locations on the laptop motherboard through bending. The heat-conducting pads are made of four copper metal plates and are in direct contact with the laptop's components. The heat-absorbing mesh and the heat-conducting pads are interwoven to form a mesh-like copper heat-absorbing structure, which has the following functions: ① High-efficiency heat conduction: The outward-extending and intermediate heat-conducting copper pipes, with their high thermal conductivity, quickly conduct heat from inside the laptop to the outside of the heat dissipation components. This high-efficiency heat conduction structure can effectively transfer the heat generated inside to the heat dissipation fins and auxiliary fins, thereby improving the heat dissipation effect of the entire heat dissipation system; ② Increased heat dissipation area: The heat-conducting pads are in direct contact with the laptop's components, ensuring that heat can be quickly conducted from the components to the heat-conducting copper pipes. The heat-absorbing mesh provides additional heat dissipation surface area through its mesh structure, helping heat to dissipate into the air more quickly.

[0008] Compared with the prior art, the present invention has the following beneficial effects:

[0009] 1. The first and second cooling fans of this utility model have the following functions: ① Improved heat dissipation efficiency: The first and second cooling fans generate airflow through rapid rotation, which helps to quickly remove heat from the inside of the laptop and reduce the internal temperature. The coordinated work of these two fans ensures the uniformity of airflow and helps to dissipate heat more effectively; ② Enhanced airflow: The first and second cooling fans are installed in different positions of the laptop to form a convection circulation, which promotes the flow of air inside the laptop. This design helps to avoid air stagnation and local overheating, and keeps the temperature inside the entire laptop uniform.

[0010] ③ Optimized heat dissipation path: The first and second cooling fans work together with the heat dissipation fins and auxiliary fins to optimize the heat conduction path and improve the overall heat dissipation efficiency. The reasonable configuration of the cooling fan positions and the number of fans ensures that each heat dissipation area can be effectively cooled.

[0011] 2. The heat-absorbing structure of this utility model has the following functions: ① The high-efficiency heat conduction of the outward-extending heat-conducting copper pipe and the intermediate heat-conducting copper pipe rapidly conducts heat from inside the laptop to the outside of the heat dissipation component through their high thermal conductivity. This efficient heat conduction structure can effectively transfer the heat generated inside to the heat dissipation fins and auxiliary fins, thereby improving the heat dissipation effect of the entire heat dissipation system; ② Increase the heat dissipation area: The thermal pad is in direct contact with the components of the laptop, ensuring that heat can be quickly conducted from the components to the heat-conducting copper pipe. The heat-absorbing mesh provides additional heat dissipation surface area through its mesh structure, helping heat to dissipate into the air more quickly. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of this utility model.

[0013] Figure 2 This is an enlarged view of point A of this utility model.

[0014] In the picture:

[0015] First cooling fan 1, second cooling fan 2, bolt mounting base 3, auxiliary fins 4, cooling fins 5, heat absorption structure 6, outwardly extending heat-conducting copper pipe 61, intermediate heat-conducting copper pipe 62, heat-conducting patch 63, heat-absorbing mesh 64. Detailed Implementation

[0016] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0017] As attached Figure 1 To be continued Figure 2 As shown.

[0018] This utility model provides a laptop cooling component for improving heat dissipation, including a first cooling fan 1, a second cooling fan 2, a bolt mounting base 3, auxiliary fins 4, cooling fins 5, and a heat-absorbing structure 6. The first cooling fan 1 and the second cooling fan 2 are respectively fixedly mounted inside the laptop casing via the bolt mounting base 3, and the cooling fins 5 are fixedly mounted between the first cooling fan 1 and the second cooling fan 2. The auxiliary fins 4 are respectively fixedly mounted on the outer sides of the first cooling fan 1 and the second cooling fan 2 and connected to the cooling fins 5. The heat-absorbing structure 6 is fixedly mounted on the auxiliary fins 4 and the cooling fins 5.

[0019] The heat-absorbing structure 6 includes an outwardly extending heat-conducting copper pipe 61, an intermediate heat-conducting copper pipe 62, a heat-conducting patch 63, and a heat-absorbing mesh 64. The outwardly extending heat-conducting copper pipe 61 is fixedly mounted on the auxiliary fins 4, and the intermediate heat-conducting copper pipe 62 is fixedly mounted on the heat dissipation fins 5. The heat-conducting patch 63 is fixedly mounted at the bottom of the outwardly extending heat-conducting copper pipe 61 and the intermediate heat-conducting copper pipe 62, and the heat-absorbing mesh 64 is fixedly mounted on the heat-conducting patch 63 and contacts the outwardly extending heat-conducting copper pipe 61 and the intermediate heat-conducting copper pipe 62.

[0020] This heat dissipation assembly is designed to improve the heat dissipation efficiency of laptops, maintain system stability, and extend the lifespan of components. The heat dissipation assembly includes a first cooling fan 1, a second cooling fan 2, a bolt mounting base 3, auxiliary fins 4, heat dissipation fins 5, and a heat absorption structure 6. Its working principle involves airflow circulation from the fans, efficient heat conduction and dispersion, and an enhanced heat dissipation area.

[0021] 1. Fan airflow circulation

[0022] The first cooling fan 1 and the second cooling fan 2 are installed in different positions on the laptop and fixed inside the laptop by bolt mounting brackets 3.

