Display module and display device

Abstract

The utility model discloses a display module and a display device. The display module comprises a display panel, a gate drive circuit, a connection bonding pad, a test bonding pad, a circuit board and an impedance test assembly. The display panel comprises a display area and a non-display area located on at least one side of the display area. The gate driving circuit is arranged on the display panel; the connecting bonding pad is arranged in the non-display area and is electrically connected with the gate driving circuit; the test bonding pad is arranged in the non-display area and located on the outer side of the connection bonding pad; a part of the circuit board is arranged in the non-display area, at least one end of the circuit board is provided with a test pin, and the test pin is bound with the test bonding pad; and the impedance test assembly is arranged on the circuit board and is used for detecting the binding impedance of the test pin and the test bonding pad. According to the invention, the detection blind area of the binding impedance of the flexible circuit board can be reduced.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display module and a display device. Background Technology

[0002] As users demand higher pixel density (Pixel Per Inch, PPI) for display devices, the number of pixels within the display area also increases. To power these pixels, the number of pins on the flexible printed circuit board (FPC) also increases, leading to a longer FPC. In traditional display device manufacturing, integrated circuits (ICs) and FPCs are bonded to the non-display area of ​​the display panel, arranged in parallel. The impedance of the bonded IC and FPC is then tested using a two-point or four-point probe method.

[0003] The display module also includes a gate drive circuit and a connection pad for connecting the gate drive circuit. As the length of the flexible circuit board increases, in an architecture where the chip and the flexible circuit board are arranged in parallel, the end of the flexible circuit board will extend beyond the end of the chip. At this time, the end of the flexible circuit board is located outside the connection pad, making it impossible to monitor the bonding impedance of the end of the flexible circuit board, resulting in a monitoring blind zone. When abnormalities such as peeling occur between the end of the flexible circuit board and the display panel, the abnormal conditions in the monitoring blind zone cannot be detected.

[0004] Therefore, it is necessary to propose a new technical solution to solve the above-mentioned technical problems. Utility Model Content

[0005] The purpose of this application is to provide a display module and display device to reduce the monitoring blind zone of the bonding impedance of flexible circuit boards.

[0006] To solve the above problems, the technical solution of this application is as follows:

[0007] In a first aspect, this application proposes a display module, comprising:

[0008] A display panel includes a display area and a non-display area located on at least one side of the display area;

[0009] A gate driving circuit is disposed on the display panel;

[0010] A connection pad is provided in the non-display area and is electrically connected to the gate drive circuit.

[0011] The test pad is located in the non-display area and outside the connection pad;

[0012] A circuit board, a portion of which is located in the non-display area, and at least one end of which is provided with test pins, the test pins being bonded to the test pads;

[0013] An impedance testing component, located on the circuit board, is used to detect the bonding impedance between the test pin and the test pad.

[0014] In one embodiment of this application, the non-display area includes a first binding area;

[0015] The connection pad and the test pad are located in the first bonding area. The test pad includes a first pad, a second pad, and a first line. The first line connects the first pad and the second pad.

[0016] The circuit board includes:

[0017] A flexible circuit board, a portion of which is disposed on a display panel and located in the first bonding area, includes test pins located at at least one end of the flexible circuit board. The test pins include a first pin, a second pin, a third pin, and a fourth pin. The first pin is located in the first bonding area and bonded to a first pad; the second pin is located in the first bonding area and bonded to a second pad; the third pin is electrically connected to the first pin; and the fourth pin is electrically connected to the second pin.

[0018] A printed circuit board connected to the flexible circuit board, the printed circuit board including a third pad and a fourth pad, the third pad being bonded to the third pin and the fourth pad being bonded to the fourth pin;

[0019] The impedance testing component includes:

[0020] A first test point is located on the printed circuit board and electrically connected to the third pad; the first test point is configured as an impedance test point.

[0021] The second test point is located on the printed circuit board and is electrically connected to the fourth pad. The second test point is configured as an impedance test point.

[0022] In one embodiment of this application, the flexible circuit board further includes a fifth pin, a sixth pin, and a second line, wherein the second line connects the fifth pin and the sixth pin;

[0023] The printed circuit board further includes a fifth pad and a sixth pad, the fifth pad being bonded to the fifth pin and the sixth pad being bonded to the sixth pin;

[0024] The impedance testing assembly further includes a third test point and a fourth test point. The third test point is located on the printed circuit board and is electrically connected to the fifth pad. The third test point is configured as an impedance test point. The fourth test point is located on the printed circuit board and is electrically connected to the sixth pad. The fourth test point is configured as an impedance test point.

[0025] In one embodiment of this application, the second test point and the third test point are the same test point;

[0026] The fourth pad and the fifth pad are the same pad;

[0027] The fourth pin and the fifth pin are the same pin.

[0028] In one embodiment of this application, in a plan view of the display module, the first direction is the long side direction of the flexible circuit board, and the third pin, the fourth pin, and the sixth pin are arranged sequentially along the first direction; the third pad, the fourth pad, and the sixth pad are arranged sequentially along the first direction, and the first test point, the second test point, and the fourth test point are arranged sequentially along the first direction.

[0029] In one embodiment of this application, the non-display area further includes a second binding area, which is located on the side of the first binding area closer to the display area;

[0030] The display module further includes a chip, which is bonded to the second bonding area;

[0031] The chip includes an eighth pin, a ninth pin, and a third line, wherein the third line connects the eighth pin and the ninth pin.

[0032] The portion of the display panel located in the second bonding area includes an eighth pad and a ninth pad, wherein the eighth pad is bonded to the eighth pin and the ninth pad is bonded to the ninth pin;

[0033] The flexible circuit board further includes a tenth pin, an eleventh pin, a twelfth pin, and a thirteenth pin, wherein the tenth pin and the eleventh pin are located in the first bonding area; the twelfth pin is electrically connected to the tenth pin, and the thirteenth pin is electrically connected to the eleventh pin;

[0034] The portion of the display panel located in the first bonding area is further provided with a tenth pad and an eleventh pad. The tenth pad and the eleventh pad are located inside the connecting pad. The tenth pad is electrically connected to the eighth pad, and the eleventh pad is electrically connected to the ninth pad.

[0035] The tenth pad is bonded to the tenth pin, and the eleventh pad is bonded to the eleventh pin;

[0036] The printed circuit board also includes a twelfth pad and a thirteenth pad, the twelfth pad being bonded to the twelfth pin and the thirteenth pad being bonded to the thirteenth pin;

[0037] The impedance testing assembly further includes a fifth test point and a sixth test point. The fifth test point is electrically connected to the twelfth pad and is configured as an impedance test point. The sixth test point is electrically connected to the thirteenth pad and is configured as an impedance test point.

[0038] In one embodiment of this application, the portion of the display panel located in the first bonding area further includes a fourteenth pad and a fourth line, wherein the fourteenth pad is located inside the connecting pad, and the fourth line connects the fourteenth pad and the eleventh pad;

[0039] The flexible circuit board further includes a fourteenth pin and a fifteenth pin, wherein the fourteenth pin is located in the first bonding area and is bonded to the fourteenth pad; the fifteenth pin is electrically connected to the fourteenth pin.

[0040] The printed circuit board also includes a fifteenth pad, which is bonded to the fifteenth pin;

[0041] The impedance testing assembly also includes a seventh test point, which is electrically connected to the fifteenth pad and is configured as an impedance test point.

[0042] In one embodiment of this application, the flexible circuit board further includes a sixteenth pin and a fifth line, the fifth line connecting the fifteenth pin and the sixteenth pin;

[0043] The printed circuit board also includes a sixteenth pad, which is bonded to the sixteenth pin;

[0044] The impedance testing assembly also includes an eighth test point, which is electrically connected to the sixteenth pad and is configured as an impedance test point.

[0045] In one embodiment of this application, the non-display area includes a first binding area;

[0046] The connection pad and the test pad are located in the first bonding area. The test pad includes a first pad, a second pad, and a first line. The first line connects the first pad and the second pad.

[0047] The circuit board includes a flexible circuit board, a part of the flexible circuit board is disposed on the display panel and located in the first bonding area, the flexible circuit board includes a first pin and a second pin; the first pin is located in the first bonding area and is bonded to the first pad; the second pin is located in the first bonding area and is bonded to the second pad;

[0048] The impedance testing component includes:

[0049] A first test point is disposed on the flexible circuit board and is electrically connected to the first pin, and the first test point is configured as an impedance test point; and

[0050] A second test point is disposed on the flexible circuit board and is electrically connected to the second pin, and the second test point is configured as an impedance test point.

[0051] In a second aspect, the present application provides a display device, including a display module, the display module includes a display panel, a gate driving circuit, connection pads, test pads, a circuit board, and an impedance testing component; the display panel includes a display area and a non-display area located on at least one side of the display area; the gate driving circuit is disposed on the display panel; the connection pads are disposed in the non-display area and are electrically connected to the gate driving circuit; the test pads are disposed in the non-display area and are located outside the connection pads; a part of the circuit board is disposed in the non-display area, at least one end of the circuit board is provided with test pins, and the test pins are bonded to the test pads; the impedance testing component is disposed on the circuit board for detecting the bonding impedance between the test pins and the test pads.

[0052] Description of the Drawings

[0053] Figure 1This is a schematic diagram of a display module according to this application;

[0054] Figure 2 yes Figure 1 The exploded view of the display module shown in this application is shown.

[0055] Figure 3 yes Figure 1 The diagram shown is a partial circuit diagram of the display module of this application;

[0056] Figure 4 This is another schematic diagram of the display module of this application;

[0057] Figure 5 yes Figure 4 The exploded view of the display module shown in this application is shown.

[0058] Figure 6 yes Figure 4 The diagram shown is a partial circuit diagram of the display module of this application;

[0059] Figure 7 This is yet another schematic diagram of the display module of this application. Detailed Implementation

[0060] The terms used in this specification and claims have the meanings that are commonly understood by one of ordinary skill in the art to which this application pertains. The terms used in this specification and claims are for the purpose of facilitating the description and understanding of this application only, and are not intended to limit this application to the narrow interpretation of the specific terms used in the specification and claims.

[0061] This application discloses a display device, which can be a mobile phone, tablet computer, e-reader, electronic display screen, laptop computer, mobile phone, augmented reality (AR) / virtual reality (VR) device, media player, wearable device, digital camera, car navigation system, etc. The display device includes a display module 100.

[0062] In the first embodiment of this application:

[0063] Please see Figure 1The display module 100 includes a display panel 10, a gate driving circuit 50, a connection pad A7, a test pad K, a circuit board S, and an impedance testing component R. The display panel 10 includes a display area AA and a non-display area NA located on at least one side of the display area AA. The gate driving circuit 50 is disposed on the display panel 10. The connection pad A7 is disposed in the non-display area NA and electrically connected to the gate driving circuit 50. The test pad K is disposed in the non-display area NA and located outside the connection pad A7. A portion of the circuit board S is disposed in the non-display area NA. At least one end of the circuit board S has a test pin, which is bonded to the test pad K. The impedance testing component R is disposed on the circuit board S and is used to detect the bonding impedance between the test pin and the test pad K.

[0064] In the display module 100 of this embodiment, the connection pad A7 and the test pad K are located in the non-display area NA, and the test pad K is located outside the connection pad A7. The connection pad A7 is electrically connected to the gate drive circuit 50. During the process of monitoring the bonding impedance of the circuit board S using the two-probe method, two probes are brought into contact with the impedance testing component R. The test current flows into the impedance testing component R, passes through the test pin and the test pad K in sequence, and then reaches the impedance testing component R. The two-probe method can measure the potential difference between the two probes, and then detect the bonding impedance of the end of the circuit board S based on the test current and the potential difference. When the bonding impedance value is close to the value of the first preset impedance, the bonding between the end of the circuit board S and the display panel 10 is qualified. The first preset impedance is the impedance range value when the bonding between the circuit board S and the display panel 10 is qualified. When the bonding impedance value deviates too much from the value of the first preset impedance, it can be determined that the end of the circuit board S has peeled off from the display panel 10, and the bonding of the end of the circuit board S is unqualified. The structural design of the display module 100 in this application can reduce monitoring blind spots and improve the detection rate of non-conforming products.

[0065] Optionally, the non-display area NA includes a second binding area NA1 and a first binding area NA2, with the first binding area NA2 located on the side of the second binding area NA1 away from the display area AA.

[0066] Optional, please refer to Figure 2The circuit board S includes a flexible printed circuit board (FPC) 30 and a printed circuit board (PCB) 40. The impedance testing assembly includes a first test point D1 and a second test point D2. The test pads K include a first pad A1, a second pad A2, and a first line T1, which connects the first pad A1 and the second pad A2. A portion of the flexible printed circuit board 30 is disposed on the display panel 10 and located in a first bonding area NA2. The flexible printed circuit board 30 includes test pins. Test pins are located at at least one end of the flexible printed circuit board 30. The test pins include a first pin P1, a second pin P2, a third pin P3, and a fourth pin P4. The first pin P1 is located in the first bonding area NA2 and is bonded to the first pad A1. The second pin P2 is located in the first bonding area NA2 and is bonded to the second pad A2. The third pin P3 is electrically connected to the first pin P1. The fourth pin P4 is electrically connected to the second pin P2. The printed circuit board 40 is connected to the flexible printed circuit board 30. Printed circuit board 40 includes a third pad A3 and a fourth pad A4. The third pad A3 is bonded to a third pin P3. The fourth pad A4 is bonded to a fourth pin P4. A first test point D1 is located on printed circuit board 40 and electrically connected to the third pad A3. The first test point D1 is configured as an impedance test point. A second test point D2 is located on printed circuit board 40 and electrically connected to the fourth pad A4. The second test point D2 is configured as an impedance test point.

[0067] In the display module 100 of this application, the end of the flexible circuit board 30 extends beyond the bonding pad A7. During the process of monitoring the bonding impedance of the flexible circuit board 30 using the two-probe method, the two probes are contacted with the first test point D1 and the second test point D2, respectively. Please refer to [link to relevant documentation]. Figure 3 The test current flows in from the first test point D1, sequentially passing through the third pad A3, the third pin P3, the first pin P1, the first pad A1, the first line T1, the second pad A2, the second pin P2, the fourth pin P4, and the fourth pad A4 before reaching the second test point D2. The two-probe method can measure the potential difference between the two probes. Based on the test current and potential difference, the bonding impedance at the end of the flexible circuit board 30 is detected. When the bonding impedance value is close to the value of the first preset impedance, the bonding between the end of the flexible circuit board 30 and the display panel 10 and the printed circuit board 40 is qualified. The first preset impedance is the impedance range value when the bonding between the flexible circuit board 30 and the display panel 10 and the printed circuit board 40 is qualified. When the bonding impedance value deviates too much from the value of the first preset impedance, it can be determined that at least one of the flexible circuit board 30 and the display panel 10 or the printed circuit board 40 has peeled off, and the bonding at the end of the flexible circuit board 30 is unqualified. The structural design of the display module 100 in this application can reduce monitoring blind spots and improve the detection rate of defective products.

[0068] Optionally, both the first pad A1 and the second pad A2 are located outside the connecting pad A7.

[0069] Optionally, the flexible circuit board 30 also includes at least one seventh pin P7, with a connection pad A7 bonded to one of the seventh pins P7.

[0070] Optionally, the gate drive circuit 50 (Gate on Array, GOA) is located in the non-display area NA, and the gate drive circuit 50 is electrically connected to at least one seventh pin P7.

[0071] In this embodiment, the gate driving circuit 50 is a driving method for the liquid crystal display panel 10. It achieves cost reduction and saves gate driving chips by integrating a gate driving circuit 50 composed of thin film transistors (TFTs) on the glass substrate. At the same time, since the gate driving circuit 50 does not require bonding to the gate driving chip, it can further improve the module process yield and facilitate the implementation of narrow bezel designs.

[0072] Optionally, the display panel 10 can be a micro light-emitting diode (Micro LED) display panel 10, a mini light-emitting diode (Mini LED) display panel 10, an organic light-emitting diode (OLED) display panel 10, or a liquid crystal display panel 10. The type of display panel 10 is not limited here.

[0073] Optionally, the display module 100 also includes a chip 20, which is bonded to a second bonding area NA1. The chip 20 extends along a first direction X, which is the long side direction of the flexible circuit board 30. In a plan view of the display module 100, the chip 20 and the flexible circuit board 30 are arranged parallel to each other. By arranging the chip 20 and the flexible circuit board 30 in this way, the space of the non-display area NA can be fully utilized, thereby reducing the area of ​​the non-display area NA and achieving a narrow bezel design.

[0074] Optionally, the first line T1 is a metal trace or a wire. The first line T1 connects the first pad A1 and the second pad A2, realizing the electrical connection between the first pad A1 and the second pad A2.

[0075] It should be noted that in all embodiments of this application, test points and pads can be connected via metal traces or wires to achieve electrical connection. Pins can be connected to each other via metal traces or wires to achieve electrical connection. Pads can be connected to each other via metal traces or wires to achieve electrical connection.

[0076] It should be noted that in all embodiments of this application, the bonding between the pin and the pad can be achieved through anisotropic conductive adhesive, thermoforming, soldering, or surface mount technology. No limitation is made to the bonding method. When the pin and pad are properly bonded, they are electrically connected with low impedance. When the pin and pad are not properly bonded, the impedance between them is very high, or there is an open circuit, preventing electrical connection.

[0077] In the second embodiment of this application:

[0078] To avoid redundancy, the second embodiment of this application will describe the parts that differ from the first embodiment of this application.

[0079] The second embodiment of this application differs from the first embodiment of this application in that:

[0080] Optional, please refer to Figure 2 The flexible circuit board 30 also includes a fifth pin P5 and a sixth pin P6, as well as a second line T2. The second line T2 connects the fifth pin P5 and the sixth pin P6.

[0081] Optionally, the printed circuit board 40 also includes a fifth pad A5 and a sixth pad A6, with the fifth pad A5 bonded to the fifth pin P5 and the sixth pad A6 bonded to the sixth pin P6.

[0082] Optionally, the impedance test assembly R also includes a third test point D3 and a fourth test point D4. The third test point D3 is located on the printed circuit board 40 and is electrically connected to the fifth pad A5. The third test point D3 is configured as an impedance test point. The fourth test point D4 is located on the printed circuit board 40 and is electrically connected to the sixth pad A6. The fourth test point D4 is configured as an impedance test point.

[0083] In the first embodiment, when the bonding impedance at the end of the flexible circuit board 30 deviates too much from the first preset impedance as detected by the two-probe method, it can be determined that the flexible circuit board 30 has peeled off from at least one of the display panel 10 and the printed circuit board 40, and the end bonding of the flexible circuit board 30 is unqualified. However, it is impossible to specifically determine whether the end of the flexible circuit board 30 has peeled off from the display panel 10 or from the printed circuit board 40.

[0084] In order to further determine the cause of the abnormal binding impedance at the end of the flexible circuit board 30, in the second embodiment, when the abnormal binding impedance at the end of the flexible circuit board 30 is detected by connecting the first test point D1 and the second test point D2 using the two-probe method, the two probes are disconnected from the first test point D1 and the second test point D2, and then the two probes are connected to the third test point D3 and the fourth test point D4 respectively.

[0085] Please see Figure 3 The test current flows in from the third test point D3, sequentially through the fifth pad A5, the fifth pin P5, the second line T2, the sixth pin P6, and the sixth pad A6, before reaching the fourth test point D4. The two-probe method can measure the potential difference between the two probes, and then detect the bonding impedance at the end of the flexible circuit board 30 based on the test current and potential difference. When the bonding impedance value is close to the value of the second preset impedance, the bonding between the end of the flexible circuit board 30 and the printed circuit board 40 is qualified. In this case, it can be determined that the bonding between the end of the flexible circuit board 30 and the display panel 10 is unqualified. The second preset impedance is the impedance range value when the bonding between the flexible circuit board 30 and the printed circuit board 40 is qualified. When the value of the bonding impedance deviates too much from the value of the second preset impedance, it can be determined that the flexible circuit board 30 and the printed circuit board 40 have peeled off, and the bonding between the end of the flexible circuit board 30 and the printed circuit board 40 is unqualified. However, it is impossible to determine whether the bonding between the end of the flexible circuit board 30 and the display panel 10 is qualified. To further determine whether the bonding between the end of the flexible circuit board 30 and the display panel 10 is qualified, the flexible circuit board 30 and the printed circuit board 40 need to be rebonded. Then, the third test point D3 and the fourth test point D4 are contacted using the two-probe method. After monitoring that the bonding between the flexible circuit board 30 and the printed circuit board 40 is qualified, the two probes are disconnected from the third test point D3 and the fourth test point D4 respectively. Then, the two probes are contacted with the first test point D1 and the second test point D2 respectively using the two-probe method. When the value of the bonding impedance is close to the value of the first preset impedance, the bonding between the end of the flexible circuit board 30 and the display panel 10 is qualified. When the value of the bonding impedance deviates too much from the value of the first preset impedance, it can be determined that the flexible circuit board 30 and the display panel 10 have peeled off, and the bonding between the end of the flexible circuit board 30 and the display panel 10 is unqualified.

[0086] The second embodiment, based on the first embodiment, can accurately monitor the location of binding abnormalities, thereby further reducing monitoring blind spots and improving the detection rate of non-conforming products.

[0087] Optionally, the second line T2 can be a metal trace or a wire. The second line T2 connects the fifth pin P5 and the sixth pin P6, thus establishing an electrical connection between the fifth pin P5 and the sixth pin P6.

[0088] In the third embodiment of this application:

[0089] To avoid redundancy, the third embodiment of this application will describe the parts that differ from the second embodiment of this application.

[0090] The third embodiment of this application differs from the second embodiment in that:

[0091] Optional, please refer to Figure 4 The second test point D2 and the third test point D3 are the same test point. The fourth pad A4 and the fifth pad A5 are the same pad. The fourth pin P4 and the fifth pin P5 are the same pin.

[0092] Optionally, the second line T2 connects the fourth pin P4 and the sixth pin P6.

[0093] The specific method for monitoring the bonding impedance of the flexible circuit board 30 is as follows:

[0094] Please see Figure 5 When an abnormality is detected in the binding impedance at the end of the flexible circuit board 30 after connecting the first test point D1 and the second test point D2 using the two-probe method, the two probes are disconnected from the first test point D1 and the second test point D2, and then the two probes are connected to the second test point D2 and the fourth test point D4 respectively.

[0095] Please see Figure 6The test current flows in from the second test point D2, sequentially through the fourth pad A4, the fourth pin P4, the second line T2, the sixth pin P6, and the sixth pad A6 before reaching the fourth test point D4. The two-probe method can measure the potential difference between the two probes, and then detect the bonding impedance at the end of the flexible circuit board 30 based on the test current and potential difference. When the bonding impedance value is close to the value of the second preset impedance, the bonding between the end of the flexible circuit board 30 and the printed circuit board 40 is qualified. In this case, it can be determined that the bonding between the end of the flexible circuit board 30 and the display panel 10 is unqualified. The second preset impedance is the impedance range value when the bonding between the flexible circuit board 30 and the printed circuit board 40 is qualified. When the value of the bonding impedance deviates too much from the value of the second preset impedance, it can be determined that the flexible circuit board 30 and the printed circuit board 40 have peeled off, and the bonding between the end of the flexible circuit board 30 and the printed circuit board 40 is unqualified. However, it is impossible to determine whether the bonding between the end of the flexible circuit board 30 and the display panel 10 is qualified. To further determine whether the bonding between the end of the flexible circuit board 30 and the display panel 10 is qualified, the flexible circuit board 30 and the printed circuit board 40 need to be rebonded. Then, the second test point D2 and the fourth test point D4 are contacted using the two-probe method. After monitoring that the bonding between the flexible circuit board 30 and the printed circuit board 40 is qualified, the two probes are disconnected from the second test point D2 and the fourth test point D4 respectively. Then, the two probes are contacted with the first test point D1 and the second test point D2 respectively using the two-probe method. When the value of the bonding impedance is close to the value of the first preset impedance, the bonding between the end of the flexible circuit board 30 and the display panel 10 is qualified. When the value of the bonding impedance deviates too much from the value of the first preset impedance, it can be determined that the flexible circuit board 30 and the display panel 10 have peeled off, and the bonding between the end of the flexible circuit board 30 and the display panel 10 is unqualified.

[0096] To further optimize the wiring design, in the third embodiment of this application, compared with the second embodiment, the third test point D3, the fifth pad A5 and the fifth pin P5 can be eliminated without affecting the bonding impedance monitoring of the flexible circuit board 30. This can reduce the testing steps of the display module 100 and improve the production efficiency of the display module 100.

[0097] Optional, please refer to Figure 5 In the plan view of the display module 100, the third pin P3, the fourth pin P4, and the sixth pin P6 are arranged sequentially along the first direction X. The third pad A3, the fourth pad A4, and the sixth pad A6 are arranged sequentially along the first direction X, and the first test point D1, the second test point D2, and the fourth test point D4 are arranged sequentially along the first direction X.

[0098] By arranging the above structures sequentially, the wiring can be made more reasonable, avoiding internal short circuits. Furthermore, this layout facilitates the monitoring of the bonding impedance of the flexible circuit board 30 by testers or testing equipment. For example, after testers or testing equipment detect an abnormality in the bonding impedance at the end of the flexible circuit board 30 by contacting the first test point D1 and the second test point D2 using the two-probe method, the two probes are disconnected from the first test point D1 and the second test point D2 respectively. Then, the two probes are moved along the first direction X to positions corresponding to the second test point D2 and the third test point D3, and then the two probes are brought into contact with the second test point D2 and the third test point D3 respectively, allowing for further monitoring. This improves the monitoring efficiency of the two-probe method, thereby increasing the monitoring efficiency and production efficiency of the display module 100.

[0099] Optionally, the second line T2 can be a metal trace or a wire. The second line T2 connects the fourth pin P4 and the sixth pin P6, thus establishing an electrical connection between the fourth pin P4 and the sixth pin P6.

[0100] In the fourth embodiment of this application:

[0101] To avoid redundancy, the fourth embodiment of this application will describe the parts that differ from the third embodiment of this application.

[0102] The fourth embodiment of this application differs from the third embodiment in that:

[0103] Optional, please refer to Figure 5 Chip 20 includes an eighth pin P8, a ninth pin P9, and a third line T3. The third line T3 connects the eighth pin P8 and the ninth pin P9.

[0104] Optionally, the portion of the display panel 10 located in the second bonding area NA1 includes an eighth pad A8 and a ninth pad A9. The eighth pad A8 is bonded to the eighth pin P8, and the ninth pad A9 is bonded to the ninth pin P9.

[0105] Optionally, the flexible circuit board 30 also includes a tenth pin P10, an eleventh pin P11, a twelfth pin P12, and a thirteenth pin P13. The tenth pin P10 and the eleventh pin P11 are located in the first bonding area NA2. The twelfth pin P12 is electrically connected to the tenth pin P10, and the thirteenth pin P13 is electrically connected to the eleventh pin P11.

[0106] Optionally, the portion of the display panel 10 located in the first bonding area NA2 is further provided with a tenth pad A10 and an eleventh pad A11. The tenth pad A10 and the eleventh pad A11 are located inside the connecting pad A7. The tenth pad A10 is electrically connected to the eighth pad A8, and the eleventh pad A11 is electrically connected to the ninth pad A9.

[0107] Optionally, the tenth pad A10 is bonded to the tenth pin P10, and the eleventh pad A11 is bonded to the eleventh pin P11.

[0108] Optionally, the printed circuit board 40 further includes a twelfth pad A12 and a thirteenth pad A13. The twelfth pad A12 is bonded to the twelfth pin P12, and the thirteenth pad A13 is bonded to the thirteenth pin P13.

[0109] Optionally, the impedance test component R further includes a fifth test point D5 and a sixth test point D6. The fifth test point D5 is electrically connected to the twelfth pad A12, and the fifth test point D5 is configured as an impedance test point. The sixth test point D6 is electrically connected to the thirteenth pad A13, and the sixth test point D6 is configured as an impedance test point.

[0110] Please refer to Figure 6 , in the display module 100 of the present application, it is also necessary to monitor whether the bonding of the chip 20 and the display panel 10 is qualified. During the process of monitoring the bonding impedance of the chip 20 and the display panel 10 using the two-probe method, two probes are respectively contacted with the fifth test point D5 and the sixth test point D6. The test current flows in from the fifth test point D5, and successively passes through the twelfth pad A12, the twelfth pin P12, the tenth pin P10, the tenth pad A10, the eighth pad A8, the eighth pin P8, the third line T3, the ninth pin P9, the ninth pad A9, the eleventh pad A11, the eleventh pin P11, the thirteenth pin P13, and the thirteenth pad A13, and then reaches the sixth test point D6. The two-probe method can measure the potential difference between the two probes, and then detect the magnitude of the bonding impedance of the display panel 10, the chip 20, the flexible circuit board 30, and the printed circuit board 40 according to the test current and the potential difference. When the value of the bonding impedance is close to the value of the third preset impedance, the bonding of the chip 20 and the display panel 10, and the bonding of the part of the flexible circuit board 30 located in the first bonding area NA2 with the display panel 10 and the printed circuit board 40 are qualified. Among them, the third preset impedance is the impedance range value when the bonding of the chip 20 and the display panel 10 is qualified, and the part of the flexible circuit board 30 located in the first bonding area NA2 is bonded to the display panel 10 and the printed circuit board 40. When the deviation between the value of the bonding impedance and the value of the third preset impedance is too large, it can be determined that the chip 20 and the display panel 10 are peeled off, or at least one of the part of the flexible circuit board 30 located in the first bonding area NA2 and the display panel 10 and the printed circuit board 40 is peeled off. The structural design of the display module 100 in this embodiment can reduce the monitoring blind area and improve the detection rate of defective products.

[0111] Optionally, the third line T3 is a metal trace or a wire. The third line T3 connects the eighth pin P8 and the ninth pin P9 to achieve electrical connection between the eighth pin P8 and the ninth pin P9.

[0112] In the fifth embodiment of this application:

[0113] To avoid redundancy, the fifth embodiment of this application will describe the parts that differ from the fourth embodiment of this application.

[0114] The fifth embodiment of this application differs from the fourth embodiment in that:

[0115] Optional, please refer to Figure 5 The portion of the display panel 10 located in the first bonding area NA2 also includes a fourteenth pad A14 and a fourth line T4. The fourteenth pad A14 is located inside the connecting pad A7. The fourth line T4 connects the fourteenth pad A14 and the eleventh pad A11.

[0116] Optionally, the flexible circuit board 30 also includes a fourteenth pin P14 and a fifteenth pin P15. The fourteenth pin P14 is located in the first bonding area NA2 and is bonded to the fourteenth pad A14. The fifteenth pin P15 is electrically connected to the fourteenth pin P14.

[0117] Optionally, the printed circuit board 40 also includes a fifteenth pad A15, which is bonded to the fifteenth pin P15.

[0118] Optionally, the impedance test assembly R also includes a seventh test point D7, which is electrically connected to the fifteenth pad A15 and is configured as an impedance test point.

[0119] In order to further determine the cause of the abnormal bonding impedance of the display module 100, in the fourth embodiment, when the abnormal bonding impedance of the display module 100 is detected by connecting the fifth test point D5 and the sixth test point D6 using the two-probe method, the two probes are disconnected from the first test point D1 and the second test point D2, and then the two probes are connected to the sixth test point D6 and the seventh test point D7 respectively.

[0120] Please see Figure 6The test current flows in from the sixth test point D6, passing sequentially through the thirteenth pad A13, the thirteenth pin P13, the eleventh pin P11, the eleventh pad A11, the fourth line T4, the fourteenth pad A14, the fourteenth pin P14, the fifteenth pin P15, and the fifteenth pad A15 before reaching the seventh test point D7. The two-probe method can measure the potential difference between the two probes. Based on the test current and potential difference, the bonding impedance between the flexible circuit board 30 and the display panel 10, and between the flexible circuit board 30 and the printed circuit board 40, can be detected. When the bonding impedance value is close to the value of the fourth preset impedance, the portion of the flexible circuit board 30 located in the first bonding area NA2 is considered to be bonded successfully with the display panel 10 and the printed circuit board 40. At this point, it can be determined that the bonding between the chip 20 and the display panel 10 is unqualified. The fourth preset impedance is the impedance range value when the bonding between the flexible circuit board 30 and the display panel 10 and the printed circuit board 40 is qualified. When the value of the bonding impedance deviates too much from the value of the second preset impedance, it can be determined that the flexible circuit board 30 has peeled off from one of the display panel 10 and the printed circuit board 40, that the bonding between the part of the flexible circuit board 30 located in the first bonding area NA2 and the display panel 10 is unqualified, and that the bonding between the flexible circuit board 30 and the printed circuit board 40 is unqualified, but it is impossible to determine whether the bonding between the chip 20 and the display panel 10 is qualified. To further determine whether the bonding between chip 20 and display panel 10 is qualified, it is necessary to re-bond flexible circuit board 30 to display panel 10 and flexible circuit board 30 to printed circuit board 40. Then, using the two-probe method, contact the sixth test point D6 and the seventh test point D7. After monitoring that the first bonding area NA2 of flexible circuit board 30 is successfully bonded to display panel 10 and that flexible circuit board 30 is successfully bonded to printed circuit board 40, disconnect the two probes from the sixth test point D6 and the seventh test point D7 respectively. Then, using the two-probe method, contact the two probes with the fifth test point D5 and the sixth test point D6 respectively. When the bonding impedance value is close to the value of the third preset impedance, the bonding between chip 20 and display panel 10 is qualified. When the bonding impedance value deviates too much from the value of the third preset impedance, it can be determined that chip 20 and display panel 10 have peeled off, and the bonding between chip 20 and display panel 10 is unqualified.

[0121] In the fourth embodiment, when the bonding impedance is abnormal, it can only determine that the chip 20 is separated from the display panel 10, or that the part of the flexible circuit board 30 located in the first bonding area NA2 is separated from at least one of the display panel 10 and the printed circuit board 40. It cannot accurately detect the location of the bonding abnormality.

[0122] Based on the fourth embodiment, the fifth embodiment can eliminate the situation of abnormal bonding between the flexible circuit board 30 and the display panel 10, as well as the situation of abnormal bonding between the flexible circuit board 30 and the printed circuit board 40. The fifth embodiment can accurately monitor the location of abnormal bonding, thereby further reducing the monitoring blind spot and improving the detection rate of defective products.

[0123] Optionally, the fourth line T4 can be a metal trace or a wire. The fourth line T4 connects the fourteenth pad A14 and the eleventh pad A11, thus achieving an electrical connection between the fourteenth pad A14 and the eleventh pad A11.

[0124] In the sixth embodiment of this application:

[0125] To avoid redundancy, the sixth embodiment of this application will describe the parts that differ from the fifth embodiment of this application.

[0126] The sixth embodiment of this application differs from the fifth embodiment of this application in that:

[0127] Optional, please refer to Figure 5 The flexible circuit board 30 also includes a sixteenth pin P16 and a fifth line T5. The fifth line T5 connects the fifteenth pin P15 and the sixteenth pin P16.

[0128] Optionally, the printed circuit board 40 also includes a sixteenth pad A16, which is bonded to the sixteenth pin P16.

[0129] Optionally, the impedance test assembly R also includes an eighth test point D8, which is electrically connected to the sixteenth pad A16 and is configured as an impedance test point.

[0130] Please see Figure 6 In order to further determine the cause of the abnormal bonding impedance of the display module 100, in the fifth embodiment, when the bonding impedance between the flexible circuit board 30 and the display panel 10 and the bonding impedance between the flexible circuit board 30 and the printed circuit board 40 are detected to be abnormal by connecting the sixth test point D6 and the seventh test point D7 using the two-probe method, the two probes are disconnected from the sixth test point D6 and the seventh test point D7, and then the two probes are connected to the seventh test point D7 and the eighth test point D8 respectively.

[0131] The test current flows in from the seventh test point D7, and successively passes through the fifteenth pad A15, the fifteenth pin P15, the fifth line T5, the sixteenth pin P16, and the sixteenth pad A16, and then reaches the eighth test point D8. The two-probe method can measure the potential difference between two probes, and then detect the binding impedance value between the flexible circuit board 30 and the printed circuit board 40 according to the test current and the potential difference. When the value of the binding impedance is close to the value of the fifth preset impedance, the binding of the flexible circuit board 30 and the printed circuit board 40 is qualified. At this time, it can be judged that the binding between the chip 20 and the display panel 10 is unqualified, or the binding between the flexible circuit board 30 and the display panel 10 is unqualified. Among them, the fifth preset impedance is the impedance range value when the flexible circuit board 30 and the printed circuit board 40 are bound qualified. When the value of the binding impedance deviates too much from the value of the fifth preset impedance, it can be judged that the flexible circuit board 30 and the printed circuit board 40 are peeled off, and the binding of the flexible circuit board 30 and the printed circuit board 40 is unqualified.

[0132] On the basis of the fifth embodiment, the sixth embodiment can exclude the abnormal binding situation between the flexible circuit board 30 and the printed circuit board 40. The sixth embodiment can accurately monitor the position of the abnormal binding, thereby further reducing the monitoring blind area and improving the detection rate of defective products.

[0133] Optionally, the fifth line T5 is a metal trace or a wire. The fifth line T5 connects the fifteenth pin P15 and the sixteenth pin P16 to realize the electrical connection between the fifteenth pin Pz5 and the sixteenth pin Pz6.

[0134] In the seventh embodiment of the present application:

[0135] To avoid redundancy, the seventh embodiment of the present application will describe the parts different from the first embodiment of the present application.

[0136] The difference between the seventh embodiment of the present application and the first embodiment of the present application is:

[0137] Please refer to Figure 7 , the circuit board S only includes the flexible circuit board 30. The impedance test component R includes a first test point D1 and a second test point D2. The flexible circuit board 30 includes test pins. The test pins are provided at at least one end of the flexible circuit board 30. The test pins only include a first pin P1 and a second pin P2. The first test point D1 is provided on the flexible circuit board 30 and is electrically connected to the first pin P1. The second test point D2 is provided on the flexible circuit board 30 and is electrically connected to the second pin P2.

[0138] The seventh embodiment of this application can monitor the bonding impedance of the end of the flexible circuit board 30 after it is bonded to the display panel 10 and before it is bonded to the printed circuit board 40. When the bonding impedance deviates significantly from a sixth preset impedance, it can be determined that the end of the flexible circuit board 30 has peeled off. When the bonding impedance is close to the sixth preset impedance, it can be determined that the bonding between the end of the flexible circuit board 30 and the display panel 10 is successful. The sixth preset impedance is the impedance range value when the bonding between the end of the flexible circuit board 30 and the display panel 10 is successful.

[0139] Compared to the first embodiment, the display module 100 of the seventh embodiment of this application can directly determine whether the flexible circuit board 30 and the display panel 10 are properly bonded, without having to exclude the case where the flexible circuit board 30 and the printed circuit board 40 are not properly bonded, thereby improving monitoring efficiency, further reducing monitoring blind spots, and increasing the detection rate of defective products.

[0140] The specific embodiments of this application have been described in detail above. The embodiments disclosed above are merely preferred embodiments of this application. Those skilled in the art can make many modifications and improvements without departing from the concept of this application. All such modifications and improvements fall within the scope of protection defined by the claims of this application.

Claims

1. A display module, characterized in that, include: A display panel includes a display area and a non-display area located on at least one side of the display area; A gate driving circuit is disposed on the display panel; A connection pad is provided in the non-display area and is electrically connected to the gate drive circuit. The test pad is located in the non-display area and outside the connection pad; A circuit board, a portion of which is located in the non-display area, and at least one end of which is provided with test pins, the test pins being bonded to the test pads; An impedance testing component, located on the circuit board, is used to detect the bonding impedance between the test pin and the test pad.

2. The display module as described in claim 1, characterized in that, The non-display area includes a first binding area; The connection pad and the test pad are located in the first bonding area. The test pad includes a first pad, a second pad, and a first line. The first line connects the first pad and the second pad. The circuit board includes: A flexible circuit board, a portion of which is disposed on a display panel and located in the first bonding area, includes test pins located at at least one end of the flexible circuit board. The test pins include a first pin, a second pin, a third pin, and a fourth pin. The first pin is located in the first bonding area and bonded to a first pad; the second pin is located in the first bonding area and bonded to a second pad; the third pin is electrically connected to the first pin; and the fourth pin is electrically connected to the second pin. A printed circuit board connected to the flexible circuit board, the printed circuit board including a third pad and a fourth pad, the third pad being bonded to the third pin and the fourth pad being bonded to the fourth pin; The impedance testing component includes: A first test point is located on the printed circuit board and electrically connected to the third pad; the first test point is configured as an impedance test point. The second test point is located on the printed circuit board and is electrically connected to the fourth pad. The second test point is configured as an impedance test point.

3. The display module as described in claim 2, characterized in that, The flexible circuit board further includes a fifth pin, a sixth pin, and a second line, wherein the second line connects the fifth pin and the sixth pin; The printed circuit board further includes a fifth pad and a sixth pad, the fifth pad being bonded to the fifth pin and the sixth pad being bonded to the sixth pin; The impedance testing assembly further includes a third test point and a fourth test point. The third test point is located on the printed circuit board and is electrically connected to the fifth pad. The third test point is configured as an impedance test point. The fourth test point is located on the printed circuit board and is electrically connected to the sixth pad. The fourth test point is configured as an impedance test point.

4. The display module as described in claim 3, characterized in that, The second test point and the third test point are the same test point; The fourth pad and the fifth pad are the same pad; The fourth pin and the fifth pin are the same pin.

5. The display module as described in claim 4, characterized in that, In the plan view of the display module, the first direction is the long side direction of the flexible circuit board, and the third pin, the fourth pin and the sixth pin are arranged sequentially along the first direction; the third pad, the fourth pad and the sixth pad are arranged sequentially along the first direction, and the first test point, the second test point and the fourth test point are arranged sequentially along the first direction.

6. The display module as described in claim 2, characterized in that, The non-display area also includes a second binding area, which is located on the side of the first binding area closer to the display area; The display module further includes a chip, which is bonded to the second bonding area; The chip includes an eighth pin, a ninth pin, and a third line, wherein the third line connects the eighth pin and the ninth pin. The portion of the display panel located in the second bonding area includes an eighth pad and a ninth pad, wherein the eighth pad is bonded to the eighth pin and the ninth pad is bonded to the ninth pin; The flexible circuit board further includes a tenth pin, an eleventh pin, a twelfth pin, and a thirteenth pin, wherein the tenth pin and the eleventh pin are located in the first bonding area; the twelfth pin is electrically connected to the tenth pin, and the thirteenth pin is electrically connected to the eleventh pin; The portion of the display panel located in the first bonding area is further provided with a tenth pad and an eleventh pad. The tenth pad and the eleventh pad are located inside the connecting pad. The tenth pad is electrically connected to the eighth pad, and the eleventh pad is electrically connected to the ninth pad. The tenth pad is bonded to the tenth pin, and the eleventh pad is bonded to the eleventh pin; The printed circuit board also includes a twelfth pad and a thirteenth pad, the twelfth pad being bonded to the twelfth pin and the thirteenth pad being bonded to the thirteenth pin; The impedance testing assembly further includes a fifth test point and a sixth test point. The fifth test point is electrically connected to the twelfth pad and is configured as an impedance test point. The sixth test point is electrically connected to the thirteenth pad and is configured as an impedance test point.

7. The display module as described in claim 6, characterized in that, The portion of the display panel located in the first bonding area further includes a fourteenth pad and a fourth line. The fourteenth pad is located inside the connecting pad, and the fourth line connects the fourteenth pad and the eleventh pad. The flexible circuit board further includes a fourteenth pin and a fifteenth pin, wherein the fourteenth pin is located in the first bonding area and is bonded to the fourteenth pad; the fifteenth pin is electrically connected to the fourteenth pin. The printed circuit board also includes a fifteenth pad, which is bonded to the fifteenth pin; The impedance testing assembly also includes a seventh test point, which is electrically connected to the fifteenth pad and is configured as an impedance test point.

8. The display module as described in claim 7, characterized in that, The flexible circuit board also includes a sixteenth pin and a fifth line, the fifth line being connected to the fifteenth pin and the sixteenth pin; The printed circuit board also includes a sixteenth pad, which is bonded to the sixteenth pin; The impedance testing assembly also includes an eighth test point, which is electrically connected to the sixteenth pad and is configured as an impedance test point.

9. The display module as described in claim 1, characterized in that, The non-display area includes a first binding area; The connection pad and the test pad are located in the first bonding area. The test pad includes a first pad, a second pad, and a first line. The first line connects the first pad and the second pad. The circuit board includes a flexible circuit board, a portion of which is disposed on the display panel and located in the first bonding area. The flexible circuit board includes a first pin and a second pin; the first pin is located in the first bonding area and is bonded to the first pad. The second pin is located in the first bonding area and is bonded to the second pad; The impedance testing component includes: The first test point is located on the flexible circuit board and is electrically connected to the first pin. The first test point is configured as an impedance test point. and The second test point is located on the flexible circuit board and is electrically connected to the second pin. The second test point is configured as an impedance test point.

10. A display device, characterized in that, Includes the display module as described in any one of claims 1-9.

Images