[0023] These two fans generate a powerful airflow by rotating, which propels the hot air inside the laptop and exhausts it to the outside.

[0024] 2. Efficient heat conduction

[0025] The heat dissipation fins 5 are fixedly installed between the first cooling fan 1 and the second cooling fan 2, serving as the main heat conduction channel.

[0026] The auxiliary fins 4 are fixed to the outside of the fan and connected to the heat dissipation fins 5 to further increase the heat dissipation area and efficiency.

[0027] 3. The function of the heat-absorbing structure

[0028] The heat-absorbing structure 6 is designed to efficiently absorb and conduct heat from the inside of the laptop to the external heat dissipation area.

[0029] The outward-extending heat-conducting copper pipe 61 and the intermediate heat-conducting copper pipe 62 are made of copper material with high thermal conductivity, which can quickly conduct heat from inside the laptop to the heat dissipation fins 5 and auxiliary fins 4.

[0030] These copper pipes bend and extend to various parts of the laptop motherboard, ensuring that heat is evenly distributed to different areas of the cooling system.

[0031] 4. Increased heat dissipation area

[0032] The thermal pad 63 is fixed to the bottom of the outwardly extending thermal copper pipe 61 and the middle thermal copper pipe 62, and is in direct contact with the components of the laptop computer to ensure that heat can be efficiently transferred to the thermal copper pipe.

[0033] The heat-absorbing mesh 64 and the heat-conducting patch 63 are interwoven to form a mesh structure, which increases the heat dissipation area and helps heat to dissipate into the air more quickly.

[0034] 5. Coordinated operation of the heat dissipation system

[0035] The first cooling fan 1 and the second cooling fan 2 work together, combined with the intelligent fan control system, to automatically adjust the fan speed according to the internal temperature of the laptop.

[0036] Under high load conditions, the fan speed increases to enhance airflow and further improve heat dissipation; under low load conditions, the fan speed decreases to reduce noise and save energy.

[0037] Summarize

[0038] This cooling system effectively improves the heat dissipation performance of laptops through a carefully designed fan airflow circulation, efficient heat conduction path, and enhanced heat dissipation area. The first cooling fan 1 and the second cooling fan 2 work together to create a powerful airflow that carries away internal heat. The heat dissipation fins 5 and auxiliary fins 4, along with the heat absorption structure 6, and the combination of heat-conducting copper pipes and heat-conducting pads, ensure that heat is rapidly transferred from the inside to the outside, maintaining stable operation and long-term use of the laptop.

[0039] Any technical solution that achieves the above-mentioned technical effects by utilizing the technical solution described in this utility model, or by designing a similar technical solution inspired by the technical solution described in this utility model, falls within the protection scope of this utility model.

Claims

1. A heat dissipation component for laptop computers to improve heat dissipation, characterized in that: The device includes a first cooling fan (1), a second cooling fan (2), a bolt mounting base (3), an auxiliary fin (4), a cooling fin (5), and a heat-absorbing structure (6). The first cooling fan (1) and the second cooling fan (2) are fixedly installed inside the laptop casing by the bolt mounting base (3), and the cooling fin (5) is fixedly installed between the first cooling fan (1) and the second cooling fan (2). The auxiliary fin (4) is fixedly installed on the outside of the first cooling fan (1) and the second cooling fan (2) and connected to the cooling fin (5). The heat-absorbing structure (6) is fixedly installed on the auxiliary fin (4) and the cooling fin (5).

2. The laptop cooling component for improving heat dissipation as described in claim 1, characterized in that: The heat absorption structure (6) includes an outwardly extending heat-conducting copper tube (61), an intermediate heat-conducting copper tube (62), a heat-conducting patch (63), and a heat-absorbing mesh (64). The outwardly extending heat-conducting copper tube (61) is fixedly installed on the auxiliary fins (4), and the intermediate heat-conducting copper tube (62) is fixedly installed on the heat dissipation fins (5). The heat-conducting patch (63) is fixedly installed at the bottom of the outwardly extending heat-conducting copper tube (61) and the intermediate heat-conducting copper tube (62), and the heat-absorbing mesh (64) is fixedly installed on the heat-conducting patch (63) and contacts the outwardly extending heat-conducting copper tube (61) and the intermediate heat-conducting copper tube (62).

3. A laptop cooling component for improving heat dissipation as described in claim 1, characterized in that: The first cooling fan (1) and the second cooling fan (2) are both compact cooling fans, and the first cooling fan (1) and the second cooling fan (2) are both installed inside the laptop via bolt mounting brackets (3). The first cooling fan (1) and the second cooling fan (2) are equipped with temperature sensors and intelligent control systems. The first cooling fan (1) and the second cooling fan (2) are located in different positions of the laptop and work together.

4. A laptop cooling component for improving heat dissipation as described in claim 2, characterized in that: The heat-absorbing structure (6) contains four outward-extending heat-conducting copper pipes (61) and four intermediate heat-conducting copper pipes (62), which extend to various locations on the laptop motherboard by bending; the thermal pad (63) Four copper metal plates are used, and the thermal pad (63) directly contacts the components of the laptop. The heat-absorbing mesh (64) and the heat-conducting patch (63) are interwoven to form a mesh-like copper heat-absorbing structure.

